FDC655BN [ONSEMI]

N 沟道,PowerTrench® MOSFET,逻辑电平,30 V,6.3 A,25 mΩ;
FDC655BN
型号: FDC655BN
厂家: ONSEMI    ONSEMI
描述:

N 沟道,PowerTrench® MOSFET,逻辑电平,30 V,6.3 A,25 mΩ

PC 开关 光电二极管 晶体管
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FDC655BN  
Single N-Channel, Logic Level, PowerTrench® MOSFET  
30 V, 6.3 A, 25 mΩ  
Features  
General Description  
„ Max rDS(on) = 25 mat VGS = 10 V, ID = 6.3 A  
„ Max rDS(on) = 33 mat VGS = 4.5 V, ID = 5.5 A  
„ Fast switching  
This N-Channel Logic Level MOSFET is produced using  
ON Semiconductor’s advanced PowerTrench® process  
that has been especially tailored to minimize the on-  
state resistance and yet maintain superior switching  
performance.  
„ Low gate charge  
These devices are well suited for low voltage and battery  
powered applicatoins where low in-line power loss and fast  
switching are required.  
„ High performance trchnology for extremely low rDS(on)  
„ Termination is Lead-free and RoHS Compliant  
D
D
S
D
D
G
MOSFET Maximum Ratings TC = 25°C unless otherwise noted  
Symbol  
VDS  
VGS  
Parameter  
Ratings  
Units  
Drain to Source Voltage  
Gate to Source Voltage  
30  
±20  
V
V
-Continuous  
-Pulsed  
Power Dissipation  
Power Dissipation  
Operating and Storage Junction Temperature Range  
TA = 25°C  
(Note 1a)  
6.3  
ID  
A
20  
( Note 1a)  
(Note 1b)  
1.6  
PD  
W
0.8  
TJ, TSTG  
-55 to + 150  
°C  
Thermal Characteristics  
RθJA  
Thermal Resistance, Junction to Ambient  
(Note 1a)  
78  
°C/W  
Package Marking and Ordering Information  
Device Marking  
Device  
Package  
SSOT-6TM  
Reel Size  
7 ’’  
Tape Width  
8 mm  
Quantity  
.55B  
FDC655BN  
3000 units  
©2010 Semiconductor Components Industries, LLC.  
October-2017, Rev.3  
Publication Order Number:  
1
FDC655BN/D  
Electrical Characteristics TJ = 25°C unless otherwise noted  
Symbol  
Parameter  
Test Conditions  
Min  
Typ  
Max  
Units  
Off Characteristics  
BVDSS  
Drain to Source Breakdown Voltage  
ID = 250 µA, VGS = 0 V  
30  
V
BVDSS  
TJ  
Breakdown Voltage Temperature  
Coefficient  
I
D = 250 µA, referenced to 25°C  
25  
mV/°C  
IDSS  
IGSS  
Zero Gate Voltage Drain Current  
Gate to Source Leakage Current  
VDS = 24 V, VGS = 0 V  
VGS = ±20 V, VDS = 0 V  
1
µA  
±100  
nA  
On Characteristics  
VGS(th)  
Gate to Source Threshold Voltage  
VGS = VDS, ID = 250 µA  
1
1.9  
-5  
3
V
VGS(th)  
TJ  
Gate to Source Threshold Voltage  
Temperature Coefficient  
I
D = 250 µA, referenced to 25°C  
mV/°C  
V
GS = 10 V, ID = 6.3 A  
21  
26  
30  
35  
25  
33  
36  
rDS(on)  
gFS  
Static Drain to Source On Resistance  
Forward Transconductance  
VGS = 4.5 V, ID = 5.5 A  
mΩ  
VGS = 10 V, ID = 6.3 A, TJ = 125°C  
VDS = 10 V, ID = 6.3 A  
S
Dynamic Characteristics  
Ciss  
Coss  
Crss  
Rg  
Input Capacitance  
470  
100  
60  
620  
130  
90  
pF  
pF  
pF  
VDS = 15 V, VGS = 0 V,  
f = 1MHz  
Output Capacitance  
Reverse Transfer Capacitance  
Gate Resistance  
3.0  
Switching Characteristics  
td(on)  
tr  
td(off)  
tf  
Turn-On Delay Time  
Rise Time  
6
2
11  
10  
26  
10  
13  
7
ns  
ns  
VDD = 15 V, ID = 1 A,  
VGS = 10 V, RGEN = 6 Ω  
Turn-Off Delay Time  
Fall Time  
15  
2
ns  
ns  
Qg  
Total Gate Charge  
Total Gate Charge  
Gate to Source Charge  
Gate to Drain “Miller” Charge  
VGS = 0 V to 10 V  
9
nC  
nC  
nC  
nC  
Qg  
VGS = 0 V to 5 V  
5
VDD = 15 V,  
ID = 6.3 A  
Qgs  
Qgd  
1.4  
1.6  
Drain-Source Diode Characteristics  
IS  
Maximum Continuous Drain-Source Diode Forward Current  
1.3  
1.2  
26  
A
V
VSD  
trr  
Source-Drain Diode Forward Voltage  
Reverse Recovery Time  
VGS = 0 V, IS = 1.3 A  
(Note 2)  
0.8  
15  
4
ns  
nC  
IF = 6.3 A, di/dt = 100 A/µs  
Qrr  
Reverse Recovery Charge  
10  
Notes:  
1: R  
is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins.  
θJA  
R
is guaranteed by design while R  
is determined by the user’s board design.  
θJC  
θCA  
2
a. 78 °C/W when mounted on a 1 in pad of 2 oz copper on FR-4 board.  
b. 156 °C/W when mounted on a minimum pad.  
2: Pulse Test: Pulse Width<300 us, Duty Cycle<2.0%.  
www.onsemi.com  
2
Typical Characteristics TJ = 25°C unless otherwise noted  
20  
5
4
3
2
1
0
VGS = 10 V  
VGS = 6 V  
PULSE DURATION = 80 µs  
DUTY CYCLE = 0.5% MAX  
VGS = 3.5 V  
VGS = 4.5 V  
16  
VGS = 3 V  
12  
8
VGS = 3.5 V  
VGS = 4.5 V  
VGS = 3 V  
4
VGS = 10 V  
PULSE DURATION = 80 µs  
VGS = 6 V  
12  
DUTY CYCLE = 0.5% MAX  
0
0
4
8
16  
20  
0
0.5  
1.0  
1.5  
2.0  
ID, DRAIN CURRENT (A)  
VDS, DRAIN TO SOURCE VOLTAGE (V)  
Figure 1. On Region Characteristics  
Figure2. N o r m a l i z e d O n - R e s i s ta n c e  
vs Drain Current and Gate Voltage  
1.6  
90  
ID = 6.3 A  
PULSE DURATION = 80 µs  
DUTY CYCLE = 0.5% MAX  
80  
70  
60  
50  
40  
30  
20  
10  
VGS = 10 V  
1.4  
1.2  
1.0  
0.8  
0.6  
ID = 6.3 A  
TJ = 125 o  
C
TJ = 25 o  
C
-75 -50 -25  
0
25 50 75 100 125 150  
2
4
6
8
10  
TJ, JUNCTION TEMPERATURE (oC)  
VGS, GATE TO SOURCE VOLTAGE (V)  
Figure 3. Normalized On Resistance  
vs Junction Temperature  
Figure4. On-Resistance vs Gate to  
Source Voltage  
20  
100  
10  
PULSE DURATION = 80 µs  
DUTY CYCLE = 0.5% MAX  
VGS = 0 V  
16  
12  
8
VDS = 5 V  
TJ = 150 o  
C
TJ = 150 o  
C
1
TJ = 25 o  
C
TJ = 25 o  
C
0.1  
4
TJ = -55 o  
C
TJ = -55 o  
C
0
1.0  
0.01  
1.5  
2.0  
2.5  
3.0  
3.5  
4.0  
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
VGS, GATE TO SOURCE VOLTAGE (V)  
VSD, BODY DIODE FORWARD VOLTAGE (V)  
Figure 5. Transfer Characteristics  
Figure6. Source to Drain Diode  
Forward Voltage vs Source Current  
www.onsemi.com  
3
Typical Characteristics TJ = 25°C unless otherwise noted  
10  
1000  
100  
10  
ID = 6.3 A  
Ciss  
8
VDD = 10 V  
6
Coss  
VDD = 15 V  
4
VDD = 20 V  
Crss  
2
0
f = 1 MHz  
= 0 V  
V
GS  
0.1  
1
10  
30  
0
2
4
6
8
10  
VDS, DRAIN TO SOURCE VOLTAGE (V)  
Q , GATE CHARGE (nC)  
g
Figure 7. Gate Charge Characteristics  
Figure8. C a p a c i t a n c e v s D r a i n  
to Source Voltage  
100  
1000  
100  
10  
THIS AREA IS  
LIMITED BY r  
DS(on)  
VGS = 10 V  
10  
1
1 ms  
SINGLE PULSE  
RθJA = 156 oC/W  
TA = 25 oC  
10 ms  
100 ms  
1 s  
SINGLE PULSE  
TJ = MAX RATED  
RθJA = 156 oC/W  
0.1  
1
10 s  
DC  
TA = 25 o  
C
0.01  
0.1  
10-4  
10-3  
10-2  
t, PULSE WIDTH (sec)  
10-1  
1
10  
0.01  
0.1  
1
10  
100  
100 1000  
VDS, DRAIN to SOURCE VOLTAGE (V)  
Figure 9. Forward Bias Safe  
Operating Area  
Figure10. Single Pulse Maximum  
Power Dissipation  
2
1
DUTY CYCLE-DESCENDING ORDER  
D = 0.5  
0.2  
0.1  
0.1  
0.01  
0.05  
0.02  
0.01  
P
DM  
t
1
t
2
SINGLE PULSE  
RθJA = 156 oC/W  
NOTES:  
DUTY FACTOR: D = t /t  
1
2
PEAK T = P  
J
x Z  
x R  
+ T  
θJA A  
0.001  
DM  
θJA  
0.0003  
10-4  
10-3  
10-2  
10-1  
1
10  
100  
1000  
t, RECTANGULAR PULSE DURATION (sec)  
Figure 11. Junction-to-Ambient Transient Thermal Response Curve  
www.onsemi.com  
4
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent  
coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.  
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,  
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or  
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer  
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not  
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification  
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized  
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and  
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such  
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This  
literature is subject to all applicable copyright laws and is not for resale in any manner.  
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