FGA50N100BNTD2 [ONSEMI]

IGBT,1000V,NPT 沟槽;
FGA50N100BNTD2
型号: FGA50N100BNTD2
厂家: ONSEMI    ONSEMI
描述:

IGBT,1000V,NPT 沟槽

双极性晶体管
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November 2013  
FGA50N100BNTD2  
1000 V NPT Trench IGBT  
Features  
General Description  
High Speed Switching  
Low Saturation Voltage : VCE(sat) = 2.5 V @ IC = 60 A  
High Input Impedance  
Built-in Fast Recovery Diode  
RoHS Compliant  
Using Fairchild's proprietary trench design and advanced NPT  
technology, the 1000V NPT IGBT offers superior conduction  
and switching performances, high avalanche ruggedness and  
easy parallel operation. This device offers the optimum perfor-  
mance for hard switching application such as UPS, welder  
applications.  
Applications  
UPS, Welder  
C
G
TO-3P  
G
C
E
E
Absolute Maximum Ratings  
Symbol  
Description  
Ratings  
1000  
± 25  
50  
Unit  
VCES  
VGES  
Collector to Emitter Voltage  
Gate to Emitter Voltage  
Collector Current  
V
V
A
A
A
@ TC = 25oC  
@ TC = 100oC  
IC  
ICM (1)  
IF  
IFM  
PD  
Collector Current  
35  
Pulsed Collector Current  
200  
@ TC = 25oC  
@ TC = 100oC  
Diode Continuous Forward Current  
Diode Continuous Forward Current  
Diode Maximum Forward Current  
30  
15  
A
A
A
150  
Maximum Power Dissipation  
Maximum Power Dissipation  
Operating Junction Temperature  
Storage Temperature Range  
@ TC = 25oC  
@ TC = 100oC  
156  
63  
W
W
oC  
oC  
TJ  
-55 to +150  
-55 to +150  
Tstg  
Maximum Lead Temp. for soldering  
Purposes, 1/8” from case for 5 seconds  
oC  
TL  
300  
Notes:  
1: Repetitive rating : Pulse width limited by max. junction temperature  
Thermal Characteristics  
Symbol  
RJC(IGBT)  
RJC(DIODE)  
RJA  
Parameter  
Thermal Resistance, Junction to Case  
Thermal Resistance, Junction to Case  
Thermal Resistance, Junction to Ambient  
Typ.  
Max.  
0.8  
Unit  
oC/W  
oC/W  
oC/W  
-
-
-
1.2  
40.0  
©2009 Fairchild Semiconductor Corporation  
FGA50N100BNTD2 Rev. C1  
1
www.fairchildsemi.com  
Package Marking and Ordering Information  
Part Number  
Top Mark  
Package Packing Method Reel Size  
Tape Width Quantity  
FGA50N100BNTD2 FGA50N100BNTD2  
TO-3P  
Tube  
N/A  
N/A  
30  
Electrical Characteristics of the IGBT  
T
= 25°C unless otherwise noted  
C
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
Off Characteristics  
BVCES  
ICES  
Collector to Emitter Breakdown Voltage VGE = 0 V, IC = 1 mA  
1000  
-
-
-
-
V
Collector Cut-Off Current  
G-E Leakage Current  
VCE = 1000 V, VGE = 0 V  
VGE = ±25 V, VCE = 0 V  
-
-
1.0  
mA  
nA  
IGES  
±500  
On Characteristics  
VGE(th)  
G-E Threshold Voltage  
IC = 60 mA, VCE = VGE  
IC = 10 A, VGE = 15 V  
IC = 60 A, VGE = 15 V  
IC = 60 A, VGE = 15 V,  
4.0  
-
5.5  
1.5  
2.5  
7.0  
1.8  
2.9  
V
V
V
VCE(sat)  
Collector to Emitter Saturation Voltage  
-
3.3  
-
V
T
C = 125oC  
Dynamic Characteristics  
Cies  
Coes  
Cres  
Input Capacitance  
-
-
-
6000  
260  
-
-
-
pF  
pF  
pF  
V
CE = 10 V VGE = 0 V,  
,
Output Capacitance  
f = 1 MHz  
Reverse Transfer Capacitance  
200  
Switching Characteristics  
td(on) Turn-On Delay Time  
tr  
td(off)  
tf  
-
-
-
-
-
-
-
34  
68  
-
ns  
ns  
V
R
CC = 600 V, IC = 60 A,  
G = 10 , VGE = 15 V,  
Inductive Load, TC = 25oC  
Rise Time  
-
Turn-Off Delay Time  
Fall Time  
243  
65  
-
100  
350  
-
ns  
ns  
Qg  
Total Gate Charge  
Gate to Emitter Charge  
Gate to Collector Charge  
257  
45  
nC  
nC  
nC  
V
V
CE = 600 V, IC = 60 A,  
GE = 15 V, TC = 25oC  
Qge  
Qgc  
95  
-
Electrical Characteristics of the Diode  
T = 25°C unless otherwise noted  
C
IF = 15 A  
IF = 60 A  
-
-
2.9  
4.0  
3.2  
4.7  
V
V
VFM  
Diode Forward Voltage  
trr  
IR  
Diode Reverse Recovery Time  
Instantaneous Reverse Current  
IF = 60 A, diF/dt = 100 A/us  
VRRM = 1000 V  
-
-
60  
-
75  
2
ns  
A  
©2009 Fairchild Semiconductor Corporation  
FGA50N100BNTD2 Rev. C1  
2
www.fairchildsemi.com  
Typical Performance Characteristics  
Figure 1. Typical Output Characteristics  
Figure 2. Typical Output Characteristics  
200  
200  
TC = 25oC  
20V  
TC = 125oC  
20V  
10V  
9V  
15V  
10V  
15V  
160  
120  
80  
160  
120  
80  
40  
0
9V  
8V  
8V  
7V  
7V  
40  
VGE = 6V  
VGE = 6V  
8 10  
0
0
2
4
6
0
2
4
6
8
10  
Collector-Emitter Voltage, VCE [V]  
Collector-Emitter Voltage, VCE [V]  
Figure 3. Typical Saturation Voltage  
Characteristics  
Figure 4. Transfer Characteristics  
200  
200  
Common Emitter  
VCE = 20V  
TC = 25oC  
TC = 125oC  
Common Emitter  
VGE = 15V  
TC = 25oC  
TC = 125oC  
160  
160  
120  
120  
80  
40  
0
80  
40  
0
2
4
6
8
10  
12  
0
1
2
3
4
5
6
7
Collector-Emitter Voltage, VCE [V]  
Gate-Emitter Voltage,VGE [V]  
Figure 5. Saturation Voltage vs. Case  
Figure 6. Saturation Voltage vs. V  
GE  
Temperature at Variant Current Level  
4.5  
20  
Common Emitter  
VGE = 15V  
90A  
Common Emitter  
TC = -40oC  
16  
12  
8
60A  
3.0  
30A  
60A  
IC = 10A  
30A  
4
90A  
1.5  
1.0  
IC = 10A  
0
25  
50  
75  
100  
125  
0
4
8
12  
16  
20  
Case Temperature, TC [oC]  
Gate-Emitter Voltage, VGE [V]  
©2009 Fairchild Semiconductor Corporation  
FGA50N100BNTD2 Rev. C1  
3
www.fairchildsemi.com  
Typical Performance Characteristics  
Figure 7. Saturation Voltage vs. V  
Figure 8. Saturation Voltage vs. V  
GE  
GE  
20  
20  
Common Emitter  
TC = 25oC  
Common Emitter  
TC = 125oC  
16  
12  
8
16  
12  
8
60A  
60A  
90A  
30A  
90A  
30A  
4
4
IC = 10A  
IC = 10A  
0
0
0
4
8
12  
16  
20  
0
4
8
12  
16  
20  
Gate-Emitter Voltage, VGE [V]  
Gate-Emitter Voltage, VGE [V]  
Figure 9. Capacitance Characteristics  
Figure 10. Gate charge Characteristics  
15  
8000  
Common Emitter  
TC = 25oC  
12  
6000  
VCC = 200V  
Cies  
Common Emitter  
VGE = 0V, f = 1MHz  
TC = 25oC  
9
400V  
4000  
2000  
0
600V  
6
3
0
Cres  
Coes  
0
55  
110  
165  
220  
275  
1
10  
Collector-Emitter Voltage, VCE [V]  
30  
Gate Charge, Qg [nC]  
Figure 11. SOA Characteristics  
Figure 12. Load Current vs. Frequency  
500  
100  
10  
10s  
100s  
1ms  
1
10 ms  
DC  
*Notes:  
1. TC = 25oC  
0.1  
2. TJ = 150oC  
3. Single Pulse  
0.01  
3000  
1000  
1
10  
100  
Collector-Emitter Voltage, VCE [V]  
©2009 Fairchild Semiconductor Corporation  
FGA50N100BNTD2 Rev. C1  
4
www.fairchildsemi.com  
Typical Performance Characteristics  
Figure 13. Turn-on Characteristics vs.  
Gate Resistance  
Figure 14. Turn-off Characteristics vs.  
Gate Resistance  
300  
2000  
1000  
td(off)  
100  
tr  
100  
tf  
td(on)  
Common Emitter  
VCC = 600V, VGE = 15V  
Common Emitter  
VCC = 600V, VGE = 15V  
IC = 60A  
IC = 60A  
TC = 25oC  
TC = 125oC  
TC = 25oC  
TC = 125oC  
10  
10  
10  
10  
20  
30  
40  
50  
20  
30  
40  
50  
Gate Resistance, RG []  
Gate Resistance, RG []  
Figure 15. Turn-on Characteristics vs.  
Collector Current  
Figure 16. Turn-off Characteristics vs.  
Collector Current  
200  
1000  
100  
td(off)  
tr  
Common Emitter  
VGE = 15V, RG = 10  
td(on)  
TC = 25oC  
100  
tf  
TC = 125oC  
Common Emitter  
VGE = 15V, RG = 10  
TC = 25oC  
TC = 125oC  
10  
10  
10 20 30 40 50 60 70 80 90 100  
10 20 30 40 50 60 70 80 90 100  
Collector Current, IC [A]  
Collector Current, IC [A]  
Figure 17. Switching Loss vs. Gate Resistance  
Fig 18. Switching Loss vs. Collector Current  
50  
30  
Common Emitter  
VCC = 600V, VGE = 15V  
IC = 60A  
10  
TC = 25oC  
Eon  
TC = 125oC  
Eon  
10  
Eoff  
1
Common Emitter  
Eoff  
VCC = 600V, VGE = 15V  
IC = 60A  
TC = 25oC  
TC = 125oC  
1
10  
0.1  
20  
30  
40  
50  
10 20 30 40 50 60 70 80 90 100  
Collector Current, IC [A]  
Gate Resistance, RG []  
©2009 Fairchild Semiconductor Corporation  
FGA50N100BNTD2 Rev. C1  
5
www.fairchildsemi.com  
Typical Performance Characteristics  
F i g u r e 1 9 . T u r n o f f S w i t c h i n g S O A C h a r a c t e r i s i c s  
F i g u r e 2 0 . F o r w a r d C h a r a c t e r i s t i c s  
200  
100  
250  
100  
TJ = 125oC  
10  
TJ = 25oC  
10  
1
TC = 25oC  
Safe Operating Area  
VGE = 15V, TC = 125oC  
TC = 125oC  
1
0.1  
3000  
1000  
1
10  
100  
0
1
2
3
4
5
6
Forward Voltage, VF [V]  
Collector-Emitter Voltage, VCE [V]  
Figure 21. Reverse Current  
Figure 22. Reverse Recovery Characteristics vs.  
di /dt  
F
300  
100  
80  
60  
40  
20  
0
10  
Trr  
TJ = 125oC  
8
10  
Irr  
6
1
4
0.1  
2
0.01  
TJ = 25oC  
IF = 60A  
TC = 25oC  
0
1E-3  
20 40 60 80 100 120 140 160 180 200  
50  
200  
400  
600  
800  
1000  
Reverse Voltage, VR [V]  
diF/dt[A/s]  
Figure 23. Reverse Recovery Characteristics vs.  
Forward Current  
80  
70  
60  
6
4
2
Trr  
Irr  
diF/dt = 100A/s  
C = 25oC  
T
10  
20  
30  
40  
50  
60  
Forward Current,IF[A]  
©2009 Fairchild Semiconductor Corporation  
FGA50N100BNTD2 Rev. C1  
6
www.fairchildsemi.com  
Typical Performance Characteristics  
Figure 24.Transient Thermal Impedance of IGBT  
1
0.1  
0.5  
0.2  
0.1  
0.05  
0.02  
PDM  
0.01  
0.01  
t1  
single pulse  
t2  
Duty Factor, D = t1/t2  
Peak Tj = Pdm x Zthjc + TC  
1E-3  
1E-5  
1E-4  
1E-3  
0.01  
0.1  
1
10  
Rectangular Pulse Duration [sec]  
©2009 Fairchild Semiconductor Corporation  
7
www.fairchildsemi.com  
FGA50N100BNTD2 Rev. C1  
Mechanical Dimensions  
Figure 25. TO-3P 3L - 3LD, T03, PLASTIC, EIAJ SC-65  
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Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:  
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FGA50N100BNTD2 Rev. C1  
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