FDP5500-F085 [ONSEMI]

N 沟道,UltraFET 功率 MOSFET,55V,80A,7mΩ;
FDP5500-F085
型号: FDP5500-F085
厂家: ONSEMI    ONSEMI
描述:

N 沟道,UltraFET 功率 MOSFET,55V,80A,7mΩ

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FDP5500-F085  
N-Channel UltraFET Power MOSFET  
55V, 80A, 7mΩ  
Applications  
Features  
„ Typ rDS(on) = 5.1mat VGS = 10V, ID = 80A  
„ Typ Qg(10) = 114nC at VGS = 10V  
„ Simulation Models  
-Temperature Compensated PSPICE and SABERTM  
Models  
„ DC Linear Mode Control  
„ Solenoid and Motor Control  
„ Switching Regulators  
„ Automotive Systems  
„ Peak Current vs Pulse Width Curve  
„ UIS Rating Curve  
„ Qualified to AEC Q101  
„ RoHS Compliant  
Package  
Symbol  
D
DRAIN  
(FLANGE)  
SOURCE  
DRAIN  
GATE  
G
TO-220AB  
S
©2009 Semiconductor Components Industries, LLC.  
September-2017, Rev. 1  
Publication Order Number:  
FDP5500-F085/D  
MOSFET Maximum Ratings TC = 25°C unless otherwise noted  
Symbol  
VDSS  
Parameter  
Ratings  
Units  
Drain to Source Voltage  
(Note 1)  
(Note 1)  
55  
V
V
V
VDGR  
VGS  
Drain to Gate Voltage (RGS = 20kΩ)  
Gate to Source Voltage  
55  
±20  
Drain Current Continuous (TC < 135oC, VGS = 10V)  
80  
ID  
A
Pulsed  
See Figure 4  
860  
EAS  
PD  
Single Pulse Avalanche Energy  
Power Dissipation  
Derate above 25oC  
(Note 2)  
mJ  
W
W/oC  
375  
2.5  
TJ, TSTG Operating and Storage Temperature  
-55 to + 175  
300  
TL  
Max. Lead Temp. for Soldering (at 1.6mm from case for 10sec)  
Max. Package Temp. for Soldering (Package Body for 10sec)  
oC  
Tpkg  
260  
Thermal Characteristics  
RθJC  
RθJA  
Thermal Resistance Junction to Case  
Thermal Resistance Junction to Ambient TO-220AB, 1in2 copper pad area  
0.4  
62  
oC/W  
oC/W  
Package Marking and Ordering Information  
Device Marking  
Device  
Package  
Reel Size  
Tape Width  
N/A  
Quantity  
FDP5500  
FDP5500-F085  
TO-220AB  
Tube  
50 units  
Electrical Characteristics TC = 25°C unless otherwise noted  
Symbol  
Parameter  
Test Conditions  
Min  
Typ  
Max  
Units  
Off Characteristics  
BVDSS  
IDSS  
Drain to Source Breakdown Voltage  
Zero Gate Voltage Drain Current  
Gate to Source Leakage Current  
ID = 250µA, VGS = 0V  
55  
-
-
-
-
-
-
1
V
V
DS = 50V, VGS = 0V  
µA  
nA  
VDS = 45V  
TC = 150oC  
-
250  
±100  
IGSS  
VGS = ±20V  
-
On Characteristics  
VGS(th)  
rDS(on)  
Gate to Source Threshold Voltage  
Drain to Source On Resistance  
VGS = VDS, ID = 250µA  
2
-
2.8  
5.1  
4
7
V
ID = 80A, VGS= 10V  
mΩ  
Dynamic Characteristics  
Ciss  
Input Capacitance  
-
-
-
-
-
-
-
-
3565  
1310  
395  
207  
114  
6.6  
-
pF  
pF  
pF  
nC  
nC  
nC  
nC  
nC  
VDS = 25V, VGS = 0V,  
f = 1MHz  
Coss  
Output Capacitance  
-
-
Crss  
Reverse Transfer Capacitance  
Total Gate Charge at 20V  
Total Gate Charge at 10V  
Threshold Gate Charge  
Gate to Source Gate Charge  
Gate to Drain “Miller“ Charge  
Qg(TOT)  
Qg(10)  
Qg(TH)  
Qgs  
VGS = 0 to 20V  
269  
148  
8.6  
-
VDD = 30V  
VGS = 0 to 10V  
VGS = 0 to 2V  
ID = 80A  
RL = 0.4Ω  
Ig = 1.0mA  
17.2  
52  
Qgd  
-
www.onsemi.com  
2
Electrical Characteristics TC = 25oC unless otherwise noted  
Symbol  
Parameter  
Test Conditions  
Min  
Typ  
Max  
Units  
Switching Characteristics  
ton  
td(on)  
tr  
Turn-On Time  
Turn-On Delay Time  
Rise Time  
-
-
-
-
-
-
-
75  
-
ns  
ns  
ns  
ns  
ns  
ns  
12  
34  
37  
23  
-
VDD = 30V, ID = 80A,  
RL = 0.4, VGS = 10V,  
-
td(off)  
tf  
Turn-Off Delay Time  
Fall Time  
-
RGS = 2.5Ω  
-
toff  
Turn-Off Time  
96  
Drain-Source Diode Characteristics  
VSD  
trr  
Source to Drain Diode Voltage  
Reverse Recovery Time  
ISD = 80A  
-
-
-
0.9  
58  
71  
1.25  
75  
V
ns  
nC  
IF = 80A, dISD/dt = 100A/µs  
Qrr  
Reverse Recovery Charge  
92  
Notes:  
o
o
1: Starting T = 25 C to175 C.  
2: Starting T = 25 C, L = 0.42mH, I = 64A  
J
o
J
AS  
www.onsemi.com  
3
Typical Characteristics  
160  
120  
80  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
VGS = 10V  
40 CURRENT LIMITED  
BY PACKAGE  
0
25  
50  
75  
100  
125  
150  
oC  
175  
0
25  
50  
75  
100  
125  
150  
175  
TC, CASE TEMPERATURE(oC)  
TC, CASE TEMPERATURE  
(
)
Figure 2. Maximum Continuous Drain Current vs  
Case Temperature  
Figure 1. Normalized Power Dissipation vs Case  
Temperature  
2
1
DUTY CYCLE - DESCENDING ORDER  
D = 0.50  
0.20  
P
DM  
0.10  
0.05  
0.02  
t
1
0.1  
t
2
0.01  
NOTES:  
DUTY FACTOR: D = t /t  
1
2
PEAK T = P  
x Z  
x R  
+ T  
J
DM  
θJA  
θJA C  
SINGLE PULSE  
10-4  
0.01  
10-5  
10-3  
10-2  
10-1  
1
10  
t, RECTANGULAR PULSE DURATION(s)  
Figure 3. Normalized Maximum Transient Thermal Impedance  
10000  
1000  
100  
TC = 25oC  
FOR TEMPERATURES  
ABOVE 25oC DERATE PEAK  
TRANSCONDUCTANCE  
MAY LIMIT CURRENT  
IN THIS REGION  
VGS = 10V  
CURRENT AS FOLLOWS:  
175 - TC  
I = I2  
150  
SINGLE PULSE  
10  
10-5  
10-4  
10-3  
10-2  
10-1  
1
10  
t, RECTANGULAR PULSE DURATION(s)  
Figure 4. Peak Current Capability  
www.onsemi.com  
4
Typical Characteristics  
1000  
100  
10  
1000  
If R = 0  
= (L)(I )/(1.3*RATED BV  
t
AV  
- V  
)
AS  
DSS  
DD  
If R  
AV  
0  
100us  
1ms  
t
= (L/R)ln[(I *R)/(1.3*RATED BV  
- V ) +1]  
100  
10  
AS  
DSS DD  
STARTING TJ = 25oC  
LIMITED  
BY PACKAGE  
10ms  
DC  
STARTING TJ = 150oC  
1
OPERATION IN THIS SINGLE PULSE  
AREA MAY BE  
LIMITED BY r  
T
= MAX RATED  
J
o
DS(on)  
T
C
= 25 C  
1
0.01  
0.1  
0.1  
1
10  
100  
1000 5000  
1
10  
100 200  
tAV, TIME IN AVALANCHE (ms)  
VDS, DRAIN TO SOURCE VOLTAGE (V)  
NOTE: Refer to ON Semiconductor Application Notes AN7514 and AN7515  
Figure 6. Unclamped Inductive Switching  
Capability  
Figure 5. Forward Bias Safe Operating Area  
160  
160  
PULSE DURATION = 80µs  
DUTY CYCLE = 0.5% MAX  
PULSE DURATION = 80  
DUTY CYCLE = 0.5% MAX  
DD = 5V  
µs  
VGS = 10V  
VGS = 6V  
V
120  
80  
40  
0
120  
80  
40  
0
VGS = 5.5V  
TJ = 175oC  
VGS = 5V  
TJ = -55oC  
TJ = 25oC  
VGS = 4.5V  
0
1
2
3
4
5
0
1
2
3
4
5
6
7
VDS, DRAIN TO SOURCE VOLTAGE (V)  
VGS, GATE TO SOURCE VOLTAGE (V)  
Figure 7. Transfer Characteristics  
Figure 8. Saturation Characteristics  
2.2  
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
40  
30  
20  
10  
0
PULSE DURATION = 80  
DUTY CYCLE = 0.5% MAX  
µs  
PULSE DURATION = 80µs  
DUTY CYCLE = 0.5% MAX  
I
D = 80A  
TJ = 175oC  
ID = 80A  
TJ = 25oC  
VGS = 10V  
-80  
-40  
0
40  
80  
120  
160  
200  
4
6
8
10  
TJ, JUNCTION TEMPERATURE  
(
oC  
)
VGS, GATE TO SOURCE VOLTAGE (V)  
Figure 9. Drain to Source On-Resistance  
Variation vs Gate to Source Voltage  
Figure 10. Normalized Drain to Source On  
Resistance vs Junction Temperature  
www.onsemi.com  
5
Typical Characteristics  
1.2  
1.15  
1.10  
1.05  
1.00  
0.95  
0.90  
0.85  
VGS  
ID  
=
VDS  
ID = 1mA  
=
250µA  
1.0  
0.8  
0.6  
0.4  
-80  
-40  
0
40  
80  
120  
160  
oC  
200  
-80  
-40  
0
40  
80  
120  
160  
oC  
200  
TJ, JUNCTION TEMPERATURE  
(
)
TJ, JUNCTION TEMPERATURE  
(
)
Figure 11. Normalized Gate Threshold Voltage vs  
Junction Temperature  
Figure 12. Normalized Drain to Source  
Breakdown Voltage vs Junction Temperature  
10  
10000  
ID = 80A  
8
6
4
2
0
VDD = 30V  
VDD = 40V  
VDD = 20V  
Ciss  
1000  
Coss  
f = 1MHz  
VGS = 0V  
Crss  
100  
0.1  
0
20  
40  
60  
80  
100  
120  
140  
1
10  
80  
Qg, GATE CHARGE(nC)  
VDS, DRAIN TO SOURCE VOLTAGE  
(V)  
Figure 13. Capacitance vs Drain to Source  
Voltage  
Figure 14. Gate Charge vs Gate to Source Voltage  
www.onsemi.com  
6
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent  
coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.  
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,  
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or  
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer  
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not  
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification  
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized  
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and  
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such  
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This  
literature is subject to all applicable copyright laws and is not for resale in any manner.  
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