AFGHL30T65RQDN [ONSEMI]

IGBT - 650 V 30 A - Short circuit rated FS4  - Automotive qualified;
AFGHL30T65RQDN
型号: AFGHL30T65RQDN
厂家: ONSEMI    ONSEMI
描述:

IGBT - 650 V 30 A - Short circuit rated FS4  - Automotive qualified

双极性晶体管
文件: 总9页 (文件大小:326K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
DATA SHEET  
www.onsemi.com  
IGBT for Automotive  
Application  
650 V, 30 A  
30 A, 650 V,  
CE(Sat) = 1.57 V (Typ.)  
V
C
AFGHL30T65RQDN  
Using novel field stop IGBT technology, onsemi’s new series of  
FS4 IGBTs offer the optimum performance for automotive  
applications. This technology is Short circuit rated and offers high  
figure of merit with low conduction and switching losses.  
G
E
Features  
Maximum Junction Temperature: T = 175°C  
J
Positive Temperature Coefficient for Easy Parallel Operation  
High Current Capability  
Low Saturation Voltage: V  
= 1.57 V (Typ.) @ I = 30 A  
C
100% of the Parts Tested for I (Note 2)  
CE(Sat)  
LM  
TO2473L  
CASE 340CX  
High Input Impedance  
Fast Switching  
Tightened Parameter Distribution  
This Device is PbFree and RoHS Compliant  
MARKING DIAGRAM  
Typical Applications  
Ecompressor for HEV/EV, PTC heater for HEV/EV  
AYWWZZ  
AFGHL30  
T65RQDN  
MAXIMUM RATINGS  
Rating  
Symbol  
Value  
Unit  
CollectortoEmitter Voltage  
V
V
650  
V
V
CES  
GatetoEmitter Voltage  
Transient GatetoEmitter Voltage  
20  
30  
GES  
Collector Current (Note 1)  
I
C
A
@ T = 25°C  
42  
30  
C
A
= Assembly Site  
@ T = 100°C  
C
WW  
Y
= Work Week Number  
= Year of Production,  
Last Number  
Pulsed Collector Current (Note 2)  
Pulsed Collector Current (Note 3)  
Diode Forward Current (Note 1)  
I
120  
120  
A
A
A
LM  
I
CM  
ZZ  
= Assembly Lot Number  
I
F
@ T = 25°C  
42  
30  
AFGHL30T65RQDN= Specific Device Code  
C
@ T = 100°C  
C
Pulsed Diode Maximum Forward Current  
I
I
120  
A
A
FM  
NonRepetitive Forward Surge Current  
FM  
ORDERING INFORMATION  
(HalfSine Pulse, tp = 8.3 ms, T = 25°C)  
140  
100  
C
(HalfSine Pulse, tp = 8.3 ms, T = 150°C)  
C
Device  
Package  
Shipping  
Short Circuit Withstand Time  
t
ms  
SC  
V
= 15 V, V = 400 V, T = 150°C  
5
AFGHL30T65RQDN  
GE  
CC  
C
TO2473L 30 Units / Rail  
(PbFree)  
Maximum Power Dissipation  
P
W
D
@ T = 25°C  
230.8  
115.4  
C
@ T = 100°C  
C
Operating Junction/Storage Temperature Range  
T , T  
55 to  
°C  
°C  
J
STG  
+175  
Maximum Lead Temp. for Soldering Purposes,  
1/8from case for 5 seconds  
T
L
265  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
1. Value limited by bond wire.  
2. V = 600 V, V = 15 V, I = 90 A, R = 75 W, Inductive Load, 100% Tested.  
CC  
GE  
C
G
3. Repetitive Rating: pulse width limited by max. Junction temperature.  
© Semiconductor Components Industries, LLC, 2021  
1
Publication Order Number:  
November, 2021 Rev. 1  
AFGHL30T65RQDN/D  
 
AFGHL30T65RQDN  
THERMAL CHARACTERISTICS  
Rating  
Symbol  
Min  
Typ  
0.50  
0.92  
Max  
0.65  
1.19  
40  
Unit  
Thermal Resistance JunctiontoCase, for IGBT  
Thermal Resistance JunctiontoCase, for Diode  
Thermal Resistance JunctiontoAmbient  
R
°C/W  
q
JC  
R
q
JC  
R
q
JA  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
J
Parameter  
Test Conditions  
Symbol  
Min  
Typ  
Max  
Unit  
OFF CHARACTERISTICS  
Collectoremitter Breakdown Voltage,  
Gateemitter Shortcircuited  
V
V
= 0 V, I = 1 mA  
BV  
CES  
650  
V
GE  
C
Temperature Coefficient of  
Breakdown Voltage  
= 0 V, I = 1 mA  
0.58  
V/°C  
GE  
C
DBV  
CES  
DT  
J
Collectoremitter Cutoff Current,  
Gateemitter Shortcircuited  
V
= 0 V, V = V  
I
30  
mA  
GE  
CE  
CES  
CES  
Gate Leakage Current,  
Collectoremitter Shortcircuited  
V
GE  
= V  
, V = 0 V  
CE  
I
400  
nA  
GES  
GES  
ON CHARACTERISTICS  
Gateemitter Threshold Voltage  
Collectoremitter Saturation Voltage  
V
= V , I = 30 mA  
V
GE(th)  
4.30  
5.30  
6.30  
V
V
GE  
CE  
C
V
GE  
= 15 V, I = 30 A, T = 25°C  
= 15 V, I = 30 A, T = 175°C  
V
CE(sat)  
1.57  
1.88  
1.82  
GE  
C
J
V
C
J
DYNAMIC CHARACTERISTICS  
Input Capacitance  
V
= 30 V, V = 0 V, f = 1 MHz  
C
1570  
56  
7
pF  
CE  
GE  
ies  
Output Capacitance  
C
oes  
Reverse Transfer Capacitance  
Gate Resistance  
C
res  
f = 1 MHz  
R
15  
37  
11  
W
g
Gate Charge Total  
V
CC  
= 400 V, I = 30 A, V = 15 V  
Q
nC  
C
GE  
g
GateEmitter Charge  
GateCollector Charge  
Q
ge  
gc  
Q
10  
SWITCHING CHARACTERISTICS, INDUCTIVE LOAD  
Turnon Delay Time  
Rise Time  
T = 25°C, V = 400 V,  
t
d(on)  
18  
13  
ns  
J
I
CC  
= 15 A, R = 2.5 W,  
C
GE  
G
t
r
V
= 15 V, Inductive Load  
Turnoff Delay Time  
Fall Time  
t
68  
d(off)  
t
f
104  
0.34  
0.32  
0.65  
19  
Turnon Switching Loss  
Turnoff Switching Loss  
Total Switching Loss  
Turnon Delay Time  
Rise Time  
E
on  
E
off  
mJ  
ns  
E
ts  
T = 25°C, V = 400 V,  
t
t
J
C
GE  
CC  
G
d(on)  
I
= 30 A, R = 2.5 W,  
t
r
29  
V
= 15 V, Inductive Load  
Turnoff Delay Time  
Fall Time  
61  
d(off)  
t
f
78  
Turnon Switching Loss  
Turnoff Switching Loss  
Total Switching Loss  
E
on  
E
off  
0.79  
0.54  
1.30  
mJ  
E
ts  
www.onsemi.com  
2
AFGHL30T65RQDN  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted) (Continued)  
J
Parameter  
Test Conditions  
Symbol  
Min  
Typ  
Max  
Unit  
SWITCHING CHARACTERISTICS, INDUCTIVE LOAD  
Turnon Delay Time  
Rise Time  
T = 175°C, V = 400 V,  
t
t
18  
17  
ns  
J
I
CC  
d(on)  
= 15 A, R = 2.5 W,  
C
GE  
G
t
r
V
= 15 V, Inductive Load  
Turnoff Delay Time  
Fall Time  
83  
d(off)  
t
f
196  
0.53  
0.69  
1.22  
21  
Turnon Switching Loss  
Turnoff Switching Loss  
Total Switching Loss  
Turnon Delay Time  
Rise Time  
E
on  
E
off  
mJ  
ns  
E
ts  
T = 175°C, V = 400 V,  
t
t
J
C
GE  
CC  
G
d(on)  
I
= 30 A, R = 2.5 W,  
t
r
37  
V
= 15 V, Inductive Load  
Turnoff Delay Time  
Fall Time  
72  
d(off)  
t
f
164  
1.14  
1.09  
2.23  
Turnon Switching Loss  
Turnoff Switching Loss  
Total Switching Loss  
DIODE CHARACTERISTICS  
Diode Forward Voltage  
E
on  
E
off  
mJ  
V
E
ts  
I = 30 A, T = 25°C  
V
F
1.7  
2.10  
F
J
I = 30 A, T = 175°C  
1.74  
F
J
DIODE SWITCHING CHARACTERISTICS, INDUCTIVE LOAD  
Reverse Recovery Energy  
I = 30 A, dl /dt = 1000 A/ms  
E
rec  
46  
39  
mJ  
nS  
nC  
mJ  
F
F
V
= 400 V, T = 25°C  
R
J
Diode Reverse Recovery Time  
Diode Reverse Recovery Charge  
Reverse Recovery Energy  
T
rr  
Q
345  
205  
85  
rr  
I = 30 A, dl /dt = 1000 A/ms  
E
rec  
F
F
V
R
= 400 V, T = 175°C  
J
Diode Reverse Recovery Time  
Diode Reverse Recovery Charge  
T
rr  
nS  
nC  
Q
1002  
rr  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
www.onsemi.com  
3
AFGHL30T65RQDN  
TYPICAL CHARACTERISTICS  
120  
80  
120  
20 V  
20 V  
15 V  
15 V  
T = 175°C  
J
T = 25°C  
J
12 V  
10 V  
= 8 V  
80  
12 V  
10 V  
40  
0
40  
0
V
GE  
V
= 8 V  
GE  
0
1
2
3
4
5
0
1
2
3
4
5
6
7
V
CE  
, CollectorEmitter Voltage (V)  
V
CE  
, CollectorEmitter Voltage (V)  
Figure 1. Typical Output Characteristics  
Figure 2. Typical Output Characteristics  
120  
80  
40  
0
120  
80  
T = 25°C  
J
V
GE  
= 15 V  
Common Emitter  
V
CE  
= 20 V  
T = 25°C  
J
T = 175°C  
J
T = 175°C  
J
40  
0
0
1
2
3
4
5
6
7
0
2
4
6
8
10  
12  
14  
V
GE  
, GateEmitter Voltage (V)  
V
CE  
, CollectorEmitter Voltage (V)  
Figure 3. Typical Saturation Voltage  
Characteristics  
Figure 4. Typical Transfer Characteristics  
3.5  
3
100000  
10000  
1000  
100  
10  
Common Emitter  
= 15 V  
V
GE  
C
iss  
I
= 100 A  
C
2.5  
2
C
oss  
I
I
= 50 A  
= 25 A  
C
C
C
rss  
f = 1 MHz  
= 0 V  
T = 25°C  
J
1.5  
V
GE  
1
0.1  
1
100  
50  
0
50  
100  
150  
200  
0.1  
1
10 30  
T , CollectorEmitter Case Temperature (5C)  
C
V
CE  
, CollectortoEmitter Voltage (V)  
Figure 5. Saturation Voltage vs. Case Temperature  
at Variant Current Level  
Figure 6. Capacitance Characteristics  
www.onsemi.com  
4
AFGHL30T65RQDN  
TYPICAL CHARACTERISTICS (Continued)  
15  
12  
9
300  
V
= 200 V  
CC  
T = 25°C  
J
100  
300 V  
10 ms  
400 V  
100 ms  
DC  
10  
1
6
3
0
10 ms  
Notes:  
1. T = 25°C  
2. T = 175°C  
1 ms  
C
J
3. Single Pulse  
0.1  
1
10  
100  
1000  
0
0
0
10  
20  
30  
40  
50  
V
, CollectorEmitter Voltage (V)  
CE  
Q , Gate Charge (nC)  
g
Figure 7. Gate Charge Characteristics  
Figure 8. SOA Characteristics  
1000  
100  
10  
200  
100  
V
= 400 V, V = 15 V  
GE  
CC  
= 30 A  
I
C
T = 25°C  
J
t
r
T = 175°C  
J
t
d(off)  
t
d(on)  
V
= 400 V, V = 15 V  
GE  
I = 30 A  
T = 25°C  
T = 175°C  
CC  
t
f
10  
C
J
J
0
10  
20  
30  
40  
50  
10  
20  
30  
40  
50  
R , Gate Resistance (W)  
g
R , Gate Resistance (W)  
g
Figure 10. Turnoff Characteristics vs.  
Figure 9. Turnon Characteristics vs.  
Gate Resistance  
Gate Resistance  
500  
100  
200  
100  
V
CC  
= 400 V, V = 15 V  
GE  
I
= 30 A  
C
t
r
T = 25°C  
J
T = 175°C  
J
t
f
t
d(on)  
V
CC  
= 400 V, V = 15 V  
GE  
R = 2.5 W  
T = 25°C  
T = 175°C  
t
d(off)  
g
J
J
10  
10  
20  
40  
60  
80  
0
20  
40  
60  
80  
I , Collector Current (A)  
C
I , Collector Current (A)  
C
Figure 11. Turnon Characteristics vs.  
Figure 12. Turnoff Characteristics vs.  
Collector Current  
Collector Current  
www.onsemi.com  
5
AFGHL30T65RQDN  
TYPICAL CHARACTERISTICS (Continued)  
100  
10  
V
= 400 V, V = 15 V  
GE  
= 30 A  
V
= 400 V, V = 15 V, I = 30 A  
CC  
CC  
GE  
C
I
C
T = 25°C  
J
T = 25°C  
T = 175°C  
J
J
E
on  
T = 175°C  
J
10  
1
E
on  
1
E
off  
E
off  
0.1  
0.1  
0
10  
20  
30  
40  
50  
0
20  
40  
60  
80  
R , Gate Resistance (W)  
g
I , Collector Current (A)  
C
Figure 13. Switching Loss vs. Gate Resistance  
Figure 14. Switching Loss vs. Collector Current  
120  
90  
60  
30  
0
40  
30  
20  
10  
0
T = 25°C  
T = 175°C  
J
T = 25°C  
J
T = 175°C  
J
J
100  
300  
500  
700  
900  
1100 1300 1500  
0
1
2
3
4
V , Forward Voltage (V)  
F
dI /dt, Diode Current Slope (A/ms)  
F
Figure 16. Reverse Recovery Current  
Figure 15. Forward Characteristics  
2
1
0
200  
150  
100  
50  
T = 25°C  
T = 175°C  
J
T = 25°C  
T = 175°C  
J
J
J
0
100  
100  
300  
500  
700  
900  
1100 1300 1500  
300  
500  
700  
900 1100 1300 1500  
dI /dt, Diode Current Slope (A/ms)  
F
dI /dt, Diode Current Slope (A/ms)  
F
Figure 17. Reverse Recovery Time  
Figure 18. Stored Charge  
www.onsemi.com  
6
AFGHL30T65RQDN  
TYPICAL CHARACTERISTICS (Continued)  
10  
1
0.5  
0.2  
0.1  
0.1  
R
R
2
1
P
DM  
t
0.05  
0.02  
0.01  
Single Pulse  
1
C = t / R  
C = t / R  
2 2 2  
1
1
1
0.01  
0.001  
t
2
i:  
ri[K/W]: 0.1438  
t[s]: 1.75E04  
1
2
3
Duty Factor, D = t / t  
0.1883  
1.38E03 8.61E03  
0.158  
1
× Z  
2
Peak T = P  
+ T  
q
J
DM  
JC C  
5  
4  
3  
2  
1  
0
1
10  
10  
10  
10  
Rectangular Pulse Duration (s)  
10  
10  
10  
Figure 19. Transient Thermal Impedance of IGBT  
10  
1
0.5  
P
DM  
0.2  
0.1  
t
1
0.1  
t
2
Duty Factor, D = t / t  
0.05  
1
2
Peak T = P  
× Z  
+ T  
q
J
DM  
JC C  
0.02  
0.01  
Single Pulse  
R
R
2
0.01  
1
i:  
ri[K/W]: 0.0720  
t[s]: 1.82E05  
1
2
3
4
0.3081  
4.22E04 3.49E03  
0.321  
0.2392  
2.37E02  
C = t / R  
C = t / R  
2 2 2  
1
1
1
0.001  
5  
4  
3  
2  
1  
0
1
10  
10  
10  
10  
10  
10  
10  
Rectangular Pulse Duration (s)  
Figure 20. Transient Thermal Impedance of Diode  
www.onsemi.com  
7
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
TO2473LD  
CASE 340CX  
ISSUE A  
DATE 06 JUL 2020  
GENERIC  
MARKING DIAGRAM*  
XXXXX = Specific Device Code  
A
Y
= Assembly Location  
= Year  
WW  
G
= Work Week  
= PbFree Package  
XXXXXXXXX  
AYWWG  
*This information is generic. Please refer to  
device data sheet for actual part marking.  
PbFree indicator, “G” or microdot “ G”, may  
or may not be present. Some products may  
not follow the Generic Marking.  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON93302G  
TO2473LD  
PAGE 1 OF 1  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding  
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically  
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the  
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© Semiconductor Components Industries, LLC, 2018  
www.onsemi.com  
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, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates  
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