FDG6324L [ONSEMI]

集成式负载开关;
FDG6324L
型号: FDG6324L
厂家: ONSEMI    ONSEMI
描述:

集成式负载开关

开关 驱动 光电二极管 接口集成电路
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Features  
VDROP=0.2V @ VIN=12V, IL=0.36A. R(ON) = 0.55W. VDROP=0.2V @  
FDG6324L  
Integrated Load Switch  
VIN=5V, IL=0.27A. R(ON) = 0.75W.  
General Description  
Very small package outline (SC70-6).  
This device is intended to be configured as a load switch and  
is particularly suited for compact computer peripheral  
switching applications where 3V to 20V input and 0.6A output  
current capability are needed. This device features a small  
Control MOSFET (Q1) includes Zener protection for ESD  
ruggedness (> 6KV Human Body Model).  
High density cell design for extremely low on-resistance.  
N-Channel MOSFET (Q1) together with  
a large P-Channel  
Power MOSFET (Q2) in a single SC70-6 package.  
SuperSOTTM-8  
SuperSOTTM-6  
SO-8  
SOT-223  
SC70-6  
SOT-23  
VOUT , C1  
VOUT , C1  
R2  
VIN , R1  
3
2
4
5
6
EQUIVALENT APPLICATION  
Q2  
VDROP  
VON/OFF  
+
-
OUT  
IN  
Q1  
ON/OFF  
R1, C1  
1
pin 1  
See Application Circuit  
SC70-6  
Absolute Maximum Ratings TA = 25°C unless otherwise noted  
Symbol Parameter  
FDG6324L  
3 - 20  
Units  
Input Voltage Range  
VIN  
V
V
A
On/Off Voltage Range  
VON/OFF  
2.5 - 8  
0.6  
Load Current  
- Continuous (Note 1)  
- Pulsed (Note 1 & 3)  
(Note 2)  
I L  
1.8  
0.3  
Maximum Power Dissipation  
W
°C  
kV  
PD  
Operating and Storage Temperature Range  
-55 to 150  
6
TJ,TSTG  
ESD  
Electrostatic Discharge Rating  
Human Body Model (100pf/1500Ohm)  
THERMAL CHARACTERISTICS  
RqJ A  
Thermal Resistance, Junction-to-Ambient (Note 2)  
415  
°C/W  
©1999 Semiconductor Components Industries, LLC.  
October-2017, Rev. 4  
Publication Order Number:  
FDG6324L/D  
Electrical Characteristics(TA = 25°C unless otherwise noted)  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Units  
OFF CHARACTERISTICS  
Forward Leakage Current  
1
µA  
IFL  
VIN = 20 V, VON/OFF = 0 V  
ON CHARACTERISTICS (Note 3)  
Conduction Voltage Drop  
0.14  
0.16  
0.37  
0.58  
0.2  
0.2  
V
VDROP  
R(ON)  
IL  
VIN = 12 V, VON/OFF = 3.3 V, IL = 0.36 A  
VIN 5 V, VON/OFF = 3.3 V, IL = 0.27 A  
=
0.55  
0.75  
Q2 - Static On-Resistance  
Load Current  
VGS = -12 V, ID = -0.6 A  
W
VGS = -5 V, ID = -0.5 A  
0.36  
0.27  
A
VDROP = 0.2 V, VIN = 12 V, VON/OFF = 3.3 V  
VDROP = 0.2 V, VIN  
= 5 V, VON/OFF = 3.3 V  
Notes:  
1. Range of Vin can be up to 25V, but R1 and R2 must be scaled such that VGS of Q2 does not exceed -20V.  
2. RqJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. RqJC is  
guaranteed by design while RqCA is determined by the user's board design. Thermal ratings based on minimum mounting pad.  
3. Pulse Test: Pulse Width < 300µs, Duty Cycle< 2.0%  
FDG6324L Load Switch Application  
APPLICATION CIRCUIT  
Q2  
IN  
OUT  
R1  
C1  
Co  
Q1  
LOAD  
ON/OFF  
R2  
External Component Recommendation  
For Co £ 1uF applications:  
R1 is required to turn Q2 off.  
R2 and C1 are optional for slew rate control.  
First select R2, 100 -1KW, for slew rate control.  
Then select R1 such that the ratio R1/R2 is maintained between 10-100.  
SPICE model (FDG6324L.MOD) available at www.onsemi.com.  
www.onsemi.com  
2
Typical Electrical Characteristics(TA = 25 OC unless otherwise noted )  
1.2  
0.9  
0.6  
0.3  
0
1.2  
1
V
V
= 5V  
IN  
V
= 12V  
= 2.5 - 8V  
IN  
= 2.5 - 8V  
ON/OFF  
V
ON/OFF  
PW =300us, D 2%  
£
PW =300us, D 2%  
£
T
= 125°C  
J
T
= 125°C  
0.8  
0.6  
0.4  
0.2  
0
J
T
= 25°C  
J
T
= 25°C  
J
0
0.4  
0.8  
1.2  
1.6  
2
0
0.5  
1
1.5  
2
I , (A)  
L
I
, (A)  
L
Figure 2. Conduction Voltage Drop  
Variation with Load Current.  
Figure 1. Conduction Voltage Drop  
Variation with Load Current.  
1.5  
I
V
= 0.5A  
L
= 2.5 - 8V  
ON/OFF  
PW =300us, D 2%  
£
1.2  
0.9  
0.6  
0.3  
0
T
= 125°C  
J
25°C  
2
4
6
8
10  
12  
V
, (V)  
IN  
Figure 3. On-Resistance Variation  
with Input Voltage.  
1
D = 0.5  
0.5  
JA  
JA (t) = r(t) * R q  
R
q
0.2  
0.2  
R
=415 °C/W  
JA  
q
0.1  
0.1  
P(pk)  
0.05  
0.05  
1
t
0.02  
t2  
0.02  
0.01  
0.01  
T - T = P * R  
(t)  
Single Pulse  
JA  
J
A
q
Duty Cycle, D = t1/ t2  
0.005  
0.002  
0.0001  
0.001  
0.01  
0.1  
, TIME (sec)  
1
10  
100  
200  
t
1
Figure 4. Transient Thermal Response Curve.  
Thermal characterization performed using the conditions described in Note  
2.  
Transient thermal response will change depending on the circuit board  
www.onsemi.com  
3
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent  
coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.  
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,  
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or  
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer  
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not  
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification  
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized  
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and  
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such  
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This  
literature is subject to all applicable copyright laws and is not for resale in any manner.  
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