CSPEMI202FCTAG [ONSEMI]
EMI Filter with ESD Protection, Headset Microphone;
| 型号： | CSPEMI202FCTAG |
| 厂家： | 
ONSEMI |
| 描述： | EMI Filter with ESD Protection, Headset Microphone LTE 数据线路滤波器 过滤器 |
| 文件： | 总9页 (文件大小：226K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
2 Channel Headset Microphone
EMI Filter with ESD Protection
CSPEMI202AG
Features
Product Description
•
•
Two channels of EMI filtering
Pi-style EMI filters in a capacitor-resistor-
capacitor (C-R-C) network
The CSPEMI202AG is a dual low-pass filter array
integrating two pi-style filters (C-R-C) that reduce
EMI/RFI emissions while at the same time providing
ESD protection. This part is custom-designed to
interface with a microphone port on a cellular
telephone or similar device. Each high quality filter
provides more than 35dB attenuation in the 800-2700
MHz range. These pi-style filters support bidirectional
•
•
Greater than 40dB attenuation at 1GHz
8kV ESD protection on each channel
(IEC 61000-4-2 Level 4, contact discharge)
15kV ESD protection on each channel (HBM)
Supports bipolar signals—ideal for
audio applications
Chip Scale Package features extremely low
lead inductance for optimum filter and ESD
performance
•
•
•
filtering, controlling EMI both to and from
a
microphone element. They also support bipolar
signals, enabling audio signals to pass through
without distortion.
•
•
5-bump, 0.930mm X 1.410mm footprint
Chip Scale Package (CSP)
RoHS compliant (lead-free) finishing
In addition, the CSPEMI202AG provides a very high
level of protection for sensitive electronic components
that may be subjected to electrostatic discharge
(ESD). The diodes safely dissipate ESD strikes of
8kV, the maximum requirement of the IEC 61000-4-
2 international standard. Using the MIL-STD-883
(Method 3015) specification for Human Body Model
(HBM) ESD, the device provides protection for
contact discharges to greater than 15kV.
Applications
•
EMI filtering and ESD protection for headset
microphone ports
•
•
•
•
•
•
Wireless Handsets
Handheld PCs / PDAs
MP3 Players
Digital Camcorders
Notebooks
The CSPEMI202AG is particularly well-suited for
portable electronics (e.g., cellular telephones, PDAs,
notebook computers) because of its small package
format and low weight. The CSPEMI202AG is
available in a space-saving, low-profile Chip Scale
Package with RoHS compliant lead-free finishing.
Desktop PCs
©2010 SCILLC. All rights reserved.
April 2010 Rev. 3
Publication Order Number:
CSPEMI202AG/D
CSPEMI202AG
Rev. 3 | Page 2 of 9 | www.onsemi.com
CSPEMI202AG
PIN DESCRIPTIONS
PIN
NAME
DESCRIPTION
A1
MIC_IN1
MIC_IN2
GND
Microphone Input 1 (from microphone)
Microphone Input 2 (from microphone)
Device Ground
A3
B2
C1
C3
MIC_OUT1
MIC_OUT2
Microphone Output 1 (to audio circuitry)
Microphone Output 2 (to audio circuitry)
Ordering Information
PART NUMBERING INFORMATION
Bumps
Package
Ordering Part Number1
Part Marking
5
CSP
CSPEMI202AGG
AD
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Rev. 3 | Page 3 of 9 | www.onsemi.com
CSPEMI202AG
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER
RATING
UNITS
Storage Temperature Range
-65 to +150
100
°C
DC Power per Resistor
mW
mW
DC Package Power Rating
200
STANDARD OPERATING CONDITIONS
PARAMETER
RATING
UNITS
Operating Temperature Range
-40 to +85
°C
Rev. 3 | Page 4 of 9 | www.onsemi.com
CSPEMI202AG
ELECTRICAL OPERATING CHARACTERISTICS1
SYMBOL PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
R1
C1
Resistance
61
68
75
Ω
Capacitance
38
47
56
pF
ILEAK
VSIG
Diode Leakage Current
VIN=5.0V
1.0
μA
Signal Voltage
Positive Clamp
Negative Clamp
ILOAD = 10mA
5
-15
7
-10
15
-5
V
V
VESD
In-system ESD Withstand Voltage
a) Human Body Model, MIL-STD-883,
Method 3015
Note 2
kV
kV
15
8
b) Contact Discharge per IEC 61000-4-2
Level 4
VCL
Clamping Voltage during ESD Discharge
MIL-STD-883 (Method 3015), 8kV
Positive Transients
Notes 2 and 3
+15
-19
V
V
Negative Transients
fC
Cut-off frequency
R = 68Ω, C = 47pF
60
MHz
Z
SOURCE = 50Ω, ZLOAD = 50Ω
Note 1: TA=25°C unless otherwise specified.
Note 2: ESD applied to input and output pins with respect to GND, one at a time.
Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin
A1, then clamping voltage is measured at Pin C1.
Rev. 3 | Page 5 of 9 | www.onsemi.com
CSPEMI202AG
Performance Information
Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment)
Figure 1. Insertion Loss VS. Frequency (A1-C1 to GND B2)
Figure 2. Insertion Loss VS. Frequency (A3-C3 to GND B2)
Application Information
Rev. 3 | Page 6 of 9 | www.onsemi.com
CSPEMI202AG
PARAMETER
VALUE
Pad Size on PCB
0.240mm
Round
Pad Shape
Pad Definition
Non-Solder Mask defined pads
0.290mm Round
Solder Mask Opening
Solder Stencil Thickness
0.125mm - 0.150mm
0.300mm Round
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Flux Ratio
Solder Paste Type
50/50 by volume
No Clean
Pad Protective Finish
OSP (Entek Cu Plus 106A)
Tolerance — Edge To Corner Ball
+50μm
Solder Ball Side Coplanarity
+20μm
60 seconds
260°C
Maximum Dwell Time Above Liquidous
Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder
Paste
Non-Solder Mask Defined Pad
0.240mm DIA.
Solder Stencil Opening
0.300mm DIA.
Solder Mask Opening
0.290mm DIA.
Figure 8. Recommended Non-Solder Mask Defined Pad Illustration
Figure 9. Lead-free (SnAgCu) Solder Ball Reflow Profile
Rev. 3 | Page 7 of 9 | www.onsemi.com
CSPEMI202AG
Mechanical Details
CSP Mechanical Specifications
The CSPEMI202AG is available in a custom Chip Scale Package (CSP). Dimensions are presented below. For
complete information on CMD’s Chip Scale Packaging, see the California Micro Devices CSP Package
Information document.
PACKAGE DIMENSIONS
BOTTOM VIEW
Custom CSP
5
Package
Bumps
A1
SIDE
VIEW
C1
B2
B1
Millimeters
Min Nom Max
Inches
Nom
C
B
A
Dim
Min
Max
0.885 0.930 0.975 0.0348 0.0366 0.0384
1.365 1.410 1.455 0.0537 0.0555 0.0573
0.495 0.500 0.505 0.0195 0.0197 0.0199
0.245 0.250 0.255 0.0096 0.0098 0.0100
0.430 0.435 0.440 0.0169 0.0171 0.0173
0.430 0.435 0.440 0.0169 0.0171 0.0173
0.165 0.215 0.265 0.0065 0.0085 0.0104
0.220 0.270 0.320 0.0087 0.0106 0.0126
0.562 0.606 0.650 0.0221 0.0239 0.0256
0.356 0.381 0.406 0.0140 0.0150 0.0160
A1
A2
B1
B2
B3
B4
C1
C2
D1
D2
1
2 3
D1
D2
0.30 DIA.
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
DIMENSIONS IN MILLIMETERS
Package Dimensions for
CSPEMI202AG Chip Scale Package
3500 pieces
# per tape and
reel
Controlling dimension: millimeters
Rev. 3 | Page 8 of 9 | www.onsemi.com
CSPEMI202AG
CSP Tape and Reel Specifications
POCKET SIZE (mm) TAPE WIDTH
REEL
DIAMETER
QTY PER
REEL
PART NUMBER
CHIP SIZE (mm)
B0 X A0 X K0
W
P0
P1
CSPEMI202AG 1.41 X 0.93 X 0.606
1.52 X 1.07 X 0.72
8mm
178mm (7")
3500
4mm 4mm
+
+
+
Figure 5. Tape and Reel Mechanical Data
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any
products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising
out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical”
parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating
parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the
rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to
support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or
use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors
harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such
unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action
Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
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Rev. 3 | Page 9 of 9 | www.onsemi.com
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