TZA1027HL [NXP]
Analog current buffer for CD-R and CD-RW systems; 模拟电流缓冲器，用于CD-R和CD-RW系统
| 型号： | TZA1027HL |
| 厂家： | 
NXP |
| 描述： | Analog current buffer for CD-R and CD-RW systems |
| 文件： | 总16页 (文件大小：91K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
TZA1027
Analog current buffer for CD-R and
CD-RW systems
Preliminary specification
1999 Sep 17
File under Integrated Circuits, IC01
Philips Semiconductors
Preliminary specification
Analog current buffer for CD-R and CD-RW
systems
TZA1027
FEATURES
• Eight amplifiers for servo and power calibration
functions
• Gain selector for CD-R and CD-RW discs
• Separate data amplifier for read speed up to thirty times
nominal data speed.
GENERAL DESCRIPTION
The TZA1027 is an analog current buffer IC for CD-R and
CD-RW systems with a 3-spot push-pull tracking system.
The IC interfaces directly to the photo diodes and
TZA1020. A HF current amplifier is implemented to detect
the actual HF data signal.
QUICK REFERENCE DATA
SYMBOL
VDD
PARAMETER
supply voltage
CONDITIONS
MIN.
4.5
TYP. MAX. UNIT
5.0 5.5
− 3400 µA
V
Ii(cd)
Ii(sd)
BCAHF
td(f)
central diode input current
satellite diode input current
bandwidth
WRON = 1
0
WRON = 1
0
−
520
−
µA
Ci = 5 pF
72
−
−
MHz
ps
flatness delay
Ci = 5 pF; f = 0.1 to 32 MHz
HG = 1
30
32
8
200
−
GSS
servo satellite detector gain
−
HG = 0
−
−
Tamb
ambient temperature
0
−
70
°C
ORDERING INFORMATION
TYPE
PACKAGE
NUMBER
NAME
DESCRIPTION
VERSION
TZA1027HL
LQFP32
plastic low profile quad flat package; 32 leads; body 5 × 5 × 1.4 mm
SOT401-1
1999 Sep 17
2
Philips Semiconductors
Preliminary specification
Analog current buffer for CD-R and CD-RW
systems
TZA1027
BLOCK DIAGRAM
TZA1027
7
23
28
24
27
A1
A1LF
A2LF
B1LF
B2LF
2
A2
6
B1
3
B2
29
22
25
1
C1LF
C2LF
C3LF
C1
8
C2
5
C3
26
4
C4LF
C4
+
19
18
9, 10, 11, 12,
17, 20, 32
CAHF
n.c.
21
HFGND
PDWN
31
30
GAIN
SELECTOR
WRON
HG
16
15
13
14
MGR881
V
DGND
V
AGND
DDA
DDD
Fig.1 Block diagram.
3
1999 Sep 17
Philips Semiconductors
Preliminary specification
Analog current buffer for CD-R and CD-RW
systems
TZA1027
PINNING
SYMBOL
C1
PIN
DESCRIPTION
1
central photo diode current input
satellite diode current input
satellite diode current input
central photo diode current input
central photo diode current input
satellite diode current input
satellite diode current input
central photo diode current input
not connected
A2
2
B2
3
C4
4
C3
5
B1
6
A1
7
C2
8
n.c.
9
n.c.
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
not connected
n.c.
not connected
n.c.
not connected
AGND
DGND
VDDD
VDDA
n.c.
analog ground
digital ground
digital power supply
analog power supply
not connected
HFGND
CAHF
n.c.
ground connection of CAHF output stage
central aperture high-frequency output
not connected
PDWN
C2LF
A1LF
B1LF
C3LF
C4LF
B2LF
A2LF
C1LF
HG
digital input power-down
C2 central detector signal output
A1 satellite detector signal output
B1 satellite detector signal output
C3 central detector signal output
C4 central detector signal output
B2 satellite detector signal output
A2 satellite detector signal output
C1 central detector signal output
digital input high gain selection
digital input write on gain selection
not connected
WRON
n.c.
1999 Sep 17
4
Philips Semiconductors
Preliminary specification
Analog current buffer for CD-R and CD-RW
systems
TZA1027
1
2
3
4
5
6
7
8
24
23
22
21
20
19
18
17
C1
A2
B2
C4
C3
B1
A1
C2
B1LF
A1LF
C2LF
PDWN
n.c.
TZA1027HL
CAHF
HFGND
n.c.
MGR882
Fig.2 Pin configuration.
5
1999 Sep 17
Philips Semiconductors
Preliminary specification
Analog current buffer for CD-R and CD-RW
systems
TZA1027
FUNCTIONAL DESCRIPTION
All detector signals are applied to wide-band amplifiers for servo and laser power calibration functions of the TZA1020.
Signals from the central detector are added and amplified to suitable levels for the decoder circuit. Current gain can be
selected for CD-R and CD-RW discs.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
VDD
PARAMETERS
MIN.
MAX.
5.5
UNIT
supply voltage
0
V
Tstg
Tamb
Ves
storage temperature
ambient temperature
electrostatic handling:
Machine model
−6.5
+150
70
°C
°C
0
−100
−500
+100
+500
V
V
Human body model
THERMAL CHARACTERISTICS
SYMBOL
Rth(j-a)
PARAMETER
thermal resistance from junction to
ambient
CONDITION
in free air
VALUE
95
UNIT
K/W
LOGIC FUNCTIONS
PDWN
WRON
HG
MODE
1
0
0
0
0
X; note 1
X; note 1
power-down
CD-R read
0
0
1
1
0
1
0
1
CD-RW read
CD-R write
CD-RW write
Note
1. X = don’t care.
1999 Sep 17
6
Philips Semiconductors
Preliminary specification
Analog current buffer for CD-R and CD-RW
systems
TZA1027
CHARACTERISTICS
VDDA = VDDD = 5 V; Tamb = 25 °C; Ii(cd) = 25 µA with x = 1LF to 4LF; Ii(sd) = 4 µA with y = A or B and z = 1LF or 2LF;
PDWN = 0; WRON = 0; HG = 0 and Ccd = Csd = 5 pF; the given maximum and minimum values are 4σ values; unless
otherwise specified. Signals available on the IC pins are upper case. Signals not visible on the IC pins are lower case.
SYMBOL
Supplies
PARAMETERS
CONDITIONS
MIN. TYP.
MAX.
UNIT
VDDA
VDDD
∆VDD
analog supply voltage
digital supply voltage
difference between
4.5
5.0
5.0
−
5.5
V
V
V
4.5
5.5
−0.3
+0.3
V
DDA and VDDD
IDDA
analog supply current
PDWN = 1
PDWN = 1
−
−
−
−
0.1
13
0
−
−
−
−
mA
mA
mA
mA
IDDD
digital supply current
14
Detector inputs
INPUT CURRENT RANGE
Ii(cd)
central diode input current
1.0
0
−
−
−
−
75
µA
µA
µA
µA
WRON = 1
WRON = 1
3400
9
Ii(sd)
satellite diode input current
0.6
0
520
INPUT VOLTAGE LEVEL
Vi(cd)
central diode input voltage level
2.5
2.6
1.6
1.7
2.9
3.0
1.9
2.0
3.3
3.4
2.2
2.3
V
V
V
V
WRON = 1
WRON = 1
Vi(sd)
satellite diode input voltage level
INPUT RESISTANCE
Ri(cd)
central diode input resistance
−
−
−
−
420
220
620
370
−
−
−
−
Ω
Ω
Ω
Ω
WRON = 1; Ii(cd) = 1 mA
Ri(sd)
satellite diode input resistance
WRON = 1; Ii(cd) = 200 µA
Transfer functions
SERVO OUTPUTS CD
Gcd
servo central detector gain
−0.93 −1
−2.8 −3
−1.07
HG = 1
−3.2
WRON = 1
WRON = 1; HG = 1
3σ
−0.94 −1
−0.93 −1
−1.06
−1.07
Gmm
Bcd
gain mismatch
bandwidth
−
−
3
−
−
−
−
%
33
18
150
44
MHz
MHz
MHz
MHz
HG = 1; Ii(cd) = 6 µA
22
WRON = 1; Ii(cd) = 1000 µA
230
130
WRON = 1; HG = 1; Ii(cd) = 250 µA 100
1999 Sep 17
7
Philips Semiconductors
Preliminary specification
Analog current buffer for CD-R and CD-RW
systems
TZA1027
SYMBOL
PARAMETERS
rise time
delay time
CONDITIONS
MIN. TYP.
MAX.
UNIT
tr
WRON = 1; 30 µA < Ii(cd) < 520 µA
−
2
−
−
ns
ns
td
WRON = 1;
−
2.5
30 µA < Ii(cd) < 520 µA
SERVO OUTPUTS SD
GSS
servo satellite detector gain
HG = 1
−2.85 −3.05 −3.25
−0.96 −1.02 −1.08
−0.88 −0.95 −1.02
−0.88 −0.95 −1.02
WRON = 0; HG = 0
WRON = 1; HG = 0
WRON = 1; HG = 1
HG = 1; Ii(cd) = 1 µA
BS
bandwidth
24
−
−
−
−
−
MHz
MHz
ns
WRON = X; note 1; HG = X; note 1 46
−
tr
rise time
WRON = 1; 4 µA < Ii(cd) < 65 µA
WRON = 1; 4 µA < Ii(cd) < 65 µA
−
−
3.6
4.5
td
delay time
ns
DATA OUTPUT; PIN CAHF
GSS
servo satellite detector gain
7.5
29
−
8.1
32
0
8.7
35
−
HG = 1
WRON = 1; HG = X; note 1
BCAHF
bandwidth
80
72
−
−
−
MHz
MHz
ps
HG = 1; Ii(cd) = 6 µA
HG = 1; Ii(cd) = 6 µA
HG = 1; Ii(cd) = 6 µA
−
−
td(f)
flatness delay
noise current
30
170
1.4
2
200
−
−
ps
In
−
−
µA
−
−
µA
Output pins
Vo(cd)
central diode output voltage
−0.2
−0.2
1
−
V
DDD − 1
DDD − 1
V
V
Vo(sd)
satellite diode output voltage
data output voltage
−
V
Vo(CAHF)
Ro(cd)
Ro(sd)
RCAHF
−
VDDD + 0.2 V
central diode output resistance
satellite diode output resistance
data output resistance
−
1
−
−
−
MΩ
−
5
MΩ
kΩ
−
40
Digital control signals
INPUT VOLTAGE LEVELS; PINS PDWN, WRON AND HG
VIL
VIH
LOW-level input voltage
HIGH-level input voltage
−0.2
−
−
+1.2
V
1.8
VDDD + 0.2 V
INPUT CURRENT
ILI
input leakage current
−1
−
+1
µA
DELAY TIME
td
delay time
−
0.3
−
µs
Note
1. X = don’t care.
1999 Sep 17
8
Philips Semiconductors
Preliminary specification
Analog current buffer for CD-R and CD-RW
systems
TZA1027
TEST AND APPLICATION INFORMATION
100 nF
100 nF
50 Ω
TZA1027
I
i(sd)(AC)
3.3 kΩ
3.3 kΩ
3.3 kΩ
3.3 kΩ
7
2
6
3
23 A1LF
A1
A2
B1
B2
4.7 kΩ
470 kΩ
100 nF
470 kΩ
100 nF
470 kΩ
100 nF
470 kΩ
3.9
pF
50
Ω
100 nF
100 nF
100 nF
50 Ω
28
A2LF
4.7 kΩ
3.9
pF
50 Ω
24 B1LF
4.7 kΩ
3.9
pF
50 Ω
B2LF
27
4.7 kΩ
V
3.9
pF
bias(sd)
100 nF
100 nF
100 nF
50 Ω
100 nF
I
C1LF
C2LF
C3LF
29
22
25
i(cd)(AC)
3.3 kΩ
3.3 kΩ
3.3 kΩ
1
8
5
C1
C2
C3
4.7 kΩ
470 kΩ
3.9
pF
50
50 Ω
Ω
100 nF
4.7 kΩ
470 kΩ
3.9
pF
50 Ω
100 nF
4.7 kΩ
470 kΩ
100 nF
470 kΩ
3.9
pF
100 nF
100 nF
50 Ω
26 C4LF
3.3 kΩ
C4
4
4.7 kΩ
V
3.9
pF
bias(cd)
+
50 Ω
1 kΩ
CAHF
19
21
31
+5 V
PDWN
WRON
+5 V
GAIN
SELECTOR
18 HFGND
HG 30
16
V
15
V
13
14
DGND
AGND
DDA
DDD
MGR883
+5 V
Fig.3 Test diagram.
9
1999 Sep 17
Philips Semiconductors
Preliminary specification
Analog current buffer for CD-R and CD-RW
systems
TZA1027
+12 V
TZA1027
A1
A2
B1
B2
7
2
6
3
23 A1LF
28 A2LF
SA1
SA2
SB1
SB2
4
8
5
9
B1LF
B2LF
24
27
TZA1020
SAA7399
C1LF
C2LF
C1
C2
C3
29
22
C1
C2
C3
1
8
5
10
3
25 C3LF
6
C4LF
C4
26
C4
4
7
+
19 CAHF
to block
decoder/
encoder
SAA7392
21
PDWN
WRON 31
HG 30
HFGND
18
GAIN
SELECTOR
16
V
15
V
13
14
DGND
AGND
DDA
DDD
+5 V
MGR884
Fig.4 Application diagram.
10
1999 Sep 17
Philips Semiconductors
Preliminary specification
Analog current buffer for CD-R and CD-RW
systems
TZA1027
PACKAGE OUTLINE
LQFP32: plastic low profile quad flat package; 32 leads; body 5 x 5 x 1.4 mm
SOT401-1
c
y
X
A
E
17
24
Z
16
25
E
e
A
H
2
E
A
(A )
3
A
1
w M
p
θ
pin 1 index
b
L
p
32
9
L
1
8
detail X
Z
v M
D
A
e
w M
b
p
D
B
H
v M
B
D
0
2.5
scale
5 mm
DIMENSIONS (mm are the original dimensions)
A
(1)
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
D
H
L
L
v
w
y
Z
Z
E
θ
1
2
3
p
E
p
D
max.
7o
0o
0.15 1.5
0.05 1.3
0.27 0.18 5.1
0.17 0.12 4.9
5.1
4.9
7.15 7.15
6.85 6.85
0.75
0.45
0.95 0.95
0.55 0.55
mm
1.60
0.25
0.5
1.0
0.2 0.12 0.1
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
95-12-19
97-08-04
SOT401-1
1999 Sep 17
11
Philips Semiconductors
Preliminary specification
Analog current buffer for CD-R and CD-RW
systems
TZA1027
SOLDERING
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering is not always suitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
Reflow soldering
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
The footprint must incorporate solder thieves at the
downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.
Typical dwell time is 4 seconds at 250 °C. A
mildly-activated flux will eliminate the need for removal of
corrosive residues in most applications.
Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.
Manual soldering
Wave soldering
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
To overcome these problems the double-wave soldering
method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:
1999 Sep 17
12
Philips Semiconductors
Preliminary specification
Analog current buffer for CD-R and CD-RW
systems
TZA1027
Suitability of surface mount IC packages for wave and reflow soldering methods
SOLDERING METHOD
PACKAGE
WAVE
REFLOW(1)
BGA, SQFP
not suitable
suitable
suitable
suitable
suitable
suitable
HLQFP, HSQFP, HSOP, HTSSOP, SMS not suitable(2)
PLCC(3), SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
suitable
not recommended(3)(4)
not recommended(5)
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1999 Sep 17
13
Philips Semiconductors
Preliminary specification
Analog current buffer for CD-R and CD-RW
systems
TZA1027
NOTES
1999 Sep 17
14
Philips Semiconductors
Preliminary specification
Analog current buffer for CD-R and CD-RW
systems
TZA1027
NOTES
1999 Sep 17
15
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South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
2092 JOHANNESBURG, P.O. Box 58088 Newville 2114,
Tel. +27 11 471 5401, Fax. +27 11 471 5398
Finland: Sinikalliontie 3, FIN-02630 ESPOO,
Tel. +358 9 615 800, Fax. +358 9 6158 0920
France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,
Tel. +33 1 4099 6161, Fax. +33 1 4099 6427
South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SÃO PAULO, SP, Brazil,
Tel. +55 11 821 2333, Fax. +55 11 821 2382
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,
Tel. +49 40 2353 60, Fax. +49 40 2353 6300
Spain: Balmes 22, 08007 BARCELONA,
Tel. +34 93 301 6312, Fax. +34 93 301 4107
Hungary: see Austria
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 5985 2000, Fax. +46 8 5985 2745
India: Philips INDIA Ltd, Band Box Building, 2nd floor,
254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. +91 22 493 8541, Fax. +91 22 493 0966
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. +41 1 488 2741 Fax. +41 1 488 3263
Indonesia: PT Philips Development Corporation, Semiconductors Division,
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,
Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080
Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874
Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. +353 1 7640 000, Fax. +353 1 7640 200
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. +66 2 745 4090, Fax. +66 2 398 0793
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007
Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,
ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813
Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI),
Tel. +39 039 203 6838, Fax +39 039 203 6800
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,
TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. +82 2 709 1412, Fax. +82 2 709 1415
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381, Fax. +1 800 943 0087
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. +60 3 750 5214, Fax. +60 3 757 4880
Uruguay: see South America
Vietnam: see Singapore
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Middle East: see Italy
Tel. +381 11 62 5344, Fax.+381 11 63 5777
For all other countries apply to: Philips Semiconductors,
Internet: http://www.semiconductors.philips.com
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
68
SCA
© Philips Electronics N.V. 1999
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
545002/01/pp16
Date of release: 1999 Sep 17
Document order number: 9397 750 04724
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