FDD5353 [ONSEMI]

N 沟道,Power Trench® MOSFET,60V,50A,12.3mΩ;
FDD5353
型号: FDD5353
厂家: ONSEMI    ONSEMI
描述:

N 沟道,Power Trench® MOSFET,60V,50A,12.3mΩ

开关 脉冲 晶体管
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April 2015  
FDD5353  
N-Channel Power Trench® MOSFET  
60V, 50A, 12.3m  
Features  
General Description  
Max rDS(on) = 12.3mat VGS = 10V, ID = 10.7A  
Max rDS(on) = 15.4mat VGS = 4.5V, ID = 9.5A  
100% UIL Tested  
This N-Channel MOSFET is produced using Fairchild  
Semiconductor‘s advanced Power Trench® process that has  
been especially tailored to minimize the on-state resistance and  
yet maintain superior switching performance.  
RoHS Compliant  
Application  
Inverter  
Synchronous rectifier  
Primary switch  
D
D
G
G
S
D-PAK  
(TO-252)  
S
MOSFET Maximum Ratings TC = 25°C unless otherwise noted  
Symbol  
VDS  
VGS  
Parameter  
Ratings  
60  
Units  
Drain to Source Voltage  
Gate to Source Voltage  
Drain Current -Continuous  
-Continuous  
V
V
±20  
TC = 25°C  
TA = 25°C  
50  
ID  
(Note 1a)  
(Note 3)  
11.5  
A
-Pulsed  
100  
EAS  
Single Pulse Avalanche Energy  
Power Dissipation  
253  
mJ  
W
TC = 25°C  
TA = 25°C  
69  
PD  
Power Dissipation  
(Note 1a)  
3.1  
TJ, TSTG  
Operating and Storage Junction Temperature Range  
-55 to +150  
°C  
Thermal Characteristics  
RJC  
RJA  
Thermal Resistance, Junction to Case  
Thermal Resistance, Junction to Ambient  
1.8  
40  
°C/W  
(Note 1a)  
Package Marking and Ordering Information  
Device Marking  
Device  
Package  
Reel Size  
13’’  
Tape Width  
16mm  
Quantity  
FDD5353  
FDD5353  
D-PAK (TO-252)  
2500 units  
1
©2013 Fairchild Semiconductor Corporation  
FDD5353 Rev.1.4  
www.fairchildsemi.com  
Electrical Characteristics TJ = 25°C unless otherwise noted  
Symbol  
Parameter  
Test Conditions  
Min  
Typ  
Max  
Units  
Off Characteristics  
BVDSS  
Drain to Source Breakdown Voltage  
ID = 250A, VGS = 0V  
60  
V
BVDSS  
TJ  
Breakdown Voltage Temperature  
Coefficient  
I
D = 250A, referenced to 25°C  
77  
mV/°C  
IDSS  
IGSS  
Zero Gate Voltage Drain Current  
Gate to Source Leakage Current  
VGS = 0V, VDS = 48V,  
VGS = ±20V, VDS = 0V  
1
A  
±100  
nA  
On Characteristics  
VGS(th)  
Gate to Source Threshold Voltage  
VGS = VDS, ID = 250A  
1.0  
1.8  
-8  
3.0  
V
VGS(th)  
TJ  
Gate to Source Threshold Voltage  
Temperature Coefficient  
I
D = 250A, referenced to 25°C  
GS = 10V, ID = 10.7A  
mV/°C  
V
10.1  
12.1  
16.7  
41  
12.3  
15.4  
20.3  
rDS(on)  
gFS  
Static Drain to Source On Resistance  
Forward Transconductance  
VGS = 4.5V, ID = 9.5A  
m  
VGS = 10V, ID = 10.7A, TJ = 125°C  
VDD = 5V, ID = 10.7A  
S
Dynamic Characteristics  
Ciss  
Coss  
Crss  
Rg  
Input Capacitance  
2420  
215  
120  
1.7  
3215  
285  
pF  
pF  
pF  
VDS = 30V, VGS = 0V,  
f = 1MHz  
Output Capacitance  
Reverse Transfer Capacitance  
Gate Resistance  
180  
f = 1MHz  
Switching Characteristics  
td(on)  
tr  
td(off)  
tf  
Turn-On Delay Time  
Rise Time  
11  
6
20  
11  
58  
10  
65  
32  
ns  
ns  
VDD = 30V, ID = 10.7A,  
V
GS = 10V, RGEN = 6  
Turn-Off Delay Time  
Fall Time  
36  
4
ns  
ns  
Qg  
Total Gate Charge  
Total Gate Charge  
Gate to Source Charge  
Gate to Drain “Miller” Charge  
VGS = 0V to 10V  
VGS = 0V to 4.5V  
46  
23  
7
nC  
nC  
nC  
nC  
VDD = 30V,  
D = 10.7A  
Qg  
I
Qgs  
Qgd  
9
Drain-Source Diode Characteristics  
V
GS = 0V, IS = 10.7A  
(Note 2)  
(Note 2)  
0.8  
0.7  
28  
1.3  
1.2  
45  
VSD  
Source to Drain Diode Forward Voltage  
V
VGS = 0V, IS = 2.6A  
trr  
Reverse Recovery Time  
ns  
IF = 10.7A, di/dt = 100A/s  
Qrr  
Reverse Recovery Charge  
21  
34  
nC  
Notes:  
1: R  
is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins.  
JA  
R
is guaranteed by design while R  
is determined by the user’s board design.  
JC  
JA  
a)  
40°C/W when mounted on a  
1 in pad of 2 oz copper  
b) 96°C/W when mounted  
on a minimum pad.  
2
2: Pulse Test: Pulse Width < 300s, Duty cycle < 2.0%.  
3: E of 253mJ is based on starting T = 25°C, L = 3mH, I = 13A, V = 60V, V = 10V. 100% test at L = 0.1mH, I = 41A.  
AS  
J
AS  
DD  
GS  
AS  
www.fairchildsemi.com  
©2013 Fairchild Semiconductor Corporation  
FDD5353 Rev.1.4  
2
Typical Characteristics TJ = 25°C unless otherwise noted  
100  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
VGS = 10V  
VGS = 3V  
VGS = 3.5V  
80  
VGS = 4.5V  
VGS = 4V  
VGS = 4V  
60  
VGS = 3.5V  
VGS = 4.5V  
40  
PULSE DURATION = 80s  
DUTY CYCLE = 0.5%MAX  
20  
VGS = 10V  
VGS = 3V  
PULSE DURATION = 80s  
DUTY CYCLE = 0.5%MAX  
0
0
1
2
3
4
5
0
20  
40  
60  
80  
100  
ID, DRAIN CURRENT(A)  
VDS, DRAIN TO SOURCE VOLTAGE (V)  
F ig u r e 1 . O n - R e g i o n C h a r a c t e r i s t i c s  
F ig u r e 2 . N o r m a li z e d On - R e s is ta n c e  
vs Drain Current and Gate Voltage  
2.0  
40  
PULSE DURATION = 80s  
DUTY CYCLE = 0.5%MAX  
ID = 10.7A  
VGS = 10V  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
32  
24  
16  
8
ID = 10.7A  
TJ = 125oC  
TJ = 25oC  
0
2
3
4
5
6
7
8
9
10  
-75 -50 -25  
0
25 50 75 100 125 150  
TJ, JUNCTION TEMPERATURE (oC)  
VGS, GATE TO SOURCE VOLTAGE (V)  
F igu re 3 . N orma lized On - Res is ta nc e  
vs Junction Temperature  
Figure 4. On-Resistance vs Gate to  
Source Voltage  
100  
200  
100  
VGS = 0V  
PULSE DURATION = 80s  
DUTY CYCLE = 0.5%MAX  
80  
60  
40  
20  
0
10  
VDS = 5V  
TJ = 150oC  
1
TJ = 25oC  
TJ = 150oC  
0.1  
TJ = 25oC  
TJ = -55oC  
0.01  
TJ = -55oC  
0.001  
1
2
3
4
5
0.0  
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
1.4  
VGS, GATE TO SOURCE VOLTAGE (V)  
VSD, BODY DIODE FORWARD VOLTAGE (V)  
Figure 5. Transfer Characteristics  
Figure 6. Source to Drain Diode  
Forward Voltage vs Source Current  
www.fairchildsemi.com  
©2013 Fairchild Semiconductor Corporation  
FDD5353 Rev.1.4  
3
Typical Characteristics TJ = 25°C unless otherwise noted  
10  
10000  
1000  
100  
ID = 10.7A  
VDD = 20V  
Ciss  
8
Coss  
6
VDD = 30V  
4
VDD = 40V  
Crss  
f = 1MHz  
= 0V  
2
0
V
GS  
10  
0.1  
0
10  
20  
30  
40  
50  
1
10  
30  
VDS, DRAIN TO SOURCE VOLTAGE (V)  
Q , GATE CHARGE(nC)  
g
F i g u r e 7 . G a t e C h a r g e C h a r a c t e r i s t i c s  
F i g u r e 8 . C a p a c i t a n c e v s D r a i n  
to Source Voltage  
60  
50  
40  
30  
20  
10  
100  
VGS = 10V  
TJ = 25oC  
Limited by Package  
VGS = 4.5V  
10  
TJ = 125oC  
R
JC = 1.8oC/W  
0
25  
1
0.01  
50  
75  
100  
125  
150  
0.1  
1
10  
100  
o
tAV, TIME IN AVALANCHE(ms)  
TC, CASE TEMPERATURE ( C)  
F i g u r e 9 . U n c l a m p e d I n d u c t i v e  
Switching Capability  
Figure 10. Maximum Continuous Drain  
Current vs Case Temperature  
105  
200  
100  
VGS = 10V  
104  
103  
102  
10  
100µs  
SINGLE PULSE  
JC = 1.8oC/W  
TC = 25oC  
10  
1
R
THIS AREA IS  
LIMITED BY rDS(on)  
1ms  
SINGLE PULSE  
TJ = MAX RATED  
10ms  
DC  
R
JC = 1.8oC/W  
C = 25oC  
T
0.1  
10-6  
10-5  
10-4  
t, PULSE WIDTH (sec)  
10-3  
10-2  
10-1  
1
1
10  
100 200  
VDS, DRAIN to SOURCE VOLTAGE (V)  
Figure 11. Forward Bias Safe  
Operating Area  
Figure 12. Single Pulse Maximum  
Power Dissipation  
www.fairchildsemi.com  
©2013 Fairchild Semiconductor Corporation  
FDD5353 Rev.1.4  
4
Typical Characteristics TJ = 25°C unless otherwise noted  
2
1
DUTY CYCLE-DESCENDING ORDER  
D = 0.5  
0.2  
0.1  
0.1  
0.05  
0.02  
0.01  
P
DM  
t
0.01  
1
t
2
NOTES:  
DUTY FACTOR: D = t /t  
SINGLE PULSE  
RJC = 1.8oC/W  
1
2
PEAK T = P  
J
x Z x R + T  
Jc Jc C  
DM  
0.001  
5E-4  
10-6  
10-5  
10-4  
10-3  
10-2  
10-1  
1
t, RECTANGULAR PULSE DURATION (sec)  
Figure 13. Transient Thermal Response Curve  
2
1
DUTY CYCLE-DESCENDING ORDER  
D = 0.5  
0.2  
0.1  
0.01  
0.1  
P
DM  
0.05  
0.02  
0.01  
t
1
t
2
SINGLE PULSE  
NOTES:  
DUTY FACTOR: D = t /t  
0.001  
R
JA = 96oC/W  
1
2
PEAK T = P  
J
x Z  
x R  
+ T  
DM  
JA  
JA A  
(Note 1b)  
0.0001  
10-4  
10-3  
10-2  
10-1  
t, RECTANGULAR PULSE DURATION (sec)  
1
10  
100  
1000  
Figure 14. Transient Thermal Response Curve  
www.fairchildsemi.com  
©2013 Fairchild Semiconductor Corporation  
FDD5353 Rev.1.4  
5
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent  
coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.  
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,  
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or  
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer  
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not  
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification  
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized  
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and  
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such  
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