FCA36N60NF [ONSEMI]

功率 MOSFET,N 沟道,SUPREMOS®,FRFET®, 600 V,34.9 A,95 mΩ,TO-3P;
FCA36N60NF
型号: FCA36N60NF
厂家: ONSEMI    ONSEMI
描述:

功率 MOSFET,N 沟道,SUPREMOS®,FRFET®, 600 V,34.9 A,95 mΩ,TO-3P

局域网 开关 脉冲 晶体管
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2014 2 月  
FCA36N60NF  
N 沟道 SupreMOS FRFET MOSFET  
600 V34.9 A95 m  
®
®
特性  
说明  
SupreMOS® MOSFET 是飞兆半导体的下一代高压超级结(SJ)  
技术,该技术采用区别于传统 SJ MOSFET 产品的深沟槽填充工  
艺。项先进技术和精密的工艺控制提供了最低的 Rsp on-  
resistance (导 通 电 阻 规 格) ,卓 越 的 开 关 性 能 和 耐 用 性。  
SupreMOS MOSFET 技术适用于高频开关电源转换器应用,如  
功率因数校正 (PFC)、服务器 / 电信电源、平板电视电源、 ATX  
电源及工业电源应用。 SupreMOS FRFET® MOSFET 优化版的  
本体二极管的反向恢复性能可去除额外元件并提高系统可靠性。  
RDS(on) = 80 m(Typ.)@VGS = 10V, ID = 18 A  
超低栅极电荷 (典型值 Qg = 86 nC)  
低有效输出电容 (典型值 Coss(eff.)= 338 pF)  
100% 经过雪崩测试  
符合 RoHS 标准  
应用  
太阳能逆变器  
AC-DC 电源  
D
G
G
D
TO-3PN  
S
S
MOSFET 最大额定值 TC = 25°C 除非另有说明  
FCA36N60NF  
600  
符号  
VDSS  
VGSS  
参数  
单位  
V
漏极-源极电压  
栅极-源极电压  
±30  
V
34.9  
22  
连续 (TC = 25°C)  
连续 (TC = 100°C)  
脉冲  
ID  
A
漏极电流  
IDM  
EAS  
IAR  
104.7  
1800  
12  
A
mJ  
A
漏极电流  
(说明 1)  
(说明 2)  
(说明 1)  
(说明 1)  
单脉冲雪崩能量  
雪崩电流  
EAR  
3.12  
100  
mJ  
重复雪崩能量  
MOSFET dv/dt  
dv/dt  
PD  
V/ns  
50  
二极管恢复 dv/dt 峰值  
(说明 3)  
(TC = 25°C)  
312  
W
W/°C  
°C  
功耗  
2.6  
降低至 25°C 以上  
TJ, TSTG  
TL  
工作和存储温度范围  
-55 +150  
用于焊接的最高引脚温度,  
距离外壳 1/8”,持续 5 秒  
300  
°C  
热性能  
FCA36N60NF  
符号  
RJC  
参数  
单位  
结至外壳热阻最大值  
0.40  
0.24  
40  
RCS  
外壳与散热体之间的热阻典型值  
结至环境热阻最大值  
°C/W  
RJA  
www.fairchildsemi.com  
©2011 飞兆半导体公司  
1
FCA36N60NF Rev. C1  
封装标识与定购信息  
器件编号  
顶标  
封装  
包装方法  
塑料管  
卷尺寸  
不适用  
带宽  
数量  
FCA36N60NF  
FCA36N60NF  
TO-3PN  
不适用  
30 单元  
电气特性  
符号  
参数  
测试条件  
最小值 典型值 最大值  
单位  
关断特性  
BVDSS  
ID = 1 mAVGS = 0 VTJ = 25°C  
D = 1 mA,参考条件为 25°C  
VDS = 480 VVGS = 0 V  
TJ = 125°C  
600  
-
-
-
-
V
漏极 - 源极击穿电压  
BVDSS  
/ TJ  
击穿电压温度系数  
I
0.60  
V/°C  
-
-
-
-
-
-
10  
IDSS  
IGSS  
A  
零栅极电压漏极电流  
100  
VGS = ±30 VVDS = 0 V  
±100  
nA  
栅极 - 体漏电流  
导通特性  
VGS(th)  
RDS(on)  
gFS  
VGS = VDSID = 250 A  
VGS = 10 VID = 18 A  
VDS = 20 VID = 18 A  
3.0  
3.7  
80  
39  
5.0  
95  
-
V
m  
S
栅极阈值电压  
-
-
漏极至源极静态导通电阻  
正向跨导  
动态特性  
Ciss  
-
-
-
-
-
-
-
-
-
3191  
145  
5
4245  
pF  
pF  
pF  
pF  
pF  
nC  
nC  
nC  
输入电容  
VDS = 100 VVGS = 0 V,  
f = 1 MHz  
Coss  
195  
输出电容  
Crss  
8
反向传输电容  
Coss  
VDS = 380 VVGS = 0 Vf = 1 MHz  
VDS = 0 V480 VVGS = 0 V  
81  
-
输出电容  
Cosseff.  
Qg(tot)  
Qgs  
338  
86  
-
有效输出电容  
112  
10 V 的栅极电荷总量  
栅极 - 源极栅极电荷  
栅极 - 漏极 米勒 电荷  
等效串联电阻 (G-S)  
VDS = 380 VID = 18 A,  
16  
-
-
-
V
GS = 10 V  
(说明 4)  
Qgd  
36  
ESR  
f = 1 MHz  
1.2  
开关特性  
td(on)  
tr  
td(off)  
tf  
-
-
-
-
27  
17  
92  
4
64  
44  
ns  
ns  
ns  
ns  
导通延迟时间  
开通上升时间  
关断延迟时间  
关断下降时间  
VDD = 380 VID = 18 A,  
V
GS = 10 VRG = 4.7   
194  
18  
(说明 4)  
漏极 - 源极二极管特性  
IS  
-
-
-
-
-
-
-
36  
108  
1.2  
-
A
A
漏极 - 源极二极管最大正向连续电流  
漏极 - 源极二极管最大正向脉冲电流  
漏极 - 源极二极管正向电压  
反向恢复时间  
ISM  
VSD  
trr  
VGS = 0 VISD = 18 A  
-
V
166  
1.3  
ns  
C  
VGS = 0 VISD = 18 A,  
dIF/dt = 100 A/s  
Qrr  
-
反向恢复电荷  
注意:  
1. 重复额定值:脉冲宽度受限于最大结温。  
2. I = 12 AR = 25 ,启动 T = 25°C。  
AS  
G
J
3. I 36 Adi/dt 1200 A/sV = 380 V,启动 T = 25°C。  
SD  
DD  
J
4. 本质上独立于工作温度的典型特性。  
www.fairchildsemi.com  
©2011 飞兆半导体公司  
2
FCA36N60NF Rev. C1  
典型性能特征  
1. 通态区域特性  
2. 传输特性  
200  
200  
VGS = 15.0 V  
10.0 V  
8.0 V  
100  
100  
7.0 V  
6.0 V  
5.0 V  
10  
25oC  
150oC  
*Notes:  
1. 250s Pulse Test  
10  
2. TC = 25oC  
-55oC  
1
*Notes:  
1. VDS = 20V  
2. 250s Pulse Test  
1
0.1  
0.2  
1
10  
20  
2
4
6
8
10  
VDS, Drain-Source Voltage[V]  
VGS, Gate-Source Voltage[V]  
3. 导通电阻变化 vs. 漏极电流和栅极电压  
4. 体二极管正向电压变化与源极电流和温度  
150  
200  
100  
125  
10  
VGS = 10V  
150oC  
100  
25oC  
VGS = 20V  
75  
1
*Notes:  
1. VGS = 0V  
*Notes: TC = 25oC  
2. 250s Pulse Test  
0.2  
0.2  
50  
0.4  
0.6  
0.8  
1.0  
1.2  
1.4  
0
18  
36  
54  
72  
90  
108  
VSD, Body Diode Forward Voltage [V]  
ID, Drain Current [A]  
5. 电容特性  
6. 栅极电荷特性  
10  
100000  
10000  
1000  
100  
10  
8
Ciss  
VDS = 120V  
VDS = 300V  
VDS = 480V  
6
4
2
0
Coss  
*Notes:  
1. VGS = 0V  
2. f = 1MHz  
Crss  
C
C
C
= C + C (C = shorted)  
gs gd ds  
iss  
= C + C  
ds gd  
oss  
rss  
= C  
gd  
*Notes: ID = 18A  
80  
1
0.1  
1
10  
100  
600  
0
20  
40  
60  
100  
VDS, Drain-Source Voltage [V]  
Qg, Total Gate Charge [nC]  
www.fairchildsemi.com  
©2011 飞兆半导体公司  
3
FCA36N60NF Rev. C1  
典型性能特征 (接上页)  
7. 击穿电压变化与温度  
8. 导通电阻变化与温度  
3.0  
1.2  
1.1  
1.0  
0.9  
0.8  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
*Notes:  
1. VGS = 0V  
*Notes:  
1. VGS = 10V  
2. ID = 1mA  
2. ID = 18A  
-100  
-50  
0
50  
100  
150  
-100  
-50  
0
50  
100  
150  
o
o
TJ, Junction Temperature [ C]  
TJ, Junction Temperature [ C]  
9. 最大安全工作区  
10. 最大漏极电流与外壳温度  
500  
100  
40  
10s  
30  
20  
10  
0
100s  
1ms  
10ms  
10  
Operation in This Area  
is Limited by R DS(on)  
DC  
1
*Notes:  
1. TC = 25oC  
2. TJ = 150oC  
0.1  
3. Single Pulse  
0.01  
25  
50  
75  
100  
125  
150  
1
10  
100  
1000  
o
TC, Case Temperature [ C]  
VDS, Drain-Source Voltage [V]  
11. 瞬态热响应曲线  
1
0.5  
0.1  
0.2  
0.1  
PDM  
0.05  
0.02  
t1  
t2  
0.01  
0.01  
*Notes:  
Single pulse  
1. ZJC(t) = 0.40oC/W Max.  
2. Duty Factor, D= t1/t2  
3. TJM - TC = PDM * ZJC(t)  
0.005  
10-5  
10-4  
10-3  
10-2  
10-1  
100  
101  
102  
t
1形脉冲持续时间 [ ]  
www.fairchildsemi.com  
©2011 飞兆半导体公司  
4
FCA36N60NF Rev. C1  
I
= 常量  
G
12. 栅极电荷测试电路与波形  
RL  
VDS  
90%  
VDS  
VDD  
VGS  
RG  
10%  
VGS  
DUT  
V
GS  
td(on)  
tr  
td(off)  
tf  
t on  
t off  
13. 阻性开关测试电路与波形  
VGS  
14. 非箝位感性开关测试电路与波形  
www.fairchildsemi.com  
©2011 飞兆半导体公司  
5
FCA36N60NF Rev. C1  
+
DUT  
VDS  
_
I SD  
L
Driver  
RG  
Same Type  
as DUT  
VDD  
VGS  
• dv/dt controlled by RG  
• ISD controlled by pulse period  
Gate Pulse Width  
--------------------------  
VGS  
D =  
Gate Pulse Period  
10V  
( Driver )  
IFM , Body Diode Forward Current  
I SD  
di/dt  
( DUT )  
IRM  
Body Diode Reverse Current  
Body Diode Recovery dv/dt  
VSD  
VDS  
( DUT )  
VDD  
Body Diode  
Forward Voltage Drop  
15. 峰值二极管恢复 dv/dt 测试电路与波形  
www.fairchildsemi.com  
©2011 飞兆半导体公司  
6
FCA36N60NF Rev. C1  
5.00  
4.60  
13.80  
13.40  
1.65  
1.45  
3.30  
3.10  
16.20  
15.40  
5.20  
4.80  
R0.50  
3°  
16.96  
16.56  
20.10  
19.70  
18.90  
18.50  
7.20  
6.80  
3°  
4°  
1
3
2.00  
1.60  
3.70  
3.30  
1.85  
2.60  
2.20  
20.30  
19.70  
2.20  
1.80  
3.20  
2.80  
1.20  
0.80  
M
0.55  
0.75  
0.55  
5.45  
5.45  
NOTES: UNLESS OTHERW ISE SPECIFIED  
A) THIS PACKAGE CONFORMS TO EIAJ  
SC-65 PACKAGING STANDARD.  
B) ALL DIMENSIONS ARE IN MILLIMETERS.  
C) DIMENSION AND TOLERANCING PER  
ASME14.5-2009.  
D) DIMENSIONS ARE EXCLUSSIVE OF BURRS,  
MOLD FLASH, AND TIE BAR EXTRUSSIONS.  
E) DRAW ING FILE NAME: TO3PN03AREV2.  
F) FAIRCHILD SEMICONDUCTOR.  
R0.50  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent  
coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.  
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,  
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or  
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer  
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not  
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification  
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized  
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and  
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such  
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This  
literature is subject to all applicable copyright laws and is not for resale in any manner.  
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