MC100E256FNR2 [ONSEMI]

100E SERIES, LOW LEVEL TRIGGERED D LATCH, COMPLEMENTARY OUTPUT, PQCC28, PLASTIC, LCC-28;
MC100E256FNR2
型号: MC100E256FNR2
厂家: ONSEMI    ONSEMI
描述:

100E SERIES, LOW LEVEL TRIGGERED D LATCH, COMPLEMENTARY OUTPUT, PQCC28, PLASTIC, LCC-28

输出元件 逻辑集成电路 触发器
文件: 总5页 (文件大小:109K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
SEMICONDUCTOR TECHNICAL DATA  
The MC10E/100E256 contains three 4:1 multiplexers followed by  
transparent latches with differential outputs. Separate Select controls are  
provided for the leading 2:1 mux pairs (see logic symbol).  
When the Latch Enable (LEN) is LOW, the latch is transparent, and  
output data is controlled by the multiplexer select controls. A logic HIGH  
on LEN latches the outputs. The Master Reset (MR) overrides all other  
controls to set the Q outputs LOW.  
3-BIT 4:1  
MUX-LATCH  
950ps Max. D to Output  
850ps Max. LEN to Output  
Split Select  
Differential Outputs  
Extended 100E V  
Range of – 4.2V to – 5.46V  
75kInput Pulldown Resistors  
EE  
Pinout: 28-Lead PLCC (Top View)  
D
D
D
D
D
D
V
CCO  
1b  
1a  
2d  
2c  
2b  
2a  
FN SUFFIX  
PLASTIC PACKAGE  
CASE 776-02  
25  
24  
23  
22  
21  
20  
19  
18  
SEL1A  
SEL1B  
SEL2  
26  
27  
28  
1
Q
Q
2
17  
16  
15  
14  
13  
2
V
CC  
V
Q
Q
EE  
1
LEN  
MR  
2
1
3
V
CCO  
D
4
12  
11  
Q
0
1c  
5
6
7
8
9
10  
D
D
D
D
D
V
Q
0
1d  
0a  
0b  
0c  
0d  
CCO  
* All V  
and V  
pins are tied together on the die.  
CC  
CCO  
FUNCTION TABLE  
PIN NAMES  
Pin  
Function  
Pin  
State  
Operation  
D
– D  
Data Inputs  
SEL2  
SEL1A  
SEL1B  
H
H
H
Output c/d Data  
Input d Data  
Input b Data  
0x  
2x  
SEL1A, SEL1B  
First-stage Select Inputs  
Second-stage Select input  
Latch Enable  
SEL2  
LEN  
MR  
Master Reset  
Q , Q – Q , Q  
Data Outputs  
0
0
2
2
12/93  
Motorola, Inc. 1996  
REV 2  
MC10E256 MC100E256  
LOGIC DIAGRAM  
D
D
0a  
0b  
Q0  
Q0  
D
EN  
R
D
0c  
D
0d  
D
D
1a  
1b  
Q1  
Q1  
D
EN  
R
D
1c  
D
1d  
D
D
2a  
2b  
Q2  
Q2  
D
EN  
R
D
2c  
D
2d  
SEL1A  
SEL1B  
SEL2  
LEN  
MR  
DC CHARACTERISTICS (V  
= V (min) to V (max); V  
EE EE  
= V  
= GND)  
EE  
CC  
CCO  
0°C  
25°C  
85°C  
Symbol  
Characteristic  
Input HIGH Current  
min  
typ  
max  
min  
typ  
max  
min  
typ  
max Unit Condition  
I
IH  
150  
150  
150  
µA  
I
Power Supply Current  
mA  
EE  
10E  
100E  
69  
69  
83  
83  
69  
69  
83  
83  
69  
79  
83  
96  
MOTOROLA  
2–2  
MC10E256 MC100E256  
AC CHARACTERISTICS (V  
= V (min) to V (max); V  
EE EE  
= V  
= GND)  
EE  
CC  
CCO  
0°C  
25°C  
85°C  
Symbol  
Characteristic  
min  
typ  
max  
min  
typ  
max  
min  
typ  
max Unit Condition  
t
Propagation Delay to Output  
ps  
900  
PLH  
PHL  
t
D
400  
550  
450  
600  
775  
650  
900  
400  
600  
775  
650  
900  
400  
600  
775  
650  
SEL1  
SEL2  
1050 550  
1050 550  
1050  
900  
450  
900  
450  
900  
LEN  
MR  
350  
350  
500  
600  
800  
825  
350  
350  
500  
600  
800  
825  
350  
350  
500  
600  
800  
825  
t
t
Setup Time  
D
ps  
ps  
s
400  
275  
400  
275  
400  
275  
SEL1  
SEL2  
600  
500  
300  
250  
600  
500  
300  
250  
600  
500  
300  
250  
Hold Time  
D
h
300 – 275  
300 – 275  
300 – 275  
SEL1  
SEL2  
100 – 300  
200 – 250  
100 – 300  
200 – 250  
100 – 300  
200 – 250  
t
t
Reset Recovery Time  
700  
600  
700  
600  
700  
600  
ps  
ps  
RR  
Minimum Pulse Width  
MR  
PW  
400  
400  
400  
t
Within-Device Skew  
50  
50  
50  
ps  
ps  
1
SKEW  
t
r
t
f
Rise/Fall Times  
20 - 80%  
275  
475  
700  
275  
475  
700  
275  
475  
700  
1. Within-device skew is defined as identical transitions on similar paths through a device.  
2–3  
MOTOROLA  
MC10E256 MC100E256  
OUTLINE DIMENSIONS  
FN SUFFIX  
PLASTIC PLCC PACKAGE  
CASE 776–02  
ISSUE D  
M
S
S
0.007 (0.180)  
T
L –M  
N
B
Z
Y BRK  
D
-N-  
M
S
S
0.007 (0.180)  
T
L –M  
N
U
-L-  
-M-  
D
W
X
G1  
S
S
S
0.010 (0.250)  
0.007 (0.180)  
T
L –M  
L –M  
N
V
28  
1
VIEW D-D  
M
M
S
S
S
0.007 (0.180)  
0.007 (0.180)  
T
T
L –M  
L –M  
N
A
R
H
M
S
S
T
N
Z
S
N
K1  
C
E
0.004 (0.100)  
SEATING  
PLANE  
G
K
-T-  
VIEW S  
J
M
S
S
0.007 (0.180)  
T
L –M  
N
F
G1  
VIEW S  
S
S
S
0.010 (0.250)  
T
L –M  
N
NOTES:  
1. DATUMS -L-, -M-, AND -N- DETERMINED  
WHERE TOP OF LEAD SHOULDER EXITS  
PLASTIC BODY AT MOLD PARTING LINE.  
2. DIM G1, TRUE POSITION TO BE MEASURED  
AT DATUM -T-, SEATING PLANE.  
INCHES  
MAX  
MILLIMETERS  
3. DIM R AND U DO NOT INCLUDE MOLD FLASH.  
ALLOWABLE MOLD FLASH IS 0.010 (0.250)  
PER SIDE.  
4. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
DIM  
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1  
K1  
MIN  
MIN  
12.32  
12.32  
4.20  
MAX  
12.57  
12.57  
4.57  
0.485  
0.495  
0.495  
0.180  
0.110  
0.019  
0.485  
0.165  
0.090  
0.013  
2.29  
2.79  
5. CONTROLLING DIMENSION: INCH.  
6. THE PACKAGE TOP MAY BE SMALLER THAN  
THE PACKAGE BOTTOM BY UP TO 0.012  
(0.300). DIMENSIONS R AND U ARE  
DETERMINED AT THE OUTERMOST  
EXTREMES OF THE PLASTIC BODY  
EXCLUSIVE OF MOLD FLASH, TIE BAR  
BURRS, GATE BURRS AND INTERLEAD  
FLASH, BUT INCLUDING ANY MISMATCH  
BETWEEN THE TOP AND BOTTOM OF THE  
PLASTIC BODY.  
7. DIMENSION H DOES NOT INCLUDE DAMBAR  
PROTRUSION OR INTRUSION. THE DAMBAR  
PROTRUSION(S) SHALL NOT CAUSE THE H  
DIMENSION TO BE GREATER THAN 0.037  
(0.940). THE DAMBAR INTRUSION(S) SHALL  
NOT CAUSE THE H DIMENSION TO BE  
SMALLER THAN 0.025 (0.635).  
0.33  
0.48  
0.050 BSC  
1.27 BSC  
0.026  
0.032  
0.456  
0.456  
0.048  
0.048  
0.056  
0.020  
0.66  
0.51  
0.64  
11.43  
11.43  
1.07  
1.07  
1.07  
0.81  
11.58  
11.58  
1.21  
1.21  
1.42  
0.50  
0.020  
0.025  
0.450  
0.450  
0.042  
0.042  
0.042  
2
°
10°  
2°  
10°  
0.410  
0.040  
0.430  
10.42  
1.02  
10.92  
MOTOROLA  
2–4  
MC10E256 MC100E256  
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding  
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and  
specificallydisclaims any and all liability, includingwithoutlimitationconsequentialorincidentaldamages. “Typical” parameters which may be provided in Motorola  
datasheetsand/orspecificationscananddovaryindifferentapplicationsandactualperformancemayvaryovertime. Alloperatingparameters,includingTypicals”  
must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of  
others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other  
applicationsintended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury  
ordeathmayoccur. ShouldBuyerpurchaseoruseMotorolaproductsforanysuchunintendedorunauthorizedapplication,BuyershallindemnifyandholdMotorola  
and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees  
arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that  
Motorola was negligent regarding the design or manufacture of the part. Motorola and  
Opportunity/Affirmative Action Employer.  
are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal  
How to reach us:  
USA/EUROPE/Locations Not Listed: Motorola Literature Distribution;  
JAPAN: Nippon Motorola Ltd.; Tatsumi–SPD–JLDC, 6F Seibu–Butsuryu–Center,  
P.O. Box 20912; Phoenix, Arizona 85036. 1–800–441–2447 or 602–303–5454  
3–14–2 Tatsumi Koto–Ku, Tokyo 135, Japan. 03–81–3521–8315  
MFAX: RMFAX0@email.sps.mot.com – TOUCHTONE 602–244–6609  
INTERNET: http://Design–NET.com  
ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park,  
51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298  
MC10E256/D  

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