MSM6408-GS-K [OKI]

Microcontroller, 4-Bit, MROM, CMOS, PQFP44, 9 X 10 MM, PLASTIC, QFP-44;
MSM6408-GS-K
型号: MSM6408-GS-K
厂家: OKI ELECTRONIC COMPONETS    OKI ELECTRONIC COMPONETS
描述:

Microcontroller, 4-Bit, MROM, CMOS, PQFP44, 9 X 10 MM, PLASTIC, QFP-44

微控制器
文件: 总19页 (文件大小:148K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
E2E0014-38-93  
This version: Sep. 1998  
Previous version: Mar. 1996  
¡ Semiconductor  
MSM6408  
High speed and High performance 4-Bit Microcontroller  
GENERAL DESCRIPTION  
TheMSM6408microcontrollerisalow-power,single-chipdeviceimplementedincomplementary  
metal-oxide semiconductor technology.  
The MSM6408 is optimized for high-speed processing and complicated-control applications, in  
which conventional microcontrollers are difficult to use.  
FEATURES  
• Mask ROM  
• RAM (including the stack area)  
• I/O port  
: 8096 words ¥ 8 bits  
: 256 words ¥ 4 bits  
Input-output port  
Input port  
: 8 ports ¥ 4 bits  
: 1 port ¥ 4 bits  
4 bits are for input ports having a latch; the other 32 bits are for input/output ports that  
allow bit manipulation  
• Three built-in counters  
: 12-bit time-base counter  
12-bit programmable timer  
8-bit high-speed programmable timer/event  
counter  
• Built-in 8-bit serial I/O register (with 3-bit counter)  
• Five interrupts with five priority levels (4 internal, 1 external)  
• 32 stack levels (in RAM)  
• Power down features  
• Minimum instruction execution time : 1.0 ms @ 4.0 MHz clock  
• Instruction systems suitable for control  
• Fully static operation  
• Low power consumption  
• Single 5 V power supply  
• Package options:  
42-pin plastic DIP (DIP42-P-600-2.54)  
44-pin plastic QFP (QFP44-P-910-0.80-K)  
44-pin plastic QFP (QFP44-P-910-0.80-2K) (Product name : MSM6408-¥¥¥GS-2K)  
(Product name : MSM6408-¥¥¥RS)  
(Product name : MSM6408-¥¥¥GS-K)  
¥¥¥ indicates a code number.  
1/19  
¡ Semiconductor  
MSM6408  
BLOCK DIAGRAM  
RAM  
16 ¥ 16 ¥ 4 bits  
ROM  
8096 ¥ 8 bits  
INSTR  
DEC  
ACC  
ALU  
DEC  
DEC  
C
SP  
H
L
F
12 PC  
0
PC INTE PB  
PD IRQ  
Interrupt  
Control  
OSC0  
OSC  
TEST  
RESET  
VDD  
12-bit Timer P9 8-bit T/C PA 8-bit SR  
Timing  
1
&
Control  
12-bit TBC  
GND  
P8  
P7  
P6  
P5  
P4  
P3  
P2  
P1  
P0  
3210 3210 3210 3210 3210 3210 3210 3210 3210  
INT  
SCK, CTO, CLK  
SO  
SI  
CIN  
TMO  
TCK  
2/19  
¡ Semiconductor  
MSM6408  
PIN CONFIGURATION (TOP VIEW)  
P4.0  
P4.1  
P4.2  
P4.3  
P3.0  
P3.1  
P3.2  
P3.3  
OSC0  
1
2
3
4
5
6
7
8
9
42 VDD  
41 P5.3  
40 P5.2  
39 P5.1  
38 P5.0  
37 P6.3  
36 P6.2  
35 P6.1  
34 P6.0  
33 P7.3  
32 P7.2  
31 P7.1  
30 P7.0  
29 P8.3  
28 P8.2  
27 P8.1  
26 P8.0  
25 P1.3  
24 P1.2  
23 P1.1  
22 P1.0  
OSC1 10  
RESET 11  
TEST 12  
P2.0 13  
P2.1 14  
P2.2 15  
P2.3 16  
P0.0 17  
P0.1 18  
P0.2 19  
P0.3 20  
GND 21  
42-Pin Plastic DIP  
3/19  
¡ Semiconductor  
MSM6408  
PIN CONFIGURATION (TOP VIEW) (continued)  
P3.1  
P3.2  
1
2
3
4
5
6
7
8
9
33 P6.2  
32 P6.1  
31 P6.0  
30 NC  
P3.3  
OSC0  
OSC1  
RESET  
TEST  
P2.0  
29 P7.3  
28 P7.2  
27 P7.1  
26 P7.0  
25 P8.3  
24 P8.2  
23 P8.1  
P2.1  
P2.2 10  
P2.3 11  
NC : No-connection pin  
44-Pin Plastic QFP  
4/19  
¡ Semiconductor  
MSM6408  
PIN DESCRIPTIONS  
Symbol  
P0.0  
Type  
Description  
During reset  
P0.1/SCK  
P0.2/SO  
P0.3/SI  
P0.1 is shared with serial clock (SLK) input/output.  
P0.2 is shared with serial data (SO) output.  
P0.3 is shared with serial data (SI) input.  
P1.0 is shared with counter input (CIN).  
P1.1 is shared with timer output (TMO).  
P1.2 is shared with timer clock input (TCK).  
I/O  
"1"  
P1.0/CIN  
P1.1/TMO  
P1.2/TCK  
P1.3  
I/O  
"1"  
P2.0/INT  
P2.1  
P2.0 is shared with external interrupt input (INT).  
The latch is  
reset.  
I
P2.2  
Input ports with a latch, with built-in pull-up resistor.  
P2.3  
P3.0 to 3.3  
P4.0 to 4.3  
P5.0 to 5.3  
P6.0 to 6.3  
P7.0 to 7.3  
P8.0 to 8.3  
OSC0  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I
"1"  
"0"  
"0"  
"0"  
"0"  
"0"  
Oscillation  
waveform  
Crystal connection pins for clock oscillation.  
(Test pin for manufacturer)  
OSC1  
O
TEST  
O
I
Pulse output  
RESET  
Input pin for system reset.  
VDD  
Power supply voltage pins.  
GND  
Note: 1. The pins except for pins P2.0 to P2.3 are pseudo bidirectional ports.  
2. When each port is used for output, the MSM6408 can drive one TTL (one input).  
5/19  
¡ Semiconductor  
MSM6408  
INSTRUCTION LIST  
Mnemonic  
LAI n  
Code  
9n  
Byte  
1
1
2
2
1
1
1
1
1
1
1
1
1
1
1
2
2
2
2
2
2
2
2
1
1
1
1
1
1
1
1
1
Cycle  
Description  
1
1
2
2
1
1
1
1
1
1
1
1
1
1
1
2
2
3
2
2
2
2
2
3
3
1
1
1
1
1
1
1
A¨n  
LLI n  
8n  
L¨n  
LHLI nn  
LMI nn  
LAL  
15nn  
14nn  
21  
HL¨nn  
M(w)¨nn  
A¨L  
LLA  
2D  
L¨A  
LAH  
22  
A¨H  
LHA  
2E  
H¨A  
LAM  
38  
A¨M  
M¨A  
LMA  
2F  
LAM+  
LAM–  
LMA+  
LMA–  
LAMM n2  
LAMD mm  
LMAD mm  
LMTD mm  
LMCT  
LCTM  
LMSR  
LSRM  
LTMM  
PUSH  
POP  
24  
A¨M, L¨L + 1,Skip if L = 0  
A¨M, L¨L – 1,Skip if L = F  
M¨A, L¨L + 1,Skip if L = 0  
M¨A, L¨L – 1,Skip if L = F  
A¨M, H¨H n2  
25  
26  
27  
39-3B  
10mm  
11mm  
19mm  
3E59  
3E51  
3E5A  
3E52  
3E50  
1C  
A¨Md  
Md¨A  
Md(w)¨T (M(w), A), T = ROM table  
M(w)¨CT  
CT¨M(w)  
M(w)¨SR  
SR¨M(w)  
TM¨(M(w), A)  
ST¨C, A, H, L, SP¨SP – 4  
C, A, H, L, ¨ST SP¨SP + 4  
A´M  
1D  
X
28  
XM n2  
X+  
29-2B  
3C  
A´M, H¨H n2  
A´M, L¨L+1, Skip if L = 0  
A´M, L¨L–1, Skip if L = F  
A¨A + 1, Skip if A = 0  
A¨M + 1, Skip if M = 0  
L¨L + 1, Skip if L = 0  
X–  
2C  
INA  
30  
INM  
33  
INL  
31  
6/19  
¡ Semiconductor  
MSM6408  
INSTRUCTION LIST (continued)  
Mnemonic  
INH  
Code  
32  
Byte  
1
2
1
1
1
1
2
1
1
1
2
1
1
1
1
1
1
1
1
1
1
1
1
2
2
2
2
1
1
1
1
1
1
Cycle  
1
Description  
H¨H + 1, Skip if M = 0  
INMD mm  
DCA  
12mm  
34  
2
Md¨Md + 1, Skip if Md = 0  
A¨A – 1, Skip if A = F  
M¨M – 1, Skip if M = F  
L¨L – 1, Skip if L = F  
1
DCM  
DCL  
37  
1
35  
1
DCH  
36  
1
H¨H – 1, Skip if H = F  
Md¨Md – 1, Skip if Md = F  
A¨A + M, Skip if Cy = 1  
DCMD mm  
ADS  
13mm  
02  
2
1
ADCS  
ADC  
01  
1
A, C¨A + M + C, Skip if Cy =1  
A, C¨A + M + C  
A¨A + n, Skip if Cy = 1  
A¨A + 6  
03  
1
AIS n  
DAA  
3E4n  
06  
2
1
DAS  
0A  
1
A¨A + 10  
AND  
0D  
1
A¨A M  
OR  
05  
1
A¨A M  
EOR  
04  
1
A¨A M  
CMA  
0B  
1
A¨A  
CIA  
0C  
1
A¨A + 1  
RAL  
0E  
1
Rotate left with C  
Rotate right with C  
Skip if C = 1  
C¨1  
RAR  
0F  
1
TC  
09  
1
SC  
07  
1
RC  
08  
1
C¨0  
CAI n  
CLI n  
CPI p, n  
CMI n  
CAM  
3E0n  
3E2n  
17pn  
3E1n  
16  
2
Skip if A = n  
Skip if L = n  
2
2
Skip if Pp = n  
Skip if M = n  
Skip if A = M  
Skip if Abit (n2) = 1  
Abit (n2)¨0  
Abit (n2)¨1  
Skip if Mbit (n2) = 1  
Mbit (n2)¨0  
2
1
TAB n2  
RAB n2  
SAB n2  
TMB n2  
RMB n2  
54-57  
64-67  
74-77  
58-5B  
68-6B  
1
1
1
1
1
7/19  
¡ Semiconductor  
MSM6408  
INSTRUCTION LIST (continued)  
Mnemonic  
SMB n  
Code  
78-7B  
5C-5F  
6C-6F  
7C-7F  
50-53  
60-63  
70-73  
30 p0-3  
3D p4-7  
3D p8-B  
3E60  
Byte  
1
1
1
1
1
1
1
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
Cycle  
1
Description  
Mbit (n2)¨1  
TFB n2  
RFB n2  
SFB n2  
TPB n2  
RPB n2  
SPB n2  
TPBD pn2  
RPBD pn2  
SPBD pn2  
MEI  
1
Skip if Fbit (n2) = 1  
Fbit (n2)¨0  
1
1
Fbit (n2)¨1  
1
Skip if Pbit (n2) = 1  
Pbit (n2)¨0  
Pbit (n2)¨1  
Skip if Ppbit (n2) = 1  
Ppbit (n2) = 0  
Ppbit (n2) = 1  
MEIF¨1  
1
1
2
2
2
2
MDI  
3E61  
2
MEIF¨0  
EITB  
3DC9  
3DCA  
3DCB  
3DC8  
3DC5  
3DC6  
3DC7  
3DC4  
3DC1  
3DC2  
3DC3  
3DC0  
3D20  
3DD0  
3DD1  
3DD2  
3DD3  
3D24  
3DD4  
3DD5  
3DD6  
3DD7  
2
EITBF¨1  
EITM  
2
EITMF¨1  
EICT  
2
EICTF¨1  
EIEX  
2
EIEXF¨1  
DITB  
2
EITBF¨0  
DITM  
DICT  
2
EITMF¨0  
2
EICTF¨0  
DIEX  
2
EIEXF¨0  
TITB  
2
Skip if EITBF = 1  
Skip if EITMF = 1  
Skip if EICTF = 1  
Skip if EIEXF = 1  
Skip if IRQEX = 1  
Skip if IRQTB = 1  
Skip if IRQTM = 1  
Skip if IRQCT = 1  
Skip if IRQSR = 1  
IRQ EX¨0  
TITM  
2
TICT  
2
TIEX  
2
TQEX  
TQTB  
TQTM  
TQCT  
TQSR  
RQEX  
RQTB  
RQTM  
RQCT  
RQSR  
2
2
2
2
2
2
2
IRQ TB¨0  
2
IRQ TM¨0  
2
IRQ CT¨0  
2
IRQ SR¨0  
8/19  
¡ Semiconductor  
MSM6408  
INSTRUCTION LIST (continued)  
Mnemonic  
ECT  
Code  
3DBB  
3DBA  
3DB7  
3DB6  
3DB3  
3DB2  
C0-FF  
4a12  
3F  
Byte  
2
Cycle  
Description  
CTF¨1 (start)  
2
2
2
2
2
2
1
2
4
4
4
4
4
1
2
1
2
1
2
1
2
2
ESR  
2
SRF¨1 (start)  
CTF¨0 (stop)  
SRF¨0 (stop)  
Skip if CTF = 1  
Skip if SRF = 1  
PC¨a6  
DCT  
2
DSR  
TCT  
2
2
TSR  
2
JCP a6  
JP a12  
LJP a13  
CZP a  
CAL a12  
RT  
1
2
PC¨a12  
3
PC¨a13  
Ba  
1
ST¨PC + 1, PC¨2a, SP¨SP – 4  
Aa12  
IE  
2
ST¨PC + 2, PC¨a12, SP¨SP – 4  
1
PC¨ST, SP¨SP + 4  
RTS  
IF  
1
PC¨ST, SP¨SP + 4, Unconditional skip  
JA  
IA  
1
PC¨(PC¨A) + 1  
PC¨(M(w), A)  
A¨P  
JM  
IB  
1
IP  
20  
1
IPD p  
OP  
3DpD  
23  
2
A¨Pp  
1
P¨A  
OPD p  
NOP  
HALT  
STOP  
3DpC  
00  
2
Pp¨A  
1
No operation  
Halt CPU  
3DB8  
3DB9  
2
2
Stop clock  
Notes: a  
: ROM address data  
m : RAM address data  
n : Immediate data  
p : Port address data  
9/19  
¡ Semiconductor  
MSM6408  
ABSOLUTE MAXIMUM RATINGS  
Parameter  
Power Supply Voltage  
Input Voltage  
Symbol  
VDD  
Condition  
Rating  
–0.3 to +7  
–0.3 to VDD  
–0.3 to VDD  
200  
Unit  
V
VI  
Ta = 25°C  
V
Output Voltage  
VO  
V
Ta = 25°C per package  
Ta = 25°C per output  
mW  
mW  
°C  
Power Dissipation  
PD  
50  
Storage Temperature  
TSTG  
–55 to +150  
RECOMMENDED OPERATING CONDITIONS  
Parameter  
Symbol  
Condition  
fOSC £ 1 MHz  
fOSC £ 4.0 MHz  
Range  
3 to 6  
Unit  
V
Power Supply Voltage  
VDD  
4.5 to 5.5  
2 to 6  
V
Data-Hold Voltage  
VDDH  
Top  
fOSC = 0 Hz  
V
Operating Temperature  
–40 to +85  
15  
°C  
MOS load  
TTL load  
Fan Out  
N
1
10/19  
¡ Semiconductor  
MSM6408  
ELECTRICAL CHARACTERISTICS  
DC Characteristics  
(VDD = 5 V 10ꢀ, Ta = –40 to +85°C)  
Parameter  
"H" Input Voltage  
Symbol  
VIH  
Condition  
Min.  
2.4  
3.6  
–0.3  
4.2  
Typ.  
5
Max.  
VDD  
VDD  
+0.8  
Unit  
V
*1,*2  
*3,*4  
"H" Input Voltage  
"L" Input Voltage  
"H" Output Voltage  
"L" Output Voltage  
"L" Output Voltage  
Input Current  
VIH  
V
VIL  
V
*1,*5  
*1  
VOH  
VOL  
VOL  
IIH/IIL  
IIH/IIL  
IOH  
IO = –15 mA  
IO = 1.6 mA  
IO = 15 mA  
VI = VDD/0 V  
VI = VDD/0 V  
VO = 2.4 V  
VO = 0.4 V  
V
0.4  
V
*5  
0.4  
V
*3  
15/–15  
1/–30  
mA  
mA  
mA  
mA  
*2,*4  
*1  
Input Current  
"H" Output Current  
"H" Output Current  
Input Capacitance  
Output Capacitance  
Power Supply Current  
(In Stopped State)  
–0.1  
*1  
IOH  
–1.2  
CI  
f = 1 MHz, Ta = 25°C  
pF  
CO  
7
VDD = 2 V, no load, Ta = 25°C  
No load  
0.2  
1
5
mA  
mA  
IDDS  
IDD  
100  
Crystal oscillation  
f = 4 MHz, no load  
Power Supply Current  
6
12  
mA  
*1 Applied to P0, P1, P3, P4, P5, P6, P7 and P8  
*2 Applied to P2  
*3 Applied to OSC  
0
*4 Applied to RESET  
*5 Applied to OSC  
1
11/19  
¡ Semiconductor  
MSM6408  
AC Characteristics  
(VDD = 5 V 10ꢀ, Ta = –40 to +85°C)  
Parameter  
Clock (OSC0) Pulse Width  
Cycle Time  
Symbol  
tfW  
Condition  
Min.  
125  
1
Typ.  
Max.  
Unit  
ns  
tCY  
ms  
Input Data Setup Time  
Input Data Hold Time  
SR/TM Clock Pulse Width  
tDS  
120  
120  
120  
2/8 tCY  
+ 120  
120  
120  
120  
ns  
tDH  
ns  
tWS/tWT  
ns  
CT Clock Pulse Width  
tWC  
ns  
P2 Input Data Clock Pulse Width  
SR Data Setup Time  
SR Data Hold Time  
Data Delay Time  
tWP  
tSS  
tSH  
tDR  
ns  
ns  
ns  
ns  
CL = 15 pF  
tCY + 300  
7/8 tCY  
+ 300  
6/8 tCY  
+ 300  
7/8 tCY  
+ 300  
2/8 tCY  
+ 360  
Data Delay Time at Mode  
Switching  
tDCR  
tDI1  
tDI2  
CL = 15 pF  
CL = 15 pF  
CL = 15 pF  
CL = 15 pF  
CL = 15 pF  
CL = 15 pF  
CL = 15 pF  
CL = 15 pF  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
Data Delay Time at OPT  
Instruction  
Data Delay Time at OPT  
Instruction  
CT/TM Data Delay Time Using  
TBC Clock  
t
CT/tTT  
SR/tTR  
tCR  
SR/TM Data Delay Time Using  
PORT Clock  
t
tCY + 480  
CT Data Delay Time Using  
PORT Clock  
10/8 tCY  
+ 480  
CT Data Delay Time Using  
External Clock  
2/8 tCY  
+ 360  
tCP  
SR/TM Data Delay Time Using  
External Clock  
tSP/tTP  
360  
SR Clock Invalid Time  
INT Invalid Time  
tSINH  
tIINH  
2/8 tCY  
1/8 tCY  
ns  
ns  
12/19  
¡ Semiconductor  
MSM6408  
Timing Diagrams  
Output Conditions  
1MC  
OSC0  
0, 1, 3  
tCY  
P0, P1, P3  
P4, P5, P6 PA = 4, 5, 6  
P7, P8  
7 or 8  
tDR  
P0.1  
P0.2  
P1.1  
PA = 9 or A  
tDCR  
P4  
P5  
OPT INST.  
tDI1  
OPT INST.  
CT  
tDI2  
P0.1  
P1.1  
TBC clock  
TM  
tCT  
tTT  
P0.2 P0.1 clock*SR  
P1.1 P1.2 clock*TM  
tSR  
tTR  
P0.1 P1.0 clock*CT  
tCR  
P0.1  
EXT clock  
P1.0 P1.2 EXT clock  
P0.1 CT  
tCP  
P0.2 SR  
P1.1 TM  
tSP  
tTP  
*
Output data to port is clock for SR, TM or CT.  
13/19  
¡ Semiconductor  
MSM6408  
Input Conditions  
1MC  
OSC0  
tfW tfW  
P0, P1, P2  
P3, P4, P5  
P6, P7, P8  
INPUT  
DATA  
tDS tDH  
P0.1 SR clock  
P1.2 TM clock  
P2  
tDW1  
P1.0 CT clock  
tDW2  
P0.1 SR clock  
P0.3 SI  
INPUT  
DATA  
tSS tSH  
1MC  
OSC0  
tIINH  
tSINH  
t
t
: P0.1 (SR clock) INH period during LMSR INST.  
(Note: P0.1 is used for clock of SR.)  
: P2.0 (interrupt) INH period during RPB and RPBD INST.  
SINH  
IINH  
14/19  
¡ Semiconductor  
MSM6408  
Operating Characteristics  
Typ. Current (I ) vs Voltage (V ) for Low  
Typ. Current (I ) vs Voltage (V ) for High  
OL  
OL  
OH  
OH  
State Output  
State Output  
Ta = 25°C  
Ta = 25°C  
–1.0  
–0.9  
–0.8  
–0.7  
–0.6  
–0.5  
–0.4  
–0.3  
–0.2  
–0.1  
20  
18  
VDD = 5 V  
4 V  
6 V  
16  
14  
12  
10  
8
6
4
2
VDD = 6 V  
5 V  
4 V  
3 V  
3 V  
0
0
0
1
2
3
4
5
6
7
8
9 10  
0 1 2 3 4 5 6 7 8 9 10  
VOH (V)  
VOL (V)  
Typ. Maximum Oscillator Frequnecy (f  
)
Typ. Maximum Oscillator Frequnecy (f  
vs Temperature (Ta)  
)
OSC  
OSC  
vs Supply Voltage (V  
)
DD  
Ta = 25°C, C = 15 pF  
C = 15 pF  
L
L
10  
9
8
7
6
5
4
3
2
1
0
10  
9
8
7
6
5
4
3
2
1
0
VDD = 5 V  
0
1
2
3
4
5
6
7
8
9 10  
–40 –20 0 20 40 60 80 100 120  
Ta (°C)  
VDD (V)  
15/19  
¡ Semiconductor  
MSM6408  
Operating Characteristics (continued)  
Typ. Supply Current (I ) vs Supply Voltage (V  
)
DD  
DD  
Ta = 25°C, no load  
10 m  
fOSC = 4 MHz  
2 MHz  
1 MHz  
500 kHz  
100 kHz  
1 m  
100 m  
10 m  
0 Hz  
1 m  
100 n  
0
1
2
3
4
5 6 7 8 9 10  
V
DD (V)  
16/19  
¡ Semiconductor  
PACKAGE DIMENSIONS  
DIP42-P-600-2.54  
MSM6408  
(Unit : mm)  
Package material  
Lead frame material  
Pin treatment  
Solder plate thickness  
Package weight (g)  
Epoxy resin  
42 alloy  
Solder plating  
5 mm or more  
6.20 TYP.  
17/19  
¡ Semiconductor  
MSM6408  
(Unit : mm)  
QFP44-P-910-0.80-K  
Mirror finish  
Package material  
Lead frame material  
Pin treatment  
Solder plate thickness  
Package weight (g)  
Epoxy resin  
42 alloy  
Solder plating  
5 mm or more  
0.35 TYP.  
Notes for Mounting the Surface Mount Type Package  
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which  
are very susceptible to heat in reflow mounting and humidity absorbed in storage.  
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the  
product name, package name, pin number, package code and desired mounting conditions  
(reflow method, temperature and times).  
18/19  
¡ Semiconductor  
MSM6408  
(Unit : mm)  
QFP44-P-910-0.80-2K  
Mirror finish  
Package material  
Lead frame material  
Pin treatment  
Solder plate thickness  
Package weight (g)  
Epoxy resin  
42 alloy  
Solder plating  
5 mm or more  
0.41 TYP.  
Notes for Mounting the Surface Mount Type Package  
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which  
are very susceptible to heat in reflow mounting and humidity absorbed in storage.  
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the  
product name, package name, pin number, package code and desired mounting conditions  
(reflow method, temperature and times).  
19/19  

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