FDB8832-F085 [ONSEMI]

30 V、80 A、1.5 mΩ、D2PAK、逻辑电平N 沟道 PowerTrench®;
FDB8832-F085
型号: FDB8832-F085
厂家: ONSEMI    ONSEMI
描述:

30 V、80 A、1.5 mΩ、D2PAK、逻辑电平N 沟道 PowerTrench®

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FDB8832-F085  
®
N-Channel Logic Level PowerTrench MOSFET  
30V, 80A, 2.1mΩ  
Features  
Applications  
„ Typ rDS(on) = 1.5mat VGS = 5V, ID = 80A  
„ 12V Automotive Load Control  
„ Typ Qg(5) = 100nC at VGS = 5V  
„ Low Miller Charge  
„ Starter / Alternator Systems  
„ Electronic Power Steering Systems  
„ ABS  
„ Low Qrr Body Diode  
„ UIS Capability (Single Pulse and Repetitive Pulse)  
„ Qualified to AEC Q101  
„ DC-DC Converters  
„ RoHS Compliant  
©2010 Semiconductor Components Industries, LLC.  
September-2017, Rev. 1  
Publication Order Number:  
FDB8832-F085/D  
MOSFET Maximum Ratings TC = 25°C unless otherwise noted  
Symbol  
VDSS  
Parameter  
Ratings  
Units  
Drain to Source Voltage  
Gate to Source Voltage  
30  
V
VGS  
±20  
V
Drain Current Continuous (TC < 165oC, VGS = 10V)  
Drain Current Continuous (TC < 163oC, VGS = 5V)  
Drain Current Continuous (Tamb = 25oC, VGS = 10V, with RθJA = 43oC/W)  
Pulsed  
80  
80  
ID  
A
34  
See Figure 4  
1246  
EAS  
PD  
Single Pulse Avalanche Energy  
(Note 1)  
mJ  
W
W/oC  
oC  
Power Dissipation  
Derate above 25oC  
300  
2
TJ, TSTG Operating and Storage Temperature  
-55 to +175  
Thermal Characteristics  
RθJC  
RθJA  
RθJA  
Thermal Resistance, Junction to Case  
0.5  
62  
43  
oC/W  
oC/W  
oC/W  
Thermal Resistance, Junction to Ambient  
Thermal Resistance, Junction to Ambient, lin2 copper pad area  
(Note 2)  
Package Marking and Ordering Information  
Device Marking  
Device  
Package  
Reel Size  
Tape Width  
Quantity  
800 units  
FDB8832  
FDB8832-F085  
TO-263AB  
330mm  
24mm  
Electrical Characteristics TJ = 25°C unless otherwise noted  
Symbol  
Parameter  
Test Conditions  
Min  
Typ  
Max  
Units  
Off Characteristics  
BVDSS  
Drain to Source Breakdown Voltage  
Zero Gate Voltage Drain Current  
Gate to Source Leakage Current  
ID = 250µA, VGS = 0V  
30  
-
-
-
-
-
-
V
1
VDS = 24V  
IDSS  
µA  
nA  
VGS = 0V  
TJ = 150°C  
-
250  
±100  
IGSS  
VGS = ±20V  
-
On Characteristics  
VGS(th)  
Gate to Source Threshold Voltage  
VDS = VGS, ID = 250µA  
1.0  
1.6  
1.4  
1.5  
1.6  
3.0  
1.9  
2.1  
2.2  
V
ID = 80A, VGS = 10V  
-
-
-
ID = 80A, VGS = 5V  
rDS(on)  
Drain to Source On Resistance  
ID = 80A, VGS = 4.5V  
mΩ  
ID = 80A, VGS = 10V  
TJ = 175°C  
-
2.3  
3.0  
Dynamic Characteristics  
Ciss  
Coss  
Crss  
RG  
Input Capacitance  
-
-
-
-
-
-
-
-
-
-
11400  
2140  
1260  
1.2  
-
pF  
pF  
pF  
VDS = 15V, VGS = 0V,  
f = 1MHz  
Output Capacitance  
Reverse Transfer Capacitance  
Gate Resistance  
-
-
VGS = 0.5V, f = 1MHz  
VGS = 0 to 10V  
-
265  
130  
14.2  
-
Qg(TOT) Total Gate Charge at 10V  
204  
100  
10.9  
33  
nC  
nC  
nC  
nC  
nC  
nC  
Qg(5)  
Qg(TH)  
Qgs  
Total Gate Charge at 5V  
VGS = 0 to 5V  
VDD = 15V  
ID = 80A  
Threshold Gate Charge  
VGS = 0 to 1V  
Gate to Source Gate Charge  
Gate Charge Threshold to Plateau  
Gate to Drain “Miller” Charge  
Ig = 1.0mA  
Qgs2  
Qgd  
22  
-
43  
-
www.onsemi.com  
2
Electrical Characteristics TJ = 25°C unless otherwise noted  
Symbol  
Parameter  
Test Conditions  
Min  
Typ  
Max  
Units  
Switching Characteristics  
t(on)  
td(on)  
tr  
Turn-On Time  
-
-
-
-
-
-
-
155  
ns  
ns  
ns  
ns  
ns  
ns  
Turn-On Delay Time  
Turn-On Rise Time  
Turn-Off Delay Time  
Turn-Off Fall Time  
Turn-Off Time  
24  
73  
54  
38  
-
-
-
V
DD = 15V, ID = 80A  
VGS = 5V, RGS = 1.5Ω  
td(off)  
tf  
-
-
toff  
149  
Drain-Source Diode Characteristics  
ISD = 75A  
-
-
-
-
0.8  
0.8  
59  
1.25  
1.0  
77  
V
V
VSD  
Source to Drain Diode Voltage  
ISD = 40A  
trr  
Reverse Recovery Time  
Reverse Recovery Charge  
IF = 75A, di/dt = 100A/µs  
IF = 75A, di/dt = 100A/µs  
ns  
nC  
Qrr  
67  
87  
Notes:  
o
1: Starting T = 25 C, L = 0.61mH, I = 64A, V = 30V, V = 10V.  
J
AS  
DD  
GS  
2: Pulse width = 100s.  
www.onsemi.com  
3
Typical Characteristics  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
350  
300  
250  
200  
150  
100  
50  
CURRENT LIMITED  
BY PACKAGE  
VGS = 10V  
VGS = 5V  
0
25  
0
25  
50  
75  
100  
125  
150  
175  
50  
75  
100  
125  
150  
175  
TC, CASE TEMPERATURE(oC)  
TC, CASE TEMPERATURE(oC)  
Figure 1. Normalized Power Dissipation vs Case  
Temperature  
Figure 2. Maximum Continuous Drain Current vs  
Case Temperature  
2
DUTY CYCLE - DESCENDING ORDER  
1
D = 0.50  
0.20  
0.10  
0.05  
P
DM  
0.1  
0.02  
0.01  
t
1
t
2
0.01  
NOTES:  
DUTY FACTOR: D = t /t  
1
2
PEAK T = P  
x Z  
x R  
+ T  
J
DM  
θJC  
θJC C  
SINGLE PULSE  
1E-3  
10-5  
10-4  
10-3  
10-2  
10-1  
100  
101  
t, RECTANGULAR PULSE DURATION(s)  
Figure 3. Normalized Maximum Transient Thermal Impedance  
10000  
TC = 25oC  
VGS = 10V  
TRANSCONDUCTANCE  
MAY LIMIT CURRENT  
IN THIS REGION  
FOR TEMPERATURES  
ABOVE 25oC DERATE PEAK  
CURRENT AS FOLLOWS:  
1000  
100  
10  
175 - TC  
I = I25  
150  
SINGLE PULSE  
10-5  
10-4  
10-3  
10-2  
10-1  
100  
101  
t, RECTANGULAR PULSE DURATION(s)  
Figure 4. Peak Current Capability  
www.onsemi.com  
4
Typical Characteristics  
4000  
1000  
500  
100  
If R = 0  
= (L)(I )/(1.3*RATED BV  
10us  
t
AV  
- V  
)
AS  
DSS  
DD  
If R  
0  
t
AV  
= (L/R)ln[(I *R)/(1.3*RATED BV  
- V ) +1]  
AS  
DSS DD  
100us  
100  
STARTING TJ = 25oC  
10  
LIMITED  
BY PACKAGE  
10  
1
STARTING TJ = 150oC  
1ms  
1
SINGLE PULSE  
OPERATION IN THIS  
AREA MAY BE  
LIMITED BY r  
DS(on)  
T
J
= MAX RATED  
10ms  
DC  
o
T
C
= 25 C  
0.1  
60  
1
10  
5000  
1000  
0.01  
0.1  
1
10  
100  
VDS, DRAIN TO SOURCE VOLTAGE (V)  
tAV, TIME IN AVALANCHE (ms)  
Figure 6. Unclamped Inductive Switching  
Figure 5. Forward Bias Safe Operating Area  
Capability  
200  
200  
PULSE DURATION = 80µs  
DUTY CYCLE = 0.5% MAX  
VGS = 5V  
PULSE DURATION = 80µs  
DUTY CYCLE = 0.5% MAX  
VGS = 10V  
VDD = 5V  
150  
100  
50  
150  
TJ = 175oC  
TJ = 25oC  
VGS = 3.5V  
VGS = 3V  
100  
50  
0
TJ = -55oC  
0
0
1
2
3
4
0.0  
0.5  
1.0  
1.5  
VDS, DRAIN TO SOURCE VOLTAGE (V)  
VGS, GATE TO SOURCE VOLTAGE (V)  
Figure 7. Transfer Characteristics  
Figure 8. Saturation Characteristics  
4
3
2
1
0
1.6  
PULSE DURATION = 80µs  
DUTY CYCLE = 0.5% MAX  
PULSE DURATION = 80µs  
DUTY CYCLE = 0.5% MAX  
1.4  
1.2  
1.0  
0.8  
0.6  
TJ = 175oC  
TJ = 25oC  
ID = 80A  
GS = 10V  
V
-80  
-40  
0
40  
80  
120  
160  
200  
2
4
6
8
10  
o
TJ, JUNCTION TEMPERATURE( C)  
VGS, GATE TO SOURCE VOLTAGE (V)  
Figure 9. Drain to Source On-Resistance  
Variation vs Gate to Source Voltage  
Figure 10. Normalized Drain to Source On  
Resistance vs Junction Temperature  
www.onsemi.com  
5
Typical Characteristics  
1.10  
1.05  
1.00  
0.95  
0.90  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
ID = 250µA  
VGS = VDS  
ID = 250µA  
-80  
-40  
0
40  
80  
120  
160  
200  
-80  
-40  
0
40  
80  
120  
160  
200  
TJ, JUNCTION TEMPERATURE(oC)  
TJ, JUNCTION TEMPERATURE (oC)  
Figure 11. Normalized Gate Threshold Voltage vs  
Junction Temperature  
Figure 12. Normalized Drain to Source  
Breakdown Voltage vs Junction Temperature  
10  
40000  
ID = 80A  
Ciss  
8
10000  
VDD = 12V  
VDD = 15V  
Coss  
6
VDD = 18V  
4
Crss  
1000  
2
0
f = 1MHz  
VGS = 0V  
100  
0.1  
0
50  
100  
150  
200  
250  
1
10  
50  
Qg, GATE CHARGE(nC)  
VDS, DRAIN TO SOURCE VOLTAGE (V)  
Figure 13. Capacitance vs Drain to Source  
Voltage  
Figure 14. Gate Charge vs Gate to Source Voltage  
www.onsemi.com  
6
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent  
coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.  
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,  
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or  
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer  
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not  
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification  
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized  
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and  
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such  
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This  
literature is subject to all applicable copyright laws and is not for resale in any manner.  
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