UAA2082H/V1 [NXP]
IC TELECOM, PAGING RECEIVER, PQFP32, 7 X 7 MM, 1.40 MM HEIGHT, PLASTIC, SOT-358-1, LQFP-32, Paging Circuit;型号: | UAA2082H/V1 |
厂家: | NXP |
描述: | IC TELECOM, PAGING RECEIVER, PQFP32, 7 X 7 MM, 1.40 MM HEIGHT, PLASTIC, SOT-358-1, LQFP-32, Paging Circuit 电信 寻呼;传讯 电信集成电路 |
文件: | 总43页 (文件大小:525K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
UAA2082
Advanced pager receiver
1996 Jan 15
Product specification
Supersedes data of 1995 Nov 27
File under Integrated Circuits, IC03
Philips Semiconductors
Product specification
Advanced pager receiver
UAA2082
FEATURES
GENERAL DESCRIPTION
• Wide frequency range: VHF, UHF and 900 MHz bands
• High sensitivity
The UAA2082 is a high-performance low-power radio
receiver circuit primarily intended for VHF, UHF and
900 MHz pager receivers for wide area digital paging
systems, employing direct FM non-return-to-zero (NRZ)
frequency shift keying (FSK).
• High dynamic range
• Electronically adjustable filters on chip
• Suitable for data rates up to 2400 bits/s
• Wide frequency offset and deviation range
• Fully POCSAG compatible FSK receiver
• Power on/off mode selectable by the chip enable input
• Low supply voltage; low power consumption
• 1-cell battery-low detection circuit
• High integration level
The receiver design is based on the direct conversion
principle where the input signal is mixed directly down to
the baseband by a local oscillator on the signal frequency.
Two complete signal paths with signals of 90° phase
difference are required to demodulate the signal.
All channel selectivity is provided by the built-in IF filters.
The circuit makes extensive use of on-chip capacitors to
minimize the number of external components.
The battery monitoring circuit has an external sense input
and a 1.1 V detection threshold for easy operation in a
single-cell supply concept.
• Interfaces directly to the PCA5000A, PCF5001 and
PCD5003 POCSAG decoders.
The UAA2082 was designed to operate together with the
PCA5000A, PCF5001 or PCD5003 POCSAG decoders,
which contain a digital input filter for optimum call success
rate.
APPLICATIONS
• Wide area paging
• On-site paging
• Telemetry
• RF security systems
• Low bit-rate wireless data links.
ORDERING INFORMATION
TYPE
PACKAGE
NUMBER
NAME
DESCRIPTION
VERSION
UAA2082H
UAA2082U
LQFP32
28 pads
plastic low profile quad flat package; 32 leads; body 7 × 7 × 1.4 mm
SOT358-1
naked die; see Fig.8
1996 Jan 15
2
Philips Semiconductors
Product specification
Advanced pager receiver
UAA2082
QUICK REFERENCE DATA
SYMBOL
PARAMETER
supply voltage
CONDITIONS
MIN.
1.9
TYP.
MAX. UNIT
VP
2.05
2.7
−
3.5
3.2
3
V
IP
supply current
2.3
mA
µA
IP(off)
Pi(ref)
stand-by current
RF input sensitivity
−
BER ≤ 3⁄100; ±4 kHz deviation;
data rate 1200 bits/s; Tamb = 25 °C
f
i(RF) = 173 MHz
fi(RF) = 470 MHz
i(RF) = 930 MHz
−
−
−
−
−126.5 −123.5 dBm
−124.5 −121.5 dBm
−120.0 −114.0 dBm
−115.0 −110.0 dBm
f
Pi(mix)
mixer input sensitivity
BER ≤ 3⁄100; fi(RF) = 470 MHz;
±4 kHz deviation;
data rate 1200 bits/s; Tamb = 25 °C
Vth
detection threshold for battery
LOW indicator
Tamb = 25 °C
1.05
1.03
−10
1.10
1.10
−
1.15
1.17
+70
V
Tamb = −10 to +70 °C
V
Tamb
operating ambient temperature
°C
1996 Jan 15
3
Philips Semiconductors
Product specification
Advanced pager receiver
UAA2082
BLOCK DIAGRAMS (173 MHz)
LMC2
o k , f u l l p a g e w i d t h
1996 Jan 15
4
Philips Semiconductors
Product specification
Advanced pager receiver
UAA2082
LM2C3
d b o o k , f u l l p a g e w i d
1996 Jan 15
5
Philips Semiconductors
Product specification
Advanced pager receiver
UAA2082
Table 1 Tolerances of components shown in Figs 1 and 2 (notes 1 and 2)
TOLERANCE
COMPONENT
(%)
REMARK
Inductances
L1
±5
Qmin = 100 at 173 MHz
L2, L3, L6, L7
±20
±10
±20
±10
Qmin = 50 at 173 MHz; TC = (+25 to +125) × 10−6/K
Qmin = 30 at 173 MHz; TC = (+25 to +125) × 10−6/K
Qmin = 30 at 173 MHz; TC = (+25 to +125) × 10−6/K
Qmin = 30 at 57 MHz; TC = (+25 to +125) × 10−6/K
L4, L5
L8
L9
Resistors
R1 to R7
±2
TC = +50 × 10−6/K
Capacitors
C1, C2, C7, C8, C9, C15
±5
−
TC = (0 ±30) × 10−6/K; tan δ ≤ 30 × 10−4 at 1 MHz
TC = (−750 ±300) × 10−6/K; tan δ ≤ 50 × 10−4 at 1 MHz
TC = (0 ±30) × 10−6/K; tan δ ≤ 10 × 10−4 at 1 MHz
TC = (0 ±30) × 10−6/K; tan δ ≤ 21 × 10−4 at 1 MHz
C3, C6, C12
C4, C5, C14, C18, C19, C20
±10
±5
±20
−
C10, C11
C13
C16
TC = (−1700 ±500) × 10−6/K; tan δ ≤ 50 × 10−4 at 1 MHz
TC = (0 ±30) × 10−6/K; tan δ ≤ 26 × 10−4 at 1 MHz
C17
±5
Notes
1. Recommended crystal: fXTAL = 57.647 MHz (crystal with 8 pF load), 3rd overtone, pullability >2.75 × 10−6/pF
(change in frequency between series resonance and resonance with 8 pF series capacitor at 25 °C), dynamic
resistance R1 < 40 Ω, ∆f = ±5 × 10−6 for Tamb = −10 to +55 °C with 25 °C reference, calibration plus aging tolerance:
−5 × 10−6 to +15 × 10−6.
2. This crystal recommendation is based on economic aspects and practical experience. Normally the spreads for R1,
pullability and calibration do not show their worst case limits simultaneously in one crystal. In such a rare event, the
tuning range will be reduced to an insufficient level.
1996 Jan 15
6
Philips Semiconductors
Product specification
Advanced pager receiver
UAA2082
BLOCK AND TEST DIAGRAMS (470 MHz)
LM2C4
o o k , f u l l p a g e w i d t h
1996 Jan 15
7
Philips Semiconductors
Product specification
Advanced pager receiver
UAA2082
LM2C5
d b o o k , f u l l p a g e w i d t h
1996 Jan 15
8
Philips Semiconductors
Product specification
Advanced pager receiver
UAA2082
LM2C6
b o o k , f u l l p a g e w i d t h
1996 Jan 15
9
Philips Semiconductors
Product specification
Advanced pager receiver
UAA2082
Table 2 Tolerances of components shown in Figs 3, 4 and 5 (notes 1 and 2)
TOLERANCE
COMPONENT
(%)
REMARK
Inductances
L1, L10
L2, L3, L6, L7
L4, L5
L8
±5
Qmin = 145 at 470 MHz
±20
±10
±10
±10
Qmin = 50 at 470 MHz; TC = (+25 to +125) × 10−6/K
Qmin = 40 at 470 MHz; TC = (+25 to +125) × 10−6/K
Qmin = 30 at 156 MHz; TC = (+25 to +125) × 10−6/K
Qmin = 40 at 78 MHz; TC = (+25 to +125) × 10−6/K
L9
Resistors
R1 to R6
±2
TC = +50 × 10−6/K
Capacitors
C1, C2, C7, C8, C9
±5
−
TC = (0 ±30) × 10−6/K; tan δ ≤ 30 × 10−4 at 1 MHz
TC = (−750 ±300) × 10−6/K; tan δ ≤ 50 × 10−4 at 1 MHz
TC = (0 ±30) × 10−6/K; tan δ ≤ 10 × 10−4 at 1 MHz
TC = (0 ±30) × 10−6/K; tan δ ≤ 21 × 10−4 at 1 MHz
C3, C6, C12, C23
C4, C5, C14, C18 to C22
±10
±5
±20
−
C10, C11
C13
C16
TC = (−1700 ±500) × 10−6/K; tan δ ≤ 50 × 10−4 at 1 MHz
TC = (0 ±30) × 10−6/K; tan δ ≤ 26 × 10−4 at 1 MHz
C17
±5
Notes
1. Recommended crystal: fXTAL = 78.325 MHz (crystal with 8 pF load), 3rd overtone, pullability >2.75 × 10−6/pF
(change in frequency between series resonance and resonance with 8 pF capacitor at 25 °C), dynamic resistance
R1 < 30 Ω, ∆f = ±5 × 10−6 for Tamb = −10 to +55 °C with 25 °C reference, calibration plus aging tolerance:
−5 × 10−6 to +15 × 10−6.
2. This crystal recommendation is based on economic aspects and practical experience. Normally the spreads for R1,
pullability and calibration do not show their worst case limits simultaneously in one crystal. In such a rare event, the
tuning range will be reduced to an insufficient level.
1996 Jan 15
10
Philips Semiconductors
Product specification
Advanced pager receiver
UAA2082
BLOCK AND TEST DIAGRAM (930 MHz)
LM2C7
a n u l l p a g e w i d t h
1996 Jan 15
11
Philips Semiconductors
Product specification
Advanced pager receiver
UAA2082
Table 3 Tolerances of components shown in Fig.6 (note 1)
TOLERANCE
COMPONENT
(%)
REMARK
Inductances
L1
±10
−
Qtyp = 150 at 930 MHz
microstrip inductor
L2, L3, L6, L7
L4, L5
L8
±5
Qtyp = 100 at 930 MHz
Qtyp = 65 at 310 MHz
Qtyp = 150 at 930 MHz
±10
±10
L10, L11
Resistors
R1 to R4
±2
TC = (0 ±200) × 10−6/K
Capacitors
C1, C2, C7, C8, C9, C15
C3, C6, C12
±5
−
TC = (0 ±30) × 10−6/K; tan δ ≤ 30 × 10−4 at 1 MHz
TC = (0 ±200) × 10−6/K; tan δ ≤ 30 × 10−4 at 1 MHz
TC = (0 ±30) × 10−6/K; tan δ ≤ 10 × 10−4 at 1 MHz
C4, C5, C14, C19
C13
±10
±20
Note
1. The external oscillator signal Vi(OSC) has a frequency of fOSC = 310.1667 MHz.
1996 Jan 15
12
Philips Semiconductors
Product specification
Advanced pager receiver
UAA2082
PINNING (LQFP32)
SYMBOL
TS
PIN
DESCRIPTION
1
test switch; connection to ground
for normal operation
BLI
2
3
4
5
6
7
8
9
battery LOW indicator output
data output
handbook, halfpage
DO
RE
receiver enable input
IF test point; I channel
IF test point; Q channel
pre-amplifier RF input 1
pre-amplifier RF input 2
not connected
TPI
1
2
3
4
5
6
7
8
TS
BLI
24
23
22
VO1MUL
n.c.
TPQ
VI1RF
VI2RF
n.c.
DO
RGYR
RE
21 COM
20 GND2
19 VI2MQ
UAA2082H
TPI
RRFA
10 external emitter resistor for
pre-amplifier
TPQ
VI1RF
VI2RF
VI1MQ
n.c.
18
17
GND1
VO2RF
VO1RF
VP
11 ground 1 (0 V)
12 pre-amplifier RF output 2
13 pre-amplifier RF output 1
14 supply voltage
MLC228
VI2MI
VI1MI
n.c.
15 I channel mixer input 2
16 I channel mixer input 1
17 not connected
VI1MQ
VI2MQ
GND2
COM
18 Q channel mixer input 1
19 Q channel mixer input 2
20 ground 2 (0 V)
Fig.7 Pin configuration; LQFP32.
21 gyrator filter resistor; common line
22 gyrator filter resistor
23 not connected
RGYR
n.c.
VO1MUL
VO2MUL
RMUL
24 frequency multiplier output 1
25 frequency multiplier output 2
26 external emitter resistor for
frequency multiplier
SENSE
OSC
n.c.
27 battery LOW detector sense input
28 oscillator collector
29 not connected
GND3
OSB
30 ground 3 (0 V)
31 oscillator base; crystal input
32 oscillator emitter
OSE
1996 Jan 15
13
Philips Semiconductors
Product specification
Advanced pager receiver
UAA2082
CHIP DIMENSIONS AND BONDING PAD LOCATIONS
See Table 4 for bonding pad description and locations for x/y co-ordinates.
y
24
23
22
21
20
19
25
26
18
17
27
28
16
15
3.83
mm
UAA2082U
14
13
1
2
3
4
12
x
0
0
5
6
7
8
9
10
11
4.74 mm
MLC229
Where:
Pad number 1 (diameter 124 µm)
Pad 124 µm x 124 µm
Pad not used
Pad 100 µm x 100 µm
Pad 100 µm x 100 µm with reference point
Chip area: 18.15 mm2
Chip thickness: 380 ±20 µm.
Drawing not to scale.
Fig.8 Bonding pad locations.
1996 Jan 15
14
Philips Semiconductors
Product specification
Advanced pager receiver
UAA2082
Table 4 Bonding pad centre locations (dimensions in µm)
SYMBOL
PAD
DESCRIPTION
x
y
TPI
1
IF test point; I channel
IF test point; Q channel
pre-amplifier RF input 1
−32
1296
1000
360
0
TPQ
2
−32
VI1RF
VI2RF
RRFA
GND1
VO2RF
VO1RF
VP
3
−32
4
pre-amplifier RF input 2; note 1
external emitter resistor for pre-amplifier
ground 1 (0 V)
0
5
472
0
6
1160
1688
2232
2760
3608
4216
4216
4216
4216
4216
4216
4216
4176
3668
2952
2312
1832
1328
432
0
7
pre-amplifier RF output 2
pre-amplifier RF output 1
supply voltage
0
8
0
9
0
VI2MI
VI1MI
VI1MQ
VI2MQ
GND2
COM
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
I channel mixer input 2
0
I channel mixer input 1
0
Q channel mixer input 1
Q channel mixer input 2
ground 2 (0 V)
360
960
1360
2024
2496
3136
3456
3458
3456
3456
3456
3456
3456
3456
3136
2512
2152
−186
gyrator filter resistor; common line
gyrator filter resistor
RGYR
VO1MUL
VO2MUL
RMUL
SENSE
OSC
frequency multiplier output 1
frequency multiplier output 2
external emitter resistor for frequency multiplier
battery LOW detector sense input
oscillator collector
GND3
OSB
ground 3 (0 V)
oscillator base; crystal input
oscillator emitter
OSE
TS
test switch; connection to ground for normal operation
battery LOW indicator output
data output
−32
BLI
−32
DO
−32
RE
receiver enable input
−32
lower left corner of chip (typical values)
−278
Note
1. All x/y co-ordinates are referenced to the centre of pad 4 (VI2RF); see Fig.8.
1996 Jan 15
15
Philips Semiconductors
Product specification
Advanced pager receiver
UAA2082
INTERNAL CIRCUITS
32
31
30
29
n.c.
28
27
26
25
1
2
5 kΩ
V
P
24
5 kΩ
3
4
V
P
150 kΩ
23
n.c.
22
21
UAA2082H
1 kΩ
1 kΩ
5
6
20
19
V
P
V
P
7
8
18
17
V
P
n.c.
9
150 Ω
n.c.
13
14
15
16
10
11
12
MLC493
Fig.9 Internal circuits drawn for LQFP32.
1996 Jan 15
16
Philips Semiconductors
Product specification
Advanced pager receiver
UAA2082
LM2C31
a n d b o o k g e w i d t h
1996 Jan 15
17
Philips Semiconductors
Product specification
Advanced pager receiver
UAA2082
The resonant circuit at output pin OSC selects the second
harmonic of the oscillator frequency. In other applications
a different multiplication factor may be chosen.
FUNCTIONAL DESCRIPTION
The complete circuit consists of the following functional
blocks as shown in Figs 1 to 6.
At 930 MHz an external oscillator circuit is required to
provide sufficient local oscillator signal for the frequency
multiplier.
Radio frequency amplifier
The RF amplifier is an emitter-coupled pair driving a
balanced cascode stage, which drives an external
balanced tuned circuit. Its bias current is set by an external
300 Ω resistor R1 to typically 770 µA. With this bias
current the optimum source resistance is 1.3 kΩ at VHF
and 1.0 kΩ at UHF. At 930 MHz a higher bias current is
required to achieve optimum gain. A value of 120 Ω is
used for R1, which corresponds with a bias current of
approximately 1.3 mA and an optimum source resistance
of approximately 600 Ω.The capacitors C1 and C2
transform a 50 Ω source resistance to this optimum value.
The output drives a tuned circuit with capacitive divider
(C7, C8 and C9) to provide maximum power transfer to the
phase-splitting network and the mixers.
Frequency multiplier
The frequency multiplier is an emitter-coupled pair driving
an external balanced tuned circuit. Its bias current is set by
external resistor R4 to typically 190 µA (173 MHz), 350 µA
(470 MHz) and 1 mA (930 MHz). The oscillator signal is
internally AC coupled to one input of the emitter-coupled
pair while the other input is internally grounded via a
capacitor. The frequency multiplier output signal between
pins VO1MUL and VO2MUL drives the upper switching
stages of the mixers. The bias voltage on pins VO1MUL
and VO2MUL is set by external resistor R3 to allow
sufficient voltage swing at the mixer outputs. The value of
R3 depends on the operating frequency: 1.5 kΩ
(173 MHz), 820 Ω (470 MHz) and 330 Ω (930 MHz).
Mixers
The double balanced mixers consist of common base
input stages and upper switching stages driven from the
frequency multiplier. The 300 Ω input impedance of each
mixer acts together with external components (C10, C11;
L4, L5 respectively) as phase shifter/power splitter to
provide a differential phase shift of 90 degrees between
the I channel and the Q channel. At 930 MHz all external
phase shifter components are inductive (L10, L11; L4, L5).
Low noise amplifiers, active filters and gyrator filters
The low noise amplifiers ensure that the noise of the
following stages does not affect the overall noise figure.
The following active filters before the gyrator filters reduce
the levels of large signals from adjacent channels. Internal
AC couplings block DC offsets from the gyrator filter
inputs.
The gyrator filters implement the transfer function of a 7th
order elliptic filter. Their cut-off frequencies are determined
by the 47 kΩ external resistor R2 between pins RGYR and
COM. The gyrator filter output signals are available on IF
test pins TPI and TPQ.
Oscillator
The oscillator is based on a transistor in common collector
configuration. It is followed by a cascode stage driving a
tuned circuit which provides the signal for the frequency
multiplier. The oscillator transistor requires an external
bias voltage Vbias(osc) (1.22 V typ.). The oscillator bias
current (typically 250 µA) is determined by the 1.5 kΩ
external resistor R5. The oscillator frequency is controlled
by an external 3rd overtone crystal in parallel resonance
mode. External capacitors between base and emitter
(C17) and from emitter to ground (C16) make the oscillator
transistor appear as having a negative resistance for small
signals; this causes the oscillator to start. Inductance L9
connected in parallel with capacitor C16 to the emitter of
the oscillator transistor prevents oscillation at the
Limiters
The gyrator filter output signals are amplified in the limiter
amplifiers to obtain IF signals with removed amplitude
information.
Demodulator
The limiter amplifier output signals are fed to the
demodulator. The demodulator output DO is going LOW or
HIGH depending upon which of the input signals has a
phase lead.
fundamental frequency of the crystal.
1996 Jan 15
18
Philips Semiconductors
Product specification
Advanced pager receiver
UAA2082
Battery LOW indicator
Band gap reference
The battery LOW indicator senses the supply voltage and
sets its output HIGH when the voltage at input SENSE is
less than Vth (typically 1.10 V). Low battery warning is
available at BLI.
The whole chip except the oscillator section can be
powered-up and powered-down by enabling and disabling
the band gap reference via the receiver enable pin RE.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
Ground pins GND1, GND2 and GND3 connected together.
SYMBOL
PARAMETER
MIN.
−0.3
MAX.
+8.0
UNIT
VP
supply voltage
V
Tstg
storage temperature
−55
−10
+125
+70
°C
°C
Tamb
Ves
operating ambient temperature
electrostatic handling; note 1
pins VI1RF and VI2RF
pin RRFA
−1500
−500
+2000
+2000
+250
V
V
V
V
V
V
pins VO1RF and VO2RF
pins VP and OSB
−2000
−500
+500
pins OSC and OSE
other pins
−2000
−2000
+500
+2000
Note
1. Equivalent to discharging a 100 pF capacitor via a 1.5 kΩ resistor.
1996 Jan 15
19
Philips Semiconductors
Product specification
Advanced pager receiver
UAA2082
DC CHARACTERISTICS
VP = 2.05 V; Tamb = −10 to +70 °C (typical values at Tamb = 25 °C); measurements taken in test circuit Figs 1, 2, 3 or 4
with crystal at pin OSB disconnected; unless otherwise specified.
SYMBOL
Supply
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
VP
IP
supply voltage
1.9
2.05
3.5
V
supply current
VRE = HIGH;
2.3
2.7
3.2
mA
fi(RF) = 173 and 470 MHz
VRE = HIGH; fi(RF) = 930 MHz
VRE = LOW
2.9
−
3.4
−
3.9
3
mA
µA
V
IP(off)
stand-by current
Vbias(osc) oscillator bias voltage
1.20
1.22
1.24
Receiver enable input (pin RE)
VIH
VIL
IIH
HIGH level input voltage
LOW level input voltage
HIGH level input current
LOW level input current
1.4
0
−
−
−
−
VP
V
0.3
20
V
VIH = VP = 3.5 V
VIL = 0 V
−
µA
µA
VIL
0
−1.0
Battery LOW indicator output (pin BLI)
VOH
VOL
Vth
HIGH level output voltage
LOW level output voltage
V
SENSE < Vth; IBLI = −10 µA
SENSE > Vth; IBLI = +10 µA
VP − 0.5
−
−
−
V
V
V
V
V
−
0.5
1.15
1.17
voltage threshold for battery VP = 2.05 V; Tamb = 25 °C
LOW indicator
1.05
1.03
1.10
1.10
VP = 2.05 to 3.5 V;
Tamb = −10 to +70 °C
Demodulator output (pin DO)
VOH
VOL
HIGH level output voltage
LOW level output voltage
IDO = −10 µA
IDO = +10 µA
VP − 0.5
−
−
−
V
V
−
0.5
1996 Jan 15
20
Philips Semiconductors
Product specification
Advanced pager receiver
UAA2082
AC CHARACTERISTICS (173 MHz)
VP = 2.05 V; Tamb = 25 °C; test circuit Figs 1 or 2; fi(RF) = 172.941 MHz with ±4.0 kHz deviation; 1200 baud pseudo
random bit sequence modulation (tr = 250 ±25 µs measured between 10% and 90% of voltage amplitude) and 20 kHz
channel spacing; unless otherwise specified.
SYMBOL
Radio frequency input
Pi(ref) input sensitivity (Pi(ref) is the
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
BER ≤ 3⁄100; note 1
−
−
−
−126.5 −123.5 dBm
maximum available power at
the RF input of the test board)
Tamb = −10 to +70 °C; note 2
−
−
−120.5 dBm
−117.5 dBm
VP = 1.9 V
Mixers to demodulator
αacs
adjacent channel selectivity
Tamb = 25 °C
69
67
−
72
−
−
dB
Tamb = −10 to +70 °C
−
dB
αci
IF filter channel imbalance
co-channel rejection
spurious immunity
−
2
dB
αc
−
4
7
dB
αsp
αim
αbl
50
55
78
±2.0
±2.5
2.5
60
60
85
−
−
dB
intermodulation immunity
blocking immunity
−
dB
∆f > ±1 MHz; note 3
deviation f = ±4.0 kHz
deviation f = ±4.5 kHz
−
dB
foffset
frequency offset range
(3 dB degradation in sensitivity)
−
kHz
kHz
kHz
−
−
∆fdev
deviation range
−
7.0
(3 dB degradation in sensitivity)
ton
receiver turn-on time
data valid after setting RE input
HIGH; note 4
−
−
5
ms
Notes
1. The bit error rate BER is measured using the test facility shown in Fig.12. Note that the BER test facility contains a
digital input filter equivalent to the one used in the PCA5000A, PCF5001 and PCD5003 POCSAG decoders.
2. Capacitor C16 requires re-adjustment to compensate temperature drift.
3. ∆f is the frequency offset between the required signal and the interfering signal.
4. Turn-on time is defined as the time from pin RE going HIGH to the reception of valid data on output pin DO. Turn-on
time is measured using an external oscillator (turn-on time using the internal oscillator is dependent upon the
oscillator circuitry).
1996 Jan 15
21
Philips Semiconductors
Product specification
Advanced pager receiver
UAA2082
AC CHARACTERISTICS (470 MHz)
VP = 2.05 V; Tamb = 25 °C; test circuit Figs 3 or 4; fi(RF) = 469.950 MHz with ±4.0 kHz deviation; 1200 baud pseudo
random bit sequence modulation (tr = 250 ± 25 µs measured between 10% and 90% of voltage amplitude) and 20 kHz
channel spacing; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Radio frequency input
Pi(ref)
input sensitivity (Pi(ref) is the
maximum available power at
the RF input of the test board)
BER ≤ 3⁄100; note 1
−
−
−
−124.5 −121.5 dBm
Tamb = −10 to +70 °C; note 2
−
−
−118.5 dBm
−115.5 dBm
VP = 1.9 V
Mixer input
Pi(mix)
input sensitivity
BER ≤ 3⁄100; note 3
−
−115.0 −110.0 dBm
Mixers to demodulator
αacs
adjacent channel selectivity
Tamb = 25 °C
67
65
−
70
−
−
dB
Tamb = −10 to +70 °C
−
dB
αci
IF filter channel imbalance
co-channel rejection
spurious immunity
−
2
dB
αc
−
4
7
dB
αsp
αim
αbl
50
55
75
±2.0
±2.5
2.5
60
60
82
−
−
dB
intermodulation immunity
blocking immunity
−
dB
∆f > ±1 MHz; note 4
deviation f = ±4.0 kHz
deviation f = ±4.5 kHz
−
dB
foffset
frequency offset range
(3 dB degradation in sensitivity)
−
kHz
kHz
kHz
−
−
∆fdev
deviation range
−
7.0
(3 dB degradation in sensitivity)
ton
receiver turn-on time
data valid after setting RE input
HIGH; note 5
−
−
5
ms
Notes
1. The bit error rate BER is measured using the test facility shown in Fig.12. Note that the BER test facility contains a
digital input filter equivalent to the one used in the PCA5000A, PCF5001 and PCD5003 POCSAG decoders.
2. Capacitor C16 requires re-adjustment to compensate temperature drift.
3. Test circuit Fig.5. Pi(mix) is the maximum available power at the input of the test board. The bit error rate BER is
measured using the test facility shown in Fig.12.
4. ∆f is the frequency offset between the required signal and the interfering signal.
5. Turn-on time is defined as the time from pin RE going HIGH to the reception of valid data on output pin DO. Turn-on
time is measured using an external oscillator (turn-on time using the internal oscillator is dependent upon the
oscillator circuitry).
1996 Jan 15
22
Philips Semiconductors
Product specification
Advanced pager receiver
UAA2082
AC CHARACTERISTICS (930 MHz)
VP = 2.05 V; Tamb = 25 °C; test circuit Fig.6; note 1; fi(RF) = 930.500 MHz with ±4.0 kHz deviation; 1200 baud pseudo
random bit sequence modulation (tr = 250 ± 25 µs measured between 10% and 90% of voltage amplitude) and 20 kHz
channel spacing; unless otherwise specified.
SYMBOL
Radio frequency input
Pi(ref) input sensitivity (Pi(ref) is the
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
BER ≤ 3⁄100; note 2
−
−
−120.0 −114.0 dBm
maximum available power at
the RF input of the test board)
VP = 1.9 V
−
−108.0 dBm
Mixers to demodulator
αacs
αc
adjacent channel selectivity
Tamb = 25 °C
60
69
5
−
dB
co-channel rejection
spurious immunity
−
10
−
dB
αsp
αim
αbl
40
60
60
74
−
dB
intermodulation immunity
blocking immunity
53
−
dB
∆f > ±1 MHz; note 3
deviation f = ±4.0 kHz
deviation f = ±4.5 kHz
65
−
dB
foffset
frequency offset range
(3 dB degradation in sensitivity)
±2.0
±2.5
2.5
−
kHz
kHz
kHz
−
−
∆fdev
deviation range
−
7.0
(3 dB degradation in sensitivity)
ton
receiver turn-on time
data valid after setting RE input
HIGH; note 4
−
−
5
ms
Notes
1. The external oscillator signal Vi(OSC) has a frequency of fOSC = 310.1667 MHz and a level of −15 dBm.
2. The bit error rate BER is measured using the test facility shown in Fig.12. Note that the BER test facility contains a
digital input filter equivalent to the one used in the PCA5000A, PCF5001 and PCD5003 POCSAG decoders.
3. ∆f is the frequency offset between the required signal and the interfering signal.
4. Turn-on time is defined as the time from pin RE going HIGH to the reception of valid data on output pin DO. Turn-on
time is measured using an external oscillator (turn-on time using the internal oscillator is dependent upon the
oscillator circuitry).
1996 Jan 15
23
Philips Semiconductors
Product specification
Advanced pager receiver
UAA2082
TEST INFORMATION
Tuning procedure for AC tests
1. Turn on the signal generator: fgen = fi(RF) + 4 kHz, no modulation, Vi(RF) = 1 mV (RMS).
2. Measure the IF with a counter connected to test pin TPI. Tune C16 to set the crystal oscillator to achieve fIF = 4 kHz
Change the generator frequency to fgen = fi(RF) − 4 kHz and check that fIF is also 4 kHz. For a received input
frequency fi(RF) = 172.941 MHz the crystal frequency is fXTAL = 57.647 MHz, while for fi(RF) = 469.950 MHz the
crystal frequency is fXTAL = 78.325 MHz. For a received input frequency fi(RF) = 930.500 MHz an external oscillator
signal must be used with fi(OSC) = 310.1667 MHz and a level of −15 dBm (for definition of crystal frequency, see
Table 1).
3. Set the signal generator to nominal frequency (fi(RF)) and turn on the modulation deviation ±4.0 kHz, 600 Hz square
wave modulation, Vi(RF) = 1 mV (RMS). Note that the RF signal should be reduced in the following tests, as the
receiver is tuned, to ensure Vo(IF) = 10 to 50 mV (p-p) on test pins TPI or TPQ.
4. Tune C15 (oscillator output circuit) and C12 (frequency multiplier output) to obtain a peak audio voltage on pin TPI.
5. Tune C3 and C6 (RF input and mixer input) to obtain a peak audio voltage on pin TPI. When testing the mixer input
sensitivity tune C23 instead of C3 and C6 (test circuit Fig.5).
6. Check that the output signal on pin TPQ is within 3 dB in amplitude and at 90° (±20°) relative phase of the signal on
pin TPI.
7. Check that data signal appears on output pin DO and proceed with the AC test.
AC test conditions
Table 5 Definitions for AC test conditions (see Table 6)
SIGNAL
DESCRIPTION
Modulated test signal 1
Frequency 172.941, 469.950 or 930.500 MHz
Deviation
Modulation 1200 baud pseudo random bit sequence
Rise time 250 ±25 µs (between 10% and 90% of final value)
Modulated test signal 2
Deviation ±2.4 kHz
±4.0 kHz
Modulation 400 Hz sine wave
Other definitions
f1
frequency of signal generator 1
f2
frequency of signal generator 2
frequency of signal generator 3
channel spacing (20 kHz)
f3
∆fcs
P1
P2
P3
Pi(ref)
maximum available power from signal generator 1 at the test board input
maximum available power from signal generator 2 at the test board input
maximum available power from signal generator 3 at the test board input
maximum available power at the test board input to give a Bit Error Rate (BER) ≤ 3⁄100 for the modulated
test signal 1, in the absence of interfering signals and under the conditions as specified in Chapters
“AC characteristics (173 MHz)”, “AC characteristics (470 MHz)” and “AC characteristics (930 MHz)”
1996 Jan 15
24
Philips Semiconductors
Product specification
Advanced pager receiver
UAA2082
Table 6 AC test conditions; notes 1 and 2
SYMBOL
PARAMETER
CONDITIONS
TEST SIGNALS
αa
adjacent channel selectivity;
Fig.11(b)
f2 = f1 ± ∆fCS
generator 1: modulated test signal 1
generator 2: modulated test signal 2
P1 = Pi(ref) + 3 dB
P2 = P1 + αa(min)
αc
co-channel rejection; Fig.11(b) f2 = f1 ± up to 3 kHz
generator 1: modulated test signal 1
P1 = Pi(ref) + 3 dB
generator 2: modulated test signal 2
f2 = 100 kHz to 2 GHz
P2 = P1 − αc(max)
αsp
spurious immunity; Fig.11(b)
generator 1: modulated test signal 1
generator 2: modulated test signal 2
f2 = f1 ± ∆fcs; f3 = f1 ± 2∆fcs
P1 = Pi(ref) + 3 dB
P2 = P1 + αsp( min)
αim
intermodulation immunity;
Fig.11(c)
generator 1: modulated test signal 1
generator 2: unmodulated
P1 = Pi(ref) + 3 dB
P2 = P1 + αim(min)
P3 = P2
generator 3: modulated test signal 2
f2 = f1 ± 1 MHz
αbl
blocking immunity; Fig.11(b)
generator 1: modulated test signal 1
generator 2: modulated test signal 2
deviation = ±4.0 kHz, f1 = fi(RF) ± 2 kHz (foffset(min)
generator 1: modulated test signal 1
P1 = Pi(ref) + 3 dB
P2 = P1 + αbl(min)
foffset
∆fdev
ton
frequency offset range;
Fig.11(a)
)
P1 = Pi(ref) + 3 dB
P1 = Pi(ref) + 3 dB
P1 = Pi(ref) + 10 dB
deviation range; Fig.11(a)
deviation = ±2.5 to ±7 kHz; (∆fdev(min) to ∆fdev(max))
generator 1: modulated test signal 1
receiver turn-on time; Fig.11(a) note 3
generator 1: modulated test signal 1
Notes
1. The tests are executed without load on pins TPI and TPQ.
2. All minimum and maximum values correspond to a bit error rate (BER) ≤ 3⁄100 in the wanted signal (P1).
3. The BER measurement is started 5 ms (ton(max)) after VRE goes HIGH; BER is then measured for 100 bits
(BER ≤ 3⁄100).
1996 Jan 15
25
Philips Semiconductors
Product specification
Advanced pager receiver
UAA2082
(1)
GENERATOR 1
= 50 Ω
DEVICE
UNDER TEST
BER TEST
FACILITY
(a)
(b)
R
s
50 Ω 2-SIGNAL
POWER
COMBINER
(1)
GENERATOR 1
= 50 Ω
DEVICE
UNDER TEST
BER TEST
FACILITY
R
s
GENERATOR 2
= 50 Ω
R
s
GENERATOR 1
= 50 Ω
R
s
50 Ω 3-SIGNAL
POWER
COMBINER
(1)
GENERATOR 2
= 50 Ω
BER TEST
FACILITY
DEVICE
UNDER TEST
(c)
R
s
MLC232
GENERATOR 3
= 50 Ω
R
s
(a) One generator.
(b) Two generators.
(c) Three generators.
(1) See Fig.12.
Fig.11 Test configurations.
recovered clock
GENERATOR
= 50 Ω
DEVICE
UNDER TEST
DIGITAL
FILTER
CLOCK
RECOVERY
retimed
Rx data
R
s
to error
counter
PRESET
DELAY
DATA
COMPARATOR
PSEUDO
RANDOM
SEQUENCE
GENERATOR
250 µs
RISE TIME
MASTER
CLOCK
MLC233
Fig.12 BER test facility.
26
1996 Jan 15
Philips Semiconductors
Product specification
Advanced pager receiver
UAA2082
PRINTED-CIRCUIT BOARDS
MBD562
Fig.13 PCB top view for LQFP32; test circuit Figs 1 and 3.
1996 Jan 15
27
Philips Semiconductors
Product specification
Advanced pager receiver
UAA2082
MBD561
Fig.14 PCB bottom view for LQFP32; test circuit Figs 1 and 3.
1996 Jan 15
28
Philips Semiconductors
Product specification
Advanced pager receiver
UAA2082
C19
R3
L7
L6
L5
L4
V
R2
bosc
C9
C14
C7
C8
C12
L8
C11
C10
C15
C20
V
P
UAA2082H
L3
C4
R6
V
sense
C6
C13
C16
C17
L9
L2
GND
XTAL
R1
R5
C18
TS
BLI
DO
RE
VIRF
DO
TPI
TPQ
MLC234
VEE = GND; VC = VP.
Fig.15 PCB top view with components for LQFP32; test circuit Fig.3.
1996 Jan 15
29
Philips Semiconductors
Product specification
Advanced pager receiver
UAA2082
C5
R4
C3
L1
C1
C2
MLC235
Fig.16 PCB bottom view with components for LQFP32; test circuit Fig.3.
1996 Jan 15
30
Philips Semiconductors
Product specification
Advanced pager receiver
UAA2082
C19
R3
C23
L7
L6
L5
L4
L10
V
R2
bosc
C14
C10
C12
L8
C21
C15
C11
C22
C20
V
UAA2082H
P
R6
V
sense
C13
V
i RF
C16
C17
GND
XTAL
L9
R5
C18
TS
BLI
DO
RE
DO
TPI
TPQ
MLC236
Fig.17 PCB top view with components for LQFP32; test circuit Fig.5.
1996 Jan 15
31
Philips Semiconductors
Product specification
Advanced pager receiver
UAA2082
C5
R4
MLC237
Fig.18 PCB bottom view with components for LQFP32; test circuit Fig.5.
1996 Jan 15
32
Philips Semiconductors
Product specification
Advanced pager receiver
UAA2082
o
GND
C13
V
P
L5
L4 C9
L11
R2
R3
C12
L10
L6
L7
UAA2082H
C7
L3
C19
C14
C4
C8
L8
L2
C6
R1
L1
V
i(OSC)
C15
TS
BLI
DO
C3
RE
C1
C2
TPI
TPQ
MLC238
V
i(RF)
Fig.19 PCB top view with components for LQFP32; test circuit Fig.6.
1996 Jan 15
33
Philips Semiconductors
Product specification
Advanced pager receiver
UAA2082
C5
R4
MLC239
Fig.20 PCB bottom view with components for LQFP32; test circuit Fig.6.
1996 Jan 15
34
Philips Semiconductors
Product specification
Advanced pager receiver
UAA2082
PACKAGE OUTLINE
LQFP32: plastic low profile quad flat package; 32 leads; body 7 x 7 x 1.4 mm
SOT358-1
c
y
X
A
24
17
25
16
Z
E
e
Q
H
E
A
E
(A )
3
2
A
A
1
w M
p
θ
b
L
p
pin 1 index
L
32
9
detail X
1
8
e
Z
D
v M
A
w M
b
p
D
B
H
v M
B
D
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
D
H
L
L
Q
v
w
y
Z
Z
E
θ
1
2
3
p
E
p
D
max.
7o
0o
0.20 1.45
0.05 1.35
0.4 0.18 7.1
0.3 0.12 6.9
7.1
6.9
9.15 9.15
8.85 8.85
0.75 0.69
0.45 0.59
0.9
0.5
0.9
0.5
mm
1.60
0.25
0.8
1.0
0.2 0.25 0.1
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
93-06-29
95-12-19
SOT358 -1
1996 Jan 15
35
Philips Semiconductors
Product specification
Advanced pager receiver
UAA2082
If wave soldering cannot be avoided, the following
conditions must be observed:
SOLDERING
Introduction
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave)
soldering technique should be used.
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
• The footprint must be at an angle of 45° to the board
direction and must incorporate solder thieves
downstream and at the side corners.
Even with these conditions, do not consider wave
soldering LQFP packages LQFP48 (SOT313-2),
LQFP64 (SOT314-2) or LQFP80 (SOT315-1).
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011). During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Reflow soldering
Reflow soldering techniques are suitable for all LQFP
packages.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
Repairing soldered joints
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
Wave soldering
Wave soldering is not recommended for LQFP packages.
This is because of the likelihood of solder bridging due to
closely-spaced leads and the possibility of incomplete
solder penetration in multi-lead devices.
1996 Jan 15
36
Philips Semiconductors
Product specification
Advanced pager receiver
UAA2082
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1996 Jan 15
37
Philips Semiconductors
Product specification
Advanced pager receiver
UAA2082
NOTES
1996 Jan 15
38
Philips Semiconductors
Product specification
Advanced pager receiver
UAA2082
NOTES
1996 Jan 15
39
Philips Semiconductors – a worldwide company
Argentina: IEROD, Av. Juramento 1992 - 14.b, (1428)
BUENOS AIRES, Tel. (541)786 7633, Fax. (541)786 9367
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,
Philippines: PHILIPS SEMICONDUCTORS PHILIPPINES Inc.,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. (63) 2 816 6380, Fax. (63) 2 817 3474
Tel. (02)805 4455, Fax. (02)805 4466
Austria: Triester Str. 64, A-1101 WIEN, P.O. Box 213,
Tel. (01)60 101-1236, Fax. (01)60 101-1211
Belgium: Postbus 90050, 5600 PB EINDHOVEN, The Netherlands,
Portugal: PHILIPS PORTUGUESA, S.A.,
Rua dr. António Loureiro Borges 5, Arquiparque - Miraflores,
Apartado 300, 2795 LINDA-A-VELHA,
Tel. (01)4163160/4163333, Fax. (01)4163174/4163366
Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,
Tel. (65)350 2000, Fax. (65)251 6500
South Africa: S.A. PHILIPS Pty Ltd.,
Tel. (31)40-2783749, Fax. (31)40-2788399
Brazil: Rua do Rocio 220 - 5th floor, Suite 51,
CEP: 04552-903-SÃO PAULO-SP, Brazil,
P.O. Box 7383 (01064-970),
195-215 Main Road Martindale, 2092 JOHANNESBURG,
P.O. Box 7430, Johannesburg 2000,
Tel. (011)470-5911, Fax. (011)470-5494
Tel. (011)821-2333, Fax. (011)829-1849
Canada: PHILIPS SEMICONDUCTORS/COMPONENTS:
Tel. (800) 234-7381, Fax. (708) 296-8556
Chile: Av. Santa Maria 0760, SANTIAGO,
Spain: Balmes 22, 08007 BARCELONA,
Tel. (03)301 6312, Fax. (03)301 42 43
Sweden: Kottbygatan 7, Akalla. S-164 85 STOCKHOLM,
Tel. (0)8-632 2000, Fax. (0)8-632 2745
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. (02)773 816, Fax. (02)777 6730
China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. (852)2319 7888, Fax. (852)2319 7700
Tel. (01)488 2211, Fax. (01)481 77 30
Taiwan: PHILIPS TAIWAN Ltd., 23-30F, 66, Chung Hsiao West
Road, Sec. 1. Taipeh, Taiwan ROC, P.O. Box 22978,
TAIPEI 100, Tel. (886) 2 382 4443, Fax. (886) 2 382 4444
Colombia: IPRELENSO LTDA, Carrera 21 No. 56-17,
77621 BOGOTA, Tel. (571)249 7624/(571)217 4609,
Fax. (571)217 4549
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong,
Bangkok 10260, THAILAND,
Tel. (66) 2 745-4090, Fax. (66) 2 398-0793
Turkey:Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
Tel. (0212)279 27 70, Fax. (0212)282 67 07
Ukraine: Philips UKRAINE, 2A Akademika Koroleva str., Office 165,
Denmark: Prags Boulevard 80, PB 1919, DK-2300
COPENHAGEN S, Tel. (45)32 88 26 36, Fax. (45)31 57 19 49
Finland: Sinikalliontie 3, FIN-02630 ESPOO,
Tel. (358)0-615 800, Fax. (358)0-61580 920
France: 4 Rue du Port-aux-Vins, BP317,
92156 SURESNES Cedex,
Tel. (01)4099 6161, Fax. (01)4099 6427
Germany: P.O. Box 10 51 40, 20035 HAMBURG,
252148 KIEV, Tel. 380-44-4760297, Fax. 380-44-4766991
United Kingdom: Philips Semiconductors LTD.,
276 Bath Road, Hayes, MIDDLESEX UB3 5BX,
Tel. (0181)730-5000, Fax. (0181)754-8421
United States:811 East Arques Avenue, SUNNYVALE,
CA 94088-3409, Tel. (800)234-7381, Fax. (708)296-8556
Uruguay: Coronel Mora 433, MONTEVIDEO,
Tel. (040)23 53 60, Fax. (040)23 53 63 00
Greece: No. 15, 25th March Street, GR 17778 TAVROS,
Tel. (01)4894 339/4894 911, Fax. (01)4814 240
India: Philips INDIA Ltd, Shivsagar Estate, A Block,
Dr. Annie Besant Rd. Worli, Bombay 400 018
Tel. (022)4938 541, Fax. (022)4938 722
Indonesia: Philips House, Jalan H.R. Rasuna Said Kav. 3-4,
P.O. Box 4252, JAKARTA 12950,
Tel. (02)70-4044, Fax. (02)92 0601
Tel. (021)5201 122, Fax. (021)5205 189
Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. (01)7640 000, Fax. (01)7640 200
Italy: PHILIPS SEMICONDUCTORS S.r.l.,
Piazza IV Novembre 3, 20124 MILANO,
Tel. (0039)2 6752 2531, Fax. (0039)2 6752 2557
Japan: Philips Bldg 13-37, Kohnan2-chome, Minato-ku, TOKYO 108,
Tel. (03)3740 5130, Fax. (03)3740 5077
Korea: Philips House, 260-199 Itaewon-dong,
Internet: http://www.semiconductors.philips.com/ps/
For all other countries apply to: Philips Semiconductors,
International Marketing and Sales, Building BE-p,
P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands,
Telex 35000 phtcnl, Fax. +31-40-2724825
Yongsan-ku, SEOUL, Tel. (02)709-1412, Fax. (02)709-1415
SCDS47
© Philips Electronics N.V. 1996
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA,
SELANGOR, Tel. (03)750 5214, Fax. (03)757 4880
Mexico: 5900 Gateway East, Suite 200, EL PASO, TX 79905,
Tel. 9-5(800)234-7381, Fax. (708)296-8556
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,
Tel. (040)2783749, Fax. (040)2788399
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
All rights are reserved. Reproduction in whole or in part is prohibited without the
prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation
or contract, is believed to be accurate and reliable and may be changed without
notice. No liability will be accepted by the publisher for any consequence of its
use. Publication thereof does not convey nor imply any license under patent- or
other industrial or intellectual property rights.
Tel. (09)849-4160, Fax. (09)849-7811
Norway: Box 1, Manglerud 0612, OSLO,
Tel. (022)74 8000, Fax. (022)74 8341
Pakistan: Philips Electrical Industries of Pakistan Ltd.,
Exchange Bldg. ST-2/A, Block 9, KDA Scheme 5, Clifton,
KARACHI 75600, Tel. (021)587 4641-49,
Fax. (021)577035/5874546
Printed in The Netherlands
Go to Philips Semiconductors' home page
Select & Go...
Catalog
& Datasheets
Information as of 2000-08-17
Catalog by Function
Discrete semiconductors
Audio
UAA2082; Advanced pager receiver
Clocks and Watches
Data communications
Microcontrollers
Peripherals
Standard analog
Video
Subscribe
to eNews
• Description
• Features
• Applications
• Datasheet
• Products, packages, availability and ordering
• Find similar products
To be kept informed on UAA2082,
subscribe to eNews.
•
Wired communications
Wireless communications
Catalog by System
Automotive
Description
Consumer Multimedia
Systems
Communications
The UAA2082 is a high-performance low-power radio receiver circuit primarily intended for VHF, UHF and 900 MHz pager receivers for
wide area digital paging systems, employing direct FM non-return-to-zero (NRZ) frequency shift keying (FSK).
PC/PC-peripherals
Cross reference
The receiver design is based on the direct conversion principle where the input signal is mixed directly down to the baseband by a local
oscillator on the signal frequency. Two complete signal paths with signals of 90° phase difference are required to demodulate the signal. All
channel selectivity is provided by the built-in IF filters. The circuit makes extensive use of on-chip capacitors to minimize the number of
external components.
Models
Packages
Application notes
Selection guides
Other technical documentation
End of Life information
Datahandbook system
The battery monitoring circuit has an external sense input and a 1.1 V detection threshold for easy operation in a single-cell supply concept.
The UAA2082 was designed to operate together with the PCA5000A, PCF5001 or PCD5003 POCSAG decoders, which contain a digital
input filter for optimum call success rate.
Relevant Links
Features
About catalog tree
About search
About this site
Subscribe to eNews
Catalog & Datasheets
Search
l Wide frequency range: VHF, UHF and 900 MHz bands
l High sensitivity
l High dynamic range
UAA2082
l Electronically adjustable filters on chip
l Suitable for data rates up to 2400 bits/s
l Wide frequency offset and deviation range
l Fully POCSAG compatible FSK receiver
l Power on/off mode selectable by the chip enable input
l Low supply voltage; low power consumption
UAA2082
l 1-cell battery-low detection circuit
l High integration level
l Interfaces directly to the PCA5000A, PCF5001 and PCD5003 POCSAG decoders.
Applications
l Wide area paging
l On-site paging
l Telemetry
l RF security systems
l Low bit-rate wireless data links.
Datasheet
File
size
(kB)
Publication
release date Datasheet status
Page
count
Type nr. Title
Datasheet
Download
UAA2082 Advanced pager receiver
15-Jan-96
Product
40
457
Specification
Products, packages, availability and ordering
North American
Partnumber
Order code
(12nc)
Partnumber
marking/packing
package device status
SOT358 Full production
buy online
Standard Marking * Reel Dry
Pack, SMD, 13"
UAA2082H/V1
UAA2082U/10/V1
UAA2082HB-T
9350 742 80518
No Marking * Chips on Wafer,
Pre-Sawn, On FFC
9352 609 66005
NONE
Samples available
-
Please read information about some discontinued variants of this product.
Find similar products:
UAA2082 links to the similar products page containing an overview of products that are similar in function or related to the part
number(s) as listed on this page. The similar products page includes products from the same catalog tree(s) , relevant selection guides and
products from the same functional category.
Copyright © 2000
Royal Philips Electronics
All rights reserved.
Terms and conditions.
相关型号:
UAA2082HB-T
IC TELECOM, PAGING RECEIVER, PQFP32, 7 X 7 MM, 1.40 MM HEIGHT, PLASTIC, SOT-358-1, LQFP-32, Paging Circuit
NXP
©2020 ICPDF网 联系我们和版权申明