FGA50N100BNTD2 [ONSEMI]
IGBT,1000V,NPT 沟槽;型号: | FGA50N100BNTD2 |
厂家: | ONSEMI |
描述: | IGBT,1000V,NPT 沟槽 双极性晶体管 |
文件: | 总11页 (文件大小:455K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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November 2013
FGA50N100BNTD2
1000 V NPT Trench IGBT
Features
General Description
•
•
•
•
•
High Speed Switching
Low Saturation Voltage : VCE(sat) = 2.5 V @ IC = 60 A
High Input Impedance
Built-in Fast Recovery Diode
RoHS Compliant
Using Fairchild's proprietary trench design and advanced NPT
technology, the 1000V NPT IGBT offers superior conduction
and switching performances, high avalanche ruggedness and
easy parallel operation. This device offers the optimum perfor-
mance for hard switching application such as UPS, welder
applications.
Applications
•
UPS, Welder
C
G
TO-3P
G
C
E
E
Absolute Maximum Ratings
Symbol
Description
Ratings
1000
± 25
50
Unit
VCES
VGES
Collector to Emitter Voltage
Gate to Emitter Voltage
Collector Current
V
V
A
A
A
@ TC = 25oC
@ TC = 100oC
IC
ICM (1)
IF
IFM
PD
Collector Current
35
Pulsed Collector Current
200
@ TC = 25oC
@ TC = 100oC
Diode Continuous Forward Current
Diode Continuous Forward Current
Diode Maximum Forward Current
30
15
A
A
A
150
Maximum Power Dissipation
Maximum Power Dissipation
Operating Junction Temperature
Storage Temperature Range
@ TC = 25oC
@ TC = 100oC
156
63
W
W
oC
oC
TJ
-55 to +150
-55 to +150
Tstg
Maximum Lead Temp. for soldering
Purposes, 1/8” from case for 5 seconds
oC
TL
300
Notes:
1: Repetitive rating : Pulse width limited by max. junction temperature
Thermal Characteristics
Symbol
RJC(IGBT)
RJC(DIODE)
RJA
Parameter
Thermal Resistance, Junction to Case
Thermal Resistance, Junction to Case
Thermal Resistance, Junction to Ambient
Typ.
Max.
0.8
Unit
oC/W
oC/W
oC/W
-
-
-
1.2
40.0
©2009 Fairchild Semiconductor Corporation
FGA50N100BNTD2 Rev. C1
1
www.fairchildsemi.com
Package Marking and Ordering Information
Part Number
Top Mark
Package Packing Method Reel Size
Tape Width Quantity
FGA50N100BNTD2 FGA50N100BNTD2
TO-3P
Tube
N/A
N/A
30
Electrical Characteristics of the IGBT
T
= 25°C unless otherwise noted
C
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
Off Characteristics
BVCES
ICES
Collector to Emitter Breakdown Voltage VGE = 0 V, IC = 1 mA
1000
-
-
-
-
V
Collector Cut-Off Current
G-E Leakage Current
VCE = 1000 V, VGE = 0 V
VGE = ±25 V, VCE = 0 V
-
-
1.0
mA
nA
IGES
±500
On Characteristics
VGE(th)
G-E Threshold Voltage
IC = 60 mA, VCE = VGE
IC = 10 A, VGE = 15 V
IC = 60 A, VGE = 15 V
IC = 60 A, VGE = 15 V,
4.0
-
5.5
1.5
2.5
7.0
1.8
2.9
V
V
V
VCE(sat)
Collector to Emitter Saturation Voltage
-
3.3
-
V
T
C = 125oC
Dynamic Characteristics
Cies
Coes
Cres
Input Capacitance
-
-
-
6000
260
-
-
-
pF
pF
pF
V
CE = 10 V VGE = 0 V,
,
Output Capacitance
f = 1 MHz
Reverse Transfer Capacitance
200
Switching Characteristics
td(on) Turn-On Delay Time
tr
td(off)
tf
-
-
-
-
-
-
-
34
68
-
ns
ns
V
R
CC = 600 V, IC = 60 A,
G = 10 , VGE = 15 V,
Inductive Load, TC = 25oC
Rise Time
-
Turn-Off Delay Time
Fall Time
243
65
-
100
350
-
ns
ns
Qg
Total Gate Charge
Gate to Emitter Charge
Gate to Collector Charge
257
45
nC
nC
nC
V
V
CE = 600 V, IC = 60 A,
GE = 15 V, TC = 25oC
Qge
Qgc
95
-
Electrical Characteristics of the Diode
T = 25°C unless otherwise noted
C
IF = 15 A
IF = 60 A
-
-
2.9
4.0
3.2
4.7
V
V
VFM
Diode Forward Voltage
trr
IR
Diode Reverse Recovery Time
Instantaneous Reverse Current
IF = 60 A, diF/dt = 100 A/us
VRRM = 1000 V
-
-
60
-
75
2
ns
A
©2009 Fairchild Semiconductor Corporation
FGA50N100BNTD2 Rev. C1
2
www.fairchildsemi.com
Typical Performance Characteristics
Figure 1. Typical Output Characteristics
Figure 2. Typical Output Characteristics
200
200
TC = 25oC
20V
TC = 125oC
20V
10V
9V
15V
10V
15V
160
120
80
160
120
80
40
0
9V
8V
8V
7V
7V
40
VGE = 6V
VGE = 6V
8 10
0
0
2
4
6
0
2
4
6
8
10
Collector-Emitter Voltage, VCE [V]
Collector-Emitter Voltage, VCE [V]
Figure 3. Typical Saturation Voltage
Characteristics
Figure 4. Transfer Characteristics
200
200
Common Emitter
VCE = 20V
TC = 25oC
TC = 125oC
Common Emitter
VGE = 15V
TC = 25oC
TC = 125oC
160
160
120
120
80
40
0
80
40
0
2
4
6
8
10
12
0
1
2
3
4
5
6
7
Collector-Emitter Voltage, VCE [V]
Gate-Emitter Voltage,VGE [V]
Figure 5. Saturation Voltage vs. Case
Figure 6. Saturation Voltage vs. V
GE
Temperature at Variant Current Level
4.5
20
Common Emitter
VGE = 15V
90A
Common Emitter
TC = -40oC
16
12
8
60A
3.0
30A
60A
IC = 10A
30A
4
90A
1.5
1.0
IC = 10A
0
25
50
75
100
125
0
4
8
12
16
20
Case Temperature, TC [oC]
Gate-Emitter Voltage, VGE [V]
©2009 Fairchild Semiconductor Corporation
FGA50N100BNTD2 Rev. C1
3
www.fairchildsemi.com
Typical Performance Characteristics
Figure 7. Saturation Voltage vs. V
Figure 8. Saturation Voltage vs. V
GE
GE
20
20
Common Emitter
TC = 25oC
Common Emitter
TC = 125oC
16
12
8
16
12
8
60A
60A
90A
30A
90A
30A
4
4
IC = 10A
IC = 10A
0
0
0
4
8
12
16
20
0
4
8
12
16
20
Gate-Emitter Voltage, VGE [V]
Gate-Emitter Voltage, VGE [V]
Figure 9. Capacitance Characteristics
Figure 10. Gate charge Characteristics
15
8000
Common Emitter
TC = 25oC
12
6000
VCC = 200V
Cies
Common Emitter
VGE = 0V, f = 1MHz
TC = 25oC
9
400V
4000
2000
0
600V
6
3
0
Cres
Coes
0
55
110
165
220
275
1
10
Collector-Emitter Voltage, VCE [V]
30
Gate Charge, Qg [nC]
Figure 11. SOA Characteristics
Figure 12. Load Current vs. Frequency
500
100
10
10s
100s
1ms
1
10 ms
DC
*Notes:
1. TC = 25oC
0.1
2. TJ = 150oC
3. Single Pulse
0.01
3000
1000
1
10
100
Collector-Emitter Voltage, VCE [V]
©2009 Fairchild Semiconductor Corporation
FGA50N100BNTD2 Rev. C1
4
www.fairchildsemi.com
Typical Performance Characteristics
Figure 13. Turn-on Characteristics vs.
Gate Resistance
Figure 14. Turn-off Characteristics vs.
Gate Resistance
300
2000
1000
td(off)
100
tr
100
tf
td(on)
Common Emitter
VCC = 600V, VGE = 15V
Common Emitter
VCC = 600V, VGE = 15V
IC = 60A
IC = 60A
TC = 25oC
TC = 125oC
TC = 25oC
TC = 125oC
10
10
10
10
20
30
40
50
20
30
40
50
Gate Resistance, RG []
Gate Resistance, RG []
Figure 15. Turn-on Characteristics vs.
Collector Current
Figure 16. Turn-off Characteristics vs.
Collector Current
200
1000
100
td(off)
tr
Common Emitter
VGE = 15V, RG = 10
td(on)
TC = 25oC
100
tf
TC = 125oC
Common Emitter
VGE = 15V, RG = 10
TC = 25oC
TC = 125oC
10
10
10 20 30 40 50 60 70 80 90 100
10 20 30 40 50 60 70 80 90 100
Collector Current, IC [A]
Collector Current, IC [A]
Figure 17. Switching Loss vs. Gate Resistance
Fig 18. Switching Loss vs. Collector Current
50
30
Common Emitter
VCC = 600V, VGE = 15V
IC = 60A
10
TC = 25oC
Eon
TC = 125oC
Eon
10
Eoff
1
Common Emitter
Eoff
VCC = 600V, VGE = 15V
IC = 60A
TC = 25oC
TC = 125oC
1
10
0.1
20
30
40
50
10 20 30 40 50 60 70 80 90 100
Collector Current, IC [A]
Gate Resistance, RG []
©2009 Fairchild Semiconductor Corporation
FGA50N100BNTD2 Rev. C1
5
www.fairchildsemi.com
Typical Performance Characteristics
F i g u r e 1 9 . T u r n o f f S w i t c h i n g S O A C h a r a c t e r i s i c s
F i g u r e 2 0 . F o r w a r d C h a r a c t e r i s t i c s
200
100
250
100
TJ = 125oC
10
TJ = 25oC
10
1
TC = 25oC
Safe Operating Area
VGE = 15V, TC = 125oC
TC = 125oC
1
0.1
3000
1000
1
10
100
0
1
2
3
4
5
6
Forward Voltage, VF [V]
Collector-Emitter Voltage, VCE [V]
Figure 21. Reverse Current
Figure 22. Reverse Recovery Characteristics vs.
di /dt
F
300
100
80
60
40
20
0
10
Trr
TJ = 125oC
8
10
Irr
6
1
4
0.1
2
0.01
TJ = 25oC
IF = 60A
TC = 25oC
0
1E-3
20 40 60 80 100 120 140 160 180 200
50
200
400
600
800
1000
Reverse Voltage, VR [V]
diF/dt[A/s]
Figure 23. Reverse Recovery Characteristics vs.
Forward Current
80
70
60
6
4
2
Trr
Irr
diF/dt = 100A/s
C = 25oC
T
10
20
30
40
50
60
Forward Current,IF[A]
©2009 Fairchild Semiconductor Corporation
FGA50N100BNTD2 Rev. C1
6
www.fairchildsemi.com
Typical Performance Characteristics
Figure 24.Transient Thermal Impedance of IGBT
1
0.1
0.5
0.2
0.1
0.05
0.02
PDM
0.01
0.01
t1
single pulse
t2
Duty Factor, D = t1/t2
Peak Tj = Pdm x Zthjc + TC
1E-3
1E-5
1E-4
1E-3
0.01
0.1
1
10
Rectangular Pulse Duration [sec]
©2009 Fairchild Semiconductor Corporation
7
www.fairchildsemi.com
FGA50N100BNTD2 Rev. C1
Mechanical Dimensions
Figure 25. TO-3P 3L - 3LD, T03, PLASTIC, EIAJ SC-65
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
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Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
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©2009 Fairchild Semiconductor Corporation
FGA50N100BNTD2 Rev. C1
8
www.fairchildsemi.com
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Rev. I66
©2009 Fairchild Semiconductor Corporation
FGA50N100BNTD2 Rev. C1
9
www.fairchildsemi.com
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are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
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regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification
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相关型号:
FGA50N100BNTDTU
Insulated Gate Bipolar Transistor, 50A I(C), 1000V V(BR)CES, N-Channel, TO-3P, 3 PIN
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