TJA1055T/3 [NXP]
Enhanced fault-tolerant CAN transceiver; 增强的容错CAN收发器型号: | TJA1055T/3 |
厂家: | NXP |
描述: | Enhanced fault-tolerant CAN transceiver |
文件: | 总26页 (文件大小:146K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
TJA1055
Enhanced fault-tolerant CAN transceiver
Rev. 04 — 17 February 2009
Product data sheet
1. General description
The TJA1055 is the interface between the protocol controller and the physical bus wires in
a Controller Area Network (CAN). It is primarily intended for low-speed applications up to
125 kBd in passenger cars. The device provides differential receive and transmit
capability but will switch to single-wire transmitter and/or receiver in error conditions. The
TJA1055 is the enhanced version of the TJA1054 and TJA1054A. TJA1055 has the same
functionality but in addition offering a number of improvements. The most important
improvements of the TJA1055 with respect to the TJA1054 and TJA1054A are:
• Improved ElectroStatic Discharge (ESD) performance
• Lower current consumption in sleep mode
• Wake-up signalling on RXD and ERR without VCC active
• 3 V interfacing with microcontroller possible with TJA1055T/3
2. Features
2.1 Optimized for in-car low-speed communication
I Pin-to-pin compatible with TJA1054 and TJA1054A
I Baud rate up to 125 kBd
I Up to 32 nodes can be connected
I Supports unshielded bus wires
I Very low ElectroMagnetic Emission (EME) due to built-in slope control function and a
very good matching of the CANL and CANH bus outputs
I Very high ElectroMagnetic Immunity (EMI) in normal operating mode and in low power
modes
I Fully integrated receiver filters
I Transmit Data (TxD) dominant time-out function
I High ESD robustness:
N ±8 kV Electrostatic Discharge (ESD) protection Human Body Model (HBM) for
off-board pins
N ±6 kV Electrostatic Discharge (ESD) protection IEC 61000-4-2 for off-board pins
I Low-voltage microcontroller support
2.2 Bus failure management
I Supports single-wire transmission modes with ground offset voltages up to 1.5 V
I Automatic switching to single-wire mode in the event of bus failures, even when the
CANH bus wire is short-circuited to VCC
TJA1055
NXP Semiconductors
Enhanced fault-tolerant CAN transceiver
I Automatic reset to differential mode if bus failure is removed
I Full wake-up capability during failure modes
2.3 Protections
I Bus pins short-circuit safe to battery and to ground
I Thermally protected
I Bus lines protected against transients in an automotive environment
I An unpowered node does not disturb the bus lines
I Microcontroller interface without reverse current paths, if unpowered
2.4 Support for low power modes
I Low current sleep mode and standby mode with wake-up via the bus lines
I Software accessible power-on reset flag
3. Quick reference data
Table 1.
Quick reference data
Symbol Parameter
Conditions
Min
4.75
−0.3
5.0
-
Typ Max Unit
VCC
supply voltage
-
-
-
-
5.25
+40
40
V
VBAT
battery supply voltage
no time limit
operating mode
load dump
V
V
58
V
IBAT
battery supply current
voltage on pin CANH
voltage on pin CANL
sleep mode at
-
25 40
µA
V
V
RTL = VWAKE = VINH
BAT = 14 V; Tamb
=
=
−40 °C to +125 °C
VCC = 0 V to 5.0 V;
BAT ≥ 0 V; no time limit;
VCANH
−58
−58
-
-
+58
V
V
V
with respect to any other
pin
VCANL
VCC = 0 V to 5.0 V;
+58
VBAT ≥ 0 V; no time limit;
with respect to any other
pin
VO(dom) dominant output voltage
on pin CANH
VTXD = 0 V; VEN = VCC
ICANH = −40 mA
ICANL = 40 mA
V
-
CC − 1.4 -
-
V
on pin CANL
-
-
1.4
1.5
V
tPD(L)
propagation delay TXD
(LOW) to RXD (LOW)
no failures;
-
µs
R
CAN_L = RCAN_H
125 Ω; CCAN_L
CAN_H = 1 nF;
see Figure 4 to Figure 6
=
=
C
[1]
Tvj
virtual junction temperature
−40
-
+150 °C
[1] Junction temperature in accordance with “IEC 60747-1”. An alternative definition is: Tvj = Tamb + P × Rth(vj-a)
where Rth(vj-a) is a fixed value to be used for the calculation of Tvj. The rating for Tvj limits the allowable
combinations of power dissipation (P) and operating ambient temperature (Tamb).
TJA1055_4
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 — 17 February 2009
2 of 26
TJA1055
NXP Semiconductors
Enhanced fault-tolerant CAN transceiver
4. Ordering information
Table 2.
Ordering information
Type number
Package
Name
Description
plastic small outline package; 14 leads; body width 3.9 mm
Version
TJA1055T
SO14
SOT108-1
TJA1055T/3
5. Block diagram
V
BAT
14
CC
10
1
INH
TEMPERATURE
PROTECTION
7
WAKE-UP
STANDBY
CONTROL
WAKE
5
9
11
12
8
STB
RTL
6
EN
CANH
CANL
RTH
V
CC
DRIVER
2
4
TIMER
(2)
TXD
ERR
(1)
V
CC
FAILURE DETECTOR
PLUS WAKE-UP
PLUS TIME-OUT
TJA1055T
(2)
CC
V
FILTER
3
RECEIVER
RXD
FILTER
13
GND
001aac769
(1) For TJA1055T/3 current source to GND; for TJA1055T pull-up resistor to VCC
(2) Not within TJA1055T/3.
.
Fig 1. Block diagram
TJA1055_4
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 — 17 February 2009
3 of 26
TJA1055
NXP Semiconductors
Enhanced fault-tolerant CAN transceiver
6. Pinning information
6.1 Pinning
1
2
3
4
5
6
7
14
13
12
11
10
9
INH
TXD
BAT
GND
CANL
CANH
RXD
ERR
STB
TJA1055T
TJA1055T/3
V
CC
EN
RTL
RTH
8
WAKE
001aac770
Fig 2. Pin configuration
6.2 Pin description
Table 3.
Symbol
INH
Pin description
Pin
Description
1
inhibit output for switching an external voltage regulator if a
wake-up signal occurs
TXD
RXD
ERR
2
3
4
transmit data input for activating the driver to the bus lines
receive data output for reading out the data from the bus lines
error, wake-up and power-on indication output; active LOW in
normal operating mode when a bus failure is detected; active LOW
in standby and sleep mode when a wake-up is detected; active
LOW in power-on standby when a VBAT power-on event is detected
STB
EN
5
6
standby digital control signal input; together with the input signal
on pin EN this input determines the state of the transceiver;
see Table 5 and Figure 3
enable digital control signal input; together with the input signal on
pin STB this input determines the state of the transceiver;
see Table 5 and Figure 3
WAKE
RTH
7
8
9
local wake-up signal input (active LOW); both falling and rising
edges are detected
termination resistor connection; in case of a CANH bus wire error
the line is terminated with a predefined impedance
RTL
termination resistor connection; in case of a CANL bus wire error
the line is terminated with a predefined impedance
VCC
10
11
12
13
14
supply voltage
CANH
CANL
GND
BAT
HIGH-level CAN bus line
LOW-level CAN bus line
ground
battery supply voltage
TJA1055_4
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 — 17 February 2009
4 of 26
TJA1055
NXP Semiconductors
Enhanced fault-tolerant CAN transceiver
7. Functional description
The TJA1055 is the interface between the CAN protocol controller and the physical wires
of the CAN bus (see Figure 9 and Figure 10). It is primarily intended for low-speed
applications, up to 125 kBd, in passenger cars. The device provides differential transmit
capability to the CAN bus and differential receive capability to the CAN controller.
To reduce EME, the rise and fall slopes are limited. This allows the use of an unshielded
twisted pair or a parallel pair of wires for the bus lines. Moreover, the device supports
transmission capability on either bus line if one of the wires is corrupted. The failure
detection logic automatically selects a suitable transmission mode.
In normal operating mode (no wiring failures) the differential receiver is output on pin RXD
(see Figure 1). The differential receiver inputs are connected to pins CANH and CANL
through integrated filters. The filtered input signals are also used for the single-wire
receivers. The receivers connected to pins CANH and CANL have threshold voltages that
ensure a maximum noise margin in single-wire mode.
A timer function (TxD dominant time-out function) has been integrated to prevent the bus
lines from being driven into a permanent dominant state (thus blocking the entire network
communication) due to a situation in which pin TXD is permanently forced to a LOW level,
caused by a hardware and/or software application failure.
If the duration of the LOW level on pin TXD exceeds a certain time, the transmitter will be
disabled. The timer will be reset by a HIGH level on pin TXD.
7.1 Failure detector
The failure detector is fully active in the normal operating mode. After the detection of a
single bus failure the detector switches to the appropriate mode (see Table 4). The
differential receiver threshold voltage is set at −3.2 V typical (VCC = 5 V). This ensures
correct reception with a noise margin as high as possible in the normal operating mode
and in the event of failures 1, 2, 5 and 6a. These failures, or recovery from them, do not
destroy ongoing transmissions. The output drivers remain active, the termination does not
change and the receiver remains in differential mode (see Table 4).
Failures 3, 3a and 6 are detected by comparators connected to the CANH and CANL bus
lines. Failures 3 and 3a are detected in a two-step approach. If the CANH bus line
exceeds a certain voltage level, the differential comparator signals a continuous dominant
condition. Because of inter operability reasons with the predecessor products TJA1054
and TJA1054A, after a first time-out the transceiver switches to single-wire operation
through CANH. If the CANH bus line is still exceeding the CANH detection voltage for a
second time-out, the TJA1055 switches to CANL operation; the CANH driver is switched
off and the RTH bias changes to the pull-down current source. The time-outs (delays) are
needed to avoid false triggering by external RF fields.
TJA1055_4
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 — 17 February 2009
5 of 26
TJA1055
NXP Semiconductors
Enhanced fault-tolerant CAN transceiver
Table 4.
Bus failures
Failure Description
Termination Termination CANH
CANH (RTH) CANL (RTL) driver
CANL
driver
Receiver
mode
1
CANH wire
interrupted
on
on
on
on
differential
2
3
CANL wire interrupted on
CANH short-circuited weak[1]
to battery
on
on
on
off
on
on
differential
CANL
3a
4
CANH short-circuited weak[1]
to VCC
on
off
on
on
on
on
on
on
off
on
off
on
off
CANL
CANL short-circuited on
to ground
weak[2]
on
CANH
5
CANH short-circuited on
to ground
differential
CANH
6
CANL short-circuited on
to battery
weak[2]
on
6a
7
CANL short-circuited on
to VCC
differential
CANH
CANL and CANH
mutually
on
weak[2]
short-circuited
[1] A weak termination implies a pull-down current source behavior of 75 µA typical.
[2] A weak termination implies a pull-up current source behavior of 75 µA typical.
Failure 6 is detected if the CANL bus line exceeds its comparator threshold for a certain
period of time. This delay is needed to avoid false triggering by external RF fields. After
detection of failure 6, the reception is switched to the single-wire mode through CANH; the
CANL driver is switched off and the RTL bias changes to the pull-up current source.
Recovery from failures 3, 3a and 6 is detected automatically after reading a consecutive
recessive level by corresponding comparators for a certain period of time.
Failures 4 and 7 initially result in a permanent dominant level on pin RXD. After a time-out
the CANL driver is switched off and the RTL bias changes to the pull-up current source.
Reception continues by switching to the single-wire mode via pins CANH or CANL. When
failures 4 or 7 are removed, the recessive bus levels are restored. If the differential voltage
remains below the recessive threshold level for a certain period of time, reception and
transmission switch back to the differential mode.
If any of the wiring failure occurs, the output signal on pin ERR will be set to LOW. On
error recovery, the output signal on pin ERR will be set to HIGH again. In case of an
interrupted open bus wire, this failure will be detected and signalled only if there is an
open wire between the transmitting and receiving node(s). Thus, during open wire
failures, pin ERR typically toggles.
During all single-wire transmissions, EMC performance (both immunity and emission) is
worse than in the differential mode. The integrated receiver filters suppress any HF noise
induced into the bus wires. The cut-off frequency of these filters is a compromise between
propagation delay and HF suppression. In single-wire mode, LF noise cannot be
distinguished from the required signal.
TJA1055_4
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 — 17 February 2009
6 of 26
TJA1055
NXP Semiconductors
Enhanced fault-tolerant CAN transceiver
7.2 Low power modes
The transceiver provides three low power modes which can be entered and exited via
STB and EN (see Table 5 and Figure 3).
The sleep mode is the mode with the lowest power consumption. Pin INH is switched to
HIGH-impedance for deactivation of the external voltage regulator. Pin CANL is biased to
the battery voltage via pin RTL. Pins RXD and ERR will signal the wake-up interrupt even
in case VCC is not present.
The standby mode operates in the same way as the sleep mode but with a HIGH level on
pin INH.
The power-on standby mode is the same as the standby mode, however, in this mode the
battery power-on flag is shown on pin ERR instead of the wake-up interrupt signal. The
output on pin RXD will show the wake-up interrupt. This mode is only for reading out the
power-on flag.
Table 5.
Mode
Normal operating and low power modes
Pin STB Pin EN
Pin ERR
LOW
Pin RXD
LOW
Pin RTL
switched
to
HIGH
HIGH
[2][3]
[2][3]
Goto-sleep LOW
command
HIGH
wake-up
interrupt
signal[1]
wake-up
interrupt
signal[1]
VBAT
Sleep
LOW
LOW
HIGH
LOW[4]
LOW
Standby
Power-on
standby
LOW
VBAT
power-on
flag[5]
wake-up
interrupt
signal[1]
VBAT
Normal
operating
HIGH
HIGH
error flag no error
flag
dominant recessive VCC
received
data
received
data
[1] Wake-up interrupts are released when entering normal operating mode.
[2] For TJA1055T a diode is added in series with the high-side driver of ERR and RXD to prevent a reverse
current from ERR to VCC in the unpowered state.
[3] For TJA1055T/3, ERR and RXD are open-drain.
[4] In case the goto-sleep command was used before. When VCC drops, pin EN will become LOW, but due to
the fail-safe functionality this does not effect the internal functions.
[5] VBAT power-on flag will be reset when entering normal operating mode.
Wake-up requests are recognized by the transceiver through two possible channels:
• The bus lines for remote wake-up
• Pin WAKE for local wake-up
In order to wake-up the transceiver remotely through the bus lines, a filter mechanism is
integrated. This mechanism makes sure that noise and any present bus failure conditions
do not result into an erroneous wake-up. Because of this mechanism it is not sufficient to
simply pull the CANH or CANL bus lines to a dominant level for a certain time. To
guarantee a successful remote wake-up under all conditions, a message frame with a
dominant phase of at least the maximum specified tdom(CANH) or tdom(CANL) in it is required.
TJA1055_4
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 — 17 February 2009
7 of 26
TJA1055
NXP Semiconductors
Enhanced fault-tolerant CAN transceiver
A local wake-up through pin WAKE is detected by a rising or falling edge with a
consecutive level exceeding the maximum specified tWAKE
.
On a wake-up request the transceiver will set the output on pin INH to HIGH which can be
used to activate the external supply voltage regulator.
A wake-up request is signalled on ERR or RXD with an active LOW signal. So the external
microcontroller can activate the transceiver (switch to normal operating mode) via
pins STB and EN.
To prevent a false remote wake-up due to transients or RF fields, the wake-up voltage
levels have to be maintained for a certain period of time. In the low power modes the
failure detection circuit remains partly active to prevent an increased power consumption
in the event of failures 3, 3a, 4 and 7.
To prevent a false local wake-up during an open wire at pin WAKE, this pin has a weak
pull-up current source towards VBAT. However, in order to protect the transceiver against
any EMC immunity issues, it is recommended to connect a not used pin WAKE to pin
BAT. Pin INH is set to floating only if the goto-sleep command is entered successfully. To
enter a successful goto-sleep command under all conditions, this command must be kept
stable for the maximum specified td(sleep)
.
Pin INH will be set to a HIGH level again by the following events only:
• VBAT power-on (cold start)
• Rising or falling edge on pin WAKE
• A message frame with a dominant phase of at least the maximum specified tdom(CANH)
or tdom(CANL), while pin EN or pin STB is at a LOW level
• Pin STB goes to a HIGH level with VCC active
To provide fail-safe functionality, the signals on pins STB and EN will internally be set to
LOW when VCC is below a certain threshold voltage (VCC(stb)). An unused output pin INH
can simply be left open within the application.
7.3 Power-on
After power-on (VBAT switched on) the signal on pin INH will become HIGH and an internal
power-on flag will be set. This flag can be read in the power-on standby mode through
pin ERR (STB = 1; EN = 0) and will be reset by entering the normal operating mode.
7.4 Protections
A current limiting circuit protects the transmitter output stages against short-circuit to
positive and negative battery voltage.
If the junction temperature exceeds the typical value of 175 °C, the transmitter output
stages are disabled. Because the transmitter is responsible for the major part of the power
dissipation, this will result in a reduced power dissipation and hence a lower chip
temperature. All other parts of the device will continue to operate.
The pins CANH and CANL are protected against electrical transients which may occur in
an automotive environment.
TJA1055_4
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 — 17 February 2009
8 of 26
TJA1055
NXP Semiconductors
Enhanced fault-tolerant CAN transceiver
POWER-ON
STANDBY
10
GOTO
SLEEP
(4)
NORMAL
11
(5)
01
STANDBY
00
SLEEP
00
(1)
(2)
(3)
mbk949
Mode 10 stands for: Pin STB = HIGH and pin EN = LOW.
(1) Mode change via input pins STB and EN.
(2) Mode change via input pins STB and EN; it should be noted that in the sleep mode pin INH is
inactive and possibly there is no VCC. Mode control is only possible if VCC of the transceiver is
active.
(3) Pin INH is activated and pins RXD and ERR are pulled LOW after wake-up via bus or input
pin WAKE.
(4) Transitions to normal mode clear the internal wake-up: wake-up interrupt flag and power-on flag
are cleared.
(5) Transitions to sleep mode: pin INH is deactivated.
Fig 3. Mode control
8. Limiting values
Table 6.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).[1]
Symbol
VCC
Parameter
Conditions
Min
−0.3
−0.3
−0.3
−0.3
−0.3
−0.3
−0.3
−58
Max
Unit
V
supply voltage
+6
VBAT
battery supply voltage
voltage on pin TXD
voltage on pin RXD
voltage on pin ERR
voltage on pin STB
voltage on pin EN
voltage on pin CANH
+58
V
VTXD
VRXD
VERR
VSTB
VEN
VCC + 0.3
VCC + 0.3
VCC + 0.3
VCC + 0.3
VCC + 0.3
+58
V
V
V
V
V
VCANH
VCC = 0 V to 5.0 V;
V
VBAT ≥ 0 V; no time
limit; with respect to
any other pin
TJA1055_4
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 — 17 February 2009
9 of 26
TJA1055
NXP Semiconductors
Enhanced fault-tolerant CAN transceiver
Table 6. Limiting values …continued
In accordance with the Absolute Maximum Rating System (IEC 60134).[1]
Symbol
Parameter
Conditions
Min
Max
Unit
VCANL
voltage on pin CANL
VCC = 0 V to 5.0 V;
−58
+58
V
VBAT ≥ 0 V; no time
limit; with respect to
any other pin
Vtrt(n)
transient voltage on
pins CANH and CANL
see Figure 7 and 8
−150
−0.3
+100
+58
V
V
VI(WAKE)
input voltage on pin WAKE with respect to any
other pin
[2]
II(WAKE)
VINH
input current on pin WAKE
voltage on pin INH
−15
−0.3
−58
-
mA
V
VBAT + 0.3
+58
VRTH
voltage on pin RTH
with respect to any
other pin
V
VRTL
RRTH
RRTL
voltage on pin RTL
with respect to any
other pin
−58
500
500
+58
V
Ω
Ω
termination resistance on
pin RTH
16000
16000
termination resistance on
pin RTL
[3]
[4]
Tvj
virtual junction temperature
storage temperature
−40
−55
+150
+150
°C
°C
Tstg
Vesd
electrostatic discharge
voltage
human body model
pins RTH, RTL,
CANH and CANL
−8
−2
+8
+2
kV
kV
all other pins
[5]
[6]
IEC 61000-4-2
pins RTH, RTL,
CANH and CANL
−6
+6
kV
machine model
any pin
−300
+300
V
[1] All voltages are defined with respect to pin GND, unless otherwise specified. Positive current flows into the
device.
[2] Only relevant if VWAKE < VGND − 0.3 V; current will flow into pin GND.
[3] Junction temperature in accordance with “IEC 60747-1”. An alternative definition is: Tvj = Tamb + P × Rth(vj-a)
where Rth(vj-a) is a fixed value to be used for the calculation of Tvj. The rating for Tvj limits the allowable
combinations of power dissipation (P) and operating ambient temperature (Tamb).
[4] Equivalent to discharging a 100 pF capacitor through a 1.5 kΩ resistor.
[5] The ESD performance of pins CANH, CANL, RTH and RTL, with respect to GND, was verified by an
external test house in accordance with IEC-61000-4-2 (C = 150 pF, R = 330 Ω). The results were equal to,
or better than, ±6 kV.
[6] Equivalent to discharging a 200 pF capacitor through a 10 Ω resistor and a 0.75 µH coil.
TJA1055_4
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 — 17 February 2009
10 of 26
TJA1055
NXP Semiconductors
Enhanced fault-tolerant CAN transceiver
9. Thermal characteristics
Table 7.
Symbol
Rth(j-a)
Thermal characteristics
Parameter
Conditions
Typ
Unit
thermal resistance from junction in free air
to ambient
120
K/W
Rth(j-s)
thermal resistance from junction in free air
to substrate
40
K/W
10. Static characteristics
Table 8.
Static characteristics
VCC = 4.75 V to 5.25 V; VBAT = 5.0 V to 40 V; VSTB = VCC; Tvj = −40 °C to +150 °C; all voltages are defined with respect to
ground; positive currents flow into the device; unless otherwise specified.[1]
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Supplies (pins VCC and BAT)
VCC
supply voltage
4.75
3.1
-
-
5.25
4.5
V
V
VCC(stb)
supply voltage for forced
standby mode (fail-safe)
ICC
supply current
normal operating mode;
2.5
3
6
10
21
mA
mA
VTXD = VCC (recessive)
normal operating mode;
13
VTXD = 0 V (dominant); no load
low power modes at VTXD = VCC
Tamb = −40 °C to +85 °C
Tamb = +85 °C to +125 °C
no time limit
0
0
0
-
5
µA
µA
V
0
25
+40
40
58
40
VBAT
battery supply voltage
battery supply current
−0.3
operating mode
5.0
-
V
load dump
-
-
-
V
IBAT
sleep mode at
25
µA
V
RTL = VWAKE = VINH = VBAT = 14 V
;
T
amb = −40 °C to +125 °C
low power mode at
VRTL = VWAKE = VINH = VBAT
;
T
amb = −40 °C to +125 °C
VBAT = 5 V to 8 V
10
10
-
-
100
75
µA
µA
µA
VBAT = 8 V to 40 V
-
normal operating mode at
150
220
VRTL = VWAKE = VINH = VBAT = 5 V
to 40 V
Vpof(BAT)
power-on flag voltage on low power modes
pin BAT
power-on flag set
-
-
-
3.8
-
V
V
power-on flag not set
5
TJA1055_4
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 — 17 February 2009
11 of 26
TJA1055
NXP Semiconductors
Enhanced fault-tolerant CAN transceiver
Table 8.
Static characteristics …continued
VCC = 4.75 V to 5.25 V; VBAT = 5.0 V to 40 V; VSTB = VCC; Tvj = −40 °C to +150 °C; all voltages are defined with respect to
ground; positive currents flow into the device; unless otherwise specified.[1]
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Isup(tot)
total supply current
low power modes; VCC = 5 V;
V
BAT = VWAKE = VINH = 14 V
Tamb = −40 °C to +85 °C
Tamb = +85 °C to +125 °C
-
-
25
25
45
65
µA
µA
Pins STB, EN and TXD
VIH
VIL
IIH
HIGH-level input voltage
2.2
-
-
7
V
V
LOW-level input voltage
HIGH-level input current
pins STB and EN
−0.3
+0.8
VI = 4 V
VI = 3 V
-
11
21
−40
21
2
µA
µA
µA
µA
pin TXD (TJA1055T)
−160
2
−80
11
pin TXD (TJA1055T/3) normal operating mode; VI = 2.4 V
low power mode; VI = 2.4 V
0.1
0.9
IIL
LOW-level input current
pins STB and EN
VI = 1 V
VI = 1 V
2
11
-
µA
µA
µA
µA
pin TXD (TJA1055T)
−400
2
−240
11
−100
pin TXD (TJA1055T/3) normal operating mode; VI = 1 V
low power mode; VI = 1 V
-
0.1
0.9
2
Pins RXD and ERR (TJA1055T)
VOH(norm) HIGH-level output voltage
in normal mode
on pin ERR
IO = −100 µA
IO = −1 mA
V
CC − 0.9
-
-
VCC
VCC
V
V
on pin RXD
V
CC − 0.9
VOH(lp)
HIGH-level output voltage
in low-power mode
on pin ERR
on pin RXD
IO = −100 µA
IO = −100 µA
V
V
0
0
0
CC − 1.1
V
V
-
CC − 0.7
CC − 0.7
V
CC − 0.4
CC − 0.4
V
V
V
V
V
CC − 1.1
V
VOL
LOW-level output voltage IO = 1.6 mA
IO = 1.2 mA; VCC < 4.75 V
IO = 5 mA
0.4
0.4
1.5
-
-
Pins RXD and ERR (TJA1055T/3)
IOL
ILH
LOW-level output current VO = 0.4 V
1.3
3.5
0
-
mA
HIGH-level leakage
current
VO = 3 V
−5
+8
µA
Pin WAKE
IIL
LOW-level input current
VWAKE = 0 V; VBAT = 40 V
VSTB = 0 V
−12
−4
−1
µA
Vth(wake)
wake-up threshold
voltage
2.5
3.2
3.9
V
Pin INH
∆VH
HIGH-level voltage drop
leakage current
IINH = −0.18 mA
-
-
-
-
0.8
5
V
|IL|
sleep mode; VINH = 0 V
µA
TJA1055_4
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 — 17 February 2009
12 of 26
TJA1055
NXP Semiconductors
Enhanced fault-tolerant CAN transceiver
Table 8.
Static characteristics …continued
VCC = 4.75 V to 5.25 V; VBAT = 5.0 V to 40 V; VSTB = VCC; Tvj = −40 °C to +150 °C; all voltages are defined with respect to
ground; positive currents flow into the device; unless otherwise specified.[1]
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Pins CANH and CANL
Vth(dif)
differential receiver
threshold voltage
no failures and
bus failures 1, 2, 5 and 6a;
see Figure 4
VCC = 5 V
−3.5
−3.2
−2.9
V
V
VCC = 4.75 V to 5.25 V
−0.70VCC −0.64VCC −0.58VCC
VO(reces)
VO(dom)
IO(CANH)
recessive output voltage VTXD = VCC
on pin CANH
on pin CANL
RRTH < 4 kΩ
-
-
-
0.2
-
V
V
RRTL < 4 kΩ
V
CC − 0.2
dominant output voltage
on pin CANH
VTXD = 0 V; VEN = VCC
ICANH = −40 mA
V
-
CC − 1.4
-
-
V
on pin CANL
ICANL = 40 mA
-
1.4
−45
V
output current on
pin CANH
normal operating mode;
−110
−80
mA
V
CANH = 0 V; VTXD = 0 V
low power modes; VCANH = 0 V;
CC = 5 V
normal operating mode;
CANL = 14 V; VTXD = 0 V
low power modes; VCANL = 14 V;
BAT = 14 V
-
−0.25
70
-
µA
mA
µA
V
IO(CANL)
output current on
pin CANL
45
-
100
-
V
0
V
Vdet(sc)(CANH) detection voltage for
short-circuit to battery
normal operating mode; VCC = 5 V
low power modes
1.5
1.1
1.7
1.8
1.85
2.5
V
V
voltage on pin CANH
Vdet(sc)(CANL) detection voltage for
short-circuit to battery
normal operating mode
VCC = 5 V
6.6
7.2
7.8
V
V
voltage on pin CANL
VCC = 4.75 V to 5.25 V
1.32VCC
1.44VCC
1.56VCC
Vth(wake)
wake-up threshold
voltage
on pin CANL
on pin CANH
low power modes
low power modes
low power modes
2.5
1.1
0.8
3.2
1.8
1.4
3.9
2.5
-
V
V
V
∆Vth(wake)
difference of wake-up
threshold voltages (on
pins CANL and CANH)
Vth(se)(CANH) single-ended receiver
threshold voltage on
pin CANH
normal operating mode and
failures 4, 6 and 7
VCC = 5 V
1.5
1.7
1.85
V
V
VCC = 4.75 V to 5.25 V
0.30VCC
0.34VCC
0.37VCC
Vth(se)(CANL)
single-ended receiver
threshold voltage on
pin CANL
normal operating mode and
failures 3 and 3a
VCC = 5 V
3.15
3.3
3.45
V
VCC = 4.75 V to 5.25 V
normal operating mode
0.63VCC
110
0.66VCC
165
0.69VCC
270
V
Ri(se)(CANH)
single-ended input
kΩ
resistance on pin CANH
TJA1055_4
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 — 17 February 2009
13 of 26
TJA1055
NXP Semiconductors
Enhanced fault-tolerant CAN transceiver
Table 8.
Static characteristics …continued
VCC = 4.75 V to 5.25 V; VBAT = 5.0 V to 40 V; VSTB = VCC; Tvj = −40 °C to +150 °C; all voltages are defined with respect to
ground; positive currents flow into the device; unless otherwise specified.[1]
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Ri(se)(CANL)
single-ended input
normal operating mode
110
165
270
kΩ
resistance on pin CANL
Ri(dif)
differential input
resistance
normal operating mode
220
330
540
kΩ
Pins RTH and RTL
Rsw(RTL) switch-on resistance on
normal operating mode; switch-on
resistance between pin RTL and
-
-
40
40
100
100
Ω
Ω
pin RTL
VCC; |IO| < 10 mA
Rsw(RTH)
switch-on resistance on
pin RTH
normal operating mode; switch-on
resistance between pin RTH and
ground; |IO| < 10 mA
VO(RTH)
IO(RTL)
Ipu(RTL)
output voltage on pin RTH low power modes; IO = 100 µA
-
0.7
1.0
−0.1
-
V
output current on pin RTL low power modes; VRTL = 0 V
−1.5
−0.65
75
mA
µA
pull-up current on pin RTL normal operating mode and
failures 4, 6 and 7
-
Ipd(RTH)
pull-down current on
pin RTH
normal operating mode and
failures 3 and 3a
-
75
-
µA
°C
Thermal shutdown
Tj(sd) shutdown junction
temperature
160
175
190
[1] All parameters are guaranteed over the virtual junction temperature range by design, but only 100 % tested at Tamb = 125 °C for dies on
wafer level, and above this for cased products 100 % tested at Tamb = 25 °C, unless otherwise specified.
11. Dynamic characteristics
Table 9.
Dynamic characteristics
VCC = 4.75 V to 5.25 V; VBAT = 5.0 V to 40 V; VSTB = VCC; Tvj = −40 °C to +150 °C; all voltages are defined with respect to
ground; unless otherwise specified.[1]
Symbol
Parameter
Conditions
Min Typ Max Unit
tt(reces-dom) transition time for recessive to
dominant (on pins CANL and
CANH)
between 10 % and 90 %; RCAN_L = RCAN_H
125 Ω; CCAN_L = CCAN_H = 1 nF;
see Figure 5 and 6
=
=
0.2 0.6
-
µs
tt(dom-reces) transition time for dominant to
recessive (on pins CANL and
CANH)
between 10 % and 90 %; RCAN_L = RCAN_H
125 Ω; CCAN_L = CCAN_H = 1 nF;
see Figure 5 and 6
0.3 0.7
-
µs
tPD(L)
propagation delay TXD (LOW) to
RXD (LOW)
no failures; RCAN_L = RCAN_H = 125 Ω;
-
-
-
-
-
-
1.5 µs
1.9 µs
1.9 µs
CCAN_L = CCAN_H = 1 nF; see Figure 4 to
Figure 6
all failures except CAN_L shorted to CAN_H;
RCAN_L = RCAN_H = 125 Ω; CCAN_L
CAN_H = 1 nF; see Figure 4 to Figure 6
=
C
failure 7, CAN_L shorted to CAN_H;
RCAN_L = 1 MΩ; RCAN_H = 125 Ω;
CCAN_L = CCAN_H = 1 nF; see Figure 4 to
Figure 6
TJA1055_4
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 — 17 February 2009
14 of 26
TJA1055
NXP Semiconductors
Enhanced fault-tolerant CAN transceiver
Table 9.
Dynamic characteristics …continued
VCC = 4.75 V to 5.25 V; VBAT = 5.0 V to 40 V; VSTB = VCC; Tvj = −40 °C to +150 °C; all voltages are defined with respect to
ground; unless otherwise specified.[1]
Symbol
Parameter
Conditions
Min Typ Max Unit
tPD(H)
propagation delay TXD (HIGH) to no failures; RCAN_L = RCAN_H = 125 Ω;
-
-
-
-
-
1.5 µs
1.9 µs
1.9 µs
RXD (HIGH)
CCAN_L = CCAN_H = 1 nF; see Figure 4 to
Figure 6
all failures except CAN_L shorted to CAN_H;
-
RCAN_L = RCAN_H = 125 Ω; CCAN_L
=
CCAN_H = 1 nF; see Figure 4 to Figure 6
failure 7, CAN_L shorted to CAN_H;
RCAN_L = 1 MΩ; RCAN_H = 125 Ω; CCAN_L
-
=
CCAN_H = 1 nF; see Figure 4 to Figure 6
[2]
td(sleep)
tdis(TxD)
delay time to sleep
5
50
4
µs
disable time of TxD permanent
dominant timer
normal operating mode; VTXD = 0 V
0.75 -
ms
[2]
[2]
[2]
tdom(CANH) dominant time on pin CANH
tdom(CANL) dominant time on pin CANL
low power modes; VBAT = 14 V
low power modes; VBAT = 14 V
7
7
7
-
-
-
38
38
38
µs
µs
µs
tWAKE
local wake-up time on pin WAKE
low power modes; VBAT = 14 V; for wake-up
after receiving a falling or rising edge
tdet
failure detection time
normal operating mode
failures 3 and 3a
1.6
0.3
-
-
8.0 ms
1.6 ms
failures 4, 6 and 7
low power modes; VBAT = 14 V
failures 3 and 3a
1.6
0.1
-
-
8.0 ms
1.6 ms
failures 4 and 7
trec
failure recovery time
normal operating mode
failures 3 and 3a
0.3
7
-
-
-
1.6 ms
failures 4 and 7
38
µs
failure 6
125
750 µs
low power modes; VBAT = 14 V
failures 3, 3a, 4 and 7
0.3
-
-
1.6 ms
-
ndet
pulse-count failure detection
difference between CANH and CANL;
normal operating mode and failures 1, 2, 5
and 6a; pin ERR becomes LOW
4
nrec
number of consecutive pulses for
failure recovery
on CANH and CANL simultaneously;
failures 1, 2, 5 and 6a
-
4
-
[1] All parameters are guaranteed over the virtual junction temperature range by design, but only 100 % tested at Tamb = 125 °C for dies on
wafer level, and above this for cased products 100 % tested at Tamb = 25 °C, unless otherwise specified.
[2] To guarantee a successful mode transition under all conditions, the maximum specified time must be applied.
TJA1055_4
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 — 17 February 2009
15 of 26
TJA1055
NXP Semiconductors
Enhanced fault-tolerant CAN transceiver
2 V to V
CC
V
TXD
0 V
V
5 V
CANL
3.6 V
1.4 V
0 V
V
CANH
2.2 V
−3.2 V
−5 V
∆V
CAN
RXD
V
0.7V
0.3V
CC
CC
t
t
PD(H)
PD(L)
mgl424
∆VCAN = VCANH − VCANL
Fig 4. Timing diagram for dynamic characteristics
12. Test information
V
= 5 V to 40 V
BAT
+5 V
V
INH
BAT
14
CC
RTH
1
10
8
C
CAN_L
R
WAKE
7
CAN_L
BAT
V
R
RTH
500 Ω
CC
V
TXD
TXD
2
CANL
CANH
12
11
STB
5
FAILURE
GENERATION
TJA1055T
EN
6
R
RTL
500 Ω
RXD
3
GND
RTL
C
CAN_H
R
CAN_H
9
4
13
GND
C
RXD
10 pF
ERR
001aac932
VTXD is a rectangular signal of 50 kHz with 50 % duty cycle and slope time < 10 ns.
Termination resistors RCAN_L and RCAN_H (125 Ω) are not connected to pin RTL or pin RTH for
testing purposes because the minimum load allowed on the CAN bus lines is 500 Ω per
transceiver.
Fig 5. Test circuit for dynamic characteristics
TJA1055_4
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 — 17 February 2009
16 of 26
TJA1055
NXP Semiconductors
Enhanced fault-tolerant CAN transceiver
V
BAT
= 5 V to 40 V
+5 V
V
INH
BAT
14
CC
RTH
1
10
8
C
CAN_L
R
CAN_L
WAKE
7
2
5
6
3
BAT
V
CC
R
RTH
500 Ω
V
TXD
TXD
STB
CANL
CANH
12
11
+3.3 V
FAILURE
GENERATION
TJA1055T/3
EN
2.5
kΩ
R
RTL
500 Ω
RXD
GND
RTL
C
CAN_H
R
CAN_H
9
4
13
GND
C
RXD
10 pF
ERR
001aac933
VTXD is a rectangular signal of 50 kHz with 50 % duty cycle and slope time < 10 ns.
Termination resistors RCAN_L and RCAN_H (125 Ω) are not connected to pin RTL or pin RTH for
testing purposes because the minimum load allowed on the CAN bus lines is 500 Ω per
transceiver.
Fig 6. Test circuit for dynamic characteristics (TJA1055T/3)
+12 V
+5 V
10 µF
V
INH
BAT
14
CC
8
RTH
1 nF
125 Ω
1
10
WAKE
7
2
5
6
3
500 Ω
TXD
STB
1 nF
1 nF
CANL
CANH
12
11
TJA1055T
GENERATOR
EN
500 Ω
RXD
RTL
9
125 Ω
1 nF
4
13
GND
10 pF
ERR
001aac934
The waveforms of the applied transients on pins CANH and CANL will be in accordance with
“ISO 7637 part 1”: test pulses 1, 2, 3a and 3b.
Fig 7. Test circuit for automotive transients
TJA1055_4
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 — 17 February 2009
17 of 26
TJA1055
NXP Semiconductors
Enhanced fault-tolerant CAN transceiver
+12 V
+5 V
10 µF
V
INH
BAT
14
CC
8
RTH
1 nF
125 Ω
1
10
WAKE
7
2
5
6
3
500 Ω
TXD
STB
1 nF
1 nF
CANL
CANH
12
11
+3.3 V
TJA1055T/3
GENERATOR
EN
2.5
kΩ
500 Ω
RXD
RTL
9
125 Ω
1 nF
4
13
GND
10 pF
ERR
001aac935
The waveforms of the applied transients on pins CANH and CANL will be in accordance with
“ISO 7637 part 1”: test pulses 1, 2, 3a and 3b.
Fig 8. Test circuit for automotive transients (TJA1055T/3)
V
BAT
V
+5 V
DD
5 V CAN CONTROLLER
CTX0 CRX0 Px.x Px.x Px.x
TXD RXD STB ERR EN
INH
2
3
5
4
6
1
WAKE
BAT
7
14
10
13
V
CC
TJA1055T
CAN TRANSCEIVER
100 nF
GND
8
11
CANH
12
CANL
9
RTH
RTL
CAN BUS LINE
001aac936
For more information: refer to the separate FTCAN information available on our web site.
Fig 9. Application diagram
TJA1055_4
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 — 17 February 2009
18 of 26
TJA1055
NXP Semiconductors
Enhanced fault-tolerant CAN transceiver
V
BAT
V
+3 V
+5 V
DD
3 V CAN CONTROLLER
CTX0 CRX0 Px.x Px.x Px.x
TXD RXD STB ERR EN
INH
2
3
5
4
6
1
WAKE
BAT
7
14
10
13
V
CC
TJA1055T/3
CAN TRANSCEIVER
100 nF
GND
8
11
CANH
12
CANL
9
RTH
RTL
CAN BUS LINE
001aac937
For more information: refer to the separate FTCAN information available on our web site.
Fig 10. Application diagram (TJA1055T/3)
12.1 Quality information
This product has been qualified to the appropriate Automotive Electronics Council (AEC)
standard Q100 or Q101 and is suitable for use in automotive applications.
TJA1055_4
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 — 17 February 2009
19 of 26
TJA1055
NXP Semiconductors
Enhanced fault-tolerant CAN transceiver
13. Package outline
SO14: plastic small outline package; 14 leads; body width 3.9 mm
SOT108-1
D
E
A
X
v
c
y
H
M
A
E
Z
8
14
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
7
e
detail X
w
M
b
p
0
2.5
scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.
0.25
0.10
1.45
1.25
0.49
0.36
0.25
0.19
8.75
8.55
4.0
3.8
6.2
5.8
1.0
0.4
0.7
0.6
0.7
0.3
mm
1.75
1.27
0.05
1.05
0.25
0.01
0.25
0.1
0.25
0.01
8o
0o
0.010 0.057
0.004 0.049
0.019 0.0100 0.35
0.014 0.0075 0.34
0.16
0.15
0.244
0.228
0.039 0.028
0.016 0.024
0.028
0.012
inches
0.041
0.01 0.004
0.069
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-19
SOT108-1
076E06
MS-012
Fig 11. Package outline SOT108-1 (SO14)
TJA1055_4
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 — 17 February 2009
20 of 26
TJA1055
NXP Semiconductors
Enhanced fault-tolerant CAN transceiver
14. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
14.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
14.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
• Through-hole components
• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
• Board specifications, including the board finish, solder masks and vias
• Package footprints, including solder thieves and orientation
• The moisture sensitivity level of the packages
• Package placement
• Inspection and repair
• Lead-free soldering versus SnPb soldering
14.3 Wave soldering
Key characteristics in wave soldering are:
• Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
• Solder bath specifications, including temperature and impurities
TJA1055_4
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 — 17 February 2009
21 of 26
TJA1055
NXP Semiconductors
Enhanced fault-tolerant CAN transceiver
14.4 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 12) than a SnPb process, thus
reducing the process window
• Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 10 and 11
Table 10. SnPb eutectic process (from J-STD-020C)
Package thickness (mm) Package reflow temperature (°C)
Volume (mm3)
< 350
235
≥ 350
220
< 2.5
≥ 2.5
220
220
Table 11. Lead-free process (from J-STD-020C)
Package thickness (mm) Package reflow temperature (°C)
Volume (mm3)
< 350
260
350 to 2000
> 2000
260
< 1.6
260
250
245
1.6 to 2.5
> 2.5
260
245
250
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 12.
TJA1055_4
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 — 17 February 2009
22 of 26
TJA1055
NXP Semiconductors
Enhanced fault-tolerant CAN transceiver
maximum peak temperature
= MSL limit, damage level
temperature
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 12. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
15. Appendix
15.1 Overview of differences between the TJA1055 and the TJA1054A
Table 12. Limiting values
Symbol
Parameter
Conditions
TJA1055
TJA1054A
Unit
Min
−58
−58
Max
Min
−27
−27
Max
VCANH
VCANL
Vesd
voltage on pin CANH
voltage on pin CANL
+58
+58
+40
+40
V
V
electrostatic discharge voltage pins RTH, RTL, CANH, CANL
human body model
IEC 61000-4-2
−8
+8
−4
+4
kV
[1]
[1] The ESD performance of pins CANH, CANL, RTH and RTL, with respect to GND, was verified by an external test house in accordance
with IEC-61000-4-2 (C = 150 pF, R = 330 Ω). The results were equal to, or better than, ±6 kV for TJA1055 and equal to, or better than,
±1.5 kV for TJA1054A.
TJA1055_4
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 — 17 February 2009
23 of 26
TJA1055
NXP Semiconductors
Enhanced fault-tolerant CAN transceiver
16. Revision history
Table 13. Revision history
Document ID
TJA1055_4
Modifications:
TJA1055_3
TJA1055_2
Release date
20090217
Data sheet status
Change notice
Supersedes
Product data sheet
-
TJA1055_3
• No technical content change; data sheet release date updated
20070313
20061030
20060801
Product data sheet
Preliminary data sheet
Objective data sheet
-
-
-
TJA1055_2
TJA1055_1
-
TJA1055_1
(9397 750 14908)
TJA1055_4
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 — 17 February 2009
24 of 26
TJA1055
NXP Semiconductors
Enhanced fault-tolerant CAN transceiver
17. Legal information
17.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
malfunction of an NXP Semiconductors product can reasonably be expected
17.2 Definitions
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
17.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
17.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
18. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
TJA1055_4
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 — 17 February 2009
25 of 26
TJA1055
NXP Semiconductors
Enhanced fault-tolerant CAN transceiver
19. Contents
1
General description . . . . . . . . . . . . . . . . . . . . . . 1
2
2.1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Optimized for in-car low-speed
communication . . . . . . . . . . . . . . . . . . . . . . . . . 1
Bus failure management. . . . . . . . . . . . . . . . . . 1
Protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Support for low power modes. . . . . . . . . . . . . . 2
2.2
2.3
2.4
3
4
5
Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
Ordering information. . . . . . . . . . . . . . . . . . . . . 3
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
6
6.1
6.2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 4
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
7
Functional description . . . . . . . . . . . . . . . . . . . 5
Failure detector. . . . . . . . . . . . . . . . . . . . . . . . . 5
Low power modes. . . . . . . . . . . . . . . . . . . . . . . 7
Power-on. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
7.1
7.2
7.3
7.4
8
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 9
Thermal characteristics. . . . . . . . . . . . . . . . . . 11
Static characteristics. . . . . . . . . . . . . . . . . . . . 11
Dynamic characteristics . . . . . . . . . . . . . . . . . 14
Test information. . . . . . . . . . . . . . . . . . . . . . . . 16
Quality information . . . . . . . . . . . . . . . . . . . . . 19
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 20
9
10
11
12
12.1
13
14
Soldering of SMD packages . . . . . . . . . . . . . . 21
Introduction to soldering . . . . . . . . . . . . . . . . . 21
Wave and reflow soldering . . . . . . . . . . . . . . . 21
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 21
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 22
14.1
14.2
14.3
14.4
15
15.1
Appendix. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Overview of differences between the
TJA1055 and the TJA1054A. . . . . . . . . . . . . . 23
16
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 24
17
Legal information. . . . . . . . . . . . . . . . . . . . . . . 25
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 25
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 25
17.1
17.2
17.3
17.4
18
19
Contact information. . . . . . . . . . . . . . . . . . . . . 25
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2009.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 17 February 2009
Document identifier: TJA1055_4
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