TZA1046TM [NXP]
Photodiode and amplifier IC for CD and DVD applications; 光电二极管和放大器IC，适用于CD和DVD的应用
| 型号： | TZA1046TM |
| 厂家： | 
NXP |
| 描述： | Photodiode and amplifier IC for CD and DVD applications |
| 文件： | 总24页 (文件大小：129K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
TZA1046
Photodiode and amplifier IC
for CD and DVD applications
Preliminary specification
2004 May 04
Philips Semiconductors
Preliminary specification
Photodiode and amplifier IC
for CD and DVD applications
TZA1046
CONTENTS
13
PACKAGE OUTLINE
14
SOLDERING
1
FEATURES
14.1
Introduction to soldering surface mount
packages
Reflow soldering
Wave soldering
Manual soldering
2
APPLICATIONS
3
GENERAL DESCRIPTION
ORDERING INFORMATION
QUICK REFERENCE DATA
BLOCK DIAGRAM
14.2
14.3
14.4
14.5
4
5
Suitability of surface mount IC packages for
wave and reflow soldering methods
6
7
PINNING
15
16
17
18
ADDITIONAL SOLDERING INFORMATION
DATA SHEET STATUS
DEFINITIONS
8
MODE SELECTION
MECHANICAL DATA
LIMITING VALUES
9
10
11
12
DISCLAIMERS
CHARACTERISTICS
APPLICATION AND TEST INFORMATION
12.1
12.2
Application example
Test mode description
2004 May 04
2
Philips Semiconductors
Preliminary specification
Photodiode and amplifier IC
for CD and DVD applications
TZA1046
1
FEATURES
The H/L switch is a three level switch that can be used to
adjust the gain for different dye and phase change media.
The third level (high-impedance state) invokes the
power-down mode for standby condition.
• High frequency RF amplifiers
• Power-down mode for standby condition
• Suitable for all CD (785 nm) and DVD (655 nm)
read/write applications
Gain switch R/W is used to reduce the gain during writing.
During CD-R writing with clipping, the high peak signals for
the central and satellite segments are clamped internally
and the output currents of the A, B, C, D, E, F, G and H
segments are folded back to reduce power consumption.
The output currents can be folded back to almost zero,
depending on the light power detected. CD-R writing can
also be done without clipping for applications where
averaging is used.
• Four high-bandwidth central outputs (A, B, C and D);
four satellite outputs (EG, FH, ETST and HTST) and one
high-bandwidth differential RF output (RFP and RFN)
• Internal current clamp and current fold back (power
reduction)
• Versatile programmable gain switches (CD/DVD, H/L
and R/W)
All outputs are current outputs that can supply a maximum
of 8 mA. In CD-R write clip mode, the clipping level of the
output currents is between 5 mA and 8 mA.
• Single 5 V supply
• Current outputs for optimum signal transport over flex
cable
The HTSSON16T package has a low spread on the
Z tolerance. The Z tolerance is measured between the
diodes (chip surface) and the bottom of the leads. The
diodes have an offset of 54 µm the y direction with respect
to the leadframe centre and a tolerance of 50µm in both
x- and y-directions.
• Small outline package HTSSON16T with good
positional tolerance.
2
APPLICATIONS
• CD and DVD read/write applications.
In normal operation the satellite outputs F and H are
combined as one output FH and the satellite outputs
E and G are combined as one output EG. In normal mode
the ETST and HTST outputs are not used (high ohmic).
When pulling the R/W pin above the supply or is left open
the device comes into a testing mode where all four
separate satellite channels are directed to the outputs.
This mode is used for Optical Pick-up Unit (OPU)
alignment of the diodes where all satellite channels must
be available.
3
GENERAL DESCRIPTION
The TZA1046 is a single optical pick-up IC for read/write
systems and is suitable for CD and DVD applications.
The device contains eight RF amplifiers for the central and
satellite diodes and one differential RF amplifier (RFP and
RFN) which handles the sum of the four A, B, C and D
central diode signals.
Programming the gain is a very versatile way to optimize
interfacing between the TZA1046 and the preamplifier.
The gain can be programmed for CD or DVD media with
the gain switch CD/DVD.
4
ORDERING INFORMATION
TYPE
PACKAGE
NUMBER
NAME
DESCRIPTION
VERSION
TZA1046TM HTSSON16T plastic thermal enhanced thin shrink small outline package/transparent;
SOT814-1
no leads; 16 terminals; body 6.6 × 5.2 × 1.1 mm
2004 May 04
3
Philips Semiconductors
Preliminary specification
Photodiode and amplifier IC
for CD and DVD applications
TZA1046
5
QUICK REFERENCE DATA
SYMBOL PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supplies
VDD1
supply voltage
front-end
4.5
5.0
5.5
V
V
VDD2
IDD1
supply voltage
back-end
4.5
5.0
5.5
supply current
front-end
dark conditions; 6-channel mode
writing DVD+R
−
−
−
−
−
−
−
−
−
13
27
13
12
27
28
27
27
0.4
−
−
−
−
−
−
−
−
−
mA
mA
mA
mA
mA
mA
mA
mA
mA
writing CDR clipping
writing DVD+RW or CDR no-clip
writing CDRW
reading DVD
reading CD
reading DVD+RW
reading CDRW
power-down mode
dark conditions; 6-channel mode
writing DVD+R
IDD2
supply current
back-end
−
−
−
−
−
−
−
−
−
5.3
5.3
5.3
5.3
5.3
5.3
5.3
6.6
0.1
−
−
−
−
−
−
−
−
−
mA
mA
mA
mA
mA
mA
mA
mA
mA
writing CDR clipping
writing DVD+RW or CDR no-clip
writing CDRW
reading DVD
reading CD
reading DVD+RW
reading CDRW
power-down mode
Temperature range
Tamb
ambient temperature
0
−
70
°C
RF bandwidth
B−3dB(cen)
bandwidth of central
channels A, B, C and D
Io = 1.0 mA; 6-channel mode
reading DVD
130
100
130
80
165
142
162
124
−
−
−
−
MHz
MHz
MHz
MHz
reading CD
reading DVD+RW
reading CDRW
B−3dB(RF)
bandwidth of differential Io = 1.0 mA
channels RFP and RFN
reading DVD
130
100
130
80
175
130
166
114
−
−
−
−
MHz
MHz
MHz
MHz
reading CD
reading DVD+RW
reading CDRW
2004 May 04
4
Philips Semiconductors
Preliminary specification
Photodiode and amplifier IC
for CD and DVD applications
TZA1046
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Settling time
tst
settling time
CD-R write mode (all channels);
Iset > 300 µA; accuracy set level
within ±5 %; write peak level to set
level factor < 50
−
−
−
−
22
ns
CD-RW and DVD+RW write modes
(all channels); Iset > 100 µA;
accuracy set level within ±5 %; write
peak level to set level factor 2; peak
current ≤ Io(max)
10
12
ns
ns
DVD+R write mode (all channels);
Iset > 100 µA; accuracy set level
within ±5 %; write peak level to set
level factor 20; peak current ≤ Io(max)
−
−
Phase delay and group delay variation
∆td(p)(RF)
phase delay variation
differential channels
RFP and RFN
Io = 1.0 mA; fi = 2 to 104 MHz
reading DVD
−
−
−
−
0.2
0.3
0.25
0.5
−
−
−
−
ns
ns
ns
ns
reading CD
reading DVD+RW
reading CDRW
∆td(g)(RF)
group delay variation
differential channels
RFP and RFN
Io = 1.0 mA; fi = 2 to 104 MHz
reading DVD
−
−
−
−
0.4
0.6
0.4
1
−
−
−
−
ns
ns
ns
ns
reading CD
reading DVD+RW
reading CDRW
Sensitivity
s
output current
sensitivity
values depend on operating mode;
see Table 1
−
−
−
A/W
2004 May 04
5
Philips Semiconductors
Preliminary specification
Photodiode and amplifier IC
for CD and DVD applications
TZA1046
Table 1 Output current sensitivity; typical values
OUTPUT CURRENT SENSITIVITY (A/W)(1)
MODE
DIFFERENTIAL
(RFP AND RFN)
CENTRAL
0.72
SATELLITE
1.44
Writing DVD+R with averaging
0.27
8.10
Reading high reflective DVD media: single layer DVD
and DVD+R
21.6
43.2
Writing DVD+RW with averaging
2.88
5.76
86.4
1.08
16.2
Reading low reflective DVD media: dual layer DVD and 43.2
DVD+RW
Writing CDR with sampling
43.2
86.4
1.44
5.76
173
86.4
173
1.08
32.4
0.54
2.16
64.8
Reading high reflective CD media
Writing CDR with averaging
2.88
11.5
346
Writing CDRW with averaging
Reading low reflective CD media: CDRW
Note
1. The sensitivity of the TZA1046 is specified in A/W because it has current outputs. In the application diagram (see
Fig.6) the resistors of 150 Ω convert the currents into voltages. The maximum absolute spread is ±20 %.
2004 May 04
6
Philips Semiconductors
Preliminary specification
Photodiode and amplifier IC
for CD and DVD applications
TZA1046
6
BLOCK DIAGRAM
V
V
V
V
V
V
V
V
DD2
DD2
DD2
DD2
DD2
DD2
DD2
DD2
6
V
GND
DD1
1
7
3
V
A
B
C
D
A
B
C
D
E
F
DD2
DD1
14
V
V
DD1
V
DD1
8
V
DD1
2
V
DD1
16
10
15
9
ETST
FH
V
V
V
DD1
DD1
DD1
G
H
EG
V
DD1
HTST
V
DD2
4
RFP
RFN
12
13
11
H/L
(1)
CODER
CD/DVD
R/W
5
TZA1046
V
DD2
MDB573
(1) The coder translates the three digital inputs into the appropriate gain level of each amplifier. The limiter
is switched to a high level for other modes than the CD-R writing mode for all segment outputs.
Fig.1 Block diagram.
2004 May 04
7
Philips Semiconductors
Preliminary specification
Photodiode and amplifier IC
for CD and DVD applications
TZA1046
7
PINNING
SYMBOL PIN
DESCRIPTION
A
1
2
3
4
5
6
7
8
9
central segment output A
central segment output D
supply voltage back-end
positive RF output
D
VDD2
RFP
RFN
GND
B
negative RF output
ground
C
B
8
7
6
5
4
3
2
1
9
HTST
central segment output B
central segment output C
10 FH
C
GND
RFN
RFP
11 R/W
12 H/L
HTST
satellite segment output H in test
mode; note 1
TZA1046TM
13 CD/DVD
FH
10 sum of satellite segment F and
segment H output, segment F output
in test mode; note 1
V
V
DD1
14
DD2
D
A
15 EG
16 ETST
R/W
H/L
11 gain select switch for reading or
writing and to select the test mode
001aaa407
terminal 1
index area
12 gain select switch for low reflective
(H/L = 1) and high reflective (H/L = 0)
media
CD/DVD
VDD1
13 gain select switch for CD or DVD
14 supply voltage front-end
EG
15 Sum of satellite segment E and
segment G output, satellite output G
in test mode; note 1
ETST
16 segment E output in test mode;
note 1
Fig.2 Pin configuration.
Note
1. In test mode all separate satellite signals are available.
In normal mode HTST and ETST are high ohmic, FH
is the sum of F and H and EG is the sum of E and G.
2004 May 04
8
Philips Semiconductors
Preliminary specification
Photodiode and amplifier IC
for CD and DVD applications
TZA1046
8
MODE SELECTION
Table 2 Coder switching
PIN LEVEL
MODE
R/W
H/L
CD/DVD
6-channel mode
don’t care
LOW
open
LOW
Power-down
LOW
LOW
open
LOW
HIGH
HIGH
LOW
HIGH
LOW
HIGH
LOW
HIGH
writing DVD+R no-clip or averaging mode
writing CDR write-clip or sample mode
writing CDR no-clip or averaging mode
LOW
LOW
LOW
HIGH
writing DVD+RW no-clip mode; either sampling or averaging mode
writing CDRW no-clip mode, either sampling or averaging mode
reading DVD+R; DVD-SL
LOW
HIGH
HIGH
HIGH
HIGH
HIGH
LOW
LOW; open
HIGH
reading CD and CDR
reading DVD+RW; DVD-DL
HIGH
reading CDRW
8-channel test mode; note 1
test mode
LOW
LOW
HIGH
LOW
HIGH
reading DVD+R and DVD-SL
reading CD and CDR
LOW; open
HIGH
reading DVD+RW and DVD-DL
reading CDRW
HIGH
Note
1. The 8-channel test mode is activated when VI(test-on) or II(test-on) is applied to pin R/W or if pin R/W is left open. The
values of VI(test-on) or II(test-on) can be found in Chapter 11.
9
MECHANICAL DATA
115
50
50
115
E
F
A
D
B
C
G
H
145
100
MGU616
150
150
Dimensions in µm.
Space between central segments: < 1 µm.
Space between satellite segments: < 1 µm.
Fig.3 Photodiode configuration.
9
2004 May 04
Philips Semiconductors
Preliminary specification
Photodiode and amplifier IC
for CD and DVD applications
TZA1046
16
15
14
E
13
12
11
10
9
y
+
54 µm offset
x
45° ± 1°
package
centre
see detail X
1
2
3
4
5
6
7
8
DETAIL X
MGU617
45° angle is with respect to the leadframe.
Not drawn to scale.
Package window is not shown.
Fig.4 Diagram showing position of the photodiode array with respect to the HTSSON16T package (top view).
4.55
0.1 C
C
1.50 min
0.3
1.00
min
°
0
°
± 1
rotation
tolerance
F
3.0 ± 0.12
pin 1
mark
0.33
0.23
(16×)
2.275 ± 0.12
0.30 ± 0.025
0.1
001aaa035
Fig.5 Diagram showing position of the photodiode array with respect to the HTSSON16T package (top view).
2004 May 04
10
Philips Semiconductors
Preliminary specification
Photodiode and amplifier IC
for CD and DVD applications
TZA1046
10 LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL
PARAMETER
supply voltage front-end
MIN.
−0.3
−0.3
MAX.
+5.5
UNIT
VDD1
VDD2
∆VDD1
∆VDD2
Vn
V
V
V
V
supply voltage back-end
+5.5
supply voltage difference with respect to VDD2
supply voltage difference with respect to VDD1
voltage at pins
VDD2 − 0.3
DD1 − 0.3
VDD2 + 0.3
VDD1 + 0.3
V
A, B, C, D, ETST, FH, EG, HTST, RFP and RFN
CD/DVD and H/L
−0.3
−0.3
−0.3
VDD2 + 0.3
VDD1 + 0.3
VDD1 + 2.5
V
V
V
R/W
11 CHARACTERISTICS
VDD1 = VDD2 = 2.0 V; pin R/W = LOW; pin H/L = LOW; pin CD/DVD = HIGH; VA = VB = VC = VD = 2.0 V;
VEG = VFH = VETST = VHTST = 2.0 V; VRFP = VRFN = 2.0 V; measured in dark conditions; Tamb = 25 °C; 6-channel mode;
unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supplies
VDD1
supply voltage
front-end
note 1
note 1
4.5
5.0
5.5
V
V
VDD2
IDD1
supply voltage
back-end
4.5
5.0
5.5
supply current
front-end
dark conditions; 6-channel mode;
note 2
writing DVD+R
−
−
−
−
−
−
−
−
−
13
27
13
12
27
28
27
27
0.4
−
−
−
−
−
−
−
−
−
mA
mA
mA
mA
mA
mA
mA
mA
mA
writing CDR clipping
writing DVD+RW or CDR no-clip
writing CDRW
reading DVD
reading CD
reading DVD+RW
reading CDRW
power-down mode
2004 May 04
11
Philips Semiconductors
Preliminary specification
Photodiode and amplifier IC
for CD and DVD applications
TZA1046
SYMBOL
IDD2
PARAMETER
supply current
back-end
CONDITIONS
MIN.
TYP.
MAX.
UNIT
dark conditions; 6-channel mode;
note 2
writing DVD+R
−
−
−
−
−
−
−
−
−
5.3
−
−
−
−
−
−
−
−
−
mA
writing CDR clipping
writing DVD+RW or CDR no-clip
writing CDRW
5.3
5.3
5.3
5.3
5.3
5.3
6.6
0.1
mA
mA
mA
mA
mA
mA
mA
mA
reading DVD
reading CD
reading DVD+RW
reading CDRW
power-down mode
Temperature range
Tamb ambient temperature
Central segment output channels: pins A, B, C and D
0
−
70
°C
B−3dB
bandwidth
Io = 1.0 mA
writing DVD+R
writing CDR clipping
writing DVD+RW or CDR no-clip
writing CDRW
−
−
−
−
172
206
211
125
165
142
162
124
−
−
−
−
−
−
−
−
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
reading DVD
130
100
130
80
reading CD
reading DVD+RW
reading CDRW
Io = 1mA; fi = 2 to 104 MHz
reading DVD
∆td(p)
phase delay variation
−
−
−
−
0
0.25
0.15
0.2
0.3
−
−
−
−
−
5
ns
ns
ns
ns
%
reading CD
reading DVD+RW
reading CDRW
note 3
Msens
channel matching
sensitivity
Vo
output voltage range
output current
1
0
−
−
V
DD2 − 1
V
Io
8
mA
Io(offset)
output offset current
dark conditions; Tamb = 0 to 70 °C
reading CDRW
−14
−14
5
−1.5
−0.9
−
+11
+12
8
µA
µA
mA
other modes
Io(clip)
In(o)
output current clipping CD-R writing; note 4
level
spot noise output
current
Io = 1.0 mA; fo = 50 MHz; note 5
reading CD
−
−
−
1.2
0.4
2.0
−
−
−
nA/√Hz
nA/√Hz
nA/√Hz
reading DVD+RW
reading CDRW
2004 May 04
12
Philips Semiconductors
Preliminary specification
Photodiode and amplifier IC
for CD and DVD applications
TZA1046
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Differential RF outputs channel: pins RFP and RFN
B−3dB
bandwidth
Io = 1.0 mA
writing DVD+R
−
−
−
−
120
−
−
−
−
−
−
−
−
MHz
writing CDR clipping
writing DVD+RW or CDR no-clip
writing CDRW
205
375
118
175
130
166
114
MHz
MHz
MHz
MHz
MHz
MHz
MHz
reading DVD
130
100
130
80
reading CD
reading DVD+RW
reading CDRW
∆td(p)
∆td(g)
CMR
phase delay variation
group delay variation
common mode ripple
Io = 1.0 mA; fi = 2 to 104 MHz
reading DVD
−
−
−
−
0.2
0.3
0.25
0.5
−
−
−
−
ns
ns
ns
ns
reading CD
reading DVD+RW
reading CDRW
Io = 1.0 mA; fi = 2 to 104 MHz
reading DVD
−
−
−
−
0.4
0.6
0.4
1
−
−
−
−
−
ns
ns
ns
ns
dB
reading CD
reading DVD+RW
reading CDRW
Io = 2 mA (peak); fo up to 104 MHz; −20
−
note 6
Vo
output voltage range
output current
1
−
−
V
DD2 − 1
V
Io
0
8
mA
Io(offset)
output offset current
dark conditions; Tamb = 0 to 70 °C
pin RFP
7
22
40
µA
µA
µA
µA
pin RFN
−7
14
−13
−20
43
−35
79
pin RFP; reading CDRW
pin RFN; reading CDRW
Io = 1.0 mA; fo = 50 MHz; note 5
reading CD
−39
−70
In(o)
spot noise output
current
−
−
−
0.9
0.3
1.5
−
−
−
nA/√Hz
nA/√Hz
nA/√Hz
reading DVD+RW
reading CDRW
2004 May 04
13
Philips Semiconductors
Preliminary specification
Photodiode and amplifier IC
for CD and DVD applications
TZA1046
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Satellite segment output channels: pins ETST, FH, EG and HTST; note 7
B−3dB
bandwidth
Io = 1.0 mA; 6-channel mode
writing DVD+R
−
−
−
−
93
−
−
−
−
−
−
−
−
5
MHz
writing CDR clipping
writing DVD+RW or CDR no-clip
writing CDRW
81
107
66
75
61
66
56
−
MHz
MHz
MHz
MHz
MHz
MHz
MHz
%
reading DVD
10
10
10
10
0
reading CD
reading DVD+RW
reading CDRW
Msens
channel matching
sensitivity
note 8
Vo
output voltage range
output current
1
0
−
−
V
DD2 − 1
V
Io
8
mA
Io(offset)
output offset current
dark conditions; Tamb = 0 to 70 °C
reading CDRW
−25
−23
5
−4
−5.4
−
17
12
8
µA
µA
mA
other modes
Io(clip)
In(o)
current clipping level
CD-R writing; note 4
Io = 1.0 mA; fo = 25 MHz; note 5
reading CD
spot noise output
current
−
−
−
2.2
0.8
4.3
−
−
−
nA/√Hz
nA/√Hz
nA/√Hz
reading DVD+RW
reading CDRW
Settling time, all channels; note 9
tst settling time
CD-R write mode; Iset > 300 µA;
accuracy set level within ±5 %;
write peak level to set level
factor < 50
−
−
−
−
−
−
22
10
12
ns
ns
ns
CD-RW and DVD+RW write modes;
Iset > 100 µA; accuracy set level
within ±5 %; write peak level to set
level factor 2; peak current ≤ Io(max)
DVD+R write mode; Iset > 100 µA;
accuracy set level within ±5 %;
write peak level to set level
factor 20; peak current ≤ Io(max)
Control inputs: pins R/W, H/L and CD/DVD
VIL
VIH
LOW-level input voltage note 10
0
−
−
0.6
V
V
HIGH-level input
voltage
note 10
2.5
VDD1
ZI(pd)
pull-down input
impedance
only pin CD/DVD
−
200
−
kΩ
2004 May 04
14
Philips Semiconductors
Preliminary specification
Photodiode and amplifier IC
for CD and DVD applications
TZA1046
SYMBOL
Test mode: pin R/W
VI(test-on) input voltage to activate note 11
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
V
DD1 + 2
−
−
8
V
the test mode
II(test-on)
force current into pin to
activate the test mode
800
1200
µA
Sensitivity
s
output current
sensitivity
values depend on operating mode;
see Table 3
−
−
−
A/W
Notes
1. The supplies are connected internally by diodes. Differences between the supply voltages should not exceed 0.3 V.
2. Estimated average power consumption (6 channel mode):
P = IDD1 × VDD1 + IDD2 × VDD2
+
11/3 × Io(RF) × VDD2 × K2 − 8/3 × Io(RF) × Vref
(Io(EG) + Io(FH)) × (VDD2 × K1 − Vref) −
+
2 × Io(RF)2 × RL2
− −
16/9 × Io(RF)2 × RL1
Io(EG)2 × RL1 − Io(FH)2 × RL1, where:
RL2 is the load resistance on each of the differential RF outputs RFP and RFN and RL1 is the load resistance on all
other outputs.
K1 = 1.35 and K2 = 1.6 for CD-RW reading; K1 = 1.50 and K2 = 1.40 for other modes.
Vref = Vref1 = Vref2; see Fig.6.
I
o(max) – Io(min)
3. Outputs A, B, C, and D: Io = 3 mA output current. Definition of matching:
-----------------------------------------------------
1
(IA + IB + IC + I ) ×
--
D
4
4. The clipping function is active in the CD-R write mode for the segment outputs (not for outputs RFP and RFN) and
in the read mode for all outputs. In the read mode, the clipping level is increased above Io(max)
.
5. The S/N ratio improves significantly when the sensitivity is lowered.
I
RFP + IRFN
6. Definition: 20log-----------------------------
RFP – IRFN
I
7. In test mode all channels are active, in normal mode channels EG and FH are active and channels ETST and HTST
are off.
8. Outputs ETST, FH, EG, and HTST: Io = 1.5 mA output current; Msens = ±7 % for reading CD-RW, CD-ROM,
DVD+RW and writing CD-R.
Io(max) – Io(min)
Definition of matching in normal mode:
---------------------------------------
1
(IFH + IEG) ×
--
2
I
o(max) – Io(min)
Definition of matching in test mode:
-------------------------------------------------------------------------------
1
(IETST + IFH + IEG + IHTST) ×
--
4
9. The settling time includes the recovery time.
10. Pins R/W and H/L are three-level switches. When these pins are left open-circuit two internal resistors (150 kΩ to
GND and 350 kΩ to VDD) will keep them between 1.3 and 1.7 V.
11. The test mode is also activated when the R/W pin is left open-circuit.
2004 May 04
15
Philips Semiconductors
Preliminary specification
Photodiode and amplifier IC
for CD and DVD applications
TZA1046
Table 3 Output current sensitivity; typical values
OUTPUT CURRENT SENSITIVITY (A/W)(1)
MODE
DIFFERENTIAL
(RFP AND RFN)
CENTRAL
0.72
SATELLITE
1.44
Writing DVD+R with averaging
0.27
8.10
Reading high reflective DVD media: single layer DVD
and DVD+R
21.6
43.2
Writing DVD+RW with averaging
2.88
5.76
86.4
1.08
16.2
Reading low reflective DVD media; dual layer DVD and 43.2
DVD+RW
Writing CDR with sampling
43.2
86.4
1.44
5.76
173
86.4
173
1.08
32.4
0.54
2.16
64.8
Reading high reflective CD media
Writing CDR with averaging
2.88
11.5
346
Writing CDRW with averaging
Reading low reflective CD media: CDRW
Note
1. The sensitivity of the TZA1046 is specified in A/W because it has current outputs. In the application diagram
(see Fig.6) the resistors of 150 Ω convert the currents into voltages. The maximum absolute spread is ±20 %.
2004 May 04
16
Philips Semiconductors
Preliminary specification
Photodiode and amplifier IC
for CD and DVD applications
TZA1046
12 APPLICATION AND TEST INFORMATION
12.1 Application example
An application example for the TZA1046 is shown in Fig.6. The satellite segment pins are cross-coupled to be suitable
for rewritable applications.
V
DD
150 150
150 150
Ω
Ω
Ω
Ω
CD/DVD H/L R/W
ETST
EG
HTST
FH
15
2
14
3
12
11
6
9
8
16
1
13
10
7
TZA1046
4
5
B
C
D
A
150 150
75
Ω
75
Ω
150 150
Ω
Ω
Ω
Ω
V
ref1
V
ref2
MDB575
RFP
RFN
Fig.6 Application example.
2004 May 04
17
Philips Semiconductors
Preliminary specification
Photodiode and amplifier IC
for CD and DVD applications
TZA1046
12.2 Test mode description
Alignment of the diodes during OPU manufacturing requires the availability of all satellite outputs. In normal mode the
F and H channels are combined to a single output FH and the E and G channels are combined to a single output EG.
This is done to switch off two channels in the normal mode (application usage) which saves power consumption. For
alignment of the diodes each individual satellite output must be available and therefore the TZA1046 can be put in a test
mode where all satellite channels are available. The test mode is activated by pulling the R/W digital input pin above the
supply (2 to 2.5 V higher than VDD1), by forcing an input current into this pin (800 to 1200 µA) or by leaving the pin
open-circuit. Fig.7 shows the R/W input configuration.
VDD2
VDD1
3
14
6 kΩ
100 Ω
300
kΩ
8-channel
test mode
350
kΩ
1 kΩ
1
1
+ 1
+ 1
1
100
kΩ
11
R/W input
1
R/W internal
100
kΩ
150
kΩ
40 kΩ
GND
6
MDB576
Fig.7 R/W input configuration.
2004 May 04
18
Philips Semiconductors
Preliminary specification
Photodiode and amplifier IC
for CD and DVD applications
TZA1046
13 PACKAGE OUTLINE
HTSSON16T: plastic thermal enhanced thin shrink small outline package/transparent; no leads;
16 terminals; body 6.6 x 5.2 x 1.1 mm
SOT814-1
X
D
B
D
1
2
A
D
A
E
E
E
1
2
c
detail X
terminal 1
index area
C
e
1
y
y
v
M
M
C
C
A
B
C
1
e
b
w
1
8
L
terminal 1
index area
E
h
16
9
0
2.5
5 mm
D
h
scale
DIMENSIONS (mm are the original dimensions)
A
max.
D
min.
E
min.
2
2
UNIT
b
c
D
D
D
E
E
E
h
e
e
L
v
w
y
y
1
h
1
1
1
0.33
0.23
0.5
0.3
5.3
5.1
4.5
4.0
5.15
4.95
6.7
6.5
4.2
3.7
5.4
5.2
mm
1.1
1.50
1.00
0.65 4.55
0.3
0.1
0.05 0.05
0.1
REFERENCES
JEDEC
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
- - -
JEITA
03-10-10
03-11-19
SOT814-1
- - -
- - -
2004 May 04
19
Philips Semiconductors
Preliminary specification
Photodiode and amplifier IC
for CD and DVD applications
TZA1046
14 SOLDERING
To overcome these problems the double-wave soldering
method was specifically developed.
14.1 Introduction to soldering surface mount
packages
If wave soldering is used the following conditions must be
observed for optimal results:
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
• For packages with leads on two sides and a pitch (e):
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering can still be used for
certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is
recommended.
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
14.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Driven by legislation and environmental forces the
The footprint must incorporate solder thieves at the
downstream end.
• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
worldwide use of lead-free solder pastes is increasing.
Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending
on heating method.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical reflow peak temperatures range from
215 to 270 °C depending on solder paste material. The
top-surface temperature of the packages should
preferably be kept:
Typical dwell time of the leads in the wave ranges from
3 to 4 seconds at 250 °C or 265 °C, depending on solder
material applied, SnPb or Pb-free respectively.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
• below 225 °C (SnPb process) or below 245 °C (Pb-free
process)
– for all BGA, HTSSON-T and SSOP-T packages
– for packages with a thickness 2.5 mm
14.4 Manual soldering
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
– for packages with a thickness < 2.5 mm and a
volume ≥ 350 mm3 so called thick/large packages.
• below 240 °C (SnPb process) or below 260 °C (Pb-free
process) for packages with a thickness < 2.5 mm and a
volume < 350 mm3 so called small/thin packages.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
Moisture sensitivity precautions, as indicated on packing,
must be respected at all times.
14.3 Wave soldering
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
2004 May 04
20
Philips Semiconductors
Preliminary specification
Photodiode and amplifier IC
for CD and DVD applications
TZA1046
14.5 Suitability of surface mount IC packages for wave and reflow soldering methods
SOLDERING METHOD
PACKAGE(1)
WAVE
not suitable
REFLOW(2)
BGA, HTSSON..T(3), LBGA, LFBGA, SQFP, SSOP..T(3), TFBGA,
USON, VFBGA
suitable
DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP, HSQFP, HSSON,
HTQFP, HTSSOP, HVQFN, HVSON, SMS
PLCC(5), SO, SOJ
not suitable(4)
suitable
suitable
suitable
LQFP, QFP, TQFP
not recommended(5)(6) suitable
SSOP, TSSOP, VSO, VSSOP
CWQCCN..L(8), PMFP(9), WQCCN..L(8)
not recommended(7)
suitable
not suitable
not suitable
Notes
1. For more detailed information on the BGA packages refer to the “(LF)BGA Application Note” (AN01026); order a copy
from your Philips Semiconductors sales office.
2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
3. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account
be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature
exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow oven. The package body peak temperature
must be kept as low as possible.
4. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
5. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
6. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
7. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
8. Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted
on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar
soldering process. The appropriate soldering profile can be provided on request.
9. Hot bar or manual soldering is suitable for PMFP packages.
15 ADDITIONAL SOLDERING INFORMATION
• Reflow peak temperature for TZA1046TM should be no higher than 215 °C ± 5 °C.
• Manual soldering for TZA1046TM is not encouraged. In case of touch-up desolder the defective device manually and
use reflow soldering for the assembly of the replacing device.
2004 May 04
21
Philips Semiconductors
Preliminary specification
Photodiode and amplifier IC
for CD and DVD applications
TZA1046
16 DATA SHEET STATUS
DATA SHEET
STATUS(1)
PRODUCT
STATUS(2)(3)
LEVEL
DEFINITION
I
Objective data
Development This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
II
Preliminary data Qualification
This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
III
Product data
Production
This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Relevant changes will
be communicated via a Customer Product/Process Change Notification
(CPCN).
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
17 DEFINITIONS
18 DISCLAIMERS
Short-form specification
The data in a short-form
Life support applications
These products are not
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Right to make changes
Philips Semiconductors
reserves the right to make changes in the products -
including circuits, standard cells, and/or software -
described or contained herein in order to improve design
and/or performance. When the product is in full production
(status ‘Production’), relevant changes will be
Application information
Applications that are
communicated via a Customer Product/Process Change
Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these
products, conveys no licence or title under any patent,
copyright, or mask work right to these products, and
makes no representations or warranties that these
products are free from patent, copyright, or mask work
right infringement, unless otherwise specified.
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
2004 May 04
22
Philips Semiconductors
Preliminary specification
Photodiode and amplifier IC
for CD and DVD applications
TZA1046
ICs with CD functionality Purchase of a Philips IC with
CD functionality does not convey an implied license under
any patent right to use this IC in any CD application.
A license under the Philips CD patents can be obtained via
Philips Intellectual Property & Standards
ICs with DVD functionality
Purchase of a Philips IC
with DVD functionality does not convey an implied license
under any patent right to use this IC in any DVD
application. A license under the Philips DVD patents can
be obtained via Philips Intellectual Property & Standards
(Internet at URL http://www.ip.philips.com;
(Internet at URL http://www.ip.philips.com;
e-mail info.licensing@philips.com).
e-mail info.licensing@philips.com).
2004 May 04
23
Philips Semiconductors – a worldwide company
Contact information
For additional information please visit http://www.semiconductors.philips.com.
Fax: +31 40 27 24825
For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
© Koninklijke Philips Electronics N.V. 2004
SCA76
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
R04/01/pp24
Date of release: 2004 May 04
Document order number: 9397 750 11525
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