FGH60N60SFDTU-F085 [ONSEMI]

IGBT,600V,60A,2.2V,TO-247,高速场截止;
FGH60N60SFDTU-F085
型号: FGH60N60SFDTU-F085
厂家: ONSEMI    ONSEMI
描述:

IGBT,600V,60A,2.2V,TO-247,高速场截止

双极性晶体管
文件: 总9页 (文件大小:472K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
IGBT - Field Stop  
600 V, 60 A  
FGH60N60SFDTU-F085  
Description  
Using Novel Field Stop IGBT Technology, ON Semiconductor’s  
new series of Field Stop IGBTs offer the optimum performance for  
Automotive Chargers, Inverter, and other applications where low  
conduction and switching losses are essential.  
www.onsemi.com  
C
Features  
High Current Capability  
Low Saturation Voltage: V  
High Input Impedance  
Fast Switching  
= 2.2 V @ I = 60 A  
C
CE(sat)  
G
E
E
Qualified to Automotive Requirements of AECQ101  
This Device is PbFree and is RoHS Compliant  
C
G
Applications  
Automotive chargers, Converters, High Voltage Auxiliaries  
Inverters, PFC, UPS  
COLLECTOR  
(FLANGE)  
TO2473LD  
CASE 340CK  
MARKING DIAGRAM  
$Y&Z&3&K  
FGH60N60  
SFDTU  
$Y  
&Z  
&3  
&K  
= ON Semiconductor Logo  
= Assembly Plant Code  
= Numeric Date Code  
= Lot Code  
FGH60N60SFDTU = Specific Device Code  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 2 of this data sheet.  
© Semiconductor Components Industries, LLC, 2015  
1
Publication Order Number:  
FGH60N60SFDTUF085/D  
February, 2020 Rev. 3  
FGH60N60SFDTUF085  
ABSOLUTE MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
C
Description  
Symbol  
Ratings  
Unit  
V
Collector to Emitter Voltage  
Gate to Emitter Voltage  
V
CES  
V
GES  
600  
20  
30  
V
Transient GatetoEmitter Voltage  
V
Collector Current  
T
T
T
T
T
= 25°C  
= 100°C  
= 25°C  
= 25°C  
= 100°C  
I
120  
A
C
C
C
C
C
C
60  
A
Pulsed Collector Current  
I
(Note 1)  
180  
A
CM  
Maximum Power Dissipation  
P
378  
W
W
°C  
°C  
°C  
D
151  
Operating Junction Temperature  
Storage Temperature Range  
T
55 to +150  
55 to +150  
300  
J
T
stg  
Maximum Lead Temp. for Soldering Purposes, 1/8” from Case for 5 Seconds  
T
L
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality  
should not be assumed, damage may occur and reliability may be affected.  
1. Repetitive test, Pulse width limited by max. junction temperature.  
THERMAL CHARACTERISTICS  
Parameter  
Thermal Resistance, Junction to Case  
Symbol  
(IGBT)  
Typ  
0.33  
1.1  
Unit  
°C/W  
°C/W  
°C/W  
R
R
JC  
Thermal Resistance, Junction to Case  
Thermal Resistance, Junction to Ambient  
(Diode)  
JC  
R
40  
JA  
PACKAGE MARKING AND ORDERING INFORMATION  
Part Number  
Top Mark  
Package  
Packing Method  
Tube  
Reel Size  
Tape Width  
Quantity  
FGH60N60SFDTUF085  
FGH60N60SFDTU  
TO247  
N/A  
N/A  
30  
ELECTRICAL CHARACTERISTICS OF THE IGBT (T = 25°C unless otherwise noted)  
C
Parameter  
Symbol  
Test Conditions  
Min  
Typ  
Max  
Unit  
OFF CHARACTERISTICS  
Collector to Emitter Breakdown Voltage  
BV  
V
V
= 0 V, I = 250 A  
600  
V
CES  
GE  
C
Temperature Coefficient of Breakdown  
Voltage  
B
V
/T  
= 0 V, I = 250 A  
0.4  
V/°C  
CES  
J
GE  
C
Collector CutOff Current  
GE Leakage Current  
I
V
V
= V  
= V  
, V = 0 V  
250  
400  
A
CES  
CE  
CES  
GE  
I
, V = 0 V  
nA  
GES  
GE  
GES  
CE  
ON CHARACTERISTICs  
GE Threshold Voltage  
V
I
C
I
C
I
C
= 250 A, V = V  
GE  
4.0  
5.1  
2.2  
2.4  
6.6  
2.9  
V
V
V
GE(th)  
CE  
Collector to Emitter Saturation Voltage  
V
= 60 A, V = 15 V  
GE  
CE(sat)  
= 60 A, V = 15 V, T = 125°C  
GE  
C
www.onsemi.com  
2
 
FGH60N60SFDTUF085  
ELECTRICAL CHARACTERISTICS OF THE IGBT (T = 25°C unless otherwise noted) (continued)  
C
Parameter  
Symbol  
Test Conditions  
Min  
Typ  
Max  
Unit  
DYNAMIC CHARACTERISTICS  
Input Capacitance  
C
V
CE  
= 30 V, V = 0 V, f = 1 MHz  
2940  
310  
pF  
pF  
pF  
ies  
GE  
Output Capacitance  
C
oes  
Reverse Transfer Capacitance  
C
100  
res  
SWITCHING CHARACTERISTICS  
TurnOn Delay Time  
t
V
= 400 V, I = 60 A,  
26  
54  
62  
ns  
ns  
d(on)  
CC  
G
C
R
= 5 ꢃ ꢄ V = 15 V,  
GE  
Rise Time  
t
r
Inductive Load, T = 25°C  
C
TurnOff Delay Time  
Fall Time  
t
134  
18  
ns  
d(off)  
t
f
ns  
TurnOn Switching Loss  
TurnOff Switching Loss  
Total Switching Loss  
TurnOn Delay Time  
Rise Time  
E
on  
E
off  
1.97  
0.57  
2.54  
26  
mJ  
mJ  
mJ  
ns  
E
ts  
t
t
V
= 400 V, I = 60 A,  
d(on)  
CC  
C
R
= 5 ꢃ ꢄ V = 15 V,  
G
GE  
t
r
50  
ns  
Inductive Load, T = 125°C  
C
TurnOff Delay Time  
Fall Time  
142  
24  
ns  
d(off)  
t
f
ns  
TurnOn Switching Loss  
TurnOff Switching Loss  
Total Switching Loss  
Total Gate Charge  
Gate to Emitter Charge  
Gate to Collector Charge  
E
on  
E
off  
2.5  
0.8  
3.2  
188  
21  
mJ  
mJ  
mJ  
nC  
nC  
nC  
E
ts  
Q
V
= 400 V, I = 60 A, V = 15 V  
g
CE C GE  
Q
ge  
gc  
Q
98  
ELECTRICAL CHARACTERISTICS OF THE DIODE (T = 25°C unless otherwise noted)  
J
Symbol  
Parameter  
Test Conditions  
Min  
Typ  
1.9  
1.7  
55  
Max  
2.6  
Unit  
V
FM  
Diode Forward Voltage  
I = 30 A  
T
= 25°C  
= 125°C  
= 25°C  
= 125°C  
= 25°C  
= 125°C  
V
F
C
C
C
C
C
C
T
T
T
T
T
t
rr  
Diode Reverse Recovery Time  
Diode Reverse Recovery Charge  
I = 30 A, di /dt = 200 A/s  
ns  
F
F
204  
125  
895  
Q
nC  
rr  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
www.onsemi.com  
3
FGH60N60SFDTUF085  
TYPICAL PERFORMANCE CHARACTERISTICS  
180  
150  
180  
T
C
= 25°C  
T
C
= 125°C  
15 V  
15 V  
20 V  
20 V  
150  
120  
90  
12 V  
12 V  
10 V  
120  
90  
60  
30  
0
10 V  
60  
30  
0
V
GE  
= 8 V  
V
= 8 V  
GE  
0
2
4
6
8
2
4
6
8
0
CollectorEmitter Voltage, V [V]  
CollectorEmitter Voltage, V [V]  
CE  
CE  
Figure 2. Typical Output Characteristics  
Figure 1. Typical Output Characteristics  
180  
180  
150  
120  
90  
Common Emitter  
Common Emitter  
V
= 20 V  
CE  
V
= 15 V  
GE  
150  
120  
90  
60  
30  
0
T
T
= 25°C  
C
C
T
T
= 25°C  
C
C
= 125°C  
= 125°C  
60  
30  
0
3
6
9
12  
15  
4
5
2
3
0
0
1
CollectorEmitter Voltage, V [V]  
GateEmitter Voltage, V [V]  
CE  
GE  
Figure 3. Typical Saturation Voltage  
Characteristics  
Figure 4. Transfer Characteristics  
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
20  
16  
12  
8
Common Emitter  
GE  
Common Emitter  
C
V
= 15 V  
T
= 40°C  
120 A  
60 A  
120 A  
12  
I
= 30 A  
C
4
0
60 A  
= 30 A  
I
C
125  
25  
50  
75  
100  
8
16  
20  
0
4
CollectorEmitter Case Temperature, T [°C]  
GateEmitter Voltage, V [V]  
C
GE  
Figure 6. Saturation Voltage vs VGE  
Figure 5. Saturation Voltage vs. Case Temperature  
at Variant Current Level  
www.onsemi.com  
4
FGH60N60SFDTUF085  
TYPICAL PERFORMANCE CHARACTERISTICS (continued)  
20  
16  
12  
8
20  
Common Emitter  
C
Common Emitter  
= 125°C  
T
= 25°C  
T
C
16  
12  
8
120 A  
120A  
12  
4
0
4
0
60A  
= 30 A  
60 A  
= 30 A  
I
I
C
C
16  
20  
4
8
20  
0
16  
GateEmitter Voltage, V [V]  
0
4
8
12  
GateEmitter Voltage, V [V]  
GE  
GE  
Figure 8. Saturation Voltage vs. VGE  
Figure 7. Saturation Voltage vs. VGE  
15  
12  
9
6000  
5000  
4000  
3000  
2000  
Common Emitter  
C
Common Emitter  
T
= 25°C  
V
= 0 V, f = 1 MHz  
GE  
T
= 25°C  
C
C
300 V  
ies  
V
CC  
= 100 V  
200 V  
6
C
oes  
3
1000  
0
C
res  
0
50  
100  
150  
200  
0
30  
1
10  
CollectorEmitter Voltage, V [V]  
Gate Charge, Q [nC]  
g
CE  
Figure 10. Gate Charge Characteristics  
Figure 9. Capacitance Characteristics  
500  
100  
300  
10 s  
100 s  
1 ms  
100  
10  
1
10  
1
10 ms  
DC  
Single Nonrepetitive  
Pulse T = 25°C  
C
0.1  
0.01  
Curves must be derated  
linearly with increase  
in temperature.  
Safe Operating Area  
V
GE  
= 15 V, T = 125°C  
C
1
10  
100  
1000  
100  
1000  
10  
1
CollectorEmitter Voltage, V [V]  
CollectorEmitter Voltage, V [V]  
CE  
CE  
Figure 11. SOA Characteristics  
Figure 12. TurnOff Switching SOA Characteristics  
www.onsemi.com  
5
FGH60N60SFDTUF085  
TYPICAL PERFORMANCE CHARACTERISTICS (continued)  
200  
100  
6000  
Common Emitter  
V
= 400 V, V = 15 V  
CC  
GE  
I
T
T
= 60 A  
C
= 25°C  
C
C
1000  
100  
10  
= 125°C  
t
r
t
d(off)  
Common Emitter  
= 400 V, V = 15 V  
t
d(on)  
V
CC  
GE  
t
f
I
= 60 A  
C
T
C
T
C
= 25°C  
= 125°C  
10  
50  
10  
20  
30  
40  
0
10  
20  
30  
40  
50  
0
Gate Resistance, R []  
G
Gate Resistance, R []  
G
Figure 14. TurnOff Characteristics  
Figure 13. TurnOn Characteristics  
vs. Gate Resistance  
vs. Gate Resistance  
200  
100  
1000  
100  
10  
Common Emitter  
Common Emitter  
V
T
C
= 15 V, R = 5 ꢃ  
V
T
C
= 15 V, R = 5 ꢃ  
GE  
G
GE  
G
= 25°C  
= 25°C  
C
C
T
= 125°C  
T
= 125°C  
t
d(off)  
t
r
t
d(on)  
t
f
10  
2
20  
40  
60  
80  
100 120  
0
20  
40  
60  
80  
120  
100  
Collector Current, I [A]  
Collector Current, I [A]  
C
C
Figure 16. TurnOff Characteristics  
Figure 15. TurnOn Characteristics  
vs. Collector Current  
vs. Collector Current  
20  
10  
Common Emitter  
Common Emitter  
E
V
I
= 400 V, V = ꢅ ꢆ V  
V
T
= 15 V, R = 5 ꢃ  
G
on  
CC  
GE  
GE  
= 60 A  
= 25°C  
10  
C
C
T
T
C
T
C
= 25°C  
= 125°C  
C
= 125°C  
E
on  
1
E
off  
E
off  
1
0.1  
0.5  
0
10  
20  
30  
40  
50  
0
20  
40  
60  
80  
100 120  
Gate Resistance, R []  
Collector Current, I [A]  
G
C
Figure 18. Switching Loss vs. Collector Current  
Figure 17. Switching Loss vs. Gate Resistance  
www.onsemi.com  
6
FGH60N60SFDTUF085  
TYPICAL PERFORMANCE CHARACTERISTICS (continued)  
500  
100  
200  
100  
T
= 125°C  
= 75°C  
T = 125°C  
J
C
T = 25°C  
J
10  
1
10  
T = 75°C  
J
T
C
1
T
C
= 25°C  
0.1  
0.01  
0.1  
50  
200  
400  
600  
1
2
3
4
0
Reverse Voltage, V [V]  
Forward Voltage, V [V]  
R
F
Figure 20. Reverse Current  
Figure 19. Forward Characteristics  
200  
150  
80  
70  
60  
200 A/s  
200 A/s  
100  
50  
0
di/dt = 100 A/s  
di/dt = 100 A/s  
50  
40  
T
C
= 25°C  
T
C
= 25°C  
60  
0
10  
20  
30  
40  
50  
60  
0
10  
20  
30  
40  
F
50  
Forward Current, I [A]  
Forward Current, I [A]  
F
Figure 22. Reverse Recovery Time  
Figure 21. Stored Charge  
1
0.5  
0.1  
0.01  
1E3  
0.2  
0.1  
0.05  
0.02  
0.01  
P
DM  
t
1
Single Pulse  
t
2
Duty Factor, D = t1/t2  
Peak T = Pdm x Zjc + T  
j
C
1
1E5  
1E4  
1E3  
0.01  
0.1  
Rectangular Pulse Duration [sec]  
Figure 23. Transient Thermal Impedance of IGBT  
www.onsemi.com  
7
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
TO2473LD SHORT LEAD  
CASE 340CK  
ISSUE A  
DATE 31 JAN 2019  
P1  
D2  
A
E
P
A
A2  
Q
E2  
S
D1  
D
E1  
B
2
2
1
3
L1  
A1  
b4  
L
c
(3X) b  
(2X) b2  
M
M
B A  
0.25  
MILLIMETERS  
MIN NOM MAX  
4.58 4.70 4.82  
2.20 2.40 2.60  
1.40 1.50 1.60  
1.17 1.26 1.35  
1.53 1.65 1.77  
2.42 2.54 2.66  
0.51 0.61 0.71  
20.32 20.57 20.82  
(2X) e  
DIM  
A
A1  
A2  
b
b2  
b4  
c
GENERIC  
D
MARKING DIAGRAM*  
D1 13.08  
~
~
D2  
E
0.51 0.93 1.35  
15.37 15.62 15.87  
AYWWZZ  
XXXXXXX  
XXXXXXX  
E1 12.81  
~
~
E2  
e
L
4.96 5.08 5.20  
5.56  
15.75 16.00 16.25  
3.69 3.81 3.93  
3.51 3.58 3.65  
XXXX = Specific Device Code  
~
~
A
Y
= Assembly Location  
= Year  
WW = Work Week  
ZZ = Assembly Lot Code  
L1  
P
*This information is generic. Please refer to  
device data sheet for actual part marking.  
PbFree indicator, “G” or microdot “G”, may  
or may not be present. Some products may  
not follow the Generic Marking.  
P1 6.60 6.80 7.00  
Q
S
5.34 5.46 5.58  
5.34 5.46 5.58  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON13851G  
TO2473LD SHORT LEAD  
PAGE 1 OF 1  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding  
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically  
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the  
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© Semiconductor Components Industries, LLC, 2018  
www.onsemi.com  
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