M1MA152AT1G [ONSEMI]

开关二极管，80V;


型号：	M1MA152AT1G
厂家：	ONSEMI
描述：	开关二极管，80V 开关光电二极管整流二极管
文件：	总6页 (文件大小：85K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Order this document

by M1MA151AT1/D

SEMICONDUCTOR TECHNICAL DATA

These Silicon Epitaxial Planar Diodes are designed for use in ultra high speed

switching applications. These devices are housed in the SC–59 package which is

designed for low power surface mount applications.

Motorola Preferred Devices

•

Fast t , < 3.0 ns

Low C , < 2.0 pF

Available in 8 mm Tape and Reel

Use M1MA151/2AT1 to order the 7 inch/3000 unit reel.

Use M1MA151/2AT3 to order the 13 inch/10,000 unit reel.

SC–59 PACKAGE

SINGLE SILICON

SWITCHING DIODES

40/80 V–100 mA

ANODE

SURFACE MOUNT

CATHODE NO CONNECTION

MAXIMUM RATINGS (T = 25°C)

CASE 318D–03, STYLE 4

SC–59

Rating

Symbol

Value

Unit

Reverse Voltage

M1MA151AT1

Vdc

M1MA152AT1

M1MA151AT1

M1MA152AT1

Peak Reverse Voltage

Vdc

Forward Current

100

225

500

mAdc

Peak Forward Current

Peak Forward Surge Current

(1)

FSM

THERMAL CHARACTERISTICS

Rating

Symbol

Max

200

Unit

°C

Power Dissipation

Junction Temperature

Storage Temperature

150

stg

–55 to +150

°C

ELECTRICAL CHARACTERISTICS (T = 25°C)

Characteristic

Symbol

Condition

Min

Max

0.1

1.2

—

Unit

Reverse Voltage Leakage Current

M1MA151AT1

M1MA152AT1

= 35 V

= 75 V

—

µAdc

Forward Voltage

= 100 mA

Vdc

Reverse Breakdown Voltage

M1MA151AT1

M1MA152AT1

= 100 µA

—

Diode Capacitance

= 0, f = 1.0 MHz

2.0

3.0

(2)

Reverse Recovery Time

I = 10 mA, V = 6.0 V,

F R

= 100 Ω, I = 0.1 I

1. t = 1 SEC

2. t Test Circuit

Thermal Clad is a trademark of the Bergquist Company

Preferred devices are Motorola recommended choices for future use and best overall value.

REV 3

Motorola Small–Signal Transistors, FETs and Diodes Device Data

Motorola, Inc. 1996

RECOVERY TIME EQUIVALENT TEST CIRCUIT

INPUT PULSE

OUTPUT PULSE

10%

= 0.1 I

90%

= 10 mA

= 6 V

= 100 Ω

= 2 µs

t = 0.35 ns

DEVICE MARKING

Marking Symbol

Type No.

151A

152A

MA^X

Symbol

The “X” represents a smaller alpha digit Date Code. The Date Code

indicates the actual month in which the part was manufactured.

Motorola Small–Signal Transistors, FETs and Diodes Device Data

MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS

Surface mount board layout is a critical portion of the total

design. The footprint for the semiconductor packages must

be the correct size to insure proper solder connection

interface between the board and the package. With the

correct pad geometry, the packages will self align when

subjected to a solder reflow process.

0.037

0.95

0.037

0.95

0.098–0.118

2.5–3.0

0.094

2.4

0.039

1.0

0.031

0.8

inches

SC–59 POWER DISSIPATION

The power dissipation of the SC–59 is a function of the pad

size. This can vary from the minimum pad size for soldering

to the pad size given for maximum power dissipation. Power

dissipation for a surface mount device is determined by

the equation for an ambient temperature T of 25°C, one can

calculate the power dissipation of the device which in this

case is 200 milliwatts.

150°C – 25°C

, the maximum rated junction temperature of the die,

, the thermal resistance from the device junction to

J(max)

θJA

= 200 milliwatts

625°C/W

ambient; and the operating temperature, T . Using the

values provided on the data sheet, P can be calculated as

follows:

The 625°C/W assumes the use of the recommended

footprint on a glass epoxy printed circuit board to achieve a

power dissipation of 200 milliwatts. Another alternative would

be to use a ceramic substrate or an aluminum core board

such as Thermal Clad . Using a board material such as

Thermal Clad, a power dissipation of 400 milliwatts can be

achieved using the same footprint.

– T

J(max)

θJA

The values for the equation are found in the maximum

ratings table on the data sheet. Substituting these values into

SOLDERING PRECAUTIONS

The melting temperature of solder is higher than the rated

temperature of the device. When the entire device is heated

to a high temperature, failure to complete soldering within a

short time could result in device failure. Therefore, the

following items should always be observed in order to

minimize the thermal stress to which the devices are

subjected.

•

The soldering temperature and time should not exceed

260°C for more than 10 seconds.

When shifting from preheating to soldering, the

maximum temperature gradient should be 5°C or less.

After soldering has been completed, the device should

be allowed to cool naturally for at least three minutes.

Gradual cooling should be used as the use of forced

cooling will increase the temperature gradient and result

in latent failure due to mechanical stress.

•

Always preheat the device.

The delta temperature between the preheat and

soldering should be 100°C or less.*

•

Mechanical stress or shock should not be applied during

cooling

•

When preheating and soldering, the temperature of the

leads and the case must not exceed the maximum

temperature ratings as shown on the data sheet. When

using infrared heating with the reflow soldering method,

the difference should be a maximum of 10°C.

* Soldering a device without preheating can cause excessive

thermal shock and stress which can result in damage to the

device.

Motorola Small–Signal Transistors, FETs and Diodes Device Data

SOLDER STENCIL GUIDELINES

Prior to placing surface mount components onto a printed

or stainless steel with a typical thickness of 0.008 inches.

The stencil opening size for the SC–59 package should be

the same as the pad size on the printed circuit board, i.e., a

1:1 registration.

circuit board, solder paste must be applied to the pads. A

solder stencil is required to screen the optimum amount of

solder paste onto the footprint. The stencil is made of brass

TYPICAL SOLDER HEATING PROFILE

For any given circuit board, there will be a group of control

settings that will give the desired heat pattern. The operator

must set temperatures for several heating zones, and a

figure for belt speed. Taken together, these control settings

make up a heating “profile” for that particular circuit board.

On machines controlled by a computer, the computer

remembers these profiles from one operating session to the

next. Figure 1 shows a typical heating profile for use when

soldering a surface mount device to a printed circuit board.

This profile will vary among soldering systems but it is a good

starting point. Factors that can affect the profile include the

type of soldering system in use, density and types of

components on the board, type of solder used, and the type

of board or substrate material being used. This profile shows

temperature versus time. The line on the graph shows the

actual temperature that might be experienced on the surface

of a test board at or near a central solder joint. The two

profiles are based on a high density and a low density board.

The Vitronics SMD310 convection/infrared reflow soldering

system was used to generate this profile. The type of solder

used was 62/36/2 Tin Lead Silver with a melting point

between 177–189°C. When this type of furnace is used for

solder reflow work, the circuit boards and solder joints tend to

heat first. The components on the board are then heated by

conduction. The circuit board, because it has a large surface

area, absorbs the thermal energy more efficiently, then

distributes this energy to the components. Because of this

effect, the main body of a component may be up to 30

degrees cooler than the adjacent solder joints.

STEP 1

PREHEAT

ZONE 1

“RAMP”

STEP 2

VENT

“SOAK” ZONES 2 & 5

“RAMP”

STEP 3

HEATING

STEP 4

HEATING

ZONES 3 & 6 ZONES 4 & 7

“SOAK” “SPIKE”

STEP 5

HEATING

STEP 6

VENT COOLING

STEP 7

205

PEAK AT

SOLDER JOINT

° TO 219°C

DESIRED CURVE FOR HIGH

MASS ASSEMBLIES

170°C

200

°C

160°C

150°C

SOLDER IS LIQUID FOR

40 TO 80 SECONDS

(DEPENDING ON

140°C

100°C

MASS OF ASSEMBLY)

100°C

DESIRED CURVE FOR LOW

MASS ASSEMBLIES

50°C

TIME (3 TO 7 MINUTES TOTAL)

MAX

Figure 1. Typical Solder Heating Profile

Motorola Small–Signal Transistors, FETs and Diodes Device Data

PACKAGE DIMENSIONS

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

MILLIMETERS

INCHES

MIN MAX

DIM

MIN

2.70

1.30

1.00

0.35

1.70

0.013

0.10

0.20

1.25

2.50

MAX

3.10 0.1063 0.1220

1.70 0.0512 0.0669

1.30 0.0394 0.0511

0.50 0.0138 0.0196

2.10 0.0670 0.0826

0.100 0.0005 0.0040

0.26 0.0040 0.0102

0.60 0.0079 0.0236

1.65 0.0493 0.0649

3.00 0.0985 0.1181

STYLE 4:

PIN 1. N.C.

2. CATHODE

3. ANODE

CASE 318D–03

ISSUE E

SC–59

Motorola Small–Signal Transistors, FETs and Diodes Device Data

Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding

the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and

specificallydisclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola

datasheetsand/orspecificationscananddovaryindifferentapplicationsandactualperformancemayvaryovertime. Alloperatingparameters,including“Typicals”

must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of

others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other

applicationsintended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury

ordeathmayoccur. ShouldBuyerpurchaseoruseMotorolaproductsforanysuchunintendedorunauthorizedapplication,BuyershallindemnifyandholdMotorola

and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees

arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that

Motorola was negligent regarding the design or manufacture of the part. Motorola and

Opportunity/Affirmative Action Employer.

are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal

How to reach us:

USA/EUROPE/Locations Not Listed: Motorola Literature Distribution;

P.O. Box 20912; Phoenix, Arizona 85036. 1–800–441–2447 or 602–303–5454

JAPAN: Nippon Motorola Ltd.; Tatsumi–SPD–JLDC, 6F Seibu–Butsuryu–Center,

3–14–2 Tatsumi Koto–Ku, Tokyo 135, Japan. 03–81–3521–8315

MFAX: RMFAX0@email.sps.mot.com – TOUCHTONE 602–244–6609

INTERNET: http://Design–NET.com

ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park,

51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298

M1MA151AT1/D

Motorola Small–Signal Transistors, FETs and Diodes Device Data

◊

M1MA152AT1G [ONSEMI]

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