FDB8444 [ONSEMI]
N 沟道，PowerTrench® MOSFET，40V，70A，5.5mΩ;
| 型号： | FDB8444 |
| 厂家： | 
ONSEMI |
| 描述： | N 沟道，PowerTrench® MOSFET，40V，70A，5.5mΩ 开关 晶体管 |
| 文件： | 总9页 (文件大小：389K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s
technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA
Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended
or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out
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is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
February 2006
FDB8444
®
N-Channel PowerTrench MOSFET
40V, 70A, 5.5mΩ
Features
Applications
Automotive Engine Control
Typ rDS(on) = 3.9mΩ at VGS = 10V, ID = 70A
Powertrain Management
Solenoid and Motor Drivers
Electronic Transmission
Typ Qg(TOT) = 91nC at VGS = 10V
Low Miller Charge
Low Qrr Body Diode
Distributed Power Architecture and VRMs
Primary Switch for 12V Systems
UIS Capability (Single Pulse and Repetitive Pulse)
Qualified to AEC Q101
RoHS Compliant
D
GATE
G
DRAIN
SOURCE
(FLANGE)
TO-263AB
S
FDB SERIES
©2006 Fairchild Semiconductor Corporation
FDB8444 Rev A2 (W)
1
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Absolute Maximum Ratings TC = 25°C unless otherwise noted
Symbol
VDSS
VGS
Parameter
Ratings
40
Units
Drain to Source Voltage
Gate to Source Voltage
V
V
A
± 20
Drain Current Continuous (VGS = 10V)
Pulsed
(Note 1)
(Note 2)
70
ID
Figure 4
307
EAS
PD
Single Pulse Avalanche Energy
mJ
W
W/oC
oC
Power Dissipation
Derate above 25oC
167
1.1
TJ, TSTG
Operating and Storage Temperature
-55 to +175
Thermal Characteristics
RθJC
Thermal Resistance, Junction to Case
0.9
43
oC/W
oC/W
RθJA
Thermal Resistance, Junction to Ambient TO-263, lin2 copper pad area
Package Marking and Ordering Information
Device Marking
Device
Package
Reel Size
Tape Width
Quantity
800 units
FDB8444
FDB8444
TO-263AB
330mm
24mm
Electrical Characteristics TJ = 25°C unless otherwise noted
Symbol
Parameter
Test Conditions
Min
Typ
Max
Units
Off Characteristics
BVDSS
Drain to Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate to Source Leakage Current
ID = 250µA, VGS = 0V
40
-
-
-
-
-
-
V
1
µA
VDS = 32V
IDSS
VGS = 0V
TJ =150°C
-
250
±100
IGSS
VGS = ±20V
-
nA
On Characteristics
VGS(th)
Gate to Source Threshold Voltage
VDS = VGS, ID = 250µA
2
-
2.6
3.9
4
V
ID = 70A, VGS = 10V
5.5
rDS(on)
Drain to Source On Resistance
mΩ
ID = 70A, VGS = 10V,
TJ = 175°C
-
7
9.9
Dynamic Characteristics
Ciss
Input Capacitance
-
-
-
-
-
-
-
-
-
6040
480
290
2
8035
pF
pF
pF
Ω
VDS = 25V, VGS = 0V,
f = 1MHz
Coss
Crss
Output Capacitance
640
Reverse Transfer Capacitance
Gate Resistance
435
RG
f = 1MHz
-
128
10
-
Qg(TOT)
Qg(TH)
Qgs
Total Gate Charge at 10V
Threshold Gate Charge
Gate to Source Gate Charge
Gate Charge Threshold to Plateau
Gate to Drain “Miller” Charge
VGS = 0 to 10V
91
nC
nC
nC
nC
nC
VGS = 0 to 2V
7
VDD=20V,
ID = 70A,
23
Qgs2
Qgd
17
-
20
-
2
www.fairchildsemi.com
FDB8444 Rev A2 (W)
Electrical Characteristics TJ = 25°C unless otherwise noted
Symbol
Parameter
Test Conditions
Min
Typ
Max
Units
Switching Characteristics
t(on)
td(on)
tr
Turn-On Time
-
-
-
-
-
-
-
135
ns
ns
ns
ns
ns
ns
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Turn-Off Time
12
78
48
15
-
-
-
VDD = 20V, ID = 70A
VGS = 10V, RGS = 2Ω
td(off)
tf
-
-
toff
95
Drain-Source Diode Characteristics
I
SD = 70A
-
-
-
-
-
-
-
-
1.25
1.0
62
V
V
VSD
Source to Drain Diode Voltage
ISD = 35A
trr
Reverse Recovery Time
Reverse Recovery Charge
IF = 70A, di/dt = 100A/µs
IF = 70A, di/dt = 100A/µs
ns
nC
Qrr
82
Notes:
1: Maximum wire current carrying capacity is 70A.
o
2: Starting T = 25 C, L = 0.2mH, I = 56A.
J
AS
This product has been designed to meet the extreme test conditions and environment demanded by the automotive industry. For
a copy of the requirements, see AEC Q101 at: http://www.aecouncil.com/
All Fairchild Semiconductor products are manufactured, assembled and tested under ISO9000 and QS9000 quality systems
certification.
3
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FDB8444 Rev A2 (W)
Typical Characteristics
100
80
60
40
20
0
1.2
1.0
0.8
0.6
0.4
0.2
0.0
CURRENT LIMITED
BY WIRE
VGS = 10V
25
50
75
100
125
150
175
0
25
50
75
100
125
150
175
TC, CASE TEMPERATURE(oC)
TC, CASE TEMPERATURE(oC)
Figure 1. Normalized Power Dissipation vs Case
Temperature
Figure 2. Maximum Continuous Drain Current vs
Case Temperature
2
DUTY CYCLE - DESCENDING ORDER
1
D = 0.50
0.20
0.10
0.05
0.02
0.01
P
DM
0.1
t
1
t
2
NOTES:
DUTY FACTOR: D = t /t
1
2
PEAK T = P
x Z
x R
+ T
J
DM
θJC
θJC C
SINGLE PULSE
0.01
10-5
10-4
10-3
10-2
10-1
100
101
t, RECTANGULAR PULSE DURATION(s)
Figure 3. Normalized Maximum Transient Thermal Impedance
5000
1000
TC = 25oC
FOR TEMPERATURES
ABOVE 25oC DERATE PEAK
CURRENT AS FOLLOWS:
175 - TC
I = I25
VGS = 10V
150
TRANSCONDUCTANCE
MAY LIMIT CURRENT
IN THIS REGION
100
10
SINGLE PULSE
10-5
10-4
10-3
10-2
10-1
100
101
t, RECTANGULAR PULSE DURATION(s)
Figure 4. Peak Current Capability
4
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FDB8444 Rev A2 (W)
Typical Characteristics
1000
100
10
500
100
If R = 0
= (L)(I )/(1.3*RATED BV
10us
t
AV
- V
)
AS
DSS
DD
If R
AV
≠ 0
t
= (L/R)ln[(I *R)/(1.3*RATED BV
- V ) +1]
AS
DSS DD
100us
STARTING TJ = 25oC
SINGLE PULSE
TJ = MAX RATED
TC = 25oC
10
1
STARTING TJ = 150oC
1ms
1
OPERATION IN THIS
AREA MAY BE
10ms
DC
LIMITED BY r
DS(on)
0.1
0.01
0.1
1
10
100
1000
1
10
VDS, DRAIN TO SOURCE VOLTAGE (V)
100
tAV, TIME IN AVALANCHE (ms)
NOTE: Refer to Fairchild Application Notes AN7514 and AN7515
Figure 6. Unclamped Inductive Switching
Capability
Figure 5. Forward Bias Safe Operating Area
140
140
PULSE DURATION = 80µs
VGS = 10V
VGS = 4.5V
VGS = 5V
DUTY CYCLE = 0.5% MAX
120
120
VDD = 5V
PULSE DURATION = 80µs
DUTY CYCLE = 0.5% MAX
100
80
60
40
20
0
100
TJ = 175oC
80
TJ = 25oC
TJ = -55oC
60
VGS = 4V
40
20
VGS = 3.5V
0
2.0
2.5
3.0
3.5
4.0
4.5
5.0
0
1
2
3
4
VDS, DRAIN TO SOURCE VOLTAGE (V)
VGS, GATE TO SOURCE VOLTAGE (V)
Figure 7. Transfer Characteristics
Figure 8. Saturation Characteristics
2.0
14
12
PULSE DURATION = 80µs
DUTY CYCLE = 0.5% MAX
PULSE DURATION = 80µs
DUTY CYCLE = 0.5% MAX
ID = 70A
1.8
1.6
1.4
1.2
1.0
0.8
0.6
10
8
TJ = 175oC
6
ID = 70A
4
VGS = 10V
TJ = 25oC
2
-80
-40
0
40
80
120
160
200
4
5
6
7
8
9
10
o
VGS, GATE TO SOURCE VOLTAGE (V)
TJ, JUNCTION TEMPERATURE( C)
Figure 9. Drain to Source On-Resistance
Variation vs Gate to Source Voltage
Figure 10. Normalized Drain to Source On
Resistance vs Junction Temperature
5
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FDB8444 Rev A2 (W)
Typical Characteristics
1.2
1.1
1.0
0.9
0.8
0.7
0.6
0.5
0.4
1.15
1.10
1.05
1.00
0.95
0.90
VGS = VDS
ID = 250µA
I
D
= 250µA
-80
-40
0
40
80
120
160
200
-80
-40
0
40
80
120
160
200
TJ, JUNCTION TEMPERATURE (oC)
TJ, JUNCTION TEMPERATURE(oC)
Figure 11. Normalized Gate Threshold Voltage vs
Junction Temperature
Figure 12. Normalized Drain to Source
Breakdown Voltage vs Junction Temperature
10000
10
ID = 70A
CISS
VDD = 15V
8
6
4
2
0
VDD = 20V
VDD = 25V
COSS
1000
CRSS
f = 1MHz
VGS = 0V
100
0.1
50
0
20
40
60
80
100
1
10
Qg, GATE CHARGE(nC)
VDS, DRAIN TO SOURCE VOLTAGE (V)
Figure 13. Capacitance vs Drain to Source
Voltage
Figure 14. Gate Charge vs Gate to Source Voltage
6
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FDB8444 Rev A2 (W)
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not
intended to be an exhaustive list of all such trademarks.
ACEx™
FAST®
FASTr™
FPS™
FRFET™
GlobalOptoisolator™ MicroPak™
ISOPLANAR™
LittleFET™
PowerSaver™
PowerTrench®
SuperSOT™-6
SuperSOT™-8
SyncFET™
TCM™
ActiveArray™
Bottomless™
Build it Now™
CoolFET™
MICROCOUPLER™ QFET®
MicroFET™
QS™
QT Optoelectronics™ TinyLogic®
CROSSVOLT™
DOME™
EcoSPARK™
E2CMOS™
EnSigna™
GTO™
HiSeC™
I2C™
MICROWIRE™
MSX™
MSXPro™
OCX™
Quiet Series™
RapidConfigure™
RapidConnect™
µSerDes™
TINYOPTO™
TruTranslation™
UHC™
i-Lo™
UltraFET®
ImpliedDisconnect™ OCXPro™
IntelliMAX™
ScalarPump™
UniFET™
FACT™
OPTOLOGIC®
SILENT SWITCHER® VCX™
FACT Quiet Series™
OPTOPLANAR™
PACMAN™
POP™
Power247™
PowerEdge™
SMART START™
SPM™
Stealth™
SuperFET™
SuperSOT™-3
Wire™
Across the board. Around the world.™
The Power Franchise®
Programmable Active Droop™
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY
PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY
LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN;
NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
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FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES
OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body, or
(b) support or sustain life, or (c) whose failure to perform
when properly used in accordance with instructions for use
provided in the labeling, can be reasonably expected to result
in significant injury to the user.
2. A critical component is any component of a life support
device or system whose failure to perform can be reasonably
expected to cause the failure of the life support device or
system, or to affect its safety or effectiveness.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Product Status
Definition
Advance Information
Formative or In
Design
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
Preliminary
First Production
This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
No Identification Needed
Obsolete
Full Production
This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
Not In Production
This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
Rev. I18
7
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FDB8444 Rev A2 (W)
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent
coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This
literature is subject to all applicable copyright laws and is not for resale in any manner.
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