FDWS86369-F085 [ONSEMI]

N-Channel PowerTrench® MOSFET 80V, 65A, 7.5mΩ;
FDWS86369-F085
型号: FDWS86369-F085
厂家: ONSEMI    ONSEMI
描述:

N-Channel PowerTrench® MOSFET 80V, 65A, 7.5mΩ

文件: 总7页 (文件大小:401K)
中文:  中文翻译
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DATA SHEET  
www.onsemi.com  
MOSFET – N-Channel,  
POWERTRENCH)  
V
R
MAX  
I MAX  
D
DSS  
DS(ON)  
80 V  
7.5 mW @ 10 V  
65 A  
80 V, 65 A, 7.5 mW  
ELECTRICAL CONNECTION  
FDWS86369-F085  
Features  
Typ R  
Typ Q  
= 5.9 mW at V = 10 V; I = 65 A  
GS D  
DS(on)  
= 35 nC at V = 10 V; I = 65 A  
g(tot)  
GS  
D
UIS Capability  
Wettable Flanks for Automatic Optical Inspection (AOI)  
AECQ101 Qualified  
These Devices are PbFree and are RoHS Compliant  
NChannel MOSFET  
Top  
Bottom  
Applications  
D
D
D
Automotive Engine Control  
PowerTrain Management  
Solenoid and Motor Drivers  
Integrated Starter/Alternator  
Primary Switch for 12 V Systems  
D
G
S
S
S
Pin 1  
DFNW8  
CASE 507AU  
MOSFET MAXIMUM RATINGS (T = 25°C, Unless otherwise specified)  
J
MARKING DIAGRAM  
Symbol  
Parameter  
Drain to Source Voltage  
Gate to Source Voltage  
Ratings  
80  
Unit  
V
V
DSS  
V
GS  
20  
V
I
D
Drain Current (T = 25°C)  
A
C
ON  
AYWWWL  
FDWS  
86369  
Continuous (V = 10 V) (Note 1)  
65  
(see Fig.  
141)  
GS  
Pulsed  
E
AS  
Single Pulse Avalanche Energy  
(Note 2)  
27  
mJ  
P
D
Power Dissipation  
Derate above 25°C  
107  
0.71  
W
W/°C  
A
Y
= Assembly Location  
= Year  
WW  
WL  
FDWS  
86369  
= Work Week  
= Assembly Lot  
= Device Code  
= Device Code  
T , T  
Operating and Storage Temperature  
55 to +175  
°C  
J
STG  
R
Thermal Resistance  
(Junction to case)  
1.4  
°C/W  
θ
JC  
R
Maximum Thermal Resistance  
(Junction to Ambient) (Note 3)  
50  
°C/W  
θ
JA  
(Note: Microdot may be in either location)  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
1. Current is limited by bondwire configuration.  
ORDERING INFORMATION  
Device  
Package  
Shipping  
2. Starting Tj = 25°C, L = 20 mH, I = 52 A, V = 80 V during inductor charging  
AS  
DD  
and V = 0 V during time in avalanche.  
DD  
FDWS86369F085  
DFNW8  
(Power56)  
(PbFree)  
3000 /  
Tape & Reel  
3. R  
is the sum of the junctiontocase and casetoambient thermal  
q
JA  
resistance where the case thermal reference is defined as the solder  
mounting surface of the drain pins. R  
is guaranteed by design while R  
q
JA  
q
JC  
is determined by the user’s board design. The maximum rating presented  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
2
here is based on mounting on a 1 in pad of 2 oz copper.  
© Semiconductor Components Industries, LLC, 2015  
1
Publication Order Number:  
October, 2021 Rev. 3  
FDWS86369F085/D  
 
FDWS86369F085  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise specified)  
J
Symbol  
Parameter  
Test Conditions  
Min  
Typ  
Max  
Unit  
OFF CHARACTERISTICS  
B
DraintoSource Breakdown Voltage  
DraintoSource Leakage Current  
I
= 250 mA, V = 0 V  
80  
1
V
VDSS  
D
GS  
I
V
= 80 V, V = 0 V, T = 25°C  
DS GS J  
mA  
mA  
nA  
DSS  
V
DS  
= 80 V, V = 0 V, T = 175°C (Note 4)  
1
GS  
J
I
GatetoSource Leakage Current  
V
GS  
=
20 V  
100  
GSS  
ON CHARACTERISTICS  
V
Gate to Source Threshold Voltage  
V
= V , I = 250 mA  
2.0  
3.0  
5.9  
4.0  
7.5  
V
GS(th)  
DS(on)  
GS  
DS  
D
R
Drain to Source OnResistance  
I
D
= 65 A, V = 10 V, T = 25°C  
mW  
GS  
J
I
D
= 65 A, V = 10 V, T = 175°C (Note 4)  
12.2  
15.5  
GS  
J
DYNAMIC CHARACTERISTICS  
C
Input Capacitance  
V
= 40 V, V = 0 V, f = 1 MHz  
2470  
400  
14  
pF  
iss  
DS  
GS  
C
Output Capacitance  
oss  
C
Reverse Transfer Capacitance  
Gate Resistance  
rss  
R
f = 1 MHz  
1.8  
35  
W
g
Q
Total Gate Charge  
V
V
= 0 V to 10 V  
= 0 V to 2 V  
V
DD  
= 64 V, I = 65 A  
46  
nC  
g(ToT)  
GS  
D
Q
Threshold Gate Charge  
GatetoSource Gate Charge  
GatetoDrain “Miller” Charge  
4.5  
12.5  
8
g(th)  
GS  
Q
gs  
Q
gd  
SWITCHING CHARACTERISTICS  
t
TurnOn Time  
TurnOn Delay  
Rise Time  
V
GS  
= 40 V, I = 65 A,  
15  
11  
24  
8
39  
ns  
on  
DD  
D
V
= 10 V, R  
= 6 W  
GEN  
t
d(on)  
t
r
t
TurnOff Delay  
Fall Time  
d(off)  
t
f
t
TurnOff Time  
48  
off  
DRAINSOURCE DIODE CHARACTERISTICS  
V
SourcetoDrain Diode Voltage  
I
= 65 A, V = 0 V  
1.4  
1.2  
74  
V
SD  
SD  
GS  
I
= 32.5 A, V = 0 V  
GS  
SD  
T
ReverseRecovery Time  
ReverseRecovery Charge  
I = 65 A, DI /Dt = 100 A/ms, V = 64 V  
49  
44  
ns  
rr  
F
SD  
DD  
Q
68  
nC  
rr  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
4. The maximum value is specified by design at T = 175°C. Product is not tested to this condition in production  
J
www.onsemi.com  
2
 
FDWS86369F085  
TYPICAL CHARACTERISTICS  
100  
80  
60  
40  
20  
0
1.2  
1.0  
V
= 10 V  
GS  
Current Limited  
by Package  
0.8  
0.6  
0.4  
Current Limited  
by Silicon  
0.2  
0
0
25  
50  
75  
100  
125  
150  
175  
25  
50  
75  
100  
125  
150  
175  
200  
T , CASE TEMPERATURE (°C)  
C
T , CASE TEMPERATURE (°C)  
C
Figure 1. Normalized Power Dissipation vs.  
Case Temperature  
Figure 2. Maximum Continuous Drain Current vs.  
Case Temperature  
2
1
Duty Cycle Descending Order  
D = 0.50  
0.20  
0.10  
0.05  
P
DM  
0.02  
0.01  
0.1  
t
1
t
2
Notes:  
Duty Factor: D = t /t  
Single Pulse  
1
2
Peak T = P  
x Z  
x R  
+ T  
JA C  
q
q
J
DM  
JA  
0.01  
3  
2  
1  
0
1
5  
4  
10  
10  
10  
10  
10  
10  
10  
t, RECTANGULAR PULSE DURATION (s)  
Figure 3. Normalized Maximum Transient Thermal Impedance  
1000  
100  
10  
V
= 10 V  
T = 25°C  
C
For temperatures above 25°C  
derate peak current as follows:  
GS  
175 * TC  
Ǹ
I + I25  
ƪ ƫ  
150  
Single Pulse  
3  
2  
1  
0
1
5  
4  
10  
10  
10  
10  
10  
10  
10  
t, RECTANGULAR PULSE DURATION (s)  
Figure 4. Peak Current Capability  
www.onsemi.com  
3
FDWS86369F085  
TYPICAL CHARACTERISTICS  
500  
1000  
100  
If R = 0  
=(L)(I )/(1.3*Rated BV  
t
V  
)
AV  
AS  
DSS  
DD  
If R 0  
=(L/R)In[(I *R)/(1.3*Rated BV  
100  
t
AV  
V )+1]  
DSS DD  
AS  
10  
1
100 ms  
Operation in this area may  
10  
be limited by R  
Starting T = 25°C  
1 ms  
DS(on)  
J
10 ms  
100 ms  
0.1  
T
= 25°C  
C
Starting T = 150°C  
J
T = Max Rated  
J
Single Pulse  
0.01  
1
1
0.001  
0.01  
0.1  
1
10  
100  
0.1  
10  
100  
500  
t
, TIME IN AVALANCHE (ms)  
V
DS  
, DRAINTOSOURCE VOLTAGE (V)  
AV  
(Note: Refer to onsemi Applications Notes AN7514 and  
AN7515)  
Figure 6. Unclamped Inductive Switching Capability  
Figure 5. Forward Bias Safe Operating Area  
200  
150  
100  
50  
200  
100  
Pulse Duration = 80 ms  
Duty Cycle = 0.5% Max  
V
GS  
= 0 V  
V
DD  
= 5 V  
10  
1
T = 175°C  
J
T = 25°C  
J
T = 175°C  
J
T = 25°C  
J
T = 55°C  
J
0
0.1  
1.4  
2
3
4
5
6
7
8
9
10  
0.0  
0.2  
, BODY DIODE FORWARD VOLTAGE (V)  
SD  
0.4  
0.6  
0.8  
1.0  
1.2  
V
GS  
, GATETOSOURCE VOLTAGE (V)  
V
Figure 7. Transfer Characteristics  
Figure 8. Forward Diode Characteristics  
200  
150  
100  
50  
200  
150  
100  
50  
80 ms Pulse Width  
T = 175°C  
J
V
GS  
V
15 V Top  
10 V  
8 V  
7 V  
6 V  
GS  
15 V Top  
10 V  
8 V  
7 V  
6 V  
5.5 V  
5 V Bottom  
5.5 V  
5 V Bottom  
80 ms Pulse Width  
T = 25°C  
J
5 V  
5 V  
4
0
0
1
0
1
2
3
4
5
0
2
3
5
V
DS  
, DRAINSOURCE VOLTAGE (V)  
V
DS  
, DRAINSOURCE VOLTAGE (V)  
Figure 9. Saturation Characteristics  
Figure 10. Saturation Characteristics  
www.onsemi.com  
4
FDWS86369F085  
TYPICAL CHARACTERISTICS  
100  
80  
60  
40  
20  
0
2.2  
I
D
= 65 A  
Pulse Duration = 80 ms  
Duty Cycle = 0.5% Max  
Pulse Duration = 80 ms  
Duty Cycle = 0.5% Max  
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
T = 175°C  
J
T = 25°C  
J
I
V
= 65 A  
D
= 10 V  
GS  
80  
10  
40  
0
40  
80  
120  
160  
6
7
9
200  
8
T , JUNCTION TEMPERATURE (°C)  
J
V
GS  
, GATETOSOURCE VOLTAGE (V)  
Figure 12. Normalized RDS(on) vs. Junction  
Temperature  
Figure 11. RDS(on) vs. Gate Voltage  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
1.10  
1.05  
1.00  
V
= V  
DS  
= 250 mA  
GS  
I
D
= 5 mA  
I
D
0.95  
0.90  
80  
0
40  
80  
120  
160  
80  
40  
0
40  
80  
120  
160  
200  
200  
40  
T , JUNCTION TEMPERATURE (°C)  
J
T , JUNCTION TEMPERATURE (°C)  
J
Figure 14. Normalized Drain to Source  
Breakdown Voltage vs. Junction Temperature  
Figure 13. Normalized Gate Threshold Voltage  
vs. Temperature  
10  
8
10000  
1000  
100  
10  
I
D
= 65 A  
V
= 32 V  
DD  
C
iss  
V
DD  
= 40 V  
V
DD  
= 48 V  
6
C
oss  
4
2
0
C
rss  
f = 1 MHz  
V
GS  
= 0 V  
1
0
15  
Q , GATE CHARGE (nC)  
20  
25  
5
10  
30  
35  
0.1  
1
10  
100  
V
DS  
, DRAINTOSOURCE VOLTAGE (V)  
g
Figure 15. Capacitance vs. DraintoSource  
Figure 16. Gate Charge vs. GatetoSource  
Voltage  
Voltage  
www.onsemi.com  
5
FDWS86369F085  
PACKAGE DIMENSIONS  
DFNW8 5.2x6.3, 1.27P  
CASE 507AU  
ISSUE A  
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6
FDWS86369F085  
POWERTRENCH is a registered trademark of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries  
in the United States and/or other countries.  
onsemi,  
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates  
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.  
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. onsemi reserves the right to make changes at any time to any  
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information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use  
of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products  
and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information  
provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may  
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license  
under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems  
or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should  
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