FDMS86255 [ONSEMI]

N 沟道屏蔽门极 PowerTrench® MOSFET 150 V,45A,12.4mΩ;
FDMS86255
型号: FDMS86255
厂家: ONSEMI    ONSEMI
描述:

N 沟道屏蔽门极 PowerTrench® MOSFET 150 V,45A,12.4mΩ

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DATA SHEET  
www.onsemi.com  
MOSFET – N-Channel,  
Shielded Gate,  
POWERTRENCH®  
150ꢀV, 62ꢀA, 12.4ꢀmW  
Pin 1  
S
S
S
G
Pin 1  
D
D
D
D
Top  
Bottom  
FDMS86255  
PQFN8 5X6, 1.27P  
CASE 483AG  
Description  
This NChannel MOSFET is produced using onsemi advanced  
POWERTRENCH process that incorporates Shielded Gate  
technology. This process has been optimized for the onstate  
resistance and yet maintain superior switching performance.  
D
D
D
S
S
S
Features  
Shielded Gate MOSFET Technology  
D
G
Max R  
Max R  
= 12.4 mW at V = 10 V, I = 10 A  
GS D  
DS(on)  
= 15.5 mW at V = 6 V, I = 8 A  
DS(on)  
GS  
D
Advanced Package and Silicon Combination for Low R  
and  
MARKING DIAGRAM  
DS(on)  
High Efficiency  
Next Generation Enhanced Body Diode Technology, Engineered for  
Soft Recovery  
$Y&Z&3&K  
MSL1 Robust Package Design  
100% UIL Tested  
RoHS Compliant  
$Y  
= Logo  
= Assembly Location  
= Date Code (Year and Week)  
= Specific Device Code  
These Device is Halogen Free  
&Z  
&3  
&K  
Applications  
OringFET / Load Switching  
Synchronous Rectification  
DCDC Conversion  
ORDERING INFORMATION  
See detailed ordering and shipping information on  
page 6 of this data sheet.  
Publication Order Number:  
© Semiconductor Components Industries, LLC, 2002  
1
FDMS86255/D  
September, 2022 Rev. 1  
FDMS86255  
MOSFET MAXIMUM RATINGS T = 25 °C unless otherwise noted  
A
Symbol  
Parameter  
Rating  
Unit  
V
V
DS  
V
GS  
Drain to Source Voltage  
Gate to Source Voltage  
150  
20  
62  
V
I
D
Drain Current Continuous, T = 25°C  
A
C
Continuous, T = 25°C (Note 1a)  
10  
A
Pulsed (Note 4)  
271  
E
Single Pulse Avalanche Energy (Note 3)  
541  
mJ  
W
AS  
P
Power Dissipation, T = 25°C  
113  
D
C
Power Dissipation, T = 25°C (Note 1a)  
2.7  
A
T
T
Operating and Storage Junction Temperature Range  
55 to +150  
°C  
J, STG  
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality  
should not be assumed, damage may occur and reliability may be affected.  
THERMAL CHARACTERISTICS  
Symbol  
Parameter  
Rating  
1.1  
Unit  
R
Thermal Resistance, Junction to Case  
Thermal Resistance, Junction to Ambient (Note 1a)  
°C/W  
θ
JC  
JA  
R
45  
θ
ELECTRICAL CHARACTERISTICS T = 25°C unless otherwise noted  
A
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
OFF CHARACTERISTICS  
BV  
Drain to Source Breakdown Voltage  
I
I
= 250 μA, V = 0 V  
150  
V
DSS  
D
GS  
ΔBV  
ΔT  
Breakdown Voltage Temperature  
Coefficient  
= 250 μA, referenced to 25°C  
109  
mV/°C  
DSS  
D
J
I
Zero Gate Voltage Drain Current  
Gate to Source Leakage Current  
V
V
= 120 V, V = 0 V  
1
μA  
DSS  
GSS  
DS  
GS  
I
=
20 V, V = 0 V  
100  
nA  
GS  
DS  
ON CHARACTERISTICS  
VGS(th)  
Gate to Source Threshold Voltage  
V
I
= V , I = 250 μA  
2.0  
3.0  
4.0  
V
GS  
DS D  
ΔVGS(th) Gate to Source Threshold Voltage  
= 250 μA, referenced to 25°C  
11  
mV/°C  
D
Temperature Coefficient  
ΔT  
J
R
Static Drain to Source On Resistance  
V
GS  
V
GS  
V
GS  
V
DS  
= 10 V, I = 10 A  
9.5  
11.5  
19  
12.4  
15.5  
25  
mΩ  
DS(ON)  
D
= 6 V, I = 8 A  
D
= 10 V, I = 10 A, T = 125°C  
D
J
g
FS  
Forward Transconductance  
= 5 V, I = 10 A  
35  
S
D
DYNAMIC CHARACTERISTICS  
C
Input Capacitance  
V
= 75 V, V = 0 V,  
3200  
291  
11  
4480  
410  
20  
pF  
pF  
pF  
Ω
ISS  
DS  
GS  
f = 1 MHz  
C
Output Capacitance  
Reverse Transfer Capacitance  
Gate Resistance  
OOS  
Crss  
R
0.1  
0.7  
2.1  
g
SWITCHING CHARACTERISTICS  
t
TurnOn Delay Time  
Rise Time  
V
V
= 75 V, I = 10 A,  
21  
4.5  
28  
34  
10  
45  
12  
63  
41  
ns  
ns  
ns  
ns  
nC  
nC  
d(on)  
DD  
GS  
D
= 10 V, R  
= 6 Ω  
GEN  
t
r
t
TurnOff Delay Time  
Fall Time  
d(off)  
t
f
6.2  
45  
Q
Q
Total Gate Charge  
Total Gate Charge  
V
V
= 0 V to 10 V  
= 0 V to 6 V  
V
I
= 75 V,  
g
g
GS  
DD  
D
= 10 A  
29  
GS  
www.onsemi.com  
2
FDMS86255  
ELECTRICAL CHARACTERISTICS (continued)T = 25°C unless otherwise noted  
A
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
SWITCHING CHARACTERISTICS  
Qgs  
Qgd  
Gate to Source Charge  
14  
nC  
nC  
Gate to Drain “Miller” Charge  
8.8  
DRAINSOURCE DIODE CHARACTERISTICS  
V
Source to Drain Diode Forward  
Voltage  
V
V
= 0 V, I = 1.9 A (Note 2)  
0.7  
0.8  
87  
1.2  
1.3  
V
SD  
GS  
S
= 0 V, I = 10 A (Note 2)  
GS  
S
t
Reverse Recovery Time  
I = 10 A, di/dt = 100 A/ms  
F
139  
264  
ns  
rr  
Q
Reverse Recovery Charge  
165  
nC  
rr  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
2
1. R  
is determined with the device mounted on a 1 in pad 2 oz copper pad on a 1.5 x 1.5 in. board of FR4 material. R  
is guaranteed  
JC  
q
q
JA  
by design while R  
is determined by the user’s board design.  
θ
CA  
b. 115°C/W when mounted on a  
minimum pad of 2 oz copper.  
2
a. 45°C/W when mounted on a 1 in  
pad of 2 oz copper.  
2. Pulse Test: Pulse Width < 300 ms, Duty cycle < 2.0%.  
3. E of 541 mJ is based on starting T = 25 °C, L = 3 mH, I = 19 A, V = 150 V, V = 10 V. 100% tested at L = 0.1 mH, I = 60 A.  
AS  
J
AS  
DD  
GS  
AS  
4. Pulse Id refers to Figure.11 Forward Bias Safe Operation Area.  
www.onsemi.com  
3
 
FDMS86255  
TYPICAL CHARACTERISTICS T = 25°C unless otherwise noted  
J
4
100  
80  
V
GS  
= 4.5 V  
V
GS  
= 10 V  
V
= 5 V  
GS  
3
2
1
0
V
GS  
= 6 V  
60  
V
GS  
= 5.5 V  
V
GS  
= 5.5 V  
40  
PULSE DURATION = 80 ms  
DUTY CYCLE = 0.5% MAX  
V
GS  
= 5 V  
V
= 10 V  
V
GS  
= 6 V  
20  
0
GS  
PULSE DURATION = 80 ms  
DUTY CYCLE = 0.5% MAX  
V
GS  
= 4.5 V  
0
20  
40  
60  
80  
100  
0
1
2
3
4
5
V
DS  
, DRAIN TO SOURCE VOLTAGE (V)  
I , DRAIN CURRENT (A)  
D
Figure 1. OnRegion Characteristics  
Figure 2. Normalized OnResistance vs  
Drain Current and Gate Voltage  
50  
40  
30  
20  
2.5  
2.0  
2.0  
1.5  
I
V
= 10 A  
= 10 V  
PULSE DURATION = 80 ms  
DUTY CYCLE = 0.5% MAX  
D
GS  
I
D
= 10 A  
T = 125°C  
J
T = 25°C  
J
1.0  
0.5  
10  
0
4
6
8
10  
60  
30  
0
30  
60  
90  
120  
150  
T , JUNCTION TEMPERATURE (°C)  
J
V
GS  
, GATE TO SOURCE VOLTAGE (V)  
Figure 3. Normalized OnResistance vs  
Figure 4. OnResistance vs Gate to  
Junction Temperature  
Source Voltage  
100  
80  
100  
10  
1
V
GS  
= 0 V  
PULSE DURATION = 80 ms  
DUTY CYCLE = 0.5% MAX  
V
DS  
= 5 V  
T = 150°C  
J
T = 150°C  
J
60  
T = 25°C  
J
T = 25°C  
J
40  
0.1  
20  
0
0.01  
T = 55°C  
J
T = 55°C  
J
0.001  
2
3
4
5
6
7
1.2  
0.0  
0.2  
0.4  
0.6  
0.8  
1.0  
SD  
V
GS  
, GATE TO SOURCE VOLTAGE (V)  
V
, BODY DIODE FORWARD VOLTAGE (V)  
Figure 5. Transfer Characteristics  
Figure 6. Source to Drain Diode Forward  
Voltage vs Source Current  
www.onsemi.com  
4
FDMS86255  
TYPICAL CHARACTERISTICS (continued) T = 25°C unless otherwise noted  
J
10000  
10  
8
I
= 10 A  
D
C
iss  
1000  
100  
10  
V
= 75 V  
DD  
C
oss  
6
V
DD  
= 50 V  
V
DD  
= 100 V  
4
C
rss  
2
0
f = 1 MHz  
= 0 V  
V
GS  
5
0.1  
1
10  
100  
0
10  
20  
30  
40  
50  
Qg, GATE CHARGE (nC)  
V
DS  
, DRAIN TO SOURCE VOLTAGE (V)  
Figure 7. Gate Charge Characteristics  
Figure 8. Capacitance vs Drain to Source  
Voltage  
80  
64  
48  
32  
100  
T = 25°C  
J
T = 100°C  
J
V
GS  
= 10 V  
10  
V
= 6 V  
GS  
T = 125°C  
16  
0
J
R
= 1.1°C/W  
θ
JC  
1
0.01  
25  
50  
75  
100  
125  
150  
0.1  
1
10  
100 300  
t , TIME IN AVALANCHE (ms)  
AV  
T , CASE TEMPERATURE (°C)  
C
Figure 9. Unclamped Inductive Switching  
Capability  
Figure 10. Maximum Continuous Drain  
Current vs Case Temperature  
1000  
100  
10  
20000  
10000  
SINGLE PULSE  
= 1.1°C/W  
R
θ
JC  
T
C
= 25°C  
10 ms  
1000  
100 ms  
THIS AREA IS  
LIMITED BY R  
1 ms  
1
DS(on)  
100  
10  
10 ms  
DC  
SINGLE PULSE  
TJ = MAX TARED  
0.1  
R
= 1.1°C/W  
θ
JC  
CURVE BENT TO  
MEASURED DATA  
T
C
= 25°C  
0.01  
2  
1  
5  
4  
3  
10  
10  
1
0.1  
1
10  
100  
700  
10  
10  
10  
V
DS  
, DRAINSOURCE VOLTAGE (V)  
t, PULSE WIDTH (sec)  
Figure 11. Forward Bias Safe Operating Area  
Figure 12. Single Pulse Maximum Power  
Dissipation  
www.onsemi.com  
5
FDMS86255  
TYPICAL CHARACTERISTICS (continued) T = 25°C unless otherwise noted  
J
2
1
D = 0.5  
0.2  
P
DM  
0.1  
0.1  
0.05  
0.02  
0.01  
t
1
t
2
Notes:  
(t)= r(t) x R  
0.01  
Z
q
q
JC  
JC  
SINGLE PULSE  
R
= 1.1°C/W  
q
JC  
Peak T = P  
x Z (t) + T  
q
JC C  
J
DM  
Duty Cycle, D = t /t  
1
2
0.001  
5  
4  
3  
2  
1  
10  
10  
10  
10  
10  
1
t, RECTANGULAR PULSE DURATION (sec)  
Figure 13. Transient Thermal Response Curve  
ORDERING INFORMATION  
Device Marking  
Device  
Package  
Reel Size  
Tape Width  
Shipping  
3000 / Tape and Reel  
FDMS86255  
FDMS86255  
PQFN8  
(Halogen Free)  
13"  
12 mm  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specification Brochure, BRD8011/D.  
www.onsemi.com  
6
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
PQFN8 5X6, 1.27P  
CASE 483AG  
ISSUE A  
DATE 25 JUN 2021  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON13657G  
PQFN8 5X6, 1.27P  
PAGE 1 OF 1  
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