FDD6530A [ONSEMI]

N 沟道,PowerTrench® MOSFET,20V,21A,32mΩ;
FDD6530A
型号: FDD6530A
厂家: ONSEMI    ONSEMI
描述:

N 沟道,PowerTrench® MOSFET,20V,21A,32mΩ

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FDD6530A  
20V N-Channel PowerTrenchÒ MOSFET  
Features  
·
21 A, 20 V  
RDS(ON) = 32 mW @ VGS = 4.5 V  
RDS(ON) = 47 mW @ VGS = 2.5 V  
General Description  
This N-Channel MOSFET has been designed  
specifically to improve the overall efficiency of DC/DC  
converters using either synchronous or conventional  
switching PWM controllers. It has been optimized for  
low gate charge, low RDS( ON) and fast switching speed.  
·
·
·
Low gate charge (6.5 nC typical)  
Fast switching  
High performance trench technology for extremely  
low RDS(ON)  
Applications  
·
DC/DC converter  
.
·
Motor drives  
D
D
G
G
S
TO-252  
S
Absolute Maximum Ratings TA=25oC unless otherwise noted  
Symbol  
VDSS  
Parameter  
Drain-Source Voltage  
Ratings  
Units  
20  
V
V
A
VGSS  
Gate-Source Voltage  
Drain Current – Continuous  
– Pulsed  
±8  
ID  
(Note 3)  
(Note 1a)  
(Note 1)  
21  
100  
PD  
W
Power Dissipation  
33  
(Note 1a)  
(Note 1b)  
3.3  
1.6  
TJ, TSTG  
Operating and Storage Junction Temperature Range  
–55 to +175  
°C  
Thermal Characteristics  
Thermal Resistance, Junction-to-Case  
(Note 1)  
(Note 1a)  
(Note 1b)  
4.5  
45  
96  
RqJC  
RqJA  
RqJA  
°C/W  
°C/W  
°C/W  
Thermal Resistance, Junction-to-Ambient  
Thermal Resistance, Junction-to-Ambient  
Package Marking and Ordering Information  
Device Marking  
Device  
Reel Size  
Tape width  
Quantity  
FDD6530A  
FDD6530A  
13’’  
16mm  
2500 units  
Ó2001 Semiconductor Components Industries, LLC.  
September-2017, Rev. 2  
Publication Order Number:  
FDD6530A/D  
Electrical Characteristics  
TA = 25°C unless otherwise noted  
Symbol  
Parameter  
Test Conditions  
Min Typ Max Units  
Drain-Source Avalanche Ratings (Note 2)  
WDSS  
IAR  
Drain-Source Avalanche Energy  
Drain-Source Avalanche Current  
Single Pulse, VDD = 10 V  
55  
8
mJ  
A
Off Characteristics  
BVDSS  
Drain–Source Breakdown Voltage  
VGS = 0 V,  
ID = 250 mA  
20  
V
Breakdown Voltage Temperature  
Coefficient  
DBVDSS  
DTJ  
15  
ID = 250 mA, Referenced to 25°C  
mV/°C  
IDSS  
Zero Gate Voltage Drain Current  
Gate–Body Leakage, Forward  
Gate–Body Leakage, Reverse  
VDS = 16 V,  
VGS = 8 V,  
VGS = –8 V,  
VGS = 0 V  
VDS = 0 V  
VDS = 0 V  
1
mA  
nA  
nA  
IGSSF  
IGSSR  
100  
–100  
On Characteristics  
(Note 2)  
VGS(th)  
Gate Threshold Voltage  
VDS = VGS  
,
ID = 250 mA  
0.4  
20  
0.9  
–3  
1.2  
V
Gate Threshold Voltage  
Temperature Coefficient  
DVGS(th)  
DTJ  
ID = 250 mA, Referenced to 25°C  
mV/°C  
RDS(on)  
Static Drain–Source  
On–Resistance  
VGS = 4.5 V,  
VGS = 2.5 V,  
VGS = 4.5 V, ID = 8 A, TJ = 125°C  
ID = 8 A  
ID = 6.6 A  
26  
36  
36  
32  
47  
48  
mW  
ID(on)  
gFS  
On–State Drain Current  
VGS = 4.5 V,  
VDS = 5 V  
A
S
Forward Transconductance  
VDS = 5 V,  
ID = 8 A  
21  
Dynamic Characteristics  
VDS = 10 V,  
f = 1.0 MHz  
V GS = 0 V,  
Ciss  
Coss  
Crss  
Input Capacitance  
710  
173  
84  
pF  
pF  
pF  
Output Capacitance  
Reverse Transfer Capacitance  
Switching Characteristics (Note 2)  
VDD = 10 V,  
VGS = 4.5 V,  
ID = 1 A,  
RGEN = 6  
td(on)  
tr  
td(off)  
tf  
Turn–On Delay Time  
Turn–On Rise Time  
Turn–Off Delay Time  
Turn–Off Fall Time  
Total Gate Charge  
Gate–Source Charge  
Gate–Drain Charge  
8
7
16  
14  
32  
8
ns  
ns  
18  
4
ns  
ns  
VDS = 10 V,  
VGS = 4.5 V  
ID = 8 A,  
Qg  
Qgs  
Qgd  
6.5  
1.3  
1.9  
9
nC  
nC  
nC  
Drain–Source Diode Characteristics and Maximum Ratings  
IS  
Maximum Continuous Drain–Source Diode Forward Current  
2.7  
1.2  
A
V
VSD  
Drain–Source Diode Forward  
Voltage  
VGS = 0 V, IS = 2.7 A  
(Note 2)  
0.8  
Notes:  
1. RqJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of  
the drain pins. RqJC is guaranteed by design while RqCA is determined by the user's board design.  
a)  
R
qJA = 45°C/W when mounted on a  
b)  
R
qJA = 96°C/W when mounted  
1in2 pad of 2 oz copper  
on a minimum pad.  
Scale 1 : 1 on letter size paper  
2. Pulse Test: Pulse Width < 300ms, Duty Cycle < 2.0%  
D
P
3. Maximum current is calculated as:  
DS(ON)  
R
where PD is maximum power dissipation at TC = 25°C and RDS(on) is at TJ(max) and VGS = 10V. Package current limitation is 21A  
www.onsemi.com  
2
Typical Characteristics  
30  
1.8  
1.6  
1.4  
1.2  
1
VGS = 4.5V  
3.0V  
3.5V  
24  
2.5V  
VGS = 2.5V  
18  
12  
6
3.0V  
3.5V  
2.0V  
4.0V  
4.5V  
0.8  
0
0
6
12  
18  
24  
30  
0
1
2
3
4
5
ID, DRAIN CURRENT (A)  
VDS, DRAIN-SOURCE VOLTAGE (V)  
Figure 1. On-Region Characteristics.  
Figure 2. On-Resistance Variation with  
Drain Current and Gate Voltage.  
0.12  
1.8  
1.6  
1.4  
1.2  
1
ID = 4 A  
ID = 8 A  
VGS = 4.5V  
0.09  
TA = 125oC  
0.06  
TA = 25oC  
0.03  
0.8  
0.6  
0
-50  
-25  
0
25  
50  
75  
100  
125  
150  
175  
1
2
3
4
5
TJ, JUNCTION TEMPERATURE (oC)  
VGS, GATE TO SOURCE VOLTAGE (V)  
Figure 3. On-Resistance Variation with  
Temperature.  
Figure 4. On-Resistance Variation with  
Gate-to-Source Voltage.  
100  
15  
VGS = 0V  
VDS = 5V  
TA =-55oC  
25oC  
125oC  
10  
TA = 125oC  
12  
9
1
25oC  
0.1  
-55oC  
6
0.01  
0.001  
3
0.0001  
0
0
0.2  
0.4  
0.6  
0.8  
1
1.2  
0.5  
1
1.5  
2
2.5  
VSD, BODY DIODE FORWARD VOLTAGE (V)  
VGS, GATE TO SOURCE VOLTAGE (V)  
Figure 5. Transfer Characteristics.  
Figure 6. Body Diode Forward Voltage Variation  
with Source Current and Temperature.  
www.onsemi.com  
3
Typical Characteristics  
5
1200  
1000  
800  
600  
400  
200  
0
ID = 8 A  
VDS = 5V  
10V  
f = 1MHz  
VGS = 0 V  
4
3
2
1
0
15V  
CISS  
COSS  
CRSS  
0
4
8
12  
16  
20  
0
2
4
6
8
VDS, DRAIN TO SOURCE VOLTAGE (V)  
Qg, GATE CHARGE (nC)  
Figure 7. Gate Charge Characteristics.  
Figure 8. Capacitance Characteristics.  
1000  
100  
10  
100  
80  
60  
40  
20  
0
SINGLE PULSE  
R
qJA = 96°C/W  
TA = 25°C  
100ms  
RDS(ON) LIMIT  
1ms  
10ms  
100ms  
1s  
10s  
1
DC  
VGS = 10V  
SINGLE PULSE  
0.1  
0.01  
R
qJA = 96oC/W  
TA = 25oC  
0.1  
1
10  
100  
0.01  
0.1  
1
10  
100  
VDS, DRAIN-SOURCE VOLTAGE (V)  
t1, TIME (sec)  
Figure 9. Maximum Safe Operating Area.  
Figure 10. Single Pulse Maximum  
Power Dissipation.  
1
D = 0.5  
R
qJA(t) = r(t) + RqJA  
RqJA = 96 °C/W  
0.2  
0.1  
0.1  
0.05  
0.02  
P(pk)  
t1  
0.01  
t2  
0.01  
TJ - TA = P * RqJA(t)  
Duty Cycle, D = t1 / t2  
SINGLE PULSE  
0.001  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
1000  
Figure 11. Transient Thermal Response Curve.  
Thermal characterization performed using the conditions described in Note 1b.  
Transient thermal response will change depending on the circuit board design.  
www.onsemi.com  
4
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent  
coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.  
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,  
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or  
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer  
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not  
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification  
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized  
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and  
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such  
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This  
literature is subject to all applicable copyright laws and is not for resale in any manner.  
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