TZA1020HP/A_技术文档

INTEGRATED CIRCUITS

DATA SHEET

TZA1020; TZA1020A

Pre-amplifiers for CD-RW systems

Product speciﬁcation

2000 Oct 30

File under Integrated Circuits, IC01

Philips Semiconductors

Product speciﬁcation

Pre-ampliﬁers for CD-RW systems

TZA1020; TZA1020A

CONTENTS

9

LIMITING VALUES

10

11

THERMAL CHARACTERISTICS

CHARACTERISTICS

1

2

3

4

5

6

7

FEATURES

GENERAL DESCRIPTION

QUICK REFERENCE DATA

ORDERING INFORMATION

BLOCK DIAGRAM

11.1

11.2

11.3

Transfer functions for normalized servo signals

Laser power control signals (alpha circuit)

Wobble pre-processor

12

APPLICATION AND TEST INFORMATION

PACKAGE OUTLINE

PINNING

13

FUNCTIONAL DESCRIPTION

14

SOLDERING

7.1

7.2

7.3

7.4

7.5

7.6

7.7

Data amplifier

Normalizer

Wobble pre-processor

Beta detector

Alpha detector

14.1

Introduction to soldering surface mount

packages

Reflow soldering

Wave soldering

Manual soldering

14.2

14.3

14.4

14.5

Fast track count

Spot position measurement

Suitability of surface mount IC packages for

wave and reflow soldering methods

8

I²C-BUS PROTOCOL

15

16

17

18

DATA SHEET STATUS

DEFINITIONS

8.1

Addressing and data bytes

Write mode

Read mode

8.1.1

8.1.2

8.1.3

8.1.4

8.1.5

8.1.6

8.1.7

8.1.8

8.1.9

8.1.10

8.2

DISCLAIMERS

PURCHASE OF PHILIPS I²C COMPONENTS

Control byte subaddress 00

Control byte subaddress 01

Control byte subaddress 02

Control byte subaddress 03

Control byte subaddress 04

Control byte subaddress 05

Control byte subaddress 06

Control byte subaddress 07

Characteristics of the I²C-bus

2000 Oct 30

2

Philips Semiconductors

Product speciﬁcation

Pre-ampliﬁers for CD-RW systems

TZA1020; TZA1020A

1

FEATURES

• Data amplifier for read speed up to twelve times nominal

data speed

• Normalized and filtered error signals for servo control

• Wobble pre-processor with switchable low-pass filter

• Calculation of signals for real-time laser power control

for write speed up to four times

2

GENERAL DESCRIPTION

TZA1020 (AEGER2) is an analog pre-processor IC for

CD-R and CD-RW systems with 3-spots push-pull tracking

system. The IC interfaces directly to the photo diodes.

The device generates signals for laser power calibration

and laser power control during disc writing. Normalized

error signals are generated for servo control and wobble

detection. An HF current amplifier is implemented to

detect the actual HF data signal. The Fast Track Count

(FTC) amplifier generates a radial error signal to allow fast

track counting.

• Calculation of signals for optimum laser calibration for

write speed up to four times

• Fast track count amplifier

• Spot position measurement for alignment of photo

diodes

• Reference voltage for laser controller

• On-chip band gap and DACs for accurate and

adjustable current/gain settings

• I²C-bus microcontroller interface for programmable

gain, speed switching and function selection

TZA1020A (AEGER2A) is similar to the TZA1020, except

for non-clamped MIRN, which allows operation with

IGUANA.

• All functions available for CD-R and CD-RW systems.

3

QUICK REFERENCE DATA

SYMBOL

V_DD

PARAMETER

CONDITIONS

MIN.

4.5

TYP.

5.0

MAX.

5.5

UNIT

positive supply voltage

V

V_SS

negative supply voltage

−5.5

0

−5.0

−

−4.5

4000

−

V

I_i(cd)

central diode input current range

µA

kHz

B_−3dB(norm)

−3 dB bandwidth normalized

48

60

error signals (servo)

B_−3dB(CAHF)

−3 dB bandwidth pin CAHF

C_i= 12 pF

17

−

MHz

ns

∆t_d(g)(CAHF)

group delay variations pin CAHF f = 0.1 to 12 MHz;

C_i= 12 pF

−

0.9

G_I(CAHF)

current gain pin CAHF

cdrwsel = 1

cdrwsel = 0

−

0

35

−

8.75

−900

−

I_RREF

T_amb

reference current

−

µA

°C

ambient temperature

70

4

ORDERING INFORMATION

PACKAGE

DESCRIPTION

TYPE

NUMBER

NAME

VERSION

TZA1020HP;

QFP44

plastic quad ﬂat package; 44 leads (lead length 1.3 mm);

SOT307-2

TZA1020HP/A

body 10 × 10 × 1.75 mm

2000 Oct 30

3

Philips Semiconductors

Product speciﬁcation

Pre-ampliﬁers for CD-RW systems

TZA1020; TZA1020A

5

BLOCK DIAGRAM

handbook, full pagewidth

ERON

15

11

35

FEN

INPUT

STAGE 3

36

CAGAIN

REN

37

NORMALIZER

LPF 1

LPF 2

TLN

4

8

5

9

34

38

SA1

SA2

SB1

SB2

XDN

MIRN

DIODE

INPUT

STAGE 1

27

26

CWBL

PPN

WOBBLE

PREPROCESSOR

10

3

C1

C2

C3

C4

DIODE

INPUT

STAGE 2

6

22

21

20

19

24

25

AINT

7

ALS

AINTON

ASTROBE

DALPHA

AZIN

ALPHA

DETECTOR

14

AMON

TZA1020

TZA1020A

control

switches currents

control

23

CURRENT

AMPLIFIER

CAHF

REGISTER

44

43

42

39

40

41

CALF

A1

12

13

SDA

SCL

2

I C-BUS

A2

BETA

DETECTOR

INTERFACE

CALPF

HCA1

HCA2

DACs

1

2

POR

UOUT

RREF

DRIVER

32

33

MEAS1

MEAS2

MEAS

BAND GAP

REFERENCE

FAST

TRACK

COUNT

31

RE

28

16

30

18

29

17

MGR809

V

SS1 SS2

GND1 GND2

DD1 DD2

Fig.1 Block diagram.

4

2000 Oct 30

Philips Semiconductors

Product speciﬁcation

Pre-ampliﬁers for CD-RW systems

TZA1020; TZA1020A

6

PINNING

SYMBOL

DESCRIPTION

SYMBOL

DESCRIPTION

UOUT

RREF

C2

1

2

reference voltage output

PPN

26

normalized, balanced push-pull

signal voltage

reference current input

CWBL

27

capacitor for EFM noise reduction

loop

3

central photo diode current input

satellite photo diode current input

central photo diode current input

satellite photo diode current input

central photo diode current input

SA1

SB1

C3

4

V_DD1

GND1

V_SS1

RE

28

29

30

31

positive supply voltage 1

ground 1

5

6

negative supply voltage 1

C4

7

fast track count signal voltage

output

SA2

SB2

C1

8

9

MEAS1

MEAS2

XDN

32

33

34

35

36

37

38

39

40

41

42

43

44

combination of photo diode

currents for adjustment 1

10

11

CAGAIN

set-point laser power on disc,

current input

I²C-bus data input/output

I²C-bus clock input

combination of photo diode

currents for adjustment 2

SDA

12

13

14

normalized spot position error

current output

SCL

AMON

alpha measurement on switch

(write/read state)

FEN

normalized focus error current

output

ERON

V_DD2

15

16

17

18

19

normalized error signals on switch

positive supply voltage 2

ground 2

REN

normalized radial error current

output

TLN

normalized track-loss current

output

GND2

V_SS2

negative supply voltage 2

MIRN

CALPF

HCA1

HCA2

A2

mirror output (disc reﬂection)

current output

ASTROBE

control signal sample-and-hold in

alpha measurement

capacitor to deﬁne CALF

bandwidth

AINTON

20

control signal integrator in alpha

measurement

capacitor to deﬁne time constant

peak detector A1

ALS

21

22

DALPHA output enabled/disabled

AINT

integrator capacitor for alpha

measurement

capacitor to deﬁne time constant

peak detector A2

CAHF

DALPHA

AZIN

23

24

25

central aperture high-frequency

current output

pit amplitude relative to CALF,

voltage output

alpha error signal for laser power

control

A1

land amplitude relative to CALF,

voltage output

set-point alpha control

CALF

low-pass ﬁltered aperture signal,

voltage output

2000 Oct 30

5

Philips Semiconductors

Product speciﬁcation

Pre-ampliﬁers for CD-RW systems

TZA1020; TZA1020A

handbook, full pagewidth

1

2

3

4

5

6

7

8

9

33 MEAS2

UOUT

RREF

C2

MEAS1

32

31 RE

V

SA1

SB1

C3

30

SS1

29 GND1

V

28

DD1

TZA1020HP

TZA1020HP/A

C4

27 CWBL

26 PPN

SA2

SB2

25 AZIN

C1 10

24 DALPHA

23 CAHF

CAGAIN 11

MGR810

Fig.2 Pin configuration.

handbook, halfpage

A

C

B

C1 C2

C4 C3

SA1 SA2

SB1 SB2

S1 S2

MGR811

Fig.3 Quadrant diode configuration.

6

2000 Oct 30

Philips Semiconductors

Product speciﬁcation

Pre-ampliﬁers for CD-RW systems

TZA1020; TZA1020A

7

FUNCTIONAL DESCRIPTION

7.4

Beta detector

All functions are designed in such a way that a read speed

up to twelve times nominal speed is possible

(N = 1, 2, 4, 8 or 12). Recording speed up to four is

possible (N = 1, 2 or 4). The maximum recording speed

must be determined.

The beta detector generates signals necessary for the

symmetry detection of the HF signal. By measuring peak

values (A1 and A2) and average value of the signal

(CALF), an optimum laser writing power can be

determined. The gain of the measured values is controlled

by the I²C-bus. The time constant of the peak detectors

and bandwidth of the low-pass filtered aperture signal can

also be adapted to the disc speed by the I²C-bus.

7.1

Data ampliﬁer

The central diodes currents (C1 to C4) are fed to a high

bandwidth current amplifier. The gain of the current

amplifier can be switched by means of the I²C-bus

microcontroller interface to compensate for differences in

CD-R and CD-RW disc reflection. Data signals up to

twelve times nominal data speed can be read.

7.5

Alpha detector

The alpha detector determines a parameter called ‘alpha’

during disc writing. Alpha must be kept constant to allow

recording over a fingerprint or black dot. The definition of

alpha is different for CD-R and CD-RW; for CD-R the light

absorption of the disc is measured, for CD-RW alpha is

determined by actual laser power and disc reflection. The

gain of the measured signals and the CD-R and CD-RW

selection is performed by the I²C-bus.

7.2

Normalizer

The currents from the central diodes (C1 to C4), the

current from the satellite diodes (SA1, SA2, SB1 and SB2)

and the laser set-point current (CAGAIN) are (optionally

sampled) fed to the first low-pass filters with a bandwidth

of 60 kHz. The normalizing circuit generates error signals

for servo control that are independent of the diode current

level. The gain of the error signals is controlled by the

I²C-bus microcontroller interface. A dropout concealment

becomes active if the input current level is below a certain

threshold value. This threshold value is also controlled by

the I²C-bus.

7.6

Fast track count

The fast track count circuit generates a Radial Error (RE)

signal for fast track counting. A gain switch compensates

for difference in CD-R and CD-RW disc reflection.

7.7

Spot position measurement

To allow alignment of photo diodes via the TZA1020, a

number of linear combinations of input currents can be

realized (MEAS1 and MEAS2). Selection of the actual

combination is performed by the I²C-bus.

7.3

Wobble pre-processor

The wobble signal of the pre-groove is detected by means

of the PPN signal. The currents from inputs C1 to C4 are

filtered and processed to provide optimal signal-to-noise

ratio. The bandwidth of the filter may be adapted to the

disc speed via the I²C-bus. The bandwidth of a noise

reduction loop is controlled by an external capacitor, the

I²C-bus interface controls the total operation of the

processor.

2000 Oct 30

7

Philips Semiconductors

Product speciﬁcation

Pre-ampliﬁers for CD-RW systems

TZA1020; TZA1020A

8

I²C-BUS PROTOCOL

8.1

Addressing and data bytes

Full control of the TZA1020 is accomplished via the 2-wire I²C-bus. Up to 400 kbits/s bus speed can be used in

accordance with the I²C-bus fast-mode specification.

For programming the device (write mode) eight data byte registers are available/addressable via eight subaddresses.

Automatic subaddress incrementing enables the writing of successive data bytes in one transmission. During power-on,

data byte registers are reset to a default state by use of a Power-On Reset (POR) circuit whose signal is derived from

the internally generated I²C-bus supply voltage (V_SS1).

For reading from the device (read mode) one data byte register is available without subaddressing.

8.1.1

Table 1 Slave address; 34H

Slave address

WRITE MODE

0

1

0

1

0

Table 2 Subaddress 00H to 07H

Subaddress

0⁽¹⁾

0/1

Note

1. The use of subaddresses F0H to F7H (11110XXX) instead of 00H to 07H (00000XXX) disables the automatic

subaddress incrementing allowing continuous writing to a single data byte register (e.g. DAC testing).

Table 3 Overview of subaddresses

SUB

ADDR

POR

STATE

DATA BYTES

00H

01H

02H

03H

04H

05H

06H

07H

00000000 alphactr2 alphactr1 alphactr0 alphagain4 alphagain3 alphagain2 alphagain1 alphagain0

00000000

00000000 tlngain1

00000000 tmdac

00000000 sdﬁne7

free

algctr6

tlngain0

tlnlim1

algctr5

rengain

tlnlim0

sdﬁne5

algctr4

negain4

sumref4

sdﬁne4

betascl4

ppnscl4

cdrwsel

algct3

negain3

sumref3

sdﬁne3

betascl3

ppnscl3

lpsel1

algctr2

negain2

sumref2

sdﬁne2

betascl2

ppnscl2

lpsel0

algctr1

negain1

sumref1

sdﬁne1

betascl1

ppnscl1

algctr0

negain0

sumref0

sdﬁne0

betascl0

ppnscl0

sdﬁne6

00011111

01100000

00000000

lexton

free

betactrl1 betactrl0

ppnctrl1

free

ppnctrl0

urefsel

porr

meassel1 meassel0

8.1.2

READ MODE

Table 4 Slave address; 35H

Slave address

0

1

0

1

0

1

Table 5 Read byte

Read byte

por⁽¹⁾

0⁽²⁾

Notes

1. In read mode the actual POR status can be read.

2. The state of unused read bits should not be relied upon; their state may be changed during development.

2000 Oct 30

8

Philips Semiconductors

Product speciﬁcation

Pre-ampliﬁers for CD-RW systems

TZA1020; TZA1020A

8.1.2.1

Examples of valid transmissions to and from the TZA1020

Write: START - 34H - 00H - Data_for_00 - STOP

Write with auto-increment: START - 34H - 00H - data_for_00 - data_for_01 - data_for_02 - STOP

Auto-increment ‘wrap around’: START - 34H - 07H - data_for_07 - data_for_00 - data_for_01 - STOP

Write without auto-increment: START - 34H - F5H - data_for_05 - data_for_05 - data_for_05 - STOP

Read: START - 35H - data_from_ IC - STOP.

8.1.3

CONTROL BYTE SUBADDRESS 00

Table 6 Control bits for alphactrl

GAIN INPUT CURRENT

ALPHA DETECTOR

alphactrl2

alphactrl1

alphactrl0

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0.50

0.33

0.25

0.20

0.17

0.14

0.12

0.11

Table 7 Control bits for alphagain-DAC; note 1

alphagain4 alphagain3 alphagain2 alphagain1 alphagain0

CURRENT alphagain-DAC

0

1

0

1

0

3.125 µA

6.250 µA

9.375 µA

:

code

100 µA (code + 1)/32

1

0

1

0

1

93.750 µA

96.900 µA

100 µA

Note

1. The currents of all DACs is controlled by reference current (I_RREF). The given currents are valid at I_RREF= −900 µA.

2000 Oct 30

9

Philips Semiconductors

Product speciﬁcation

Pre-ampliﬁers for CD-RW systems

TZA1020; TZA1020A

8.1.4

CONTROL BYTE SUBADDRESS 01

Table 8 Control byte for algctrl switch functions

algctr6

algctr5

algctr4

algctr3

algctr2

algctr1

algctr0

DESCRIPTION

0

POR state

−

current gain alpha CD-R

Aoc = 0alpha CD-R circuit power-off

0

1

−

1

0

1

−

current gain alpha CD-R

Aoc = 1alpha CD-R circuit power-on

current gain alpha CD-R

Aoc = 3alpha CD-R circuit power-off

current gain alpha CD-R

Aoc = 4alpha CD-R circuit power-on

−

0

1

−

0

1

−

0

1

−

0

1

−

0

1

0

1

alpha peak detector normal mode

alpha peak detector to level (test)

CD-RW mode 1

CD-RW mode 2

alpha CD-R

alpha CD-RW

DALPHA gain = 0.25

DALPHA gain = 0.50

DALPHA gain = 0.75

DALPHA gain = 1.00

8.1.5

CONTROL BYTE SUBADDRESS 02

Table 9 Control bits for tlngain

tlngain1

tlngain0

GAIN TLN SIGNAL

0

1

0

1

0

1

1.5

3.0

4.5

6.0

Table 10 Control bits for rengain

rengain

DESCRIPTION

0

1

1 normal

1.3 self test

2000 Oct 30

10

Philips Semiconductors

Product speciﬁcation

Pre-ampliﬁers for CD-RW systems

TZA1020; TZA1020A

Table 11 Control bits for current negain-DAC; note 1

negain4

negain3

negain2

negain1

negain0

CURRENT negain-DAC

0

1

0

1

0

3.125 µA

6.250 µA

9.375 µA

:

code

100 µA (code + 1)/32

1

0

1

0

1

93.750 µA

96.900 µA

100 µA

Note

1. The currents of all DACs is controlled by reference current (I_RREF). The given currents are valid at I_RREF= −900 µA.

8.1.6

CONTROL BYTE SUBADDRESS 03

Table 12 Control bit for tmdac

tmdac

DESCRIPTION

0

1

DAC test off

DAC test on

Table 13 Control bits for tlnlimit

tlnlim1

tlnlim0

DESCRIPTION

0

X

1

0

1

0

clamp off

clamp on 1 (0.6 V; T_amb= 25°C)

clamp on 2 (1.2 V; T_amb= 25°C)

Table 14 Control bits for current sumref-DAC; note 1

sumref4

sumref3

sumref2

sumref1

sumref0

CURRENT sumref-DAC

0

1

0

1

0

0.468 µA

0.937 µA

1.40 µA

:

code

15 µA (code + 1)/32

1

0

1

0

1

14.06 µA

14.53 µA

15.00 µA

Note

1. The currents of all DACs is controlled by reference current (I_RREF). The given currents are valid at I_RREF= −900 µA.

2000 Oct 30

11

Philips Semiconductors

Product speciﬁcation

Pre-ampliﬁers for CD-RW systems

TZA1020; TZA1020A

8.1.7

CONTROL BYTE SUBADDRESS 04

Table 15 Control byte for 8-bit sdﬁne-DAC; note 1

sdﬁne7 sdﬁne6 sdﬁne5 sdﬁne4 sdﬁne3 sdﬁne2 sdﬁne1 sdﬁne0

CURRENT sdﬁne-DAC

0

1

0

1

0

0.117 µA

0.234 µA

0.352 µA

:

code

30 µA (code + 1)/256

1

0

1

0

1

29.76 µA

29.88 µA

30.0 µA

Note

1. The currents of all DACs is controlled by reference current (I_RREF). The given currents are valid at I_RREF= −900 µA.

8.1.8

CONTROL BYTE SUBADDRESS 05

Table 16 Control bits for betactrl control via 5-bit DAC

betactrl1

betactrl0

CALF BANDWIDTH (Hz)

0

1

0

1

0

1

500

1000

2000

4000

Table 17 Control bits for betascl control via 5-bit DAC; note 1

betascl4

betascl3

betascl2

betascl1

betascl0

CURRENT betascl-DAC

0

1

0

1

0

3.125 µA

6.250 µA

9.375 µA

:

code

100 µA (code + 1)/32

1

0

1

0

1

93.750 µA

96.900 µA

100 µA

Note

1. The currents of all DACs is controlled by reference current (I_RREF). The given currents are valid at I_RREF= −900 µA.

2000 Oct 30

12

Philips Semiconductors

Product speciﬁcation

Pre-ampliﬁers for CD-RW systems

TZA1020; TZA1020A

8.1.9

CONTROL BYTE SUBADDRESS 06

Table 18 Control bits for ppnctrl control via 5-bit DAC

ppnctrl1

ppnctrl0

DESCRIPTION

1

−

0

1

0

1

−

POR state

integrator slow disabled

integrator slow enabled

integrator fast disabled

integrator fast enabled

Table 19 Control bits for ppnscl control via 5-bit DAC; note 1

ppnscl4

ppnscl3

ppnscl2

ppnscl1

ppnscl0

CURRENT ppnscl-DAC

0

1

0

1

0

3.125 µA

6.250 µA

9.375 µA

:

code

100 µΑ (code + 1)/32

1

0

1

0

1

93.750 µA

96.900 µA

100 µA

Note

1. The currents of all DACs is controlled by reference current (I_RREF). The given currents are valid at I_RREF= −900 µA.

8.1.10 CONTROL BYTE SUBADDRESS 07

Table 20 Control bits for porr

porr

MODE

DESCRIPTION

0

1

note 1

POR reset

reset of POR signal bit

Note

1. When porr is set to logic 1 it ensures that the POR read bit is reset to logic 0. This way a reading of POR is always

at logic 1 with the occurrence of an actual power-on I²C-bus register reset and cannot accidentally be caused by

other I²C-bus control bits. Bit porr has no control function; it is an ‘unused’ bit dedicated by name to change the

I²C-bus register content from the POR state. Bit POR of the read byte is a wired NOR function that checks all

I²C-bus register bits: when the I²C-bus register contents equals the Power-on reset default state POR will read

logic 1, also when this state is set via the I²C-bus control. Because a setting of porr = 1 differs from the POR default

state it forces a reset to logic 0 of the POR bit independent of other bit settings.

2000 Oct 30

13

Philips Semiconductors

Product speciﬁcation

Pre-ampliﬁers for CD-RW systems

TZA1020; TZA1020A

Table 21 Control bits for meassel

meassel1

meassel0

MEAS1

MEAS2

0

1

0

1

0

1

Gc [(Ic1 + Ic4) − (Ic2 + Ic3)] Gc [(Ic1 + Ic2) − (Ic3 + Ic4)]

Gs (Ia1 − Ia2)

Gs (Ia1 + Ib1)

Gs (Ia1 + Ia2)

Gs (Ib2 − Ib1)

Gs (Ia2 + Ib2)

Gs (Ib2 + Ib1)

Table 22 Control bits for lpsel

lpsel1

lpsel0

BANDWIDTH

0

1

0

1

0

1

40 kHz

80 kHz

160 kHz

320 kHz

Table 23 Control bit for cdrwsel

cdrwsel

DESCRIPTION

CD-R mode

0

1

CD-RW mode

Table 24 Control bits for urefsel

urefsel

REFERENCE OUTPUT VOLTAGE

0

1

2.9 V

3.5 V

Table 25 Read byte

POR

DESCRIPTION

0

1

I²C-bus bit state differs from power-on reset state

I²C-bus bit state equals power-on reset state; note 1

Note

1. At power-on, an internal power-on reset signal is generated which resets the I²C-bus data bits to a pre-defined state.

When the internal data bits are found to be in a POR state (due to an actual power-on reset but also when set via

the I²C-bus) bit POR signals logic 1. Using the POR bit to detect occurrence of a power-on reset requires bit PORR

to be set to logic 1 after power-up. Setting bit PORR forces the POR bit to logic 0 independent of other I²C-bus bit

settings.

2000 Oct 30

14

Philips Semiconductors

Product speciﬁcation

Pre-ampliﬁers for CD-RW systems

TZA1020; TZA1020A

8.2

Characteristics of the I²C-bus

SYMBOL PARAMETER

f_SCL

FAST-MODE I²C-BUS

MIN. MAX.

UNIT

SCL clock frequency

0

400

kHz

t_BUF

bus free time between a STOP and START

condition

1.3

−

µs

t_HD;STA

hold time (repeated) START condition; after this 0.6

period, the ﬁrst clock pulses are generated

−

µs

t_LOW

t_HIGH

t_SU;STA

t_HD;DAT

t_SU;DAT

t_r

LOW period of the SCL clock

HIGH period of the SCL clock

set-up time for a repeated START condition

data hold time

1.3

0.6

0

−

µs

ns

µs

pF

−

0.9

−

data set-up time

100

(1)

rise time of both SDA and SCL signals

fall time of both SDA and SCL signals

set-up time for STOP condition

capacitive load for each bus line; note 1

20 + 0.1C_b

300

−

t_f

20 + 0.1C_b

t_SU;STO

C_b

0.6

−

400

Note

1. C_b= total capacitance of one bus line in pF.

For more information on “The I²C-bus and how to use it” see home page http://www.semiconductors.philips.com.

2000 Oct 30

15

Philips Semiconductors

Product speciﬁcation

Pre-ampliﬁers for CD-RW systems

TZA1020; TZA1020A

Table 26 Scale factors controlled by the I²C-bus interface

BINARY VALUE

CONTROL SIGNAL

SCALE FACTOR

RE_scale

CONTROL SIGNAL

VALUE SCALE FACTOR

rengain

0

1

1.3

1.5

3.0

4.5

6.0

0.05

0.2

TL_scale

tlngain1 and tlngain0

00

01

10

11

0

MIR_scale

cdrwsel

1

Table 27 Currents controlled by the I²C-bus interface; note 1

NORMALIZER

CONTROL SIGNAL

CURRENTS

BINARY VALUE

CONTROL SIGNAL

VALUE CURRENT (µA)

I_negain

I_sumref

I_sdﬁne

negain4 to negain0

sumref4 to sumref0

sdﬁne7 to sdﬁne0

−

00000

3.125

:

50

:

01111

:

11111

100

0.47

:

00000

:

01111

7.5

:

11111

15

0.12

:

0000000

:

0111111

15

:

1111111

−

30

20

I_ref

Note

1. The currents are proportional to I_RREF. The given current values are valid at I_RREF= −900 µA.

2000 Oct 30

17

Philips Semiconductors

Product speciﬁcation

Pre-ampliﬁers for CD-RW systems

TZA1020; TZA1020A

9

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

SYMBOL PARAMETER

V_DD

MIN.

MAX.

13.2

UNIT

positive supply voltage

storage temperature

ambient temperature

0

V

T_stg

T_amb

V_es

−65

+150

70

°C

0

electrostatic handling voltage:

Machine model

−200

+200

V

Human body model

−1000

+1000

10 THERMAL CHARACTERISTICS

SYMBOL

R_th(j-a)

PARAMETER

CONDITIONS

VALUE

60

UNIT

thermal resistance from junction to ambient in free air

K/W

11 CHARACTERISTICS

_DD1= V_DD2= 5 V; V_SS1= V_SS2= −5 V; T_amb= 25 °C; ERON = 1; AMON = 0; I_RREF= −900 µA; unless otherwise

speciﬁed.

V

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

Supplies

V_DD1

positive supply voltage 1

(pin 28)

4.5

5.0

5.5

V

V_SS1

V_DD2

V_SS2

∆V_DD

∆V_SS

I_DD(tot)

negative supply voltage 1

(pin 30)

−5.5

4.5

−5.0

5.0

−5.0

−

−4.5

5.5

positive supply voltage 2

(pin 16)

negative supply voltage 2

(pin 18)

−5.5

−0.5

−4.5

+0.5

difference between V_DD1

and V_DD2

difference between V_SS1

and V_SS2

−

positive supply current

V_DD1+ V_DD2

quiescent state

−

12

26

49

−

mA

maximum current

maximum current at

AMON = 1

I_SS(tot)

negative supply current

V_SS1+ V_SS2

quiescent state

−

16

25

33

−

mA

maximum current

maximum current at

AMON = 1

2000 Oct 30

18

Philips Semiconductors

Product speciﬁcation

Pre-ampliﬁers for CD-RW systems

TZA1020; TZA1020A

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

Reference input current; pin RREF

I_i(RREF)

I_RREF

input reference current

current range

note 1

−

−900

−

µA

−1200

−

−6500

µA

V_i(RREF)

input voltage on pin RREF I_RREF= −900 µA

1.22

1.245

1.26

V

referenced to V_SS

Reference voltage buffer; pin UOUT

V_UOUT

LOW-level output

reference voltage

urefsel = 0

I_UOUT= −6 mA

2.63

2.77

2.9

2.90

V

I_UOUT= 0 mA

−

HIGH-level output

reference voltage

urefsel = 1

I_UOUT= −6 mA

3.23

−

3.4

3.5

−

3.57

V

I_UOUT= 0 mA

−

0

−

V

I_UOUT

current range

−10

22

mA

nF

C_UOUT

capacitance on pin UOUT I_UOUT= −6 mA

(necessary for stability)

−

I_UOUT= 0 mA

100

−

Detector inputs

INPUT CURRENT RANGE

I_i(Cn)

central diode input current AMON = 0

1.0

0

−

75

µA

for C1 to C4

AMON = 1

4000

9

I_i(SA,SB)

satellite diode input current AMON = 0

0.6

0

for SA1/SA2 and SB1/SB2

AMON = 1

520

1800

I_i(CAGAIN)

input current for set-point

laser power

30

INPUT VOLTAGE LEVEL

V_i(Cn)

central diode input voltage AMON = 0

for C1 to C4

−

0

−

V

AMON = 1

1.4

0.7

V_i(SA,SB)

satellite diode input voltage AMON = 0

for SA1/SA2 and SB1/SB2

AMON = 1

V_i(CAGAIN)

input current for set-point

laser power

INPUT RESISTANCE

R_i(Cn)

central diode input

AMON = 0

−

300

−

Ω

resistance for C1 to C4

AMON = 1; I_i(cd)= 25 µA

Iexton = 1

−

600

−

Ω

Iexton = 0

1000

R_i(SA,SB)

satellite diode input

resistance for SA1/SA2

and SB1/SB2

I_i(SA,SB)= 6.25 µA

Iexton = 1

−

1000

4000

700

−

Ω

Iexton = 0

R_i(CAGAIN)

input resistance for

set-point laser power

I_i(CAGAIN)= 35 µA

2000 Oct 30

19

Philips Semiconductors

Product speciﬁcation

Pre-ampliﬁers for CD-RW systems

TZA1020; TZA1020A

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

Digital control signals

INPUT VOLTAGE LEVELS; PINS ERON, ASTROBE, AINTON, ALS, SDA, SCL AND AMON

V_IL

V_IH

LOW-level input voltage

HIGH-level input voltage

V_DD1= V_DD2= 5.0 V

−0.3

−

+0.9

V

2.3

5.3

OUTPUT VOLTAGE LEVEL; PIN SDA

V_OH

V_OL

LOW-level output voltage

V_DD1= 5.0 V

4.5

0

−

5.0

0.5

V

HIGH-level output voltage

INPUT CURRENT

I_LI

input leakage current

pins SDA, SCL, AMON

and ALS

−1.5

−

0

µA

pin ERON

−15

−

0

µA

pins AINTON and

ASTROBE

−100

0

+100

nA

DELAY TIMES

t_d

delay time

pins ASTROBE and

AINTON

−

15

36

−

ns

pins SDA, SCL, AMON

and ALS

50

3.5

pin ERON

2.5

Normalized servo signals; note 2 and Section 11.1

GAIN SETTINGS

G_fe

G_re

G_tl

gain focus error signal

gain radial error signal

gain track loss signal

gain radial beam landing

ERON = 1

ERON = 0

ERON = 1

ERON = 0

ERON = 1

ERON = 0

ERON = 1

ERON = 0

ERON = 1

0.22

−

0.24

0

0.26

−

0.87

−

0.95

0

1.03

−

0.87

−

0.95

0

1.03

−

G_xd

0.87

−

0.95

0

1.03

−

G_gr

gain in grating ratio

correction

0.94

1

1.06

G_mir

gain in mirror signal

ERON = 1

0.90

1.03

1.15

2000 Oct 30

20

Philips Semiconductors

Product speciﬁcation

Pre-ampliﬁers for CD-RW systems

TZA1020; TZA1020A

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

OFFSET CURRENTS

I_offset(fe)

I_offset(re)

I_offset(tl)

offset current focus error

offset current radial error

offset current track loss

offset radial beam landing

−550

0

+550

nA

rengain = 0

−1.5

−4

+1.5

+4

µA

tlngain(1,0) = 00

I_offset(xd)

∆I_offset(re)

−1.5

−0.8

+1.5

+0.8

variation in offset current

radial error

AMON 0 → 1

∆I_offset(tl)

variation in offset current

track loss

−1.4

−0.2

+1.2

µA

OUTPUT IMPEDANCE

Z_o(FEN)

Z_o(REN)

Z_o(XDN)

Z_o(TLN)

Z_o(MIRN)

output impedance pin FEN

−

40

21

15

80

−

MΩ

output impedance pin REN

output impedance pin XDN

output impedance pin TLN

output impedance

pin MIRN

VOLTAGE RANGE OF OUTPUT SIGNALS

V_o(FEN)

V_o(REN)

V_o(XDN)

V_o(l)(TLN)

output voltage pin FEN

output voltage pin REN

output voltage pin XDN

output voltage pin TLN

−4

−1

−2

0.2

−

+4

+3

+1

+2

1.0

V

tlnlim(1,0) = 00; note 3

tlnlim(1,0) = X1; note 3

tlnlim(1,0) = 10; note 3

V_o(l)(MIRN)

output voltage linear range note 4

pin MIRN; TZA1020

output voltage linear range note 4

pin MIRN; TZA1020A

0.2

−

4.0

V

BANDWIDTH

B_−3dB

−3 dB bandwidth

48

60

72

4

kHz

%

∆B_−3dB

relative variation of B_{−3 dB}

over total input current

range

−

Fast track count; see Table 28 and notes 5 and 6

GAIN SETTINGS

Z_tr(FTC)

transimpedance of fast

track circuit

cdrwsel = 0

cdrwsel = 1

AMON = 1

4

5

6

kΩ

16

−

20

0

24

−

G_gr

gain in grating ratio

correction

0.94

1.00

1.06

∆V_RE-NOM(p-p)

nominal signal swing

(peak-to-peak value)

−

1

−

V

2000 Oct 30

21

Philips Semiconductors

Product speciﬁcation

Pre-ampliﬁers for CD-RW systems

TZA1020; TZA1020A

SYMBOL

TS_Ztr(FTC)

PARAMETER

CONDITIONS

MIN.

TYP.

0.2

MAX.

UNIT

%/K

temperature sensitivity for

transimpedance of fast

track circuit

−

FAST TRACK COUNT SIGNAL VOLTAGE OUTPUT; PIN RE

V_o(RE)

output voltage range

output offset voltage

−3.5

−40

−100

−

+2.5

+40

+150

−

V

V_offset(RE)

cdrwsel = 0

0

mV

Ω

cdrwsel = 1

+25

125

580

−

R_o(RE)

output resistance

minimum diode currents

−

Ω

B_−3dB(RE)

bandwidth of RE signal

C_L= 20 pF; valid for

complete input current

range

800

−

kHz

Spot position measurements; see Table 29 and note 7

GAIN SETTINGS

G_cd

gain central diode current AMON = 0

0.45

−

0.50

0

0.55

−

combination

AMON = 1

G_sd

gain satellite diode current AMON = 0

0.9

−

1.00

0

1.1

−

combinations

AMON = 1

OFFSET CURRENTS

I_offset(MEAS)

offset of MEAS1 current

meassel = 00

meassel = 01

meassel = 00

meassel = 01

−1.6

0

+1.6

µA

offset of MEAS2 current

Central aperture high frequency output

G_I(CAHF)

current gain

cdrwsel = 0;

ΣI_CI= 180 µA

7.5

8.25

9.0

38

cdrwsel = 1; ΣI_C1= 50 µA 30

35

I_offset(CAHF)

f_−3dB

offset current at zero input cdrwsel = 0; ΣI_C1= 0 µA

current

−

100

µA

bandwidth (−3 dB), valid

for total current range

C_i= 12 pF; note 8

C_i= 5 pF

17

19

−

MHz

∆t_d

delay variations valid for

total current range

f = 0.1 to 12 MHz

C_i= 12 pF

−

0.9

1.1

ns

C_i= 5 pF

2000 Oct 30

22

Philips Semiconductors

Product speciﬁcation

Pre-ampliﬁers for CD-RW systems

TZA1020; TZA1020A

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

Laser power calibration signals (beta circuit); see Fig.5 and Table 30

I_p1= I_p2= 10 TO 90 µA; 2.1 × I_p1; I_betascl= I_p1

V_ref(beta)

reference voltage for beta AMON = 0

1.1

1.25

1.4

V

−

detector

AMON = 1

−

0

1

−

V_A1/V_A2

ratio between A1 and A2

0.9

0.8

1.1

1.2

V_A1/V_CALF

ratio between CALF and

A1

ΣI_c1= 100 µA; I_betascale= I_p1

B_−3dBbandwidth (−3 dB) of CALF C_CALPF= 15 nF

and CALFI signal

betactrl = 00

betactrl = 01

−

500

−

Hz

1000

2000

4000

betactrl = 10

betactrl = 11

tc_peak

time constant peak

detector

C_HCA1= C_HCA2= 10 nF

betactrl = 00

−

500

250

125

60

−

µs

Ω

betactrl = 01

betactrl = 10

betactrl = 11

R_o

V_o

output resistance pins A1,

A2 and CALF

250

output voltage pins A1, A2 V_DD1= 5.0 V

and CALF

0

−

4.5

V

Laser power calibration signals (alpha circuit); see note 9 and Tables 31 and 32

GAIN SETTINGS

G_alpha(CD-RW)

gain in alpha CD-RW

circuit

ERON = 1

0.88

−

1

1.12

−

ERON = 0

0

G_CD-R(i)

G_CD-R(norm)

G_sub

gain in CD-R input circuit

gain in CD-R normalizer

subtractor gain

AINTON = 1

ASTROBE = 1

ALS = 1

0.53

38126

0.94

−

0.62

48158

0.97

0

0.72

6190

1.0

−

µA/V

ALS = 0

∆V_AINT-ASTROBEchange in voltage

measured behind

ASTROBE 1 → 0

−

130

−

mV

ASTROBE switch

V_AINT

B_lpf

voltage range pin AINT

0.5

48

0.3

−

3

V

bandwidth of low-pass ﬁlter ERON = 1

current to peak detector

60

−

72

2

kHz

mA

µA/µs

I_peak

I_L(peak)

leakage current of peak

detector

algctr6 = 1; algctr4 = 0

100

−

tc_peak

time constant peak

detector time discrete to

time continues

switching AINTON at

realistic data speed = N

−

5/N

−

µs

2000 Oct 30

23

Philips Semiconductors

Product speciﬁcation

Pre-ampliﬁers for CD-RW systems

TZA1020; TZA1020A

SYMBOL

V_AZIN

PARAMETER

voltage on AZIN input node I_AZIN= 100 µA

_AZIN= 10 µA

CONDITIONS

MIN.

TYP.

MAX.

UNIT

mV

−

0

−

I

−60

mV

V

V_o(DALPHA)

R_sw(AINTON)

output voltage pin

DALPHA

−3.5

−

+3.5

resistance AINTON switch

−

50

−

Ω

Wobble pre-processor; see note 10 and Table 33

LPF2

B_−3dB(LPF2)

bandwidth (−3 dB) of LPF2 lpsel = 00

32

40

48

96

kHz

%

lpsel = 01

lpsel = 10

lpsel = 11

64

80

120

240

−

150

300

−

180

360

6

∆B_LPF2

relative variation B_LPF2

over input current range

note 10

VARIABLE GAIN LOOP

k_bal

sensitivity balance circuit

−

1

−

V⁻¹

G_bal

gain balancing circuit

cdrwsel = 0

cdrwsel = 1

0.758

3.0

0.5

0.889

3.5

−

0.951

3.84

2

I_l/I_r

input current range of

balancing circuit

SR_loop

slew rate loop

ppnctrl1 = 0

−

6200

0

−

V/s

kHz

−

B_−3dB(bal)

bandwidth variable gain

loop

I_op= I_on= 0 µA; note 11

800

−

1000

0

1250

ppnctrl1 = 0; note 11

−

MULTIPLIER LOOP

V_PPN(norm)

R_ca

normalize voltage pin PPN

resistance ca

−

3.14

8

−

V

AMON = 0

AMON = 1

−

kΩ

−

1

kΩ

B_−3dB(HPF)

k_mult

bandwidth (−3 dB) of HPF

sensitivity multiplier

40

−

50

60

−

kHz

mA/V²

µA/V

0.19

340

g_m(V-I)

transconductance V → I

V_p− V_ref(V-I)< 0.354 V;

−

note 12

ppnctrl2 = 0

−

0

−

µA/V

V_ref(V-I)

reference voltage V → I

3.25

3.5

3.75

V

2000 Oct 30

24

Philips Semiconductors

Product speciﬁcation

Pre-ampliﬁers for CD-RW systems

TZA1020; TZA1020A

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

OUTPUT STAGE; note 13

V_PPN

R_(I-V)

voltage range

I -> V conversion

−3.5

−

+2.5

V

244

320

400

kΩ

resistance

V_offset(PPN)

offset voltage of PPN

signal

I_ppnscl= 3.125 µA

−38

+6

+50

mV

I

_ppnscl= 100 µA

−1165

+80

+1325

ppnctrl1 = 0

I_ppnscl= 3.125 µA

−115

+6

+130

mV

Ω

I

_ppnscl= 100 µA

I_ppnscl= 3.125 µA

_ppnscl= 20 µA

−3800

+80

2200

400

0.2

+4000

R_o(PPN)

output resistance PPN

signal

−

I

Ω

TS_R(I-V)

temperature sensitivity of

offset voltage of PPN

signal

%/°C

B_−3dB(PPN)

internal signal bandwidth

of PPN circuit

−

1

−

MHz

Notes

1. In the application, the reference current will be generated by means of a resistor. The given current can be realized

by a resistor of 1.3844 kΩ. As these are not available, the actual reference current will be slightly different. This

means that all derived signal currents will be scaled in the same way.

2. I_C1= I_C2= I_C3= I_C4= 10 µA; I_SA1= I_SA2= I_SB1= I_SB2= 1.25 µA; I_negain= 50 µA; I_sdﬁne= 20 µA; I_RREF= −900 µA;

I_cagain= 35 µA; ERON = 1.

3. The voltage on TLN can be clamped with respect to GND (positive and negative) with one or two diodes. The clamp

has an internal resistance of approximately 900 Ω.

4. In the TZA1020A, pin MIRN is clamped with respect to GND (positive) by means of one diode.

5. I_C1= I_C2= I_C3= I_C4= 25 µA; I_SA1= I_SA2= I_SB1= I_SB2= 3.125 µA; I_sdfine= 20 µA; I_RREF= −900 µA.

4 × G_gr× (I_ref+ I_sdfine

)

6.

V_RE= –T_rre× (I_C1+ I_C4) – (I_C2+ I_C3) –

× ((I _SA1+ I_SB1) – (I_SA2+ I_SB2))

-----------------------------------------------------------

I_ref

7. I_C1= I_C2= I_C3= I_C4= 25 µA; I_SA1= I_SA2= I_SB1= I_SB2= 3.125 µA.

8. C_i= total capacitance connected to all input pins C1 to C4 (between pin and ground).

9. ΣI_C1= 2e-3.(1 + 0.7 sin(12π.3e6.t)) µA; I_SA1= I_SB1= I_SA2= I_SB2= 25 µA; I_MIRN= 15 µA; I_alphagain= 50 µA;

I_sumref= 15 µA; I_AZIN= 100 µA; AMON = 1; alphactrl(2 to 0) = 000; algctr4 = 00; algctr6 = 1; algctr5 = 0;

I_CAGAIN= 200 µA.

10. I_C1= I_C2= I_C3= I_C4= 25 µA; I_ppnscl= 50 µA; ppnctrl1 = 1, ppnctrl2 = 1.

Sr_loop× k_bal

11. Bandwidth =

.

-------------------------------

2π

12. I_opand I_onare limited to 12 µA ±3 µA.

L – R

13. V _PPN

=

× R_{(I – V)}× I_ppnscl

-------------

L + R

2000 Oct 30

25

Philips Semiconductors

Product speciﬁcation

Pre-ampliﬁers for CD-RW systems

TZA1020; TZA1020A

Table 28 Fast track count; note 1

BINARY VALUE

CONTROL SIGNAL

FTC CURRENTS

I_sd-ﬁne

CONTROL SIGNAL

VALUE CURRENT (µA)

sdﬁne7 to sdﬁne0

0000000

0.12

:

0111111

15

:

1111111

−

30

20

I_ref

−

Note

1. The currents are proportional to I_RREF. The given current values are valid at I_RREF= −900 µA.

Table 29 Spot position measurements

meassel CODE

00 (POR)

I_MEAS1

I_MEAS2

G_cd[(I_C1+ I_C4) − (I_C2+ I_C3)]

G_cd[(I_C1+ I_C2) − (I_C3+ I_C4)]

01

10

11

G

_sd(I_SA1− I_SA2

)

G_sd(I_SB2− I_SB1)

_sd(I_SA1+ I_SB1

)

G_sd(I_SA2+ I_SB2

)

_sd(I_SA1+ I_SA2

G_sd(I_SB1+ I_SB2

Table 30 Laser power calibration (beta circuit); note 1

BETA CIRCUIT

CONTROL SIGNAL

CURRENTS

BINARY VALUE

CONTROL SIGNAL

VALUE CURRENT (µA)

I_betascl

betascl4 to betascl0

00000

3.125

:

50

:

01111

:

11111

100

Note

1. The currents are proportional to I_RREF. The given current values are valid I_RREF= −900 µA.

2000 Oct 30

26

Philips Semiconductors

Product speciﬁcation

Pre-ampliﬁers for CD-RW systems

TZA1020; TZA1020A

MGR812

k, full pagewidth

Σ

I

CI

I

p1

l

p2

I

calfi

V_beta

V_A1

=

× I

-----------------

I_betascl

p1

V_beta

V_A2

-----------------

I_betascl

p2

V_beta

V_CALF

=

× I

-----------------

I_betascl

calfi

ΣI_C1= I_C1+ I_C2+ I_C3+ I_C4

I_p1= (ΣI_C1≈ I_calfi

I_p2= (I_calfi≈ ΣI_C1

)

Fig.5 Laser power calibration signal (beta circuit).

2000 Oct 30

27

Philips Semiconductors

Product speciﬁcation

Pre-ampliﬁers for CD-RW systems

TZA1020; TZA1020A

11.1 Transfer functions for normalized servo signals

I

_C1– I_C4

I _C3– I_C2

I_FEN= G_fe

×

+

× I_negdoc

--------------------- ---------------------

I

_C1+ I_{C4 C3}+ I_C2

I

(I_C1+ I_C4) – (I_C2+ I_C3) – G_sat× (I_S1– I_S2

)

I_XDN= G_xd

×

× I_negdoc

--------------------------------------------------------------------------------------------------------------

_C1+ I_C2+ I_C3+ I_C4+ G_sat× (I_S1+ I_S2

I

)

(I_C1+ I_C4) – (I_C2+ I_C3) – G_sat× (I_S1– I_S2

)

I_REN= G_re× RE_scale

×

× I_negdoc

--------------------------------------------------------------------------------------------------------------

I

_C1+ I_C2+ I_C3+ I_C4+ G_sat× (I_S1+ I_S2

)

(I_C1+ I_C4) – (I_C2+ I_C3) – G_sat× (I_S1– I_S2

)

I_TLN= G_tl× TL_scale

×

× I_negdoc

--------------------------------------------------------------------------------------------------------------

I

_C1+ I_C2+ I_C3+ I_C4+ G_sat× (I_S1+ I_S2

)

(I_C1+ I_C4) – (I_C2+ I_C3) – G_sat× (I_S1– I_S2

)

I_MIRN= –G_mir× MIR_scale

×

× I_negain

at I_C1+ I_C2+ I_C3+ I_C4< 0.9I_sumref

at I_C1+ I_C2+ I_C3+ I_C4> 1.1I_sumref

--------------------------------------------------------------------------------------------------------------

I_CAGAIN

I

_C1+ I_C2+ I_C3+ I_C4

--------------------------------------------------

I_sumref

I_negdoc= I_negain

×

I

_C1+ I_C2+ I_C3+ I_C4

--------------------------------------------------

I_sumref

I

_C1+ I_C2+ I_C3+ I_C4

--------------------------------------------------

I_sumref

I_S1= I_SA1+ I_SB1, I_S2= I_SA2+ I_SB2

4 × G_gr× (I_ref+ I_sdfine

)

G_sat

=

-----------------------------------------------------------

I_ref

2000 Oct 30

28

Philips Semiconductors

Product speciﬁcation

Pre-ampliﬁers for CD-RW systems

TZA1020; TZA1020A

11.2 Laser power control signals (alpha circuit)

The alpha circuit can be split into an alpha circuit for CD-RW, an alpha circuit for CD-R and a subtractor with additional

gain switching. The alpha circuit is active only if AMON = 1.

Table 31 Alpha scale factors

BINARY VALUE

CONTROL SIGNAL

SCALE FACTOR

gain input current

CONTROL SIGNAL

VALUE SCALE FACTOR

alphactrl2 to alphactrl0

000

001

010

011

100

101

110

111

00

0.50

0.33

0.25

0.20

0.17

0.14

0.12

0.11

0

current gain output

subtractor gain

algctrl4 and Algctrl6

algctrl1 and algctrl0

01

1

10

3

11

4

00

0.25

0.5

01

10

0.75

1.0

11

Table 32 Alpha currents; note 1

ALPHA CIRCUIT

CURRENTS

BINARY VALUE

CONTROL SIGNAL

VALUE CURRENT (µA)

I_alphagain

alphagain4 to alphagain0

00000

01111

11111

−

3.125

50

100

20

I_ref

−

Note

1. The currents and gain factor are proportional to I_RREF. The given current values are valid at I_RREF= −900 µA.

2000 Oct 30

29

Philips Semiconductors

Product speciﬁcation

Pre-ampliﬁers for CD-RW systems

TZA1020; TZA1020A

11.3 Wobble pre-processor

Table 33 Wobble currents; note 1

BINARY VALUE

CONTROL SIGNAL

WOBBLE CURRENTS

I_ppnscl

CONTROL SIGNAL

VALUE CURRENT (µA)

ppnscl4 to ppnscl0

00000

3.125

:

50

:

01111

:

11111

100

Note

1. The currents are proportional to I_RREF. The given current values are valid at I_RREF= −900 µA.

2000 Oct 30

30

Philips Semiconductors

Product speciﬁcation

Pre-ampliﬁers for CD-RW systems

TZA1020; TZA1020A

12 APPLICATION AND TEST INFORMATION

handbook, full pagewidth

15

11

ERON

35 FEN

36 REN

from

laser control

CAGAIN

INPUT

STAGE 3

37 TLN

SERVO

34 XDN

+12 V

NORMALIZER

LPF 1

LPF 2

SA1

SA2

SB1

SB2

4

8

5

9

38 MIRN

DIODE

INPUT

STAGE 1

26 PPN

WOBBLE

PREPROCESSOR

10

3

C1

C2

C3

C4

27 CWBL

DEMODULATOR

DIODE

INPUT

STAGE 2

100 nF

6

24 DALPHA

to laser

7

1 nF

22 AINT

ALPHA

DETECTOR

70 pF

AMON 14

ASTROBE 19

AINTON 20

TIMING

CIRCUIT

25 AZIN

from microcontroller

ALS 21

23 CAHF

CURRENT

AMPLIFIER

EFM

DECODER

control

switches currents

TZA1020

TZA1020A

44 CALF

43 A1

REGISTER

BETA

MEASUREMENT

42 A2

BETA

DETECTOR

12

13

SDA

SCL

39 CALPF

40 HCA1

41 HCA2

2

I C-BUS

from

microcontroller

INTERFACE

15

nF

10

nF

DACs

10

nF

−5 V

to

1

2

UOUT

RREF

−5 V

POR

laser control

DRIVER

−5 V

32 MEAS1

33 MEAS2

MEAS

BAND GAP

REFERENCE

FAST

TRACK

COUNT

(optional)

31 RE

30

V

29

28

V

18

V

17

16

V

−5 V

MGR813

GND1

GND2

SS1

DD1

SS2

DD2

100

nF

100

nF

100

nF

100

nF

−5 V

+5 V

−5 V

+5 V

Fig.6 Application diagram.

31

2000 Oct 30

Philips Semiconductors

Product speciﬁcation

Pre-ampliﬁers for CD-RW systems

TZA1020; TZA1020A

13 PACKAGE OUTLINE

QFP44: plastic quad flat package; 44 leads (lead length 1.3 mm); body 10 x 10 x 1.75 mm

SOT307-2

y

X

A

33

23

34

22

Z

E

e

H

E

A

2

A

(A )

3

A

1

w M

θ

b

p

L

p

pin 1 index

L

12

44

detail X

1

11

w M

Z

v

M

A

D

b

p

e

D

B

H

v

M

B

D

0

2.5

5 mm

scale

DIMENSIONS (mm are the original dimensions)

A

(1)

UNIT

A

b

c

D

E

e

H

D

H

L

v

w

y

Z

θ

1

2

3

p

E

p

D

E

max.

10^o

0^o

0.25 1.85

0.05 1.65

0.40 0.25 10.1 10.1

0.20 0.14 9.9 9.9

12.9 12.9

12.3 12.3

0.95

0.55

1.2

0.8

1.2

0.8

mm

2.10

0.25

0.8

1.3

0.15 0.15 0.1

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

REFERENCES

OUTLINE

EUROPEAN

PROJECTION

ISSUE DATE

VERSION

IEC

JEDEC

EIAJ

95-02-04

97-08-01

SOT307-2

2000 Oct 30

32

Philips Semiconductors

Product speciﬁcation

Pre-ampliﬁers for CD-RW systems

TZA1020; TZA1020A

14 SOLDERING

If wave soldering is used the following conditions must be

observed for optimal results:

14.1 Introduction to soldering surface mount

packages

• Use a double-wave soldering method comprising a

turbulent wave with high upward pressure followed by a

smooth laminar wave.

This text gives a very brief insight to a complex technology.

A more in-depth account of soldering ICs can be found in

our “Data Handbook IC26; Integrated Circuit Packages”

(document order number 9398 652 90011).

• For packages with leads on two sides and a pitch (e):

– larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the

transport direction of the printed-circuit board;

There is no soldering method that is ideal for all surface

mount IC packages. Wave soldering is not always suitable

for surface mount ICs, or for printed-circuit boards with

high population densities. In these situations reflow

soldering is often used.

– smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the

printed-circuit board.

The footprint must incorporate solder thieves at the

downstream end.

14.2 Reﬂow soldering

• For packages with leads on four sides, the footprint must

be placed at a 45° angle to the transport direction of the

printed-circuit board. The footprint must incorporate

solder thieves downstream and at the side corners.

Reflow soldering requires solder paste (a suspension of

fine solder particles, flux and binding agent) to be applied

to the printed-circuit board by screen printing, stencilling or

pressure-syringe dispensing before package placement.

During placement and before soldering, the package must

be fixed with a droplet of adhesive. The adhesive can be

applied by screen printing, pin transfer or syringe

dispensing. The package can be soldered after the

adhesive is cured.

Several methods exist for reflowing; for example,

infrared/convection heating in a conveyor type oven.

Throughput times (preheating, soldering and cooling) vary

between 100 and 200 seconds depending on heating

method.

Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal

of corrosive residues in most applications.

Typical reflow peak temperatures range from

215 to 250 °C. The top-surface temperature of the

packages should preferable be kept below 230 °C.

14.4 Manual soldering

14.3 Wave soldering

Fix the component by first soldering two

diagonally-opposite end leads. Use a low voltage (24 V or

less) soldering iron applied to the flat part of the lead.

Contact time must be limited to 10 seconds at up to

300 °C.

Conventional single wave soldering is not recommended

for surface mount devices (SMDs) or printed-circuit boards

with a high component density, as solder bridging and

non-wetting can present major problems.

To overcome these problems the double-wave soldering

method was specifically developed.

When using a dedicated tool, all other leads can be

soldered in one operation within 2 to 5 seconds between

270 and 320 °C.

2000 Oct 30

33

Philips Semiconductors

Product speciﬁcation

Pre-ampliﬁers for CD-RW systems

TZA1020; TZA1020A

14.5 Suitability of surface mount IC packages for wave and reﬂow soldering methods

SOLDERING METHOD

PACKAGE

WAVE

REFLOW⁽¹⁾

BGA, SQFP

not suitable

suitable

HLQFP, HSQFP, HSOP, HTSSOP, SMS not suitable⁽²⁾

PLCC⁽³⁾, SO, SOJ

LQFP, QFP, TQFP

SSOP, TSSOP, VSO

suitable

not recommended⁽³⁾⁽⁴⁾

not recommended⁽⁵⁾

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum

temperature (with respect to time) and body size of the package, there is a risk that internal or external package

cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the

Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.

2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink

(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).

3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.

The package footprint must incorporate solder thieves downstream and at the side corners.

4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;

it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is

definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

2000 Oct 30

34

Philips Semiconductors

Product speciﬁcation

Pre-ampliﬁers for CD-RW systems

TZA1020; TZA1020A

15 DATA SHEET STATUS

PRODUCT

DATA SHEET STATUS

STATUS

DEFINITIONS ⁽¹⁾

Objective speciﬁcation

Development This data sheet contains the design target or goal speciﬁcations for

product development. Speciﬁcation may change in any manner without

notice.

Preliminary speciﬁcation Qualiﬁcation

This data sheet contains preliminary data, and supplementary data will be

published at a later date. Philips Semiconductors reserves the right to

make changes at any time without notice in order to improve design and

supply the best possible product.

Product speciﬁcation

Production

This data sheet contains ﬁnal speciﬁcations. Philips Semiconductors

reserves the right to make changes at any time without notice in order to

improve design and supply the best possible product.

Note

1. Please consult the most recently issued data sheet before initiating or completing a design.

16 DEFINITIONS

17 DISCLAIMERS

Short-form specification

The data in a short-form

Life support applications

These products are not

specification is extracted from a full data sheet with the

same type number and title. For detailed information see

the relevant data sheet or data handbook.

designed for use in life support appliances, devices, or

systems where malfunction of these products can

reasonably be expected to result in personal injury. Philips

Semiconductors customers using or selling these products

for use in such applications do so at their own risk and

agree to fully indemnify Philips Semiconductors for any

damages resulting from such application.

Limiting values definition Limiting values given are in

accordance with the Absolute Maximum Rating System

(IEC 60134). Stress above one or more of the limiting

values may cause permanent damage to the device.

These are stress ratings only and operation of the device

at these or at any other conditions above those given in the

Characteristics sections of the specification is not implied.

Exposure to limiting values for extended periods may

affect device reliability.

Right to make changes

Philips Semiconductors

reserves the right to make changes, without notice, in the

products, including circuits, standard cells, and/or

software, described or contained herein in order to

improve design and/or performance. Philips

Semiconductors assumes no responsibility or liability for

the use of any of these products, conveys no licence or title

under any patent, copyright, or mask work right to these

products, and makes no representations or warranties that

these products are free from patent, copyright, or mask

work right infringement, unless otherwise specified.

Application information

Applications that are

described herein for any of these products are for

illustrative purposes only. Philips Semiconductors make

no representation or warranty that such applications will be

suitable for the specified use without further testing or

modification.

18 PURCHASE OF PHILIPS I²C COMPONENTS

Purchase of Philips I²C components conveys a license under the Philips’ I²C patent to use the

components in the I²C system provided the system conforms to the I²C specification defined by

Philips. This specification can be ordered using the code 9398 393 40011.

2000 Oct 30

35

Philips Semiconductors – a worldwide company

Argentina: see South America

Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,

Tel. +31 40 27 82785, Fax. +31 40 27 88399

Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140,

Tel. +61 2 9704 8141, Fax. +61 2 9704 8139

New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,

Tel. +64 9 849 4160, Fax. +64 9 849 7811

Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,

Tel. +43 1 60 101 1248, Fax. +43 1 60 101 1210

Norway: Box 1, Manglerud 0612, OSLO,

Tel. +47 22 74 8000, Fax. +47 22 74 8341

Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,

220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773

Pakistan: see Singapore

Belgium: see The Netherlands

Brazil: see South America

Philippines: Philips Semiconductors Philippines Inc.,

106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,

Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474

Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,

51 James Bourchier Blvd., 1407 SOFIA,

Tel. +359 2 68 9211, Fax. +359 2 68 9102

Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW,

Tel. +48 22 5710 000, Fax. +48 22 5710 001

Portugal: see Spain

Romania: see Italy

Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,

Tel. +1 800 234 7381, Fax. +1 800 943 0087

China/Hong Kong: 501 Hong Kong Industrial Technology Centre,

72 Tat Chee Avenue, Kowloon Tong, HONG KONG,

Tel. +852 2319 7888, Fax. +852 2319 7700

Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,

Tel. +7 095 755 6918, Fax. +7 095 755 6919

Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,

Colombia: see South America

Czech Republic: see Austria

Tel. +65 350 2538, Fax. +65 251 6500

Slovakia: see Austria

Slovenia: see Italy

Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V,

Tel. +45 33 29 3333, Fax. +45 33 29 3905

South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,

2092 JOHANNESBURG, P.O. Box 58088 Newville 2114,

Tel. +27 11 471 5401, Fax. +27 11 471 5398

Finland: Sinikalliontie 3, FIN-02630 ESPOO,

Tel. +358 9 615 800, Fax. +358 9 6158 0920

France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,

Tel. +33 1 4099 6161, Fax. +33 1 4099 6427

South America: Al. Vicente Pinzon, 173, 6th floor,

04547-130 SÃO PAULO, SP, Brazil,

Tel. +55 11 821 2333, Fax. +55 11 821 2382

Germany: Hammerbrookstraße 69, D-20097 HAMBURG,

Tel. +49 40 2353 60, Fax. +49 40 2353 6300

Spain: Balmes 22, 08007 BARCELONA,

Tel. +34 93 301 6312, Fax. +34 93 301 4107

Hungary: see Austria

Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,

Tel. +46 8 5985 2000, Fax. +46 8 5985 2745

India: Philips INDIA Ltd, Band Box Building, 2nd floor,

254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,

Tel. +91 22 493 8541, Fax. +91 22 493 0966

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,

Tel. +41 1 488 2741 Fax. +41 1 488 3263

Indonesia: PT Philips Development Corporation, Semiconductors Division,

Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,

Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080

Taiwan: Philips Semiconductors, 5F, No. 96, Chien Kuo N. Rd., Sec. 1,

TAIPEI, Taiwan Tel. +886 2 2134 2451, Fax. +886 2 2134 2874

Ireland: Newstead, Clonskeagh, DUBLIN 14,

Tel. +353 1 7640 000, Fax. +353 1 7640 200

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,

60/14 MOO 11, Bangna Trad Road KM. 3, Bagna, BANGKOK 10260,

Tel. +66 2 361 7910, Fax. +66 2 398 3447

Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,

TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007

Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,

ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813

Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI),

Tel. +39 039 203 6838, Fax +39 039 203 6800

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,

252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461

Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,

TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,

MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421

Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,

Tel. +82 2 709 1412, Fax. +82 2 709 1415

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,

Tel. +1 800 234 7381, Fax. +1 800 943 0087

Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,

Tel. +60 3 750 5214, Fax. +60 3 757 4880

Uruguay: see South America

Vietnam: see Singapore

Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,

Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087

Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Middle East: see Italy

Tel. +381 11 3341 299, Fax.+381 11 3342 553

For all other countries apply to: Philips Semiconductors,

Marketing Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN,

The Netherlands, Fax. +31 40 27 24825

Internet: http://www.semiconductors.philips.com

70

SCA

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed

without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license

under patent- or other industrial or intellectual property rights.

Printed in The Netherlands

753503/01/pp36

Date of release: 2000 Oct 30

Document order number: 9397 750 04694


型号：	TZA1020HP/A
厂家：	NXP
描述：	Pre-amplifiers for CD-RW systems 前置放大器的CD -RW系统驱动电子器件驱动程序和接口接口集成电路放大器 CD
文件：	总36页 (文件大小：154K)
中文：	中文翻译
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