TJA1057GTJ [NXP]
TJA1057 - High-speed CAN transceiver SOIC 8-Pin;
| 型号： | TJA1057GTJ |
| 厂家： | 
NXP |
| 描述： | TJA1057 - High-speed CAN transceiver SOIC 8-Pin 电信 光电二极管 电信集成电路 |
| 文件： | 总20页 (文件大小：359K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TJA1057
High-speed CAN transceiver
Rev. 2 — 30 October 2013
Product data sheet
1. General description
The TJA1057 is a high-speed CAN transceiver that provides an interface between a
Controller Area Network (CAN) protocol controller and the physical two-wire CAN bus.
The transceiver is designed for high-speed CAN applications in the automotive industry,
providing the differential transmit and receive capability to (a microcontroller with) a CAN
protocol controller.
The TJA1057 offers a feature set optimized for 12 V automotive applications, with
significant improvements over NXP's first- and second-generation CAN transceivers, such
as the TJA1050, and excellent ElectroMagnetic Compatibility (EMC) performance. The
TJA1057 also displays ideal passive behavior to the CAN bus when the supply voltage is
off.
These features make the TJA1057 an excellent choice for HS-CAN networks that only
require basic CAN functionality. The TJA1057GT variant guarantees additional timing
parameters to ensure robust communication at data rates beyond 1 Mbps as used in, for
example, CAN FD networks.
2. Features and benefits
2.1 General
Fully ISO 11898-2 compliant
Optimized for use in 12 V automotive systems
Excellent ElectroMagnetic Compatibility (EMC) performance, satisfying 'Hardware
Requirements for LIN, CAN and FlexRay Interfaces in Automotive Applications’,
Version 1.3, May 2012.
Compatible with 5 V and 3V3 microcontrollers
2.2 Predictable and fail-safe behavior
Functional behavior predictable under all supply conditions
Transceiver disengages from bus when not powered (zero load) or in Silent mode
Transmit Data (TXD) dominant time-out function
Undervoltage detection on pin VCC
Internal biasing of TXD and S input pins
2.3 Protection
High ESD handling capability on the bus pins (6 kV IEC and HBM)
Bus pins protected against transients in automotive environments
TJA1057
NXP Semiconductors
High-speed CAN transceiver
Thermally protected
2.4 TJA1057GT
Loop delay symmetry guaranteed for data rates up to 5 Mbps
Improved TXD to RXD propagation delay of 210 ns
3. Quick reference data
Table 1.
Symbol
VCC
Quick reference data
Parameter
Conditions
Min
4.75
3.5
Typ
Max
5.25
4.3
Unit
V
supply voltage
-
Vuvd(VCC)
undervoltage detection voltage
on pin VCC
4
V
ICC
supply current
Silent mode
100
2
-
800
10
A
mA
mA
kV
V
Normal mode; bus recessive
Normal mode; bus dominant
IEC 61000-4-2 at pins CANH and CANL
no time limit; DC limiting value
no time limit; DC limiting value
5
45
-
20
70
VESD
VCANH
VCANL
Tvj
electrostatic discharge voltage
voltage on pin CANH
6
+6
42
42
40
-
+42
+42
voltage on pin CANL
-
V
virtual junction temperature
-
+150 C
4. Ordering information
Table 2.
Ordering information
Type number
Package
Name
SO8
Description
Version
TJA1057T
plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
TJA1057GT
TJA1057
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 2 — 30 October 2013
2 of 20
TJA1057
NXP Semiconductors
High-speed CAN transceiver
5. Block diagram
V
CC
3
V
CC
TJA1057
TEMPERATURE
PROTECTION
7
6
V
V
CC
CANH
CANL
SLOPE
CONTROL
AND
1
8
TIME-OUT
DRIVER
TXD
CC
MODE
CONTROL
S
4
RXD
DRIVER
2
015aaa391
GND
Fig 1. Block diagram
TJA1057
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 2 — 30 October 2013
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TJA1057
NXP Semiconductors
High-speed CAN transceiver
6. Pinning information
6.1 Pinning
1
2
3
4
8
7
6
5
TXD
S
GND
CANH
CANL
n.c.
TJA1057
V
CC
RXD
015aaa392
Fig 2. Pin configuration diagram
6.2 Pin description
Table 3.
Pin description
Pin Description
Symbol
TXD
GND
VCC
1
2
3
4
5
6
7
8
transmit data input
ground
supply voltage
RXD
n.c.
receive data output; reads out data from the bus lines
not connected
CANL
CANH
S
LOW-level CAN bus line
HIGH-level CAN bus line
Silent mode control input
TJA1057
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 2 — 30 October 2013
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TJA1057
NXP Semiconductors
High-speed CAN transceiver
7. Functional description
7.1 Operating modes
The TJA1057 supports two operating modes, Normal and Silent. The operating mode is
selected via pin S. See Table 4 for a description of the operating modes under normal
supply conditions.
Table 4.
Mode
Operating modes
Inputs
Outputs
Pin S
Pin TXD
LOW
CAN driver
dominant
recessive
Pin RXD
Normal
Silent
LOW
LOW
HIGH
LOW when bus dominant
HIGH when bus recessive
HIGH
x[1]
biased to recessive follows bus
[1] ‘x’ = don’t care.
7.1.1 Normal mode
A LOW level on pin S selects Normal mode. In this mode, the transceiver can transmit and
receive data via the bus lines, CANH and CANL (see Figure 1 for the block diagram). The
differential receiver converts the analog data on the bus lines into digital data which is
output on pin RXD. The slope of the output signals on the bus lines is controlled and
optimized in a way that guarantees the lowest possible EME.
7.1.2 Silent mode
A HIGH level on pin S selects Silent mode. The transmitter is disabled in Silent mode,
releasing the bus pins to recessive state. All other IC functions, including the receiver,
continue to operate as in Normal mode. Silent mode can be used to prevent a faulty CAN
controller disrupting all network communications.
7.2 Fail-safe features
7.2.1 TXD dominant time-out function
A 'TXD dominant time-out' timer is started when pin TXD is set LOW. If the LOW state on
this pin persists for longer than tto(dom)TXD, the transmitter is disabled, releasing the bus
lines to recessive state. This function prevents a hardware and/or software application
failure from driving the bus lines to a permanent dominant state (blocking all network
communications). The TXD dominant time-out timer is reset when pin TXD is set HIGH.
The TXD dominant time-out time also defines the minimum possible bit rate of 40 kbit/s.
7.2.2 Internal biasing of TXD and S input pins
Pins TXD and S have internal pull-ups to VCC to ensure a safe, defined state in case one
or both of these pins are left floating. Pull-up currents flow in these pins in all states; both
pins should be held HIGH in Silent mode to minimize standby current.
7.2.3 Undervoltage detection on pins VCC
If VCC drops below the undervoltage detection level, Vuvd(VCC), the transceiver switches
off.
TJA1057
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 2 — 30 October 2013
5 of 20
TJA1057
NXP Semiconductors
High-speed CAN transceiver
7.2.4 Overtemperature protection
The output drivers are protected against overtemperature conditions. If the virtual junction
temperature exceeds the shutdown junction temperature, Tj(sd), both output drivers are
disabled. When the virtual junction temperature drops below Tj(sd) again, the output
drivers recover once TXD has been reset to HIGH. Including the TXD condition prevents
output driver oscillation due to small variations in temperature.
TJA1057
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 2 — 30 October 2013
6 of 20
TJA1057
NXP Semiconductors
High-speed CAN transceiver
8. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are referenced to GND.
Symbol Parameter
Conditions
Min
Max
Unit
Vx
voltage on pin x
DC value
on pins CANH, CANL
on pin VCC
42
+42
V
V
V
V
0.3 +6
[1]
[2]
[3]
[4]
[5]
on any other pin
on pins CANH and CANL
IEC 61000-4-2
at pins CANH and CANL
HBM
0.3 VCC + 0.3
150 +100
Vtrt
transient voltage
VESD
electrostatic discharge voltage
6
+6
kV
at pins CANH and CANL
at any other pin
MM
6
4
+6
+4
kV
kV
[6]
[7]
at any pin
200 +200
V
CDM
at corner pins
at any pin
750 +750
500 +500
V
V
[8]
Tvj
virtual junction temperature
storage temperature
40
55
+150
+150
C
C
Tstg
[1] No time limit.
[2] Verified by IBEE Zwickau to ensure that pins CANH and CANL can withstand ISO 7637 part 3 automotive transient test pulses 1, 2a, 3a
and 3b.
[3] IEC 61000-4-2 (150 pF, 330 ); direct coupling.
[4] ESD performance of pins CANH and CANL according to IEC 61000-4-2 (150 pF, 330 ) has been verified by an external test house.
The result is equal to or better than 6 kV (unaided).
[5] Human Body Model (HBM): according to AEC-Q100-002 (100 pF, 1.5 k).
[6] Machine Model (MM): according to AEC-Q100-003 (200 pF, 0.75 H, 10 ).
[7] Charged Device Model (CDM): according to AEC-Q100-011 (field Induced charge; 4 pF); grade C3B.
[8] In accordance with IEC 60747-1. An alternative definition of virtual junction temperature is: Tvj = Tamb + P Rth(vj-a), where Rth(vj-a) is a
fixed value to be used for the calculation of Tvj. The rating for Tvj limits the allowable combinations of power dissipation (P) and ambient
temperature (Tamb).
9. Thermal characteristics
Table 6.
Thermal characteristics
According to IEC 60747-1.
Symbol
Parameter
Conditions
Value
Unit
Rth(vj-a)
thermal resistance from virtual junction to ambient
SO8 package; in free air
97
K/W
TJA1057
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 2 — 30 October 2013
7 of 20
TJA1057
NXP Semiconductors
High-speed CAN transceiver
10. Static characteristics
Table 7.
Static characteristics
Tvj = 40 C to +150 C; VCC = 4.75 V to 5.25 V; RL = 60 ; CL = 100 pF unless specified otherwise; All voltages are defined
with respect to ground. Positive currents flow into the IC.[1]
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Supply; pin VCC
VCC
supply voltage
4.75
3.5
-
5.25
4.3
V
V
Vuvd(VCC)
undervoltage detection
voltage on pin VCC
4
ICC
supply current
Silent mode; VTXD = VCC
Normal mode
0.1
-
2.5
mA
recessive; VTXD = VCC
dominant; VTXD = 0 V
2
5
10
70
mA
mA
20
45
Silent mode control input; pin S
VIH
VIL
IIH
HIGH-level input voltage
2
-
-
-
-
VCC + 0.3 V
LOW-level input voltage
HIGH-level input current
LOW-level input current
0.3
1
0.8
+1
1
V
VS = VCC
VS = 0 V
A
A
IIL
15
CAN transmit data input; pin TXD
VIH
VIL
IIH
IIL
HIGH-level input voltage
LOW-level input voltage
HIGH-level input current
LOW-level input current
input capacitance
2
-
VCC + 0.3 V
0.3
5
-
0.8
+5
V
VTXD = VCC
VTXD = 0 V
-
A
A
pF
260
-
150
70
10
[2]
Ci
5
CAN receive data output; pin RXD
IOH
IOL
HIGH-level output current
LOW-level output current
VRXD = VCC 0.4 V
8
3
1
mA
mA
VRXD = 0.4 V; bus dominant
1
-
12
Bus lines; pins CANH and CANL
VO(dom)
dominant output voltage
VTXD = 0 V; t < tto(dom)TXD
pin CANH
2.75
0.5
3.5
1.5
-
4.5
V
pin CANL
2.25
+400
V
Vdom(TX)sym
VO(dif)bus
transmitter dominant voltage Vdom(TX)sym = VCC VCANH VCANL
400
mV
symmetry
bus differential output
voltage
VTXD = 0 V; t < tto(dom)TXD
RL = 50 to 65
1.5
-
3
V
VTXD = VCC; bus recessive; no load
VTXD = VCC; no load
50
2
-
+50
3
mV
V
VO(rec)
recessive output voltage
0.5VCC
-
[3]
Vth(RX)dif
differential receiver
threshold voltage
Vcm(CAN) = 12 V to +12 V;
Normal/Silent mode
0.5
0.9
V
Vhys(RX)dif
IO(dom)
differential receiver
hysteresis voltage
Vcm(CAN) = 12 V to +12 V
Normal mode
50
-
300
mV
dominant output current
VTXD = 0 V; t < tto(dom)TXD; VCC = 5 V
pin CANH; VCANH = 0 V
100
70
40
mA
mA
pin CANL; VCANL = 5 V / 40 V
40
70
100
TJA1057
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 2 — 30 October 2013
8 of 20
TJA1057
NXP Semiconductors
High-speed CAN transceiver
Table 7.
Static characteristics …continued
Tvj = 40 C to +150 C; VCC = 4.75 V to 5.25 V; RL = 60 ; CL = 100 pF unless specified otherwise; All voltages are defined
with respect to ground. Positive currents flow into the IC.[1]
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
IO(rec)
recessive output current
Normal mode; VTXD = VCC
5
-
+5
mA
VCANH = VCANL = 27 V to +32 V
IL
leakage current
VCC = 0 V; VCANH = VCANL = 5 V
5
9
-
+5
28
+3
52
20
A
k
%
Ri
input resistance
15
-
Ri
Ri(dif)
Ci(cm)
input resistance deviation
differential input resistance
between VCANH and VCANL
3
19
-
30
-
k
pF
[2]
[2]
common-mode input
capacitance
Ci(dif)
differential input capacitance
-
-
-
10
-
pF
Temperature detection
Tj(sd) shutdown junction
temperature
[2]
185
C
[1] Factory testing uses correlated test conditions to cover the specified temperature and power supply voltage range.
[2] Guaranteed by design.
[3]
Vcm(CAN) is the common mode voltage of CANH and CANL.
TJA1057
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 2 — 30 October 2013
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TJA1057
NXP Semiconductors
High-speed CAN transceiver
11. Dynamic characteristics
Table 8.
Dynamic characteristics
Tvj = 40 C to +150 C; VCC = 4.75 V to 5.25 V; RL = 60 ; CL = 100 pF unless specified otherwise. All voltages are defined
with respect to ground.[1]
Symbol
Parameter
Conditions
Min Typ
Max
Unit
Transceiver timing; pins CANH, CANL, TXD and RXD; see Figure 3 and Figure 4
td(TXD-busdom) delay time from TXD to bus dominant
td(TXD-busrec) delay time from TXD to bus recessive
td(busdom-RXD) delay time from bus dominant to RXD
td(busrec-RXD) delay time from bus recessive to RXD
Normal mode
-
65
90
60
65
-
-
ns
ns
ns
ns
ns
ns
ns
Normal mode
-
-
Normal mode
-
-
Normal mode
-
-
tPD(TXD-RXD)
propagation delay from TXD to RXD
TJA1057T; Normal mode
TJA1057GT; Normal mode
50
50
-
230
210
300
-
[2]
[3]
[3]
TJA1057GT; Normal mode;
RL = 120 ; CL = 200 pF
-
tbit(RXD)
bit time on pin RXD
TJA1057GT only;
tbit(TXD) = 500 ns
400
120
0.8
-
550
220
16
ns
ns
ms
TJA1057GT only;
tbit(TXD) = 200 ns
-
tto(dom)TXD
TXD dominant time-out time
VTXD = 0 V; Normal mode
3
[1] Factory testing uses correlated test conditions to cover the specified temperature and power supply voltage range.
[2] Guaranteed by design.
[3] See Figure 5.
ꢃꢄꢂ9
ꢀꢁꢁꢂQ)
9
&&
7;'
&$1+
&$1/
5
&
/
/
7-$ꢀꢁꢂꢃ
5;'
*1'
6
ꢀꢄꢂS)
ꢀꢁꢂDDDꢃꢄꢃ
Fig 3. CAN transceiver timing test circuit
TJA1057
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 2 — 30 October 2013
10 of 20
TJA1057
NXP Semiconductors
High-speed CAN transceiver
HIGH
LOW
TXD
CANH
CANL
dominant
0.9 V
V
O(dif)(bus)
0.5 V
recessive
HIGH
0.7V
IO
RXD
0.3V
IO
LOW
t
t
d(TXD-busrec)
d(TXD-busdom)
t
t
d(busrec-RXD)
d(busdom-RXD)
t
t
PD(TXD-RXD)
PD(TXD-RXD)
015aaa169
Fig 4. CAN transceiver timing diagram
ꢇꢁꢂꢈ
7;'
ꢉꢁꢂꢈ
ꢉꢁꢂꢈ
ꢄꢂ[ꢂW
ELWꢅ7;'ꢆ
W
ELWꢅ7;'ꢆ
ꢇꢁꢂꢈ
5;'
ꢉꢁꢂꢈ
W
ELWꢅ5;'ꢆ
DDDꢅꢀꢀꢆꢄꢂꢀ
Fig 5. Loop delay symmetry timing diagram (TJA1057GT only)
TJA1057
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 2 — 30 October 2013
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TJA1057
NXP Semiconductors
High-speed CAN transceiver
12. Application information
5 V
BAT
V
CC
V
CANH
S
DD
I/O
μC + CAN
TJA1057
TXD
RXD
CONTROLLER
TX0
CANL
RX0
GND
GND
015aaa394
Fig 6. Typical TJA1057 application with a 5 V microcontroller.
13. Test information
13.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q100 - Failure mechanism based stress test qualification for integrated
circuits, and is suitable for use in automotive applications.
TJA1057
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 2 — 30 October 2013
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TJA1057
NXP Semiconductors
High-speed CAN transceiver
14. Package outline
SO8: plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
D
E
A
X
c
y
H
v
M
A
E
Z
5
8
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
4
e
w
M
detail X
b
p
0
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
(1)
(1)
(2)
UNIT
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.
0.25
0.10
1.45
1.25
0.49
0.36
0.25
0.19
5.0
4.8
4.0
3.8
6.2
5.8
1.0
0.4
0.7
0.6
0.7
0.3
mm
1.27
0.05
1.05
0.041
1.75
0.25
0.01
0.25
0.01
0.25
0.1
8o
0o
0.010 0.057
0.004 0.049
0.019 0.0100 0.20
0.014 0.0075 0.19
0.16
0.15
0.244
0.228
0.039 0.028
0.016 0.024
0.028
0.012
inches 0.069
0.01 0.004
Notes
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-18
SOT96-1
076E03
MS-012
Fig 7. Package outline SOT96-1 (SO8)
TJA1057
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 2 — 30 October 2013
13 of 20
TJA1057
NXP Semiconductors
High-speed CAN transceiver
15. Handling information
All input and output pins are protected against ElectroStatic Discharge (ESD) under
normal handling. When handling ensure that the appropriate precautions are taken as
described in JESD625-A or equivalent standards.
16. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
16.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
16.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
• Through-hole components
• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
• Board specifications, including the board finish, solder masks and vias
• Package footprints, including solder thieves and orientation
• The moisture sensitivity level of the packages
• Package placement
• Inspection and repair
• Lead-free soldering versus SnPb soldering
16.3 Wave soldering
Key characteristics in wave soldering are:
TJA1057
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Product data sheet
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TJA1057
NXP Semiconductors
High-speed CAN transceiver
• Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
• Solder bath specifications, including temperature and impurities
16.4 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 8) than a SnPb process, thus
reducing the process window
• Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 9 and 10
Table 9.
SnPb eutectic process (from J-STD-020D)
Package thickness (mm) Package reflow temperature (C)
Volume (mm3)
< 350
350
220
< 2.5
235
220
2.5
220
Table 10. Lead-free process (from J-STD-020D)
Package thickness (mm) Package reflow temperature (C)
Volume (mm3)
< 350
260
350 to 2000
> 2000
260
< 1.6
260
250
245
1.6 to 2.5
> 2.5
260
245
250
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 8.
TJA1057
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Product data sheet
Rev. 2 — 30 October 2013
15 of 20
TJA1057
NXP Semiconductors
High-speed CAN transceiver
maximum peak temperature
= MSL limit, damage level
temperature
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 8. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
TJA1057
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 2 — 30 October 2013
16 of 20
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High-speed CAN transceiver
17. Revision history
Table 11. Revision history
Document ID
TJA1057 v.2
Modifications:
Release date
20131030
Data sheet status
Change notice
Supersedes
Product data sheet
-
TJA1057 v.1
• specification status changed to ‘Product’
• added Mantis logo on front page
• added TJA1057GT variant:
–
–
–
–
Section 1, Table 2: text amended
Section 2.4: added
Table 8: parameter tPD(TXD-RXD) amended; parameter tbit(RXD) added
Figure 5: added
• Section 2.1: text amended
• Table 5, Table note 2: text amended
• Table 7, table header text amended (CL added); Table note 1, Table note 2 text amended
• Table 8, table header text amended (CL added, last sentence deleted); Table note 1 text
amended; parameter value added: tPD(TXD-RXD) along with associated table note (Table
note 2)
• Figure 3 amended
TJA1057 v.1
20130530
Preliminary data sheet
-
-
TJA1057
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 2 — 30 October 2013
17 of 20
TJA1057
NXP Semiconductors
High-speed CAN transceiver
18. Legal information
18.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
Suitability for use in automotive applications — This NXP
18.2 Definitions
Semiconductors product has been qualified for use in automotive
applications. Unless otherwise agreed in writing, the product is not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer's own
risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
18.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
TJA1057
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 2 — 30 October 2013
18 of 20
TJA1057
NXP Semiconductors
High-speed CAN transceiver
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
18.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
19. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
TJA1057
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 2 — 30 October 2013
19 of 20
TJA1057
NXP Semiconductors
High-speed CAN transceiver
20. Contents
1
General description. . . . . . . . . . . . . . . . . . . . . . 1
2
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
General. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Predictable and fail-safe behavior . . . . . . . . . . 1
Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
TJA1057GT . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
2.1
2.2
2.3
2.4
3
4
5
Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
6
6.1
6.2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 4
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
7
7.1
Functional description . . . . . . . . . . . . . . . . . . . 5
Operating modes . . . . . . . . . . . . . . . . . . . . . . . 5
Normal mode . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Silent mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Fail-safe features . . . . . . . . . . . . . . . . . . . . . . . 5
TXD dominant time-out function. . . . . . . . . . . . 5
Internal biasing of TXD and S input pins . . . . . 5
Undervoltage detection on pins VCC. . . . . . . . . 5
Overtemperature protection . . . . . . . . . . . . . . . 6
7.1.1
7.1.2
7.2
7.2.1
7.2.2
7.2.3
7.2.4
8
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 7
Thermal characteristics . . . . . . . . . . . . . . . . . . 7
Static characteristics. . . . . . . . . . . . . . . . . . . . . 8
Dynamic characteristics . . . . . . . . . . . . . . . . . 10
Application information. . . . . . . . . . . . . . . . . . 12
Test information. . . . . . . . . . . . . . . . . . . . . . . . 12
Quality information . . . . . . . . . . . . . . . . . . . . . 12
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 13
Handling information. . . . . . . . . . . . . . . . . . . . 14
9
10
11
12
13
13.1
14
15
16
Soldering of SMD packages . . . . . . . . . . . . . . 14
Introduction to soldering . . . . . . . . . . . . . . . . . 14
Wave and reflow soldering . . . . . . . . . . . . . . . 14
Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 14
Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . 15
16.1
16.2
16.3
16.4
17
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 17
18
Legal information. . . . . . . . . . . . . . . . . . . . . . . 18
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 18
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 19
18.1
18.2
18.3
18.4
19
20
Contact information. . . . . . . . . . . . . . . . . . . . . 19
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2013.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 30 October 2013
Document identifier: TJA1057
相关型号：
TJA1080ATS/2/T
IC SPECIALTY INTERFACE CIRCUIT, PDSO20, 5.30 MM, PLASTIC, MO-150, SOT339-1, SSOP-20, Interface IC:Other
NXP
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