UAA3201TD [NXP]
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| 型号： | UAA3201TD |
| 厂家： | 
NXP |
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INTEGRATED CIRCUITS
DATA SHEET
UAA3201T
UHF/VHF remote control receiver
Product specification
2000 Apr 18
Supersedes data of 1995 May 18
File under Integrated Circuits, IC18
Philips Semiconductors
Product specification
UHF/VHF remote control receiver
UAA3201T
FEATURES
APPLICATIONS
• Oscillator with external Surface Acoustic Wave
Resonator (SAWR)
• Car alarm systems
• Remote control systems
• Security systems
• Gadgets and toys
• Telemetry.
• Wide frequency range from 150 to 450 MHz
• High sensitivity
• Low power consumption
• Automotive temperature range
• Superheterodyne architecture
GENERAL DESCRIPTION
• Applicable to fulfil FTZ 17 TR 2100 (Germany)
• High integration level, few external components
• Inexpensive external components
• IF filter bandwidth determined by application.
The UAA3201T is a fully integrated single-chip receiver,
primarily intended for use in VHF and UHF systems
employing direct AM Return-to-Zero (RZ) Amplitude Shift
Keying (ASK) modulation.
QUICK REFERENCE DATA
SYMBOL
VCC
PARAMETER
supply voltage
CONDITIONS
MIN.
3.5
TYP. MAX. UNIT
−
6.0
V
ICC
supply current
−
−
3.4
−
4.8
mA
dBm
Pref
input reference sensitivity
fi(RF) = 433.92 MHz;
data rate = 250 bits/s;
BER ≤ 3 × 10−2
−105
Tamb
ambient temperature
−40
−
+85
°C
ORDERING INFORMATION
TYPE
PACKAGE
NUMBER
NAME
DESCRIPTION
VERSION
UAA3201T
SO16
plastic small outline package; 16 leads; body width 3.9 mm
SOT109-1
2000 Apr 18
2
Philips Semiconductors
Product specification
UHF/VHF remote control receiver
UAA3201T
BLOCK DIAGRAM
V
CC
IF FILTER
RF_IN
C12
C17
R1
C19
LIN
13
V
EM
15
MIXIN
14
FA
16
LFB CPC
CPO
10
12
11
IF AMPLIFIER
×
BUFFER
MIXER
DATA
data
9
LIMITER
COMPARATOR
BUFFER
BAND GAP
REFERENCE
UAA3201T
V
V
ref
3
CC
OSCILLATOR
4
5
1
2
6
7
8
MHB679
OSC OSE
MON
MOP
V
V
CPB
CPA
CC
EE
C13
C14
C7
Fig.1 Block diagram.
PINNING
SYMBOL PIN
DESCRIPTION
negative mixer output
MON
MOP
VCC
1
2
3
4
5
6
7
8
9
positive mixer output
positive supply voltage
oscillator collector
oscillator emitter
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
MON
MOP
FA
V
OSC
OSE
VEE
EM
V
MIXIN
LIN
CC
negative supply voltage
comparator input B
comparator input A
data output
OSC
OSE
CPB
CPA
DATA
CPO
CPC
LFB
LIN
UAA3201T
LFB
V
CPC
CPO
DATA
EE
CPB
CPA
10 comparator offset adjustment
11 comparator input C
12 limiter feedback
13 limiter input
MED897
MIXIN
VEM
14 mixer input
15 negative supply voltage for mixer
16 IF amplifier output
Fig.2 Pin configuration.
FA
2000 Apr 18
3
Philips Semiconductors
Product specification
UHF/VHF remote control receiver
UAA3201T
FUNCTIONAL DESCRIPTION
Limiter
The RF signal is fed directly into the mixer stage where it
is mixed down to nominal 500 kHz IF by the integrated
oscillator controlled by an external SAWR (see Fig.1). The
IF signal is then passed to the IF amplifier which increases
the level. A 5th-order elliptic low-pass filter acts as main
IF filtering. The output voltage of that filter is demodulated
by a limiter that rectifies the incoming IF signal. The
demodulated signal passes two RC filter stages and is
then limited by a data comparator which makes it available
at the data output.
The limiting amplifier consists of three DC coupled
amplifier stages with a total gain of 60 dB. A Received
Signal Strength Indicator (RSSI) signal is generated by
rectifying the IF signal. The limiter has a lower frequency
limit of 100 kHz which can be controlled by capacitors C12
and C19. The upper frequency limit is 3 MHz.
Comparator
The 2 × IF component in the RSSI signal is removed by the
first order low-pass capacitor C17. After passing a buffer
stage the signal is split into two paths, leading via
RC filters to the inputs of a voltage comparator. The time
constant of one path (C14) is compared to the bit duration.
Consequently the potential at the negative comparator
input represents the average magnitude of the RSSI
signal. The second path with a short time constant (C13)
allows the signal at the positive comparator input to follow
the RSSI signal instantaneously. This results in a variable
comparator threshold, depending on the strength of the
incoming signal. Hence the comparator output is switched
on, when the RSSI signal exceeds its average value, i.e.
when an ASK ‘on’ signal is received.
Mixer
The mixer is a single balanced emitter coupled pair with
internally set bias current. The optimum impedance is
320 Ω at 430 MHz. Capacitor C5 (see Fig.9) is used to
transform a 50 Ω generator impedance to the optimum
value.
Oscillator
The oscillator consists of a transistor in common base
configuration and a tank circuit including the SAWR.
Resistor R2 (see Fig.9) is used to control the bias current
through the transistor. Resistor R3 is required to reduce
unwanted responses of the tank circuit.
The low-pass filter capacitor C13 rejects the unwanted
2 × IF component and reduces the noise bandwidth of the
data filter.
IF amplifier
The resistor R1 is used to set the current of an internal
source. This current is drawn from the positive comparator
input, thereby applying an offset and driving the output into
the ‘off’ state during the absence of an input signal. This
offset can be increased by lowering the value of R1
yielding a higher noise immunity at the expense of reduced
sensitivity.
The IF amplifier is a differential input, single-ended output
emitter coupled pair. It is used to decouple the first and the
second IF filter and to provide some additional gain in
order to reduce the influence of the noise of the limiter on
the total noise figure.
IF filters
Band gap reference
The first IF filter is an RC filter formed by internal resistors
and an external capacitor C7 (see Fig.1).
The band gap reference controls the biasing of the whole
circuit. In this block currents are generated that are
constant over the temperature range and currents that are
proportional to the absolute temperature.
The second IF filter is an external elliptic filter. The source
impedance is 1.4 kΩ and the load is high-impedance. The
bandwidth of the IF filter in the application and test circuit
(see Fig.9) is 800 kHz due to the centre frequency spread
of the SAWR. It may be reduced when SAWRs with less
tolerances are used or temperature range requirements
are lower. A smaller bandwidth of the filter will yield a
higher sensitivity of the receiver. As the RF signal is mixed
down to a low IF signal there is no image rejection
possible.
The current consumption of the receiver rises with
increasing temperature, because the blocks with the
highest current consumption are biased by currents that
are proportional to the absolute temperature.
2000 Apr 18
4
Philips Semiconductors
Product specification
UHF/VHF remote control receiver
UAA3201T
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL
VCC
PARAMETER
CONDITIONS
MIN.
−0.3
MAX.
+8.0
UNIT
supply voltage
V
Tamb
Tstg
Ves
ambient temperature
storage temperature
electrostatic handling voltage
pins OSC and OSE
pins LFB and MIXIN
all other pins
−40
−55
+85
°C
°C
+125
note 1
−2000
−1500
−2000
+1500
+2000
+2000
V
V
V
Note
1. Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 kΩ series resistor.
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
Rth(j-a)
thermal resistance from junction to ambient in free air
105
K/W
DC CHARACTERISTICS
VCC = 3.5 V; all voltages referenced to VEE; Tamb = −40 to +85 °C; typical value for Tamb = 25 °C; for test circuit
see Fig.9; SAWR disconnected; unless otherwise specified.
SYMBOL
VCC
PARAMETER
supply voltage
supply current
CONDITIONS
MIN.
3.5
TYP.
MAX.
6.0
UNIT
−
V
ICC
R2 = 680 Ω
−
3.4
4.8
mA
V
VOH(DATA)
HIGH-level output voltage at IDATA = −10 µA; note 1
V
CC
− 0.5
−
VCC
pin DATA
VOL(DATA)
LOW-level output voltage at IDATA = +200 µA; note 1
0
−
0.6
V
pin DATA
Note
1. I
is defined to be positive when the current flows into pin DATA.
DATA
2000 Apr 18
5
Philips Semiconductors
Product specification
UHF/VHF remote control receiver
UAA3201T
AC CHARACTERISTICS
VCC = 3.5 V; Tamb = 25 °C; for test circuit see Fig.9; R1 disconnected; for AC test conditions see Section “AC test
conditions”; unless otherwise specified.
SYMBOL
PARAMETER
input reference sensitivity
CONDITIONS
MIN.
TYP. MAX. UNIT
Pref
BER ≤ 3 × 10−2; note 1
BER ≤ 3 × 10−2
note 2
−
−
−105
−30
−60
−
dBm
dBm
dBm
dBm
dBm
dBm
ms
P
i(max)
maximum input power
−
−
P
spur
spurious radiation
−
−
IP3
IP3
interception point (mixer)
interception point (mixer plus IF amplifier)
1 dB compression point (mixer)
receiver turn-on time
−20
−38
−38
−
−17
−35
−35
−
mix
−
IF
P
1dB
−
t
note 3
10
on(RX)
Notes
1. Pref is the maximum available power at the input of the test board. The Bit Error Rate (BER) is measured using the
test facility shown in Fig.8.
2. Valid only for the reference PCB (see Figs 10 and 11). Spurious radiation is strongly dependent on the PCB layout.
3. The supply voltage VCC is pulsed as explained in Fig.3.
INTERNAL PIN CONFIGURATION
PIN
SYMBOL
EQUIVALENT CIRCUIT
1
2
MON
MOP
V
P
1.5
kΩ
1.5
kΩ
1
from
oscillator
buffer
MHB680
2
3
VCC
3
V
CC
MHB681
4
5
OSC
OSE
V
P
4
5
6 kΩ
1.2 V
MHB682
2000 Apr 18
6
Philips Semiconductors
Product specification
UHF/VHF remote control receiver
UAA3201T
PIN
SYMBOL
EQUIVALENT CIRCUIT
6
VEE
6
MHB683
7
8
CPB
CPA
V
P
150 kΩ
7
8
150 kΩ
MHB684
9
DATA
V
P
1 kΩ
9
MHB686
10
CPO
V
P
10
MHB685
11
CPC
V
P
30 kΩ
11
MHB704
2000 Apr 18
7
Philips Semiconductors
Product specification
UHF/VHF remote control receiver
UAA3201T
PIN
SYMBOL
EQUIVALENT CIRCUIT
12
13
LFB
LIN
V
P
50
kΩ
12
13
MHB687
14
15
MXIN
VEM
14
15
MHB688
16
FA
V
P
1.4 kΩ
16
MHB689
TEST INFORMATION
Tuning procedure for AC tests
1. Turn on the signal generator: fi(RF) = 433.92 MHz, no modulation and RF input level = 1 mV.
2. Tune capacitor C6 (RF stage input) to obtain a maximum voltage on pin LIN.
3. Check that data is appearing on pin DATA and proceed with the AC tests.
AC test conditions
The reference signal level Pref for the following tests is defined as the minimum input level in dBm to give a
BER ≤ 3 × 10−2 (e.g. 7.5 bit errors per second for 250 bits/s).
2000 Apr 18
8
Philips Semiconductors
Product specification
UHF/VHF remote control receiver
UAA3201T
Table 1 Test signals
TEST
SIGNAL
FREQUENCY
(MHz)
MODULATION
INDEX
DATA SIGNAL
MODULATION
1
433.92
250 bits/s
(square wave)
RZ signal with duty cycle of 66% for logic 1;
RZ signal with duty cycle of 33% for logic 0
100%
2
3
434.02
433.92
−
−
no modulation
no modulation
−
−
Test results
P1 is the maximum available power from signal generator 1 at the input of the test board; P2 is the maximum available
power from signal generator 2 at the input of the test board.
Table 2 Test results
GENERATOR
TEST
RESULT
1
2
Maximum input power;
see Fig.4
test signal 1;
P1 = −30 dBm
(minimum Pmax
−
BER ≤ 3 × 10−2
(e.g. 7.5 bit errors per second for 250 bits/s)
)
Receiver turn-on time;
see Fig.4 and note 1
test signal 1;
P1 = Pref + 10 dB
−
check that the first 10 bits are correct; error counting is
started 10 ms after VCC is switched on
Interception point (mixer);
see Fig.5 and note 2
test signal 3;
P1 = −50 dBm
test
IP3 = P1 + 1⁄2 × IM3 (dB);
signal 2; minimum value: IP3mix ≥ −20 dBm
P2 = P1
Interception point (mixer plus test signal 3;
test
IP3 = P1 + 1⁄2 × IM3 (dB);
IF amplifier); see Fig.5 and
note 3
P1 = −50 dBm
signal 2; minimum value: IP3IF ≥ −38 dBm
P2 = P1
Spurious radiation; see Fig.6
and note 4
−
−
−
no spurious radiation (25 MHz to 1 GHz) with level
higher than −60 dBm (maximum Pspur
)
1 dB compression point
(mixer);
see Fig.7 and note 5
test signal 3;
P
P12 = −38 dBm
(Po1 + 70 dB) − [Po2 + 38 dB (minimum P1dB)] ≤ 1 dB,
where Po1 is the output power for test signal with P11
and Po2 is the output power for test signal with P12
11 = −70 dBm;
(minimum P1dB
)
Notes
1. The supply voltage VCC of the test circuit alternates between ‘on’ (100 ms) and ‘off’ (100 ms); see Fig.3.
2. Differential probe of spectrum analyser connected to pins MOP and MON.
3. Probe of spectrum analyser connected to pin LIN.
4. Spectrum analyser connected to the input of the test board.
5. Probe of spectrum analyser connected to either pin MOP or pin MON.
2000 Apr 18
9
Philips Semiconductors
Product specification
UHF/VHF remote control receiver
UAA3201T
MED899 - 1
V
CC
(V)
3.5
0
0
100
200
300
t (ms)
Fig.3 Timing diagram for pulsed supply voltage.
GENERATOR 1
50 Ω
BER TEST
FACILITY
(1)
TEST CIRCUIT
(2)
MED900
(1) For test circuit see Fig.9.
(2) For BER test facility see Fig.8.
Fig.4 Test configuration (single generator).
GENERATOR 1
50 Ω
SPECTRUM
ANALYZER
WITH
50 Ω
2-SIGNAL
POWER
(1)
TEST CIRCUIT
PROBE
COMBINER
GENERATOR 2
50 Ω
IM3
∆f
∆f
∆f = 100 kHz
∆f
MED901
(1) For test circuit see Fig.9.
Fig.5 Test configuration (interception point).
10
2000 Apr 18
Philips Semiconductors
Product specification
UHF/VHF remote control receiver
UAA3201T
SPECTRUM
ANALYZER
INPUT IMPEDANCE
50 Ω
(1)
TEST CIRCUIT
MED902
(1) For test circuit see Fig.9.
Fig.6 Test configuration (spurious radiation).
GENERATOR 1
50 Ω
SPECTRUM
ANALYZER
WITH
(1)
TEST CIRCUIT
PROBE
MED903
(1) For test circuit see Fig.9.
Fig.7 Test configuration (1 dB compression point).
TX data
SIGNAL
GENERATOR
MASTER
CLOCK
BIT PATTERN
GENERATOR
PRESET
DELAY
delayed
TX data
DEVICE
UNDER TEST
INTEGRATE
AND DUMP
DATA
COMPARATOR
to error counter
RX data
BER TEST BOARD
MED904
Fig.8 BER test facility.
2000 Apr 18
11
Philips Semiconductors
Product specification
UHF/VHF remote control receiver
UAA3201T
APPLICATION INFORMATION
RF_IN
+3.5 V
C8
C9
C11
C10
C5
C4
C20
L2
L1
C6
data
C15
C12
C17
R1
C19
L3
V
FA
16
MIXIN
14
LIN
13
LFB
12
CPC
11
CPO
10
DATA
9
EM
15
LIMITER
BUFFER
COMPARATOR
MIXER
IF
AMP
BUFFER
V
UAA3201T
CC
BAND GAP
REFERENCE
OSCILLATOR
V
ref
1
2
MOP
3
4
5
6
7
8
MED896
V
V
MON
OSC
OSE
CPB
C14
CPA
EE
CC
C18
C16
C7
L4
R2
C13
C21
(1)
3.5 V
C1
C2
C3
R3
SAWR
(1) Stray inductance.
Fig.9 Application and test circuit.
12
2000 Apr 18
Philips Semiconductors
Product specification
UHF/VHF remote control receiver
UAA3201T
Components and layout of printed circuit board of test circuit for fi(RF) = 433.92 MHz
Table 3 Components list for Fig.9
COMPONENT
VALUE
27 kΩ
TOLERANCE
DESCRIPTION
R1
±2%
TC = +50 ppm/K
TC = +50 ppm/K
TC = +50 ppm/K
−
R2
680 Ω
220 Ω
4.7 µF
150 pF
1 nF
±2%
R3
±2%
C1
±20%
±10%
±10%
±10%
±10%
−
C2
TC = 0 ±30 ppm/K; tan δ ≤ 10 × 10−4; f = 1 MHz
TC = 0 ±30 ppm/K; tan δ ≤ 10 × 10−4; f = 1 MHz
TC = 0 ±30 ppm/K; tan δ ≤ 10 × 10−4; f = 1 MHz
TC = 0 ±150 ppm/K; tan δ ≤ 30 × 10−4; f = 1 MHz
TC = 0 ±300 ppm/K; tan δ ≤ 20 × 10−4; f = 1 MHz
TC = 0 ±30 ppm/K; tan δ ≤ 10 × 10−4; f = 1 MHz
TC = 0 ±30 ppm/K; tan δ ≤ 10 × 10−4; f = 1 MHz
TC = 0 ±30 ppm/K; tan δ ≤ 10 × 10−4; f = 1 MHz
TC = 0 ±30 ppm/K; tan δ ≤ 20 × 10−4; f = 1 MHz
TC = 0 ±30 ppm/K; tan δ ≤ 10 × 10−4; f = 1 MHz
tan δ ≤ 25 × 10−3; f = 1 kHz
C3
C4
820 pF
3.3 pF
2.5 to 6 pF
56 pF
C5
C6
C7
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±10%
±5%
C8
150 pF
220 pF
27 pF
C9
C10
C11
C12
C13
C14
C15
C16
C17
C18
C19
C20
C21
L1
150 pF
100 nF
2.2 nF
33 nF
tan δ ≤ 25 × 10−3; f = 1 kHz
tan δ ≤ 25 × 10−3; f = 1 kHz
150 pF
3.9 pF
10 nF
TC = 0 ±30 ppm/K; tan δ ≤ 10 × 10−4; f = 1 MHz
TC = 0 ±150 ppm/K; tan δ ≤ 30 × 10−4; f = 1 MHz
tan δ ≤ 25 × 10−3; f = 1 kHz
TC = 0 ±150 ppm/K; tan δ ≤ 30 × 10−4; f = 1 MHz
TC = 0 ±30 ppm/K; tan δ ≤ 10 × 10−4; f = 1 MHz
TC = 0 ±150 ppm/K; tan δ ≤ 30 × 10−4; f = 1 MHz
TC = 0 ±30 ppm/K; tan δ ≤ 10 × 10−4; f = 1 MHz
3.3 pF
68 pF
6.8 pF
47 pF
10 nH
330 µH
330 µH
33 nH
−
±10%
±10%
±10%
±10%
−
Q
min = 50 to 450 MHz; TC = 25 to 125 ppm/K
Qmin = 45 to 800 kHz; Cstray ≤ 1 pF
Qmin = 45 to 800 kHz; Cstray ≤ 1 pF
L2
L3
L4
Qmin = 45 to 450 MHz; TC = 25 to 125 ppm/K
see Table 4
SAWR
Table 4 SAWR data
DESCRIPTION
SPECIFICATION
Type
one-port (e.g. RFM R02112)
433.42 MHz ±75 kHz
1.5 dB
Centre frequency
Maximum insertion loss
Typical loaded Q
Temperature drift
Turnover temperature
1600 (50 Ω load)
0.032 ppm/K2
43 °C
2000 Apr 18
13
Philips Semiconductors
Product specification
UHF/VHF remote control receiver
UAA3201T
MBE589
RF_IN
data
n.c.
UAA3201T
H4ACS15
Fig.10 Layout top side.
MBE591
PCALH/H4ACS15
H 4 A C S 1 5
Fig.11 Layout bottom side.
14
2000 Apr 18
Philips Semiconductors
Product specification
UHF/VHF remote control receiver
UAA3201T
MBE590
RF_IN
C5
C4
L3
C15
L1
DATA
R1
C19
C6
data
C12 C17
IC1
L2
C13
C14
n.c.
SAWR
supply
UAA3201T
H4ACS15
Fig.12 Top side with components.
MBE592
C11
C10
C9
C8
C21
C20
C2
R2
C7
C16
C1
C3
C18
L4
R3
PCALH/H4ACS15
H 4 A C S 1 5
Fig.13 Bottom side with components.
15
2000 Apr 18
Philips Semiconductors
Product specification
UHF/VHF remote control receiver
UAA3201T
PACKAGE OUTLINE
SO16: plastic small outline package; 16 leads; body width 3.9 mm
SOT109-1
D
E
A
X
c
y
H
v
M
A
E
Z
16
9
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
8
e
w
M
detail X
b
p
0
2.5
scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.
0.25
0.10
1.45
1.25
0.49
0.36
0.25
0.19
10.0
9.8
4.0
3.8
6.2
5.8
1.0
0.4
0.7
0.6
0.7
0.3
mm
1.27
0.050
1.05
0.041
1.75
0.25
0.01
0.25
0.01
0.25
0.1
8o
0o
0.010 0.057
0.004 0.049
0.019 0.0100 0.39
0.014 0.0075 0.38
0.16
0.15
0.244
0.228
0.039 0.028
0.016 0.020
0.028
0.012
inches
0.069
0.01 0.004
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
97-05-22
99-12-27
SOT109-1
076E07
MS-012
2000 Apr 18
16
Philips Semiconductors
Product specification
UHF/VHF remote control receiver
UAA3201T
SOLDERING
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering is not always suitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The footprint must incorporate solder thieves at the
downstream end.
Reflow soldering
• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.
Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.
Manual soldering
Wave soldering
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
To overcome these problems the double-wave soldering
method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:
2000 Apr 18
17
Philips Semiconductors
Product specification
UHF/VHF remote control receiver
UAA3201T
Suitability of surface mount IC packages for wave and reflow soldering methods
SOLDERING METHOD
PACKAGE
BGA, LFBGA, SQFP, TFBGA
WAVE
not suitable
REFLOW(1)
suitable
HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS
PLCC(3), SO, SOJ
not suitable(2)
suitable
suitable
suitable
LQFP, QFP, TQFP
not recommended(3)(4) suitable
not recommended(5)
suitable
SSOP, TSSOP, VSO
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2000 Apr 18
18
Philips Semiconductors
Product specification
UHF/VHF remote control receiver
UAA3201T
DATA SHEET STATUS
PRODUCT
DATA SHEET STATUS
STATUS
DEFINITIONS (1)
Objective specification
Development This data sheet contains the design target or goal specifications for
product development. Specification may change in any manner without
notice.
Preliminary specification Qualification
This data sheet contains preliminary data, and supplementary data will be
published at a later date. Philips Semiconductors reserves the right to
make changes at any time without notice in order to improve design and
supply the best possible product.
Product specification
Production
This data sheet contains final specifications. Philips Semiconductors
reserves the right to make changes at any time without notice in order to
improve design and supply the best possible product.
Note
1. Please consult the most recently issued data sheet before initiating or completing a design.
DEFINITIONS
DISCLAIMERS
Short-form specification
The data in a short-form
Life support applications
These products are not
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Right to make changes
Philips Semiconductors
reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
the use of any of these products, conveys no licence or title
under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that
these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified.
Application information
Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
2000 Apr 18
19
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For all other countries apply to: Philips Semiconductors,
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5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
69
SCA
© Philips Electronics N.V. 2000
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
03/pp20
Date of release: 2000 Apr 18
Document order number: 9397 750 06929
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