ESDR0524PMUTAG [ONSEMI]
Transient Voltage Suppressors Low Capacitance ESD Protection for High Speed Data; 瞬态电压抑制器低电容ESD保护高速数据
| 型号： | ESDR0524PMUTAG |
| 厂家： | 
ONSEMI |
| 描述： | Transient Voltage Suppressors Low Capacitance ESD Protection for High Speed Data |
| 文件： | 总3页 (文件大小：95K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ESDR0524PMUTAG
Transient Voltage
Suppressors
Low Capacitance ESD Protection for
High Speed Data
http://onsemi.com
The ESDR0524P transient voltage suppressor is designed to protect
high speed data lines from ESD. Ultra−low capacitance and low ESD
clamping voltage make this device an ideal solution for protecting
voltage sensitive high speed data lines. The flow−through style
package allows for easy PCB layout and matched trace lengths
necessary to maintain consistent impedance between high speed
differential lines such as HDMI.
MARKING
DIAGRAM
UDFN10
CASE 517BB
4P MG
G
4P
M
G
= Specific Device Code
= Date Code
= Pb−Free Package
Features
• Low Capacitance (0.3 pF Typical, I/O to I/O)
• ESD Rating of Class 3B (Exceeding 8 kV) per Human Body model
and Class C (Exceeding 400 V) per Machine Model
• Protection for the Following IEC Standards:
IEC 61000−4−2 (±8 kV Contact)
(Note: Microdot may be in either location)
PIN CONFIGURATION
AND SCHEMATIC
• UL Flammability Rating of 94 V−0
N/C N/C GND N/C N/C
• This is a Pb−Free Device
10
9
8
7
6
Typical Applications
• HDMI
1
2
3
4
5
• DVI
• Display Port
• MDDI
I/O I/O GND I/O I/O
• eSATA
Pin 1
Pin 2
Pin 4
Pin 5
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
J
Rating
Symbol
Value
−55 to +125
−55 to +150
260
Unit
°C
Operating Junction Temperature Range
Storage Temperature Range
T
J
Pin 3,8
T
stg
°C
Lead Solder Temperature −
Maximum (10 Seconds)
T
L
°C
ORDERING INFORMATION
IEC 61000−4−2 Contact (ESD)
IEC 61000−4−2 Air (ESD)
ESD
ESD
±8.0
±15
kV
kV
Device
Package
Shipping
ESDR0524PMUTAG
UDFN10
(Pb−Free)
3000 /
Tape & Reel
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
See Application Note AND8308/D for further description of
survivability specs.
© Semiconductor Components Industries, LLC, 2010
1
Publication Order Number:
July, 2010 − Rev. 1
ESDR0524P/D
ESDR0524PMUTAG
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise specified)
A
Parameter
Reverse Working Voltage
Breakdown Voltage
Symbol
Conditions
I/O Pin to GND (Note 1)
I = 1 mA, I/O Pin to GND
Min
Typ
Max
Unit
V
V
RWM
5.0
V
BR
6.0
V
T
Reverse Leakage Current
Clamping Voltage
I
V
= 5 V, I/O Pin to GND
1.0
15
mA
V
R
RWM
V
I
PP
= 1 A, I/O Pin to GND (8 x 20 ms pulse)
= 0 V, f = 1 MHz between I/O Pins
C
Junction Capacitance
Junction Capacitance
C
C
V
R
V
R
0.3
0.5
0.4
0.8
pF
pF
J
J
= 0 V, f = 1 MHz between I/O Pins and GND
1. TVS devices are normally selected according to the working peak reverse voltage (V
or continuous peak operating voltage level.
), which should be equal or greater than the DC
RWM
http://onsemi.com
2
ESDR0524PMUTAG
PACKAGE DIMENSIONS
UDFN10 2.5x1, 0.5P
CASE 517BB−01
ISSUE O
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30mm FROM TERMINAL.
L
L
D
B
E
A
L1
PIN ONE
REFERENCE
DETAIL A
OPTIONAL
CONSTRUCTIONS
MILLIMETERS
2X
0.10 C
DIM
A
MIN
0.45
0.00
MAX
0.55
0.05
A1
A3
b
2X
0.10
C
MOLD CMPD
TOP VIEW
EXPOSED Cu
0.13 REF
0.15
0.35
0.25
0.45
b2
D
DETAIL B
2.50 BSC
A3
A
A3
E
1.00 BSC
0.50 BSC
0.10
0.08
C
C
e
L
0.30
---
0.40
0.05
A1
L1
DETAIL B
10X
A1
OPTIONAL
SEATING
PLANE
CONSTRUCTION
C
SIDE VIEW
RECOMMENDED
SOLDERING FOOTPRINT*
2X b2
10X
L
10X
0.50
DETAIL A
2X
0.45
5
1
10
6
1.30
e
8X b
PACKAGE
OUTLINE
0.10
0.05
C
C
A
B
8X
0.25
NOTE 3
0.50
PITCH
BOTTOM VIEW
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
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PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
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USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
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Phone: 81−3−5773−3850
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
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P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
For additional information, please contact your local
Sales Representative
ESDR0524P/D
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