FDMC2514SDC [ONSEMI]
N 沟道 Dual Cool™ 33 PowerTrench® SyncFET™ 25V,40A,3.5mΩ;型号: | FDMC2514SDC |
厂家: | ONSEMI |
描述: | N 沟道 Dual Cool™ 33 PowerTrench® SyncFET™ 25V,40A,3.5mΩ 开关 脉冲 光电二极管 晶体管 |
文件: | 总9页 (文件大小:425K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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FDMC2514SDC
N-Channel Dual CoolTM 33 PowerTrench® SyncFETTM
25 V, 40 A, 3.5 mΩ
General Description
This
Semiconductor’s
N-Channel
MOSFET
advanced
is
produced
using
process.
ON
PowerTrench®
Features
Advancements in both silicon and Dual CoolTM package
technologies have been combined to offer the lowest rDS(on)
Dual CoolTM Top Side Cooling PQFN package
Max rDS(on) = 3.5 mΩ at VGS = 10 V, ID = 22.5 A
Max rDS(on) = 4.7 mΩ at VGS = 4.5 V, ID = 18 A
High performance technology for extremely low rDS(on)
SyncFET Schottky Body Diode
while maintaining excellent switching performance by extremely
low Junction-to-Ambient thermal resistance. This device has the
added benefit of an efficient monolithic Schottky body diode.
Applications
Synchronous Rectifier for DC/DC Converters
Telecom Secondary Side Rectification
RoHS Compliant
High End Server/Workstation Vcore Low Side
Pin 1
G
S
S
D
D
D
G
5
6
7
8
4
3
2
1
S
S
S
S
D
D
D
D
D
Dual CoolTM 33
Top
Bottom
MOSFET Maximum Ratings TA = 25°C unless otherwise noted
Symbol
VDS
VGS
Parameter
Ratings
Units
Drain to Source Voltage
Gate to Source Voltage
25
±20
V
V
(Note 4)
Drain Current -Continuous (Package limited)
-Continuous (Silicon limited)
-Continuous
TC = 25 °C
TC = 25 °C
TA = 25 °C
40
106
ID
A
(Note 1a)
24
-Pulsed
200
EAS
Single Pulse Avalanche Energy
Peak Diode Recovery dv/dt
Power Dissipation
(Note 3)
(Note 5)
84
mJ
dv/dt
2.0
V/ns
TC = 25 °C
TA = 25 °C
60
PD
W
Power Dissipation
(Note 1a)
3.0
TJ, TSTG
Operating and Storage Junction Temperature Range
-55 to +150
°C
Thermal Characteristics
RθJC
RθJC
RθJA
RθJA
RθJA
RθJA
RθJA
Thermal Resistance, Junction to Case
(Top Source)
(Bottom Drain)
(Note 1a)
5.8
2.1
42
Thermal Resistance, Junction to Case
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
(Note 1b)
105
17
°C/W
(Note 1i)
(Note 1j)
26
(Note 1k)
12
Package Marking and Ordering Information
Device Marking
Device
Package
Dual CoolTM 33
1
Reel Size
Tape Width
12 mm
Quantity
2514S
FDMC2514SDC
13’’
3000 units
©2010 Semiconductor Components Industries, LLC.
October-2017, Rev. 2
Publication Order Number:
FDMC2514SDC/D
Electrical Characteristics TJ = 25 °C unless otherwise noted
Symbol
Parameter
Test Conditions
Min
Typ
Max
Units
Off Characteristics
BVDSS
Drain to Source Breakdown Voltage
ID = 1 mA, VGS = 0 V
D = 10 mA, referenced to 25 °C
VDS = 20 V, VGS = 0 V
25
V
ΔBVDSS
ΔTJ
Breakdown Voltage Temperature
Coefficient
I
21
mV/°C
IDSS
IGSS
Zero Gate Voltage Drain Current
500
100
μA
Gate to Source Leakage Current, Forward VGS = 20 V, VDS = 0 V
nA
On Characteristics
VGS(th)
Gate to Source Threshold Voltage
VGS = VDS, ID = 1 mA
D = 10 mA, referenced to 25 °C
GS = 10 V, ID = 22.5 A
1.2
1.7
-5
3.0
V
ΔVGS(th)
ΔTJ
Gate to Source Threshold Voltage
Temperature Coefficient
I
mV/°C
V
2.5
3.6
3.5
122
3.5
4.7
4.5
rDS(on)
gFS
Static Drain to Source On Resistance
Forward Transconductance
VGS = 4.5 V, ID = 18 A
mΩ
VGS = 10 V, ID = 22.5 A, TJ = 125 °C
VDS = 5 V, ID = 22.5 A
S
Dynamic Characteristics
Ciss
Coss
Crss
Rg
Input Capacitance
2031
596
134
1.1
2705
795
205
2.4
pF
pF
pF
Ω
VDS = 13 V, VGS = 0 V,
f = 1 MHz
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
Switching Characteristics
td(on)
tr
td(off)
tf
Turn-On Delay Time
Rise Time
11
3.6
26
3
22
10
41
10
44
20
ns
ns
VDD = 13 V, ID = 22.5 A,
V
GS = 10 V, RGEN = 6 Ω
Turn-Off Delay Time
Fall Time
ns
ns
Qg
Total Gate Charge
Total Gate Charge
Gate to Source Gate Charge
Gate to Drain “Miller” Charge
VGS = 0 V to 10 V
VGS = 0 V to 4.5 V
31
14
6.5
3.9
nC
nC
nC
nC
Qg
VDD = 13 V,
ID = 22.5 A
Qgs
Qgd
Drain-Source Diode Characteristics
V
GS = 0 V, IS = 22.5 A
(Note 2)
(Note 2)
0.79
0.47
24
1.2
0.8
39
VSD
Source to Drain Diode Forward Voltage
V
VGS = 0 V, IS = 2 A
trr
Reverse Recovery Time
ns
IF = 22.5 A, di/dt = 300 A/μs
Qrr
Reverse Recovery Charge
19
34
nC
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2
Thermal Characteristics
RθJC
RθJC
RθJA
RθJA
RθJA
RθJA
RθJA
RθJA
RθJA
RθJA
RθJA
RθJA
RθJA
RθJA
Thermal Resistance, Junction to Case
(Top Source)
(Bottom Drain)
(Note 1a)
(Note 1b)
(Note 1c)
(Note 1d)
(Note 1e)
(Note 1f)
5.8
2.1
42
105
29
40
19
23
30
79
17
26
12
16
Thermal Resistance, Junction to Case
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
°C/W
(Note 1g)
(Note 1h)
(Note 1i)
(Note 1j)
(Note 1k)
(Note 1l)
NOTES:
1. R
is determined with the device mounted on a FR-4 board using a specified pad of 2 oz copper as shown below. R
is guaranteed by design while R is determined
θCA
θJA
θJC
by the user's board design.
b. 105 °C/W when mounted on
a minimum pad of 2 oz copper
a. 42 °C/W when mounted on
a 1 in pad of 2 oz copper
2
2
c. Still air, 20.9x10.4x12.7mm Aluminum Heat Sink, 1 in pad of 2 oz copper
d. Still air, 20.9x10.4x12.7mm Aluminum Heat Sink, minimum pad of 2 oz copper
2
e. Still air, 45.2x41.4x11.7mm Aavid Thermalloy Part # 10-L41B-11 Heat Sink, 1 in pad of 2 oz copper
f. Still air, 45.2x41.4x11.7mm Aavid Thermalloy Part # 10-L41B-11 Heat Sink, minimum pad of 2 oz copper
2
g. 200FPM Airflow, No Heat Sink,1 in pad of 2 oz copper
h. 200FPM Airflow, No Heat Sink, minimum pad of 2 oz copper
2
i. 200FPM Airflow, 20.9x10.4x12.7mm Aluminum Heat Sink, 1 in pad of 2 oz copper
j. 200FPM Airflow, 20.9x10.4x12.7mm Aluminum Heat Sink, minimum pad of 2 oz copper
2
k. 200FPM Airflow, 45.2x41.4x11.7mm Aavid Thermalloy Part # 10-L41B-11 Heat Sink, 1 in pad of 2 oz copper
l. 200FPM Airflow, 45.2x41.4x11.7mm Aavid Thermalloy Part # 10-L41B-11 Heat Sink, minimum pad of 2 oz copper
2. Pulse Test: Pulse Width < 300 μs, Duty cycle < 2.0%.
3. E of 84 mJ is based on starting T = 25 °C, L = 1 mH, I = 13 A, V = 23 V, V = 10 V. 100% test at L = 0.3 mH, I = 20 A.
AS
J
AS
DD
GS
AS
4. As an N-ch device, the negative Vgs rating is for low duty cycle pulse ocurrence only. No continuous rating is implied.
o
5. I ≤ 22.5 A, di/dt ≤ 200 A/μs, V ≤ BV
, Starting T = 25 C.
J
SD
DD
DSS
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3
Typical Characteristics TJ = 25 °C unless otherwise noted
8
7
6
5
4
3
2
1
0
120
VGS = 10 V
PULSE DURATION = 80 μs
DUTY CYCLE = 0.5% MAX
VGS = 4.5 V
VGS = 2.5 V
VGS = 3 V
VGS = 3.5 V
90
PULSE DURATION = 80 μs
DUTY CYCLE = 0.5% MAX
VGS = 3 V
60
VGS = 3.5 V
VGS = 4.5 V
30
VGS = 2.5 V
VGS = 10 V
0
0
30
60
ID, DRAIN CURRENT (A)
90
120
0
1
2
3
4
5
VDS, DRAIN TO SOURCE VOLTAGE (V)
Figure2. N o r m a l i z e d O n - R e s i s ta n c e
vs Drain Current and Gate Voltage
Figure 1. On-Region Characteristics
1.5
12
PULSE DURATION = 80 μs
DUTY CYCLE = 0.5% MAX
ID = 22.5 A
ID = 22.5 A
VGS = 10 V
1.4
1.3
1.2
1.1
1.0
0.9
0.8
10
8
6
TJ = 125 o
C
4
2
TJ = 25 o
C
0
-75 -50 -25
0
25 50 75 100 125 150
2
4
6
8
10
TJ, JUNCTION TEMPERATURE (oC)
VGS, GATE TO SOURCE VOLTAGE (V)
F i gu re 3 . N orma li zed On - Res is ta nc e
vs Junction Temperature
Figure4. On-Resistance vs Gate to
Source Voltage
120
200
100
VGS = 0 V
PULSE DURATION = 80 μs
DUTY CYCLE = 0.5% MAX
10
90
60
30
0
TJ = 125 o
C
VDS = 5 V
1
TJ = 25 oC
TJ = 125 o
C
0.1
TJ = 25 o
C
TJ = -55 o
C
0.01
0.001
TJ = -55 o
C
1.0
1.5
2.0
2.5
3.0
3.5
4.0
0.0
0.2
0.4
0.6
0.8
1.0
1.2
VGS, GATE TO SOURCE VOLTAGE (V)
VSD, BODY DIODE FORWARD VOLTAGE (V)
Figure 5. Transfer Characteristics
Figure6. Source to Drain Diode
Forward Voltage vs Source Current
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4
Typical Characteristics TJ = 25 °C unless otherwise noted
3000
1000
10
ID = 22.5 A
8
Ciss
VDD = 16 V
VDD = 10 V
6
4
2
0
VDD = 13 V
Coss
f = 1 MHz
100
60
Crss
V
GS
= 0 V
30
0.1
1
10
0
4
8
12
16
20
24
28
32
VDS, DRAIN TO SOURCE VOLTAGE (V)
Qg, GATE CHARGE (nC)
Figure 7. Gate Charge Characteristics
Figure8. C a p a c i t a n c e v s D r a i n
to Source Voltage
120
80
40
0
30
R
θJC = 2.1 oC/W
VGS = 10 V
TJ = 25 oC
10
TJ = 100 o
C
VGS = 4.5 V
TJ = 125 o
C
Limited by Package
50
1
0.01
0.1
1
10
100
25
75
100
125
150
TC, CASE TEMPERATURE (oC)
tAV, TIME IN AVALANCHE (ms)
Figure9. U n c l a m p e d I n d u c t i v e
Switching Capability
Figure 10. Maximum Continuous Drain
Current vs Case Temperature
300
100
2000
SINGLE PULSE
RθJA = 105 oC/W
1000
100
10
100 us
T
A = 25 o
C
1ms
10
1
10 ms
100 ms
1 s
THIS AREA IS
LIMITED BY r
DS(on)
SINGLE PULSE
TJ = MAX RATED
0.1
0.01
10 s
DC
R
θJA = 105 oC/W
A = 25 oC
T
1
0.5
10-4
10-3
10-2
t, PULSE WIDTH (sec)
10-1
1
10
0.01
0.1
1
10
100
100 1000
VDS, DRAIN to SOURCE VOLTAGE (V)
Figure 11. Forward Bias Safe
Operating Area
Figure 12. Single Pulse Maximum
Power Dissipation
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5
Typical Characteristics TJ = 25 °C unless otherwise noted
2
DUTY CYCLE-DESCENDING ORDER
1
D = 0.5
0.2
0.1
0.05
0.1
P
0.02
0.01
DM
t
0.01
1
t
2
NOTES:
DUTY FACTOR: D = t /t
SINGLE PULSE
1
2
R
θJA = 105 oC/W
PEAK T = P
J
x Z
x R
+ T
DM
θJA
θJA A
0.001
0.0005
10-4
10-3
10-2
10-1
t, RECTANGULAR PULSE DURATION (sec)
1
10
100
1000
Figure 13. Junction-to-Ambient Transient Thermal Response Curve
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6
Typical Characteristics (continued)
SyncFET Schottky body diode
Characteristics
ON Semiconductor’s SyncFET process embeds a Schottky
diode in parallel with PowerTrench MOSFET. This diode
Schottky barrier diodes exhibit significant leakage at high tem-
perature and high reverse voltage. This will increase the power
in the device.
exhibits
similar
characteristics to
a
discrete external
Schottky diode in parallel with
a
MOSFET. Figure 13
characteristic of the
shows
the
reverse
recovery
FDMC2514SDC.
10-2
25
20
15
10
5
TJ = 125 o
C
10-3
10-4
10-5
10-6
TJ = 100 o
C
di/dt = 300 A/μs
0
TJ = 25 o
C
-5
0
50
100
150
200
0
5
10
15
20
25
TIME (ns)
VDS, REVERSE VOLTAGE (V)
Figure 14. SyncFET body diode reverse
leakage versus drain-source voltage
Figure 13. FDMC2514SDC SyncFET body
diode reverse recovery characteristic
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7
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent
coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This
literature is subject to all applicable copyright laws and is not for resale in any manner.
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