MSC7165GS-K [OKI]
Vacuum Fluorescent Driver, 16-Segment, PDSO24, PLASTC, SOP-24;型号: | MSC7165GS-K |
厂家: | OKI ELECTRONIC COMPONETS |
描述: | Vacuum Fluorescent Driver, 16-Segment, PDSO24, PLASTC, SOP-24 光电二极管 |
文件: | 总8页 (文件大小:111K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
E2C0031-27-Y2
This version: Nov. 1997
Previous version: Jul. 1996
¡ Semiconductor
MSC7165
16-Bit Grid Driver with 4 to 16-Decoder
GENERAL DESCRIPTION
The MSC7165 is a driver IC designed to directly drive the grids of a vacuum fluorescent display
tube.
Since this IC has a built-in 4 to 16-line decoder and 16 output circuits, a single device of MSC7165
can replace a set of the following three: two devices of either MSL915 or MSL917 and one device
of either MSM4514 or MSM74HC4514.
Setting the DUTY pin to the "L" level makes all driver outputs go "L". Blanking can be set using
this function.
FEATURES
• Logic supply voltage
• Driver supply voltage
• Driver output current
: 5V
: –60V
I
I
: –40mA
: 1mA
OH
OL
• Can be connected directly to VFD without a pull-down resistor
• Built-in 4 to 16-line decoder
• Brightness can be adjusted by the DUTY pin
• Package:
24-pin plastic SOP (SOP24-P-430-1.27-K) (Product name: MSC7165GS-K)
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¡ Semiconductor
MSC7165
BLOCK DIAGRAM
VDD
DUTY
S 1
GRID 1
S 2
GRID 2
GRID 3
GRID 4
GRID 5
GRID 6
GRID 7
GRID 8
GRID 9
GRID 10
GRID 11
GRID 12
GRID 13
GRID 14
GRID 15
GRID 16
S 3
S 4
SEL 0
SEL 1
SEL 2
SEL 3
S 5
S 6
S 7
S 8
4 to 16
DECODER
S 9
S 10
S 11
S 12
S 13
S 14
S 15
S 16
VDISP(–)
Vss
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¡ Semiconductor
MSC7165
INPUT AND OUTPUT CONFIGURATION
Schematic Diagrams of Logic Portion Input Circuit
VDD
VDD
Input
VDISP(–)
VSS
VSS
Schematic Diagram of Driver Output Circuit
VDD VDD
Output
VDISP(–)
VDISP(–)
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¡ Semiconductor
MSC7165
PIN CONFIGURATION (TOP VIEW)
1
2
24
23
22
21
20
19
18
17
16
15
14
13
GRID 1
GRID 2
GRID 3
GRID 4
GRID 5
GRID 6
GRID 7
GRID 8
GRID 9
GRID 10
GRID 11
VDISP(–)
SEL 0
3
SEL 1
4
SEL 2
5
SEL 3
6
DUTY
7
VSS
8
VDD
9
GRID 13
GRID 14
GRID 15
GRID 16
10
11
GRID 12 12
24-Pin Plastic SOP
PIN DESCRIPTIONS
Symbol
SEL0-3
Type
Description
4- to 16-line decoder input pins
I
I
The input 4-bit binary signals are converted into hexadecimal signals, then output
through driver output pins.
Duty control signal input pin
DUTY
Setting this pin to "L" makes all driver outputs go "L", so this pin can be used for
brightness control.
High withstand voltage driver output pins for driving fluorescent display tube
These pins can be connected directly to the grid of fluorescent display tube.
No pull-down resistor is required.
GRID1-16
O
Power supply pin for the fluorescent display tube driver circuit
Logic power supply pin
—
—
—
VDISP(–)
VDD
Ground pin
VSS
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¡ Semiconductor
MSC7165
ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Condition
Rating
Unit
Logic Supply Voltage
VDD
Applied to logic supply pin
–0.3 to +6.5
*1
*1
*2
V
Driver Supply Voltage
VDISP(–)
Applied to driver supply pin
–70 to VDD
V
Input Voltage
VIN
PD
Applied to all input pins
–0.3 to VDD+0.3 *1
790
V
<
Power Dissipation
Ta 25°C
=
mW
Package Thermal Resistance
Storage Temperature
Rj–a
TSTG
—
158
*3 °C/W
°C
—
–55 to +150
*1 The maximum supply voltage for V
SS
*2 Permanent damage to the device may be caused if the voltage is supplied over the absolute
maximum rating value.
*3 Thermal resistance of the package (between junction and atmosphere)
Thejunctiontemperature(T )givenbytheequationindicatedbelowshouldnotexceed150°C.
j
T =P¥R +Ta (P: Maximum power consumption of IC)
j
j–a
RECOMMENDED OPERATING CONDITIONS
Parameter
Logic Supply Voltage
Driver Supply Voltage
High Level Input Voltage
Low Level Input Voltage
High Level Output Current
Low Level Output Current
Operating Temperature
Input Pulse Rise time
Input Pulse Fall Time
Symbol
VDD
VDISP(–)
VIH
Condition
Applied to logic supply pin
Applied to driver supply pin
Applied to all input pins
Applied to all input pins
Applied to all driver output pins
Applied to all driver output pins
—
Min.
4.5
–60
3.1
—
Max.
5.5
–5
Unit
V
V
—
V
VIL
1.7
–40
1.0
85
V
IOH
—
mA
mA
°C
µs
µs
IOL
—
Top
–40
—
tr
Applied to all input pins
Applied to all input pins
1.0
tf
—
1.0
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¡ Semiconductor
MSC7165
ELECTRICAL CHARACTERISTICS
DC Characteristics
(VDD=4.5 to 5.5V, VDISP(–)=–60 to –5V, Ta=–40 to +85°C)
Parameter
Symbol
IDD1
IDD2
IDISP1
IDISP2
IIH
Condition
No load, 1 output H
No load, DUTY=L
No load, 1 output H
No load, DUTY=L
—
Min.
—
Typ.
—
Max.
6.0
6.0
—
Unit
mA
mA
mA
mA
µA
Logic Supply Voltage
—
—
Driver Supply Voltage
–6.0
–6.0
—
—
—
—
High Level Input Current
Low Level Input Current
High Level Output Voltage
Low Level Output Voltage
—
1
IIL
—
—
—
1
µA
VOH
IOH=–40mA
VDD–4
—
—
—
V
VOL
IOL=1mA
—
VDISP(–)
+2.5
V
AC Characteristics
(VDD=4.5 to 5.5V, VDISP(–)=–60 to –5V, Ta=–40 to +85°C)
Parameter
Delay Time L to H
Symbol
Condition
Min.
—
Typ.
0.5
Max.
1.5
Unit
µs
tDLH
tTLH
tDHL
tTHL
CL=10pF, See figure below
CL=10pF, See figure below
CL=10pF, See figure below
CL=10pF, See figure below
Transient Time L to H
Delay Time H to L
—
2.0
4.0
µs
—
0.3
1.0
µs
Transient Time H to L
—
2.0
4.0
µs
tr
tf
90%
50%
90%
50%
DUTY
SELn
10%
10%
tDHL
90%
tDLH
90%
10%
10%
GRIDn
tTLH
tTHL
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¡ Semiconductor
MSC7165
FUNCTIONAL DESCRIPTION
Function Table
SEL
GRID
DUTY
0
X
L
1
X
L
2
X
L
3
X
L
1
L
H
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
2
L
L
H
L
L
L
L
L
L
L
L
L
L
L
L
L
L
3
L
L
L
H
L
L
L
L
L
L
L
L
L
L
L
L
L
4
L
L
L
L
H
L
L
L
L
L
L
L
L
L
L
L
L
5
L
L
L
L
L
H
L
L
L
L
L
L
L
L
L
L
L
6
L
L
L
L
L
L
H
L
L
L
L
L
L
L
L
L
L
7
L
L
L
L
L
L
L
H
L
L
L
L
L
L
L
L
L
8
L
L
L
L
L
L
L
L
H
L
L
L
L
L
L
L
L
9
L
L
L
L
L
L
L
L
L
H
L
L
L
L
L
L
L
10 11 12 13 14 15 16
L
L
L
L
L
L
L
L
L
L
L
H
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
H
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
H
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
H
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
H
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
H
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
H
H
L
L
L
L
H
H
L
L
L
H
L
L
L
H
H
H
H
L
L
H
L
L
L
H
H
L
L
H
L
L
H
H
H
H
H
H
H
H
H
H
L
L
L
H
H
L
L
H
L
L
H
H
H
H
H
L
L
H
H
H
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¡ Semiconductor
MSC7165
PACKAGE DIMENSIONS
(Unit : mm)
SOP24-P-430-1.27-K
Mirror finish
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
0.58 TYP.
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
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