TJA1055T/3/C_技术文档

TJA1055

Enhanced fault-tolerant CAN transceiver

Rev. 04 — 17 February 2009

Product data sheet

1. General description

The TJA1055 is the interface between the protocol controller and the physical bus wires in

a Controller Area Network (CAN). It is primarily intended for low-speed applications up to

125 kBd in passenger cars. The device provides differential receive and transmit

capability but will switch to single-wire transmitter and/or receiver in error conditions. The

TJA1055 is the enhanced version of the TJA1054 and TJA1054A. TJA1055 has the same

functionality but in addition offering a number of improvements. The most important

improvements of the TJA1055 with respect to the TJA1054 and TJA1054A are:

• Improved ElectroStatic Discharge (ESD) performance

• Lower current consumption in sleep mode

• Wake-up signalling on RXD and ERR without V_CCactive

• 3 V interfacing with microcontroller possible with TJA1055T/3

2. Features

2.1 Optimized for in-car low-speed communication

I Pin-to-pin compatible with TJA1054 and TJA1054A

I Baud rate up to 125 kBd

I Up to 32 nodes can be connected

I Supports unshielded bus wires

I Very low ElectroMagnetic Emission (EME) due to built-in slope control function and a

very good matching of the CANL and CANH bus outputs

I Very high ElectroMagnetic Immunity (EMI) in normal operating mode and in low power

modes

I Fully integrated receiver ﬁlters

I Transmit Data (TxD) dominant time-out function

I High ESD robustness:

N ±8 kV Electrostatic Discharge (ESD) protection Human Body Model (HBM) for

off-board pins

N ±6 kV Electrostatic Discharge (ESD) protection IEC 61000-4-2 for off-board pins

I Low-voltage microcontroller support

2.2 Bus failure management

I Supports single-wire transmission modes with ground offset voltages up to 1.5 V

I Automatic switching to single-wire mode in the event of bus failures, even when the

CANH bus wire is short-circuited to V_CC

TJA1055

NXP Semiconductors

Enhanced fault-tolerant CAN transceiver

I Automatic reset to differential mode if bus failure is removed

I Full wake-up capability during failure modes

2.3 Protections

I Bus pins short-circuit safe to battery and to ground

I Thermally protected

I Bus lines protected against transients in an automotive environment

I An unpowered node does not disturb the bus lines

I Microcontroller interface without reverse current paths, if unpowered

2.4 Support for low power modes

I Low current sleep mode and standby mode with wake-up via the bus lines

I Software accessible power-on reset ﬂag

3. Quick reference data

Table 1.

Quick reference data

Symbol Parameter

Conditions

Min

4.75

−0.3

5.0

-

Typ Max Unit

V_CC

supply voltage

-

5.25

+40

40

V

V_BAT

battery supply voltage

no time limit

operating mode

load dump

V

58

V

I_BAT

battery supply current

voltage on pin CANH

voltage on pin CANL

sleep mode at

-

25 40

µA

V

_RTL= V_WAKE= V_INH

_BAT= 14 V; T_amb

=

−40 °C to +125 °C

V_CC= 0 V to 5.0 V;

_BAT≥ 0 V; no time limit;

V_CANH

−58

-

+58

V

with respect to any other

V_CANL

V_CC= 0 V to 5.0 V;

+58

V_BAT≥ 0 V; no time limit;

with respect to any other

V_O(dom)dominant output voltage

on pin CANH

V_TXD= 0 V; V_EN= V_CC

I_CANH= −40 mA

I_CANL= 40 mA

V

-

_CC− 1.4 -

-

V

on pin CANL

-

1.4

1.5

V

t_PD(L)

propagation delay TXD

(LOW) to RXD (LOW)

no failures;

-

µs

R

_{CAN_L}= R_{CAN_H}

125 Ω; C_{CAN_L}

_{CAN_H}= 1 nF;

see Figure 4 to Figure 6

=

C

[1]

T_vj

virtual junction temperature

−40

-

+150 °C

[1] Junction temperature in accordance with “IEC 60747-1”. An alternative deﬁnition is: T_vj= T_amb+ P × R_th(vj-a)

where R_th(vj-a)is a ﬁxed value to be used for the calculation of T_vj. The rating for T_vjlimits the allowable

combinations of power dissipation (P) and operating ambient temperature (T_amb).

TJA1055_4

Product data sheet

Rev. 04 — 17 February 2009

2 of 26

TJA1055

NXP Semiconductors

Enhanced fault-tolerant CAN transceiver

4. Ordering information

Table 2.

Ordering information

Type number

Package

Name

Description

plastic small outline package; 14 leads; body width 3.9 mm

Version

TJA1055T

SO14

SOT108-1

TJA1055T/3

5. Block diagram

V

BAT

14

CC

10

1

INH

TEMPERATURE

PROTECTION

7

WAKE-UP

STANDBY

CONTROL

WAKE

5

9

11

12

8

STB

RTL

6

EN

CANH

CANL

RTH

V

CC

DRIVER

2

4

TIMER

(2)

TXD

ERR

(1)

V

CC

FAILURE DETECTOR

PLUS WAKE-UP

PLUS TIME-OUT

TJA1055T

(2)

CC

V

FILTER

3

RECEIVER

RXD

FILTER

13

GND

001aac769

(1) For TJA1055T/3 current source to GND; for TJA1055T pull-up resistor to V_CC

(2) Not within TJA1055T/3.

.

Fig 1. Block diagram

TJA1055_4

Product data sheet

Rev. 04 — 17 February 2009

3 of 26

TJA1055

NXP Semiconductors

Enhanced fault-tolerant CAN transceiver

6. Pinning information

6.1 Pinning

1

2

3

4

5

6

7

14

13

12

11

10

9

INH

TXD

BAT

GND

CANL

CANH

RXD

ERR

STB

TJA1055T

TJA1055T/3

V

CC

EN

RTL

RTH

8

WAKE

001aac770

Fig 2. Pin conﬁguration

6.2 Pin description

Table 3.

Symbol

INH

Pin description

Description

1

inhibit output for switching an external voltage regulator if a

wake-up signal occurs

TXD

RXD

ERR

2

3

4

transmit data input for activating the driver to the bus lines

receive data output for reading out the data from the bus lines

error, wake-up and power-on indication output; active LOW in

normal operating mode when a bus failure is detected; active LOW

in standby and sleep mode when a wake-up is detected; active

LOW in power-on standby when a V_BATpower-on event is detected

STB

EN

5

6

standby digital control signal input; together with the input signal

on pin EN this input determines the state of the transceiver;

see Table 5 and Figure 3

enable digital control signal input; together with the input signal on

pin STB this input determines the state of the transceiver;

see Table 5 and Figure 3

WAKE

RTH

7

8

9

local wake-up signal input (active LOW); both falling and rising

edges are detected

termination resistor connection; in case of a CANH bus wire error

the line is terminated with a predeﬁned impedance

RTL

termination resistor connection; in case of a CANL bus wire error

the line is terminated with a predeﬁned impedance

V_CC

10

11

12

13

14

supply voltage

CANH

CANL

GND

BAT

HIGH-level CAN bus line

LOW-level CAN bus line

ground

battery supply voltage

TJA1055_4

Product data sheet

Rev. 04 — 17 February 2009

4 of 26

TJA1055

NXP Semiconductors

Enhanced fault-tolerant CAN transceiver

7. Functional description

The TJA1055 is the interface between the CAN protocol controller and the physical wires

of the CAN bus (see Figure 9 and Figure 10). It is primarily intended for low-speed

applications, up to 125 kBd, in passenger cars. The device provides differential transmit

capability to the CAN bus and differential receive capability to the CAN controller.

To reduce EME, the rise and fall slopes are limited. This allows the use of an unshielded

twisted pair or a parallel pair of wires for the bus lines. Moreover, the device supports

transmission capability on either bus line if one of the wires is corrupted. The failure

detection logic automatically selects a suitable transmission mode.

In normal operating mode (no wiring failures) the differential receiver is output on pin RXD

(see Figure 1). The differential receiver inputs are connected to pins CANH and CANL

through integrated ﬁlters. The ﬁltered input signals are also used for the single-wire

receivers. The receivers connected to pins CANH and CANL have threshold voltages that

ensure a maximum noise margin in single-wire mode.

A timer function (TxD dominant time-out function) has been integrated to prevent the bus

lines from being driven into a permanent dominant state (thus blocking the entire network

communication) due to a situation in which pin TXD is permanently forced to a LOW level,

caused by a hardware and/or software application failure.

If the duration of the LOW level on pin TXD exceeds a certain time, the transmitter will be

disabled. The timer will be reset by a HIGH level on pin TXD.

7.1 Failure detector

The failure detector is fully active in the normal operating mode. After the detection of a

single bus failure the detector switches to the appropriate mode (see Table 4). The

differential receiver threshold voltage is set at −3.2 V typical (V_CC= 5 V). This ensures

correct reception with a noise margin as high as possible in the normal operating mode

and in the event of failures 1, 2, 5 and 6a. These failures, or recovery from them, do not

destroy ongoing transmissions. The output drivers remain active, the termination does not

change and the receiver remains in differential mode (see Table 4).

Failures 3, 3a and 6 are detected by comparators connected to the CANH and CANL bus

lines. Failures 3 and 3a are detected in a two-step approach. If the CANH bus line

exceeds a certain voltage level, the differential comparator signals a continuous dominant

condition. Because of inter operability reasons with the predecessor products TJA1054

and TJA1054A, after a ﬁrst time-out the transceiver switches to single-wire operation

through CANH. If the CANH bus line is still exceeding the CANH detection voltage for a

second time-out, the TJA1055 switches to CANL operation; the CANH driver is switched

off and the RTH bias changes to the pull-down current source. The time-outs (delays) are

needed to avoid false triggering by external RF ﬁelds.

TJA1055_4

Product data sheet

Rev. 04 — 17 February 2009

5 of 26

TJA1055

NXP Semiconductors

Enhanced fault-tolerant CAN transceiver

Table 4.

Bus failures

Failure Description

Termination Termination CANH

CANH (RTH) CANL (RTL) driver

CANL

driver

Receiver

mode

1

CANH wire

interrupted

on

differential

2

3

CANL wire interrupted on

CANH short-circuited weak^[1]

to battery

on

off

on

differential

CANL

3a

4

CANH short-circuited weak^[1]

to V_CC

on

off

on

off

on

off

on

off

CANL

CANL short-circuited on

to ground

weak^[2]

on

CANH

5

CANH short-circuited on

to ground

differential

CANH

6

CANL short-circuited on

to battery

weak^[2]

on

6a

7

CANL short-circuited on

to V_CC

differential

CANH

CANL and CANH

mutually

on

weak^[2]

short-circuited

[1] A weak termination implies a pull-down current source behavior of 75 µA typical.

[2] A weak termination implies a pull-up current source behavior of 75 µA typical.

Failure 6 is detected if the CANL bus line exceeds its comparator threshold for a certain

period of time. This delay is needed to avoid false triggering by external RF ﬁelds. After

detection of failure 6, the reception is switched to the single-wire mode through CANH; the

CANL driver is switched off and the RTL bias changes to the pull-up current source.

Recovery from failures 3, 3a and 6 is detected automatically after reading a consecutive

recessive level by corresponding comparators for a certain period of time.

Failures 4 and 7 initially result in a permanent dominant level on pin RXD. After a time-out

the CANL driver is switched off and the RTL bias changes to the pull-up current source.

Reception continues by switching to the single-wire mode via pins CANH or CANL. When

failures 4 or 7 are removed, the recessive bus levels are restored. If the differential voltage

remains below the recessive threshold level for a certain period of time, reception and

transmission switch back to the differential mode.

If any of the wiring failure occurs, the output signal on pin ERR will be set to LOW. On

error recovery, the output signal on pin ERR will be set to HIGH again. In case of an

interrupted open bus wire, this failure will be detected and signalled only if there is an

open wire between the transmitting and receiving node(s). Thus, during open wire

failures, pin ERR typically toggles.

During all single-wire transmissions, EMC performance (both immunity and emission) is

worse than in the differential mode. The integrated receiver ﬁlters suppress any HF noise

induced into the bus wires. The cut-off frequency of these ﬁlters is a compromise between

propagation delay and HF suppression. In single-wire mode, LF noise cannot be

distinguished from the required signal.

TJA1055_4

Product data sheet

Rev. 04 — 17 February 2009

6 of 26

TJA1055

NXP Semiconductors

Enhanced fault-tolerant CAN transceiver

7.2 Low power modes

The transceiver provides three low power modes which can be entered and exited via

STB and EN (see Table 5 and Figure 3).

The sleep mode is the mode with the lowest power consumption. Pin INH is switched to

HIGH-impedance for deactivation of the external voltage regulator. Pin CANL is biased to

the battery voltage via pin RTL. Pins RXD and ERR will signal the wake-up interrupt even

in case V_CCis not present.

The standby mode operates in the same way as the sleep mode but with a HIGH level on

pin INH.

The power-on standby mode is the same as the standby mode, however, in this mode the

battery power-on ﬂag is shown on pin ERR instead of the wake-up interrupt signal. The

output on pin RXD will show the wake-up interrupt. This mode is only for reading out the

power-on ﬂag.

Table 5.

Mode

Normal operating and low power modes

Pin STB Pin EN

Pin ERR

LOW

Pin RXD

LOW

Pin RTL

switched

to

HIGH

[2][3]

Goto-sleep LOW

command

HIGH

wake-up

interrupt

signal^[1]

wake-up

interrupt

signal^[1]

V_BAT

Sleep

LOW

HIGH

LOW^[4]

LOW

Standby

Power-on

standby

LOW

V_BAT

power-on

ﬂag^[5]

wake-up

interrupt

signal^[1]

V_BAT

Normal

operating

HIGH

error ﬂag no error

ﬂag

dominant recessive V_CC

received

data

received

data

[1] Wake-up interrupts are released when entering normal operating mode.

[2] For TJA1055T a diode is added in series with the high-side driver of ERR and RXD to prevent a reverse

current from ERR to V_CCin the unpowered state.

[3] For TJA1055T/3, ERR and RXD are open-drain.

[4] In case the goto-sleep command was used before. When V_CCdrops, pin EN will become LOW, but due to

the fail-safe functionality this does not effect the internal functions.

[5] V_BATpower-on ﬂag will be reset when entering normal operating mode.

Wake-up requests are recognized by the transceiver through two possible channels:

• The bus lines for remote wake-up

• Pin WAKE for local wake-up

In order to wake-up the transceiver remotely through the bus lines, a ﬁlter mechanism is

integrated. This mechanism makes sure that noise and any present bus failure conditions

do not result into an erroneous wake-up. Because of this mechanism it is not sufﬁcient to

simply pull the CANH or CANL bus lines to a dominant level for a certain time. To

guarantee a successful remote wake-up under all conditions, a message frame with a

dominant phase of at least the maximum speciﬁed t_dom(CANH)or t_dom(CANL)in it is required.

TJA1055_4

Product data sheet

Rev. 04 — 17 February 2009

7 of 26

TJA1055

NXP Semiconductors

Enhanced fault-tolerant CAN transceiver

A local wake-up through pin WAKE is detected by a rising or falling edge with a

consecutive level exceeding the maximum speciﬁed t_WAKE

.

On a wake-up request the transceiver will set the output on pin INH to HIGH which can be

used to activate the external supply voltage regulator.

A wake-up request is signalled on ERR or RXD with an active LOW signal. So the external

microcontroller can activate the transceiver (switch to normal operating mode) via

pins STB and EN.

To prevent a false remote wake-up due to transients or RF ﬁelds, the wake-up voltage

levels have to be maintained for a certain period of time. In the low power modes the

failure detection circuit remains partly active to prevent an increased power consumption

in the event of failures 3, 3a, 4 and 7.

To prevent a false local wake-up during an open wire at pin WAKE, this pin has a weak

pull-up current source towards V_BAT. However, in order to protect the transceiver against

any EMC immunity issues, it is recommended to connect a not used pin WAKE to pin

BAT. Pin INH is set to ﬂoating only if the goto-sleep command is entered successfully. To

enter a successful goto-sleep command under all conditions, this command must be kept

stable for the maximum speciﬁed t_d(sleep)

.

Pin INH will be set to a HIGH level again by the following events only:

• V_BATpower-on (cold start)

• Rising or falling edge on pin WAKE

• A message frame with a dominant phase of at least the maximum speciﬁed t_dom(CANH)

or t_dom(CANL), while pin EN or pin STB is at a LOW level

• Pin STB goes to a HIGH level with V_CCactive

To provide fail-safe functionality, the signals on pins STB and EN will internally be set to

LOW when V_CCis below a certain threshold voltage (V_CC(stb)). An unused output pin INH

can simply be left open within the application.

7.3 Power-on

After power-on (V_BATswitched on) the signal on pin INH will become HIGH and an internal

power-on ﬂag will be set. This ﬂag can be read in the power-on standby mode through

pin ERR (STB = 1; EN = 0) and will be reset by entering the normal operating mode.

7.4 Protections

A current limiting circuit protects the transmitter output stages against short-circuit to

positive and negative battery voltage.

If the junction temperature exceeds the typical value of 175 °C, the transmitter output

stages are disabled. Because the transmitter is responsible for the major part of the power

dissipation, this will result in a reduced power dissipation and hence a lower chip

temperature. All other parts of the device will continue to operate.

The pins CANH and CANL are protected against electrical transients which may occur in

an automotive environment.

TJA1055_4

Product data sheet

Rev. 04 — 17 February 2009

8 of 26

TJA1055

NXP Semiconductors

Enhanced fault-tolerant CAN transceiver

POWER-ON

STANDBY

10

GOTO

SLEEP

(4)

NORMAL

11

(5)

01

STANDBY

00

SLEEP

00

(1)

(2)

(3)

mbk949

Mode 10 stands for: Pin STB = HIGH and pin EN = LOW.

(1) Mode change via input pins STB and EN.

(2) Mode change via input pins STB and EN; it should be noted that in the sleep mode pin INH is

inactive and possibly there is no V_CC. Mode control is only possible if V_CCof the transceiver is

active.

(3) Pin INH is activated and pins RXD and ERR are pulled LOW after wake-up via bus or input

pin WAKE.

(4) Transitions to normal mode clear the internal wake-up: wake-up interrupt ﬂag and power-on ﬂag

are cleared.

(5) Transitions to sleep mode: pin INH is deactivated.

Fig 3. Mode control

8. Limiting values

Table 6.

Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).^[1]

Symbol

V_CC

Parameter

Conditions

Min

−0.3

−58

Max

Unit

V

supply voltage

+6

V_BAT

battery supply voltage

voltage on pin TXD

voltage on pin RXD

voltage on pin ERR

voltage on pin STB

voltage on pin EN

voltage on pin CANH

+58

V

V_TXD

V_RXD

V_ERR

V_STB

V_EN

V_CC+ 0.3

+58

V

V_CANH

V_CC= 0 V to 5.0 V;

V

V_BAT≥ 0 V; no time

limit; with respect to

any other pin

TJA1055_4

Product data sheet

Rev. 04 — 17 February 2009

9 of 26

TJA1055

NXP Semiconductors

Enhanced fault-tolerant CAN transceiver

Table 6. Limiting values …continued

In accordance with the Absolute Maximum Rating System (IEC 60134).^[1]

Symbol

Parameter

Conditions

Min

Max

Unit

V_CANL

voltage on pin CANL

V_CC= 0 V to 5.0 V;

−58

+58

V

V_BAT≥ 0 V; no time

limit; with respect to

any other pin

V_trt(n)

transient voltage on

pins CANH and CANL

see Figure 7 and 8

−150

−0.3

+100

+58

V

V_I(WAKE)

input voltage on pin WAKE with respect to any

other pin

[2]

I_I(WAKE)

V_INH

input current on pin WAKE

voltage on pin INH

−15

−0.3

−58

-

mA

V

V_BAT+ 0.3

+58

V_RTH

voltage on pin RTH

with respect to any

other pin

V

V_RTL

R_RTH

R_RTL

voltage on pin RTL

with respect to any

other pin

−58

500

+58

V

Ω

termination resistance on

pin RTH

16000

termination resistance on

pin RTL

[3]

[4]

T_vj

virtual junction temperature

storage temperature

−40

−55

+150

°C

T_stg

V_esd

electrostatic discharge

voltage

human body model

pins RTH, RTL,

CANH and CANL

−8

−2

+8

+2

kV

all other pins

[5]

[6]

IEC 61000-4-2

pins RTH, RTL,

CANH and CANL

−6

+6

kV

machine model

any pin

−300

+300

V

[1] All voltages are deﬁned with respect to pin GND, unless otherwise speciﬁed. Positive current ﬂows into the

device.

[2] Only relevant if V_WAKE< V_GND− 0.3 V; current will ﬂow into pin GND.

[3] Junction temperature in accordance with “IEC 60747-1”. An alternative deﬁnition is: T_vj= T_amb+ P × R_th(vj-a)

where R_th(vj-a)is a ﬁxed value to be used for the calculation of T_vj. The rating for T_vjlimits the allowable

combinations of power dissipation (P) and operating ambient temperature (T_amb).

[4] Equivalent to discharging a 100 pF capacitor through a 1.5 kΩ resistor.

[5] The ESD performance of pins CANH, CANL, RTH and RTL, with respect to GND, was veriﬁed by an

external test house in accordance with IEC-61000-4-2 (C = 150 pF, R = 330 Ω). The results were equal to,

or better than, ±6 kV.

[6] Equivalent to discharging a 200 pF capacitor through a 10 Ω resistor and a 0.75 µH coil.

TJA1055_4

Product data sheet

Rev. 04 — 17 February 2009

10 of 26

TJA1055

NXP Semiconductors

Enhanced fault-tolerant CAN transceiver

9. Thermal characteristics

Table 7.

Symbol

R_th(j-a)

Thermal characteristics

Parameter

Conditions

Typ

Unit

thermal resistance from junction in free air

to ambient

120

K/W

R_th(j-s)

thermal resistance from junction in free air

to substrate

40

K/W

10. Static characteristics

Table 8.

Static characteristics

V_CC= 4.75 V to 5.25 V; V_BAT= 5.0 V to 40 V; V_STB= V_CC; T_vj= −40 °C to +150 °C; all voltages are deﬁned with respect to

ground; positive currents ﬂow into the device; unless otherwise speciﬁed.^[1]

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

Supplies (pins V_CCand BAT)

V_CC

supply voltage

4.75

3.1

-

5.25

4.5

V

V_CC(stb)

supply voltage for forced

standby mode (fail-safe)

I_CC

supply current

normal operating mode;

2.5

3

6

10

21

mA

V_TXD= V_CC(recessive)

normal operating mode;

13

V_TXD= 0 V (dominant); no load

low power modes at V_TXD= V_CC

T_amb= −40 °C to +85 °C

T_amb= +85 °C to +125 °C

no time limit

0

-

5

µA

V

0

25

+40

40

58

40

V_BAT

battery supply voltage

battery supply current

−0.3

operating mode

5.0

-

V

load dump

-

V

I_BAT

sleep mode at

25

µA

V

_RTL= V_WAKE= V_INH= V_{BAT = 14 V}

;

T

_amb= −40 °C to +125 °C

low power mode at

V_RTL= V_WAKE= V_INH= V_BAT

;

T

_amb= −40 °C to +125 °C

V_BAT= 5 V to 8 V

10

-

100

75

µA

V_BAT= 8 V to 40 V

-

normal operating mode at

150

220

V_RTL= V_WAKE= V_INH= V_BAT= 5 V

to 40 V

V_pof(BAT)

power-on ﬂag voltage on low power modes

pin BAT

power-on ﬂag set

-

3.8

-

V

power-on ﬂag not set

5

TJA1055_4

Product data sheet

Rev. 04 — 17 February 2009

11 of 26

TJA1055

NXP Semiconductors

Enhanced fault-tolerant CAN transceiver

Table 8.

Static characteristics …continued

V_CC= 4.75 V to 5.25 V; V_BAT= 5.0 V to 40 V; V_STB= V_CC; T_vj= −40 °C to +150 °C; all voltages are deﬁned with respect to

ground; positive currents ﬂow into the device; unless otherwise speciﬁed.^[1]

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

I_sup(tot)

total supply current

low power modes; V_CC= 5 V;

V

_BAT= V_WAKE= V_INH= 14 V

T_amb= −40 °C to +85 °C

T_amb= +85 °C to +125 °C

-

25

45

65

µA

Pins STB, EN and TXD

V_IH

V_IL

I_IH

HIGH-level input voltage

2.2

-

7

V

LOW-level input voltage

HIGH-level input current

pins STB and EN

−0.3

+0.8

V_I= 4 V

V_I= 3 V

-

11

21

−40

21

2

µA

pin TXD (TJA1055T)

−160

2

−80

11

pin TXD (TJA1055T/3) normal operating mode; V_I= 2.4 V

low power mode; V_I= 2.4 V

0.1

0.9

I_IL

LOW-level input current

pins STB and EN

V_I= 1 V

2

11

-

µA

pin TXD (TJA1055T)

−400

2

−240

11

−100

pin TXD (TJA1055T/3) normal operating mode; V_I= 1 V

low power mode; V_I= 1 V

-

0.1

0.9

2

Pins RXD and ERR (TJA1055T)

V_OH(norm)HIGH-level output voltage

in normal mode

on pin ERR

I_O= −100 µA

I_O= −1 mA

V

_CC− 0.9

-

V_CC

V

on pin RXD

V

_CC− 0.9

V_OH(lp)

HIGH-level output voltage

in low-power mode

on pin ERR

on pin RXD

I_O= −100 µA

V

0

_CC− 1.1

V

-

_CC− 0.7

V

_CC− 0.4

V

_CC− 1.1

V

V_OL

LOW-level output voltage I_O= 1.6 mA

I_O= 1.2 mA; V_CC< 4.75 V

I_O= 5 mA

0.4

1.5

-

Pins RXD and ERR (TJA1055T/3)

I_OL

I_LH

LOW-level output current V_O= 0.4 V

1.3

3.5

0

-

mA

HIGH-level leakage

current

V_O= 3 V

−5

+8

µA

Pin WAKE

I_IL

LOW-level input current

V_WAKE= 0 V; V_BAT= 40 V

V_STB= 0 V

−12

−4

−1

µA

V_th(wake)

wake-up threshold

voltage

2.5

3.2

3.9

V

Pin INH

∆V_H

HIGH-level voltage drop

leakage current

I_INH= −0.18 mA

-

0.8

5

V

|I_L|

sleep mode; V_INH= 0 V

µA

TJA1055_4

Product data sheet

Rev. 04 — 17 February 2009

12 of 26

TJA1055

NXP Semiconductors

Enhanced fault-tolerant CAN transceiver

Table 8.

Static characteristics …continued

V_CC= 4.75 V to 5.25 V; V_BAT= 5.0 V to 40 V; V_STB= V_CC; T_vj= −40 °C to +150 °C; all voltages are deﬁned with respect to

ground; positive currents ﬂow into the device; unless otherwise speciﬁed.^[1]

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

Pins CANH and CANL

V_th(dif)

differential receiver

threshold voltage

no failures and

bus failures 1, 2, 5 and 6a;

see Figure 4

V_CC= 5 V

−3.5

−3.2

−2.9

V

V_CC= 4.75 V to 5.25 V

−0.70V_CC−0.64V_CC−0.58V_CC

V_O(reces)

V_O(dom)

I_O(CANH)

recessive output voltage V_TXD= V_CC

on pin CANH

on pin CANL

R_RTH< 4 kΩ

-

0.2

-

V

R_RTL< 4 kΩ

V

_CC− 0.2

dominant output voltage

on pin CANH

V_TXD= 0 V; V_EN= V_CC

I_CANH= −40 mA

V

-

_CC− 1.4

-

V

on pin CANL

I_CANL= 40 mA

-

1.4

−45

V

output current on

pin CANH

normal operating mode;

−110

−80

mA

V

_CANH= 0 V; V_TXD= 0 V

low power modes; V_CANH= 0 V;

_CC= 5 V

normal operating mode;

_CANL= 14 V; V_TXD= 0 V

low power modes; V_CANL= 14 V;

_BAT= 14 V

-

−0.25

70

-

µA

mA

µA

V

I_O(CANL)

output current on

pin CANL

45

-

100

-

V

0

V

V_{det(sc)(CANH)}detection voltage for

short-circuit to battery

normal operating mode; V_CC= 5 V

low power modes

1.5

1.1

1.7

1.8

1.85

2.5

V

voltage on pin CANH

V_{det(sc)(CANL)}detection voltage for

short-circuit to battery

normal operating mode

V_CC= 5 V

6.6

7.2

7.8

V

voltage on pin CANL

V_CC= 4.75 V to 5.25 V

1.32V_CC

1.44V_CC

1.56V_CC

V_th(wake)

wake-up threshold

voltage

on pin CANL

on pin CANH

low power modes

2.5

1.1

0.8

3.2

1.8

1.4

3.9

2.5

-

V

∆V_th(wake)

difference of wake-up

threshold voltages (on

pins CANL and CANH)

V_th(se)(CANH)single-ended receiver

threshold voltage on

pin CANH

normal operating mode and

failures 4, 6 and 7

V_CC= 5 V

1.5

1.7

1.85

V

V_CC= 4.75 V to 5.25 V

0.30V_CC

0.34V_CC

0.37V_CC

V_th(se)(CANL)

single-ended receiver

threshold voltage on

pin CANL

normal operating mode and

failures 3 and 3a

V_CC= 5 V

3.15

3.3

3.45

V

V_CC= 4.75 V to 5.25 V

normal operating mode

0.63V_CC

110

0.66V_CC

165

0.69V_CC

270

V

R_i(se)(CANH)

single-ended input

kΩ

resistance on pin CANH

TJA1055_4

Product data sheet

Rev. 04 — 17 February 2009

13 of 26

TJA1055

NXP Semiconductors

Enhanced fault-tolerant CAN transceiver

Table 8.

Static characteristics …continued

V_CC= 4.75 V to 5.25 V; V_BAT= 5.0 V to 40 V; V_STB= V_CC; T_vj= −40 °C to +150 °C; all voltages are deﬁned with respect to

ground; positive currents ﬂow into the device; unless otherwise speciﬁed.^[1]

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

R_i(se)(CANL)

single-ended input

normal operating mode

110

165

270

kΩ

resistance on pin CANL

R_i(dif)

differential input

resistance

normal operating mode

220

330

540

kΩ

Pins RTH and RTL

R_sw(RTL)switch-on resistance on

normal operating mode; switch-on

resistance between pin RTL and

-

40

100

Ω

pin RTL

V_CC; |I_O| < 10 mA

R_sw(RTH)

switch-on resistance on

pin RTH

normal operating mode; switch-on

resistance between pin RTH and

ground; |I_O| < 10 mA

V_O(RTH)

I_O(RTL)

I_pu(RTL)

output voltage on pin RTH low power modes; I_O= 100 µA

-

0.7

1.0

−0.1

-

V

output current on pin RTL low power modes; V_RTL= 0 V

−1.5

−0.65

75

mA

µA

pull-up current on pin RTL normal operating mode and

failures 4, 6 and 7

-

I_pd(RTH)

pull-down current on

pin RTH

normal operating mode and

failures 3 and 3a

-

75

-

µA

°C

Thermal shutdown

T_j(sd)shutdown junction

temperature

160

175

190

[1] All parameters are guaranteed over the virtual junction temperature range by design, but only 100 % tested at T_amb= 125 °C for dies on

wafer level, and above this for cased products 100 % tested at T_amb= 25 °C, unless otherwise speciﬁed.

11. Dynamic characteristics

Table 9.

Dynamic characteristics

V_CC= 4.75 V to 5.25 V; V_BAT= 5.0 V to 40 V; V_STB= V_CC; T_vj= −40 °C to +150 °C; all voltages are deﬁned with respect to

ground; unless otherwise speciﬁed.^[1]

Symbol

Parameter

Conditions

Min Typ Max Unit

t_t(reces-dom)transition time for recessive to

dominant (on pins CANL and

CANH)

between 10 % and 90 %; R_{CAN_L}= R_{CAN_H}

125 Ω; C_{CAN_L}= C_{CAN_H}= 1 nF;

see Figure 5 and 6

=

0.2 0.6

-

µs

t_t(dom-reces)transition time for dominant to

recessive (on pins CANL and

CANH)

between 10 % and 90 %; R_{CAN_L}= R_{CAN_H}

125 Ω; C_{CAN_L}= C_{CAN_H}= 1 nF;

see Figure 5 and 6

0.3 0.7

-

µs

t_PD(L)

propagation delay TXD (LOW) to

RXD (LOW)

no failures; R_{CAN_L}= R_{CAN_H}= 125 Ω;

-

1.5 µs

1.9 µs

C_{CAN_L}= C_{CAN_H}= 1 nF; see Figure 4 to

Figure 6

all failures except CAN_L shorted to CAN_H;

R_{CAN_L}= R_{CAN_H}= 125 Ω; C_{CAN_L}

_{CAN_H}= 1 nF; see Figure 4 to Figure 6

=

C

failure 7, CAN_L shorted to CAN_H;

R_{CAN_L}= 1 MΩ; R_{CAN_H}= 125 Ω;

C_{CAN_L}= C_{CAN_H}= 1 nF; see Figure 4 to

Figure 6

TJA1055_4

Product data sheet

Rev. 04 — 17 February 2009

14 of 26

TJA1055

NXP Semiconductors

Enhanced fault-tolerant CAN transceiver

Table 9.

Dynamic characteristics …continued

V_CC= 4.75 V to 5.25 V; V_BAT= 5.0 V to 40 V; V_STB= V_CC; T_vj= −40 °C to +150 °C; all voltages are deﬁned with respect to

ground; unless otherwise speciﬁed.^[1]

Symbol

Parameter

Conditions

Min Typ Max Unit

t_PD(H)

propagation delay TXD (HIGH) to no failures; R_{CAN_L}= R_{CAN_H}= 125 Ω;

-

1.5 µs

1.9 µs

RXD (HIGH)

C_{CAN_L}= C_{CAN_H}= 1 nF; see Figure 4 to

Figure 6

all failures except CAN_L shorted to CAN_H;

-

R_{CAN_L}= R_{CAN_H}= 125 Ω; C_{CAN_L}

=

C_{CAN_H}= 1 nF; see Figure 4 to Figure 6

failure 7, CAN_L shorted to CAN_H;

R_{CAN_L}= 1 MΩ; R_{CAN_H}= 125 Ω; C_{CAN_L}

-

=

C_{CAN_H}= 1 nF; see Figure 4 to Figure 6

[2]

t_d(sleep)

t_dis(TxD)

delay time to sleep

5

50

4

µs

disable time of TxD permanent

dominant timer

normal operating mode; V_TXD= 0 V

0.75 -

ms

[2]

t_dom(CANH)dominant time on pin CANH

t_dom(CANL)dominant time on pin CANL

low power modes; V_BAT= 14 V

7

-

38

µs

t_WAKE

local wake-up time on pin WAKE

low power modes; V_BAT= 14 V; for wake-up

after receiving a falling or rising edge

t_det

failure detection time

normal operating mode

failures 3 and 3a

1.6

0.3

-

8.0 ms

1.6 ms

failures 4, 6 and 7

low power modes; V_BAT= 14 V

failures 3 and 3a

1.6

0.1

-

8.0 ms

1.6 ms

failures 4 and 7

t_rec

failure recovery time

normal operating mode

failures 3 and 3a

0.3

7

-

1.6 ms

failures 4 and 7

38

µs

failure 6

125

750 µs

low power modes; V_BAT= 14 V

failures 3, 3a, 4 and 7

0.3

-

1.6 ms

-

n_det

pulse-count failure detection

difference between CANH and CANL;

normal operating mode and failures 1, 2, 5

and 6a; pin ERR becomes LOW

4

n_rec

number of consecutive pulses for

failure recovery

on CANH and CANL simultaneously;

failures 1, 2, 5 and 6a

-

4

-

[1] All parameters are guaranteed over the virtual junction temperature range by design, but only 100 % tested at T_amb= 125 °C for dies on

wafer level, and above this for cased products 100 % tested at T_amb= 25 °C, unless otherwise speciﬁed.

[2] To guarantee a successful mode transition under all conditions, the maximum speciﬁed time must be applied.

TJA1055_4

Product data sheet

Rev. 04 — 17 February 2009

15 of 26

TJA1055

NXP Semiconductors

Enhanced fault-tolerant CAN transceiver

2 V to V

CC

V

TXD

0 V

V

5 V

CANL

3.6 V

1.4 V

0 V

V

CANH

2.2 V

−3.2 V

−5 V

∆V

CAN

RXD

V

0.7V

0.3V

CC

t

PD(H)

PD(L)

mgl424

∆V_CAN= V_CANH− V_CANL

Fig 4. Timing diagram for dynamic characteristics

12. Test information

V

= 5 V to 40 V

BAT

+5 V

V

INH

BAT

14

CC

RTH

1

10

8

C

CAN_L

R

WAKE

7

CAN_L

BAT

V

R

RTH

500 Ω

CC

V

TXD

2

CANL

CANH

12

11

STB

5

FAILURE

GENERATION

TJA1055T

EN

6

R

RTL

500 Ω

RXD

3

GND

RTL

C

CAN_H

R

CAN_H

9

4

13

GND

C

RXD

10 pF

ERR

001aac932

V_TXDis a rectangular signal of 50 kHz with 50 % duty cycle and slope time < 10 ns.

Termination resistors R_{CAN_L}and R_{CAN_H}(125 Ω) are not connected to pin RTL or pin RTH for

testing purposes because the minimum load allowed on the CAN bus lines is 500 Ω per

transceiver.

Fig 5. Test circuit for dynamic characteristics

TJA1055_4

Product data sheet

Rev. 04 — 17 February 2009

16 of 26

TJA1055

NXP Semiconductors

Enhanced fault-tolerant CAN transceiver

V

BAT

= 5 V to 40 V

+5 V

V

INH

BAT

14

CC

RTH

1

10

8

C

CAN_L

R

CAN_L

WAKE

7

2

5

6

3

BAT

V

CC

R

RTH

500 Ω

V

TXD

STB

CANL

CANH

12

11

+3.3 V

FAILURE

GENERATION

TJA1055T/3

EN

2.5

kΩ

R

RTL

500 Ω

RXD

GND

RTL

C

CAN_H

R

CAN_H

9

4

13

GND

C

RXD

10 pF

ERR

001aac933

V_TXDis a rectangular signal of 50 kHz with 50 % duty cycle and slope time < 10 ns.

Termination resistors R_{CAN_L}and R_{CAN_H}(125 Ω) are not connected to pin RTL or pin RTH for

testing purposes because the minimum load allowed on the CAN bus lines is 500 Ω per

transceiver.

Fig 6. Test circuit for dynamic characteristics (TJA1055T/3)

+12 V

+5 V

10 µF

V

INH

BAT

14

CC

8

RTH

1 nF

125 Ω

1

10

WAKE

7

2

5

6

3

500 Ω

TXD

STB

1 nF

CANL

CANH

12

11

TJA1055T

GENERATOR

EN

500 Ω

RXD

RTL

9

125 Ω

1 nF

4

13

GND

10 pF

ERR

001aac934

The waveforms of the applied transients on pins CANH and CANL will be in accordance with

“ISO 7637 part 1”: test pulses 1, 2, 3a and 3b.

Fig 7. Test circuit for automotive transients

TJA1055_4

Product data sheet

Rev. 04 — 17 February 2009

17 of 26

TJA1055

NXP Semiconductors

Enhanced fault-tolerant CAN transceiver

+12 V

+5 V

10 µF

V

INH

BAT

14

CC

8

RTH

1 nF

125 Ω

1

10

WAKE

7

2

5

6

3

500 Ω

TXD

STB

1 nF

CANL

CANH

12

11

+3.3 V

TJA1055T/3

GENERATOR

EN

2.5

kΩ

500 Ω

RXD

RTL

9

125 Ω

1 nF

4

13

GND

10 pF

ERR

001aac935

The waveforms of the applied transients on pins CANH and CANL will be in accordance with

“ISO 7637 part 1”: test pulses 1, 2, 3a and 3b.

Fig 8. Test circuit for automotive transients (TJA1055T/3)

V

BAT

V

+5 V

DD

5 V CAN CONTROLLER

CTX0 CRX0 Px.x Px.x Px.x

TXD RXD STB ERR EN

INH

2

3

5

4

6

1

WAKE

BAT

7

14

10

13

V

CC

TJA1055T

CAN TRANSCEIVER

100 nF

GND

8

11

CANH

12

CANL

9

RTH

RTL

CAN BUS LINE

001aac936

For more information: refer to the separate FTCAN information available on our web site.

Fig 9. Application diagram

TJA1055_4

Product data sheet

Rev. 04 — 17 February 2009

18 of 26

TJA1055

NXP Semiconductors

Enhanced fault-tolerant CAN transceiver

V

BAT

V

+3 V

+5 V

DD

3 V CAN CONTROLLER

CTX0 CRX0 Px.x Px.x Px.x

TXD RXD STB ERR EN

INH

2

3

5

4

6

1

WAKE

BAT

7

14

10

13

V

CC

TJA1055T/3

CAN TRANSCEIVER

100 nF

GND

8

11

CANH

12

CANL

9

RTH

RTL

CAN BUS LINE

001aac937

For more information: refer to the separate FTCAN information available on our web site.

Fig 10. Application diagram (TJA1055T/3)

12.1 Quality information

This product has been qualiﬁed to the appropriate Automotive Electronics Council (AEC)

standard Q100 or Q101 and is suitable for use in automotive applications.

TJA1055_4

Product data sheet

Rev. 04 — 17 February 2009

19 of 26

TJA1055

NXP Semiconductors

Enhanced fault-tolerant CAN transceiver

13. Package outline

SO14: plastic small outline package; 14 leads; body width 3.9 mm

SOT108-1

D

E

A

X

v

c

y

H

M

A

E

Z

8

14

Q

A

2

A

(A )

3

A

1

pin 1 index

θ

L

p

L

1

7

e

detail X

w

M

b

p

0

2.5

scale

5 mm

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A

(1)

UNIT

A

b

c

D

E

e

H

L

p

Q

v

w

y

Z

θ

1

2

3

p

E

max.

0.25

0.10

1.45

1.25

0.49

0.36

0.25

0.19

8.75

8.55

4.0

3.8

6.2

5.8

1.0

0.4

0.7

0.6

0.7

0.3

mm

1.75

1.27

0.05

1.05

0.25

0.01

0.25

0.1

0.25

0.01

8^o

0^o

0.010 0.057

0.004 0.049

0.019 0.0100 0.35

0.014 0.0075 0.34

0.16

0.15

0.244

0.228

0.039 0.028

0.016 0.024

0.028

0.012

inches

0.041

0.01 0.004

0.069

Note

1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.

REFERENCES

OUTLINE

EUROPEAN

PROJECTION

ISSUE DATE

VERSION

IEC

JEDEC

JEITA

99-12-27

03-02-19

SOT108-1

076E06

MS-012

Fig 11. Package outline SOT108-1 (SO14)

TJA1055_4

Product data sheet

Rev. 04 — 17 February 2009

20 of 26

TJA1055

NXP Semiconductors

Enhanced fault-tolerant CAN transceiver

14. Soldering of SMD packages

This text provides a very brief insight into a complex technology. A more in-depth account

of soldering ICs can be found in Application Note AN10365 “Surface mount reﬂow

soldering description”.

14.1 Introduction to soldering

Soldering is one of the most common methods through which packages are attached to

Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both

the mechanical and the electrical connection. There is no single soldering method that is

ideal for all IC packages. Wave soldering is often preferred when through-hole and

Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not

suitable for ﬁne pitch SMDs. Reﬂow soldering is ideal for the small pitches and high

densities that come with increased miniaturization.

14.2 Wave and reﬂow soldering

Wave soldering is a joining technology in which the joints are made by solder coming from

a standing wave of liquid solder. The wave soldering process is suitable for the following:

• Through-hole components

• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board

Not all SMDs can be wave soldered. Packages with solder balls, and some leadless

packages which have solder lands underneath the body, cannot be wave soldered. Also,

leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,

due to an increased probability of bridging.

The reﬂow soldering process involves applying solder paste to a board, followed by

component placement and exposure to a temperature proﬁle. Leaded packages,

packages with solder balls, and leadless packages are all reﬂow solderable.

Key characteristics in both wave and reﬂow soldering are:

• Board speciﬁcations, including the board ﬁnish, solder masks and vias

• Package footprints, including solder thieves and orientation

• The moisture sensitivity level of the packages

• Package placement

• Inspection and repair

• Lead-free soldering versus SnPb soldering

14.3 Wave soldering

Key characteristics in wave soldering are:

• Process issues, such as application of adhesive and ﬂux, clinching of leads, board

transport, the solder wave parameters, and the time during which components are

exposed to the wave

• Solder bath speciﬁcations, including temperature and impurities

TJA1055_4

Product data sheet

Rev. 04 — 17 February 2009

21 of 26

TJA1055

NXP Semiconductors

Enhanced fault-tolerant CAN transceiver

14.4 Reﬂow soldering

Key characteristics in reﬂow soldering are:

• Lead-free versus SnPb soldering; note that a lead-free reﬂow process usually leads to

higher minimum peak temperatures (see Figure 12) than a SnPb process, thus

reducing the process window

• Solder paste printing issues including smearing, release, and adjusting the process

window for a mix of large and small components on one board

• Reﬂow temperature proﬁle; this proﬁle includes preheat, reﬂow (in which the board is

heated to the peak temperature) and cooling down. It is imperative that the peak

temperature is high enough for the solder to make reliable solder joints (a solder paste

characteristic). In addition, the peak temperature must be low enough that the

packages and/or boards are not damaged. The peak temperature of the package

depends on package thickness and volume and is classiﬁed in accordance with

Table 10 and 11

Table 10. SnPb eutectic process (from J-STD-020C)

Package thickness (mm) Package reﬂow temperature (°C)

Volume (mm³)

< 350

235

≥ 350

220

< 2.5

≥ 2.5

220

Table 11. Lead-free process (from J-STD-020C)

Package thickness (mm) Package reﬂow temperature (°C)

Volume (mm³)

< 350

260

350 to 2000

> 2000

260

< 1.6

260

250

245

1.6 to 2.5

> 2.5

260

245

250

245

Moisture sensitivity precautions, as indicated on the packing, must be respected at all

times.

Studies have shown that small packages reach higher temperatures during reﬂow

soldering, see Figure 12.

TJA1055_4

Product data sheet

Rev. 04 — 17 February 2009

22 of 26

TJA1055

NXP Semiconductors

Enhanced fault-tolerant CAN transceiver

maximum peak temperature

= MSL limit, damage level

temperature

minimum peak temperature

= minimum soldering temperature

peak

temperature

time

001aac844

MSL: Moisture Sensitivity Level

Fig 12. Temperature proﬁles for large and small components

For further information on temperature proﬁles, refer to Application Note AN10365

“Surface mount reﬂow soldering description”.

15. Appendix

15.1 Overview of differences between the TJA1055 and the TJA1054A

Table 12. Limiting values

Symbol

Parameter

Conditions

TJA1055

TJA1054A

Unit

Min

−58

Max

Min

−27

Max

V_CANH

V_CANL

V_esd

voltage on pin CANH

voltage on pin CANL

+58

+40

V

electrostatic discharge voltage pins RTH, RTL, CANH, CANL

human body model

IEC 61000-4-2

−8

+8

−4

+4

kV

[1]

[1] The ESD performance of pins CANH, CANL, RTH and RTL, with respect to GND, was veriﬁed by an external test house in accordance

with IEC-61000-4-2 (C = 150 pF, R = 330 Ω). The results were equal to, or better than, ±6 kV for TJA1055 and equal to, or better than,

±1.5 kV for TJA1054A.

TJA1055_4

Product data sheet

Rev. 04 — 17 February 2009

23 of 26

TJA1055

NXP Semiconductors

Enhanced fault-tolerant CAN transceiver

16. Revision history

Table 13. Revision history

Document ID

TJA1055_4

Modiﬁcations:

TJA1055_3

TJA1055_2

Release date

20090217

Data sheet status

Change notice

Supersedes

Product data sheet

-

TJA1055_3

• No technical content change; data sheet release date updated

20070313

20061030

20060801

Product data sheet

Preliminary data sheet

Objective data sheet

-

TJA1055_2

TJA1055_1

-

TJA1055_1

(9397 750 14908)

TJA1055_4

Product data sheet

Rev. 04 — 17 February 2009

24 of 26

TJA1055

NXP Semiconductors

Enhanced fault-tolerant CAN transceiver

17. Legal information

17.1 Data sheet status

Document status^[1][2]

Product status^[3]

Development

Deﬁnition

Objective [short] data sheet

This document contains data from the objective speciﬁcation for product development.

This document contains data from the preliminary speciﬁcation.

This document contains the product speciﬁcation.

Preliminary [short] data sheet Qualiﬁcation

Product [short] data sheet Production

[1]

[2]

[3]

Please consult the most recently issued document before initiating or completing a design.

The term ‘short data sheet’ is explained in section “Deﬁnitions”.

The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

malfunction of an NXP Semiconductors product can reasonably be expected

17.2 Deﬁnitions

to result in personal injury, death or severe property or environmental

damage. NXP Semiconductors accepts no liability for inclusion and/or use of

NXP Semiconductors products in such equipment or applications and

therefore such inclusion and/or use is at the customer’s own risk.

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modiﬁcations or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liability for the consequences of

use of such information.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

speciﬁed use without further testing or modiﬁcation.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and title. A short data sheet is intended

for quick reference only and should not be relied upon to contain detailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

ofﬁce. In case of any inconsistency or conﬂict with the short data sheet, the

full data sheet shall prevail.

Limiting values — Stress above one or more limiting values (as deﬁned in

the Absolute Maximum Ratings System of IEC 60134) may cause permanent

damage to the device. Limiting values are stress ratings only and operation of

the device at these or any other conditions above those given in the

Characteristics sections of this document is not implied. Exposure to limiting

values for extended periods may affect device reliability.

Terms and conditions of sale — NXP Semiconductors products are sold

subject to the general terms and conditions of commercial sale, as published

at http://www.nxp.com/proﬁle/terms, including those pertaining to warranty,

intellectual property rights infringement and limitation of liability, unless

explicitly otherwise agreed to in writing by NXP Semiconductors. In case of

any inconsistency or conﬂict between information in this document and such

terms and conditions, the latter will prevail.

17.3 Disclaimers

General — Information in this document is believed to be accurate and

reliable. However, NXP Semiconductors does not give any representations or

warranties, expressed or implied, as to the accuracy or completeness of such

information and shall have no liability for the consequences of use of such

information.

No offer to sell or license — Nothing in this document may be interpreted

or construed as an offer to sell products that is open for acceptance or the

grant, conveyance or implication of any license under any copyrights, patents

or other industrial or intellectual property rights.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation speciﬁcations and product descriptions, at any time and without

notice. This document supersedes and replaces all information supplied prior

to the publication hereof.

17.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks

are the property of their respective owners.

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suitable for use in medical, military, aircraft,

space or life support equipment, nor in applications where failure or

18. Contact information

For more information, please visit: http://www.nxp.com

For sales ofﬁce addresses, please send an email to: salesaddresses@nxp.com

TJA1055_4

Product data sheet

Rev. 04 — 17 February 2009

25 of 26

TJA1055

NXP Semiconductors

Enhanced fault-tolerant CAN transceiver

19. Contents

1

General description . . . . . . . . . . . . . . . . . . . . . . 1

2

2.1

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Optimized for in-car low-speed

communication . . . . . . . . . . . . . . . . . . . . . . . . . 1

Bus failure management. . . . . . . . . . . . . . . . . . 1

Protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Support for low power modes. . . . . . . . . . . . . . 2

2.2

2.3

2.4

3

4

5

Quick reference data . . . . . . . . . . . . . . . . . . . . . 2

Ordering information. . . . . . . . . . . . . . . . . . . . . 3

Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3

6

6.1

6.2

Pinning information. . . . . . . . . . . . . . . . . . . . . . 4

Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4

7

Functional description . . . . . . . . . . . . . . . . . . . 5

Failure detector. . . . . . . . . . . . . . . . . . . . . . . . . 5

Low power modes. . . . . . . . . . . . . . . . . . . . . . . 7

Power-on. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

7.1

7.2

7.3

7.4

8

Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 9

Thermal characteristics. . . . . . . . . . . . . . . . . . 11

Static characteristics. . . . . . . . . . . . . . . . . . . . 11

Dynamic characteristics . . . . . . . . . . . . . . . . . 14

Test information. . . . . . . . . . . . . . . . . . . . . . . . 16

Quality information . . . . . . . . . . . . . . . . . . . . . 19

Package outline . . . . . . . . . . . . . . . . . . . . . . . . 20

9

10

11

12

12.1

13

14

Soldering of SMD packages . . . . . . . . . . . . . . 21

Introduction to soldering . . . . . . . . . . . . . . . . . 21

Wave and reﬂow soldering . . . . . . . . . . . . . . . 21

Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 21

Reﬂow soldering . . . . . . . . . . . . . . . . . . . . . . . 22

14.1

14.2

14.3

14.4

15

15.1

Appendix. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Overview of differences between the

TJA1055 and the TJA1054A. . . . . . . . . . . . . . 23

16

Revision history. . . . . . . . . . . . . . . . . . . . . . . . 24

17

Legal information. . . . . . . . . . . . . . . . . . . . . . . 25

Data sheet status . . . . . . . . . . . . . . . . . . . . . . 25

Deﬁnitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 25

17.1

17.2

17.3

17.4

18

19

Contact information. . . . . . . . . . . . . . . . . . . . . 25

Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 17 February 2009

Document identifier: TJA1055_4


型号：	TJA1055T/3/C
厂家：	NXP
描述：	IC DATACOM, INTERFACE CIRCUIT, PDSO14, 3.90 MM, ROHS COMPLIANT, PLASTIC, MS-012, SOT-108-1, SOP-14, Network Interface 网络接口电信集成电路电信电路光电二极管
文件：	总26页 (文件大小：146K)
中文：	中文翻译
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