MSC7165GS-K [OKI]

Vacuum Fluorescent Driver, 16-Segment, PDSO24, PLASTC, SOP-24;
MSC7165GS-K
型号: MSC7165GS-K
厂家: OKI ELECTRONIC COMPONETS    OKI ELECTRONIC COMPONETS
描述:

Vacuum Fluorescent Driver, 16-Segment, PDSO24, PLASTC, SOP-24

光电二极管
文件: 总8页 (文件大小:111K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
E2C0031-27-Y2  
This version: Nov. 1997  
Previous version: Jul. 1996  
¡ Semiconductor  
MSC7165  
16-Bit Grid Driver with 4 to 16-Decoder  
GENERAL DESCRIPTION  
The MSC7165 is a driver IC designed to directly drive the grids of a vacuum fluorescent display  
tube.  
Since this IC has a built-in 4 to 16-line decoder and 16 output circuits, a single device of MSC7165  
can replace a set of the following three: two devices of either MSL915 or MSL917 and one device  
of either MSM4514 or MSM74HC4514.  
Setting the DUTY pin to the "L" level makes all driver outputs go "L". Blanking can be set using  
this function.  
FEATURES  
• Logic supply voltage  
• Driver supply voltage  
• Driver output current  
: 5V  
: –60V  
I
I
: –40mA  
: 1mA  
OH  
OL  
• Can be connected directly to VFD without a pull-down resistor  
• Built-in 4 to 16-line decoder  
• Brightness can be adjusted by the DUTY pin  
• Package:  
24-pin plastic SOP (SOP24-P-430-1.27-K) (Product name: MSC7165GS-K)  
1/8  
¡ Semiconductor  
MSC7165  
BLOCK DIAGRAM  
VDD  
DUTY  
S 1  
GRID 1  
S 2  
GRID 2  
GRID 3  
GRID 4  
GRID 5  
GRID 6  
GRID 7  
GRID 8  
GRID 9  
GRID 10  
GRID 11  
GRID 12  
GRID 13  
GRID 14  
GRID 15  
GRID 16  
S 3  
S 4  
SEL 0  
SEL 1  
SEL 2  
SEL 3  
S 5  
S 6  
S 7  
S 8  
4 to 16  
DECODER  
S 9  
S 10  
S 11  
S 12  
S 13  
S 14  
S 15  
S 16  
VDISP(–)  
Vss  
2/8  
¡ Semiconductor  
MSC7165  
INPUT AND OUTPUT CONFIGURATION  
Schematic Diagrams of Logic Portion Input Circuit  
VDD  
VDD  
Input  
VDISP(–)  
VSS  
VSS  
Schematic Diagram of Driver Output Circuit  
VDD VDD  
Output  
VDISP(–)  
VDISP(–)  
3/8  
¡ Semiconductor  
MSC7165  
PIN CONFIGURATION (TOP VIEW)  
1
2
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
14  
13  
GRID 1  
GRID 2  
GRID 3  
GRID 4  
GRID 5  
GRID 6  
GRID 7  
GRID 8  
GRID 9  
GRID 10  
GRID 11  
VDISP(–)  
SEL 0  
3
SEL 1  
4
SEL 2  
5
SEL 3  
6
DUTY  
7
VSS  
8
VDD  
9
GRID 13  
GRID 14  
GRID 15  
GRID 16  
10  
11  
GRID 12 12  
24-Pin Plastic SOP  
PIN DESCRIPTIONS  
Symbol  
SEL0-3  
Type  
Description  
4- to 16-line decoder input pins  
I
I
The input 4-bit binary signals are converted into hexadecimal signals, then output  
through driver output pins.  
Duty control signal input pin  
DUTY  
Setting this pin to "L" makes all driver outputs go "L", so this pin can be used for  
brightness control.  
High withstand voltage driver output pins for driving fluorescent display tube  
These pins can be connected directly to the grid of fluorescent display tube.  
No pull-down resistor is required.  
GRID1-16  
O
Power supply pin for the fluorescent display tube driver circuit  
Logic power supply pin  
VDISP(–)  
VDD  
Ground pin  
VSS  
4/8  
¡ Semiconductor  
MSC7165  
ABSOLUTE MAXIMUM RATINGS  
Parameter  
Symbol  
Condition  
Rating  
Unit  
Logic Supply Voltage  
VDD  
Applied to logic supply pin  
–0.3 to +6.5  
*1  
*1  
*2  
V
Driver Supply Voltage  
VDISP(–)  
Applied to driver supply pin  
–70 to VDD  
V
Input Voltage  
VIN  
PD  
Applied to all input pins  
–0.3 to VDD+0.3 *1  
790  
V
<
Power Dissipation  
Ta 25°C  
=
mW  
Package Thermal Resistance  
Storage Temperature  
Rj–a  
TSTG  
158  
*3 °C/W  
°C  
–55 to +150  
*1 The maximum supply voltage for V  
SS  
*2 Permanent damage to the device may be caused if the voltage is supplied over the absolute  
maximum rating value.  
*3 Thermal resistance of the package (between junction and atmosphere)  
Thejunctiontemperature(T )givenbytheequationindicatedbelowshouldnotexceed150°C.  
j
T =P¥R +Ta (P: Maximum power consumption of IC)  
j
j–a  
RECOMMENDED OPERATING CONDITIONS  
Parameter  
Logic Supply Voltage  
Driver Supply Voltage  
High Level Input Voltage  
Low Level Input Voltage  
High Level Output Current  
Low Level Output Current  
Operating Temperature  
Input Pulse Rise time  
Input Pulse Fall Time  
Symbol  
VDD  
VDISP(–)  
VIH  
Condition  
Applied to logic supply pin  
Applied to driver supply pin  
Applied to all input pins  
Applied to all input pins  
Applied to all driver output pins  
Applied to all driver output pins  
Min.  
4.5  
–60  
3.1  
Max.  
5.5  
–5  
Unit  
V
V
V
VIL  
1.7  
–40  
1.0  
85  
V
IOH  
mA  
mA  
°C  
µs  
µs  
IOL  
Top  
–40  
tr  
Applied to all input pins  
Applied to all input pins  
1.0  
tf  
1.0  
5/8  
¡ Semiconductor  
MSC7165  
ELECTRICAL CHARACTERISTICS  
DC Characteristics  
(VDD=4.5 to 5.5V, VDISP(–)=–60 to –5V, Ta=–40 to +85°C)  
Parameter  
Symbol  
IDD1  
IDD2  
IDISP1  
IDISP2  
IIH  
Condition  
No load, 1 output H  
No load, DUTY=L  
No load, 1 output H  
No load, DUTY=L  
Min.  
Typ.  
Max.  
6.0  
6.0  
Unit  
mA  
mA  
mA  
mA  
µA  
Logic Supply Voltage  
Driver Supply Voltage  
–6.0  
–6.0  
High Level Input Current  
Low Level Input Current  
High Level Output Voltage  
Low Level Output Voltage  
1
IIL  
1
µA  
VOH  
IOH=–40mA  
VDD–4  
V
VOL  
IOL=1mA  
VDISP(–)  
+2.5  
V
AC Characteristics  
(VDD=4.5 to 5.5V, VDISP(–)=–60 to –5V, Ta=–40 to +85°C)  
Parameter  
Delay Time L to H  
Symbol  
Condition  
Min.  
Typ.  
0.5  
Max.  
1.5  
Unit  
µs  
tDLH  
tTLH  
tDHL  
tTHL  
CL=10pF, See figure below  
CL=10pF, See figure below  
CL=10pF, See figure below  
CL=10pF, See figure below  
Transient Time L to H  
Delay Time H to L  
2.0  
4.0  
µs  
0.3  
1.0  
µs  
Transient Time H to L  
2.0  
4.0  
µs  
tr  
tf  
90%  
50%  
90%  
50%  
DUTY  
SELn  
10%  
10%  
tDHL  
90%  
tDLH  
90%  
10%  
10%  
GRIDn  
tTLH  
tTHL  
6/8  
¡ Semiconductor  
MSC7165  
FUNCTIONAL DESCRIPTION  
Function Table  
SEL  
GRID  
DUTY  
0
X
L
1
X
L
2
X
L
3
X
L
1
L
H
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
2
L
L
H
L
L
L
L
L
L
L
L
L
L
L
L
L
L
3
L
L
L
H
L
L
L
L
L
L
L
L
L
L
L
L
L
4
L
L
L
L
H
L
L
L
L
L
L
L
L
L
L
L
L
5
L
L
L
L
L
H
L
L
L
L
L
L
L
L
L
L
L
6
L
L
L
L
L
L
H
L
L
L
L
L
L
L
L
L
L
7
L
L
L
L
L
L
L
H
L
L
L
L
L
L
L
L
L
8
L
L
L
L
L
L
L
L
H
L
L
L
L
L
L
L
L
9
L
L
L
L
L
L
L
L
L
H
L
L
L
L
L
L
L
10 11 12 13 14 15 16  
L
L
L
L
L
L
L
L
L
L
L
H
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
H
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
H
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
H
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
H
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
H
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
L
H
H
L
L
L
L
H
H
L
L
L
H
L
L
L
H
H
H
H
L
L
H
L
L
L
H
H
L
L
H
L
L
H
H
H
H
H
H
H
H
H
H
L
L
L
H
H
L
L
H
L
L
H
H
H
H
H
L
L
H
H
H
7/8  
¡ Semiconductor  
MSC7165  
PACKAGE DIMENSIONS  
(Unit : mm)  
SOP24-P-430-1.27-K  
Mirror finish  
Package material  
Lead frame material  
Pin treatment  
Solder plate thickness  
Package weight (g)  
Epoxy resin  
42 alloy  
Solder plating  
5 mm or more  
0.58 TYP.  
Notes for Mounting the Surface Mount Type Package  
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which  
are very susceptible to heat in reflow mounting and humidity absorbed in storage.  
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the  
product name, package name, pin number, package code and desired mounting conditions  
(reflow method, temperature and times).  
8/8  

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