MC100H603FNR2G [ONSEMI]
9−Bit Latch ECL to TTL Translator; 9位锁存器ECL至TTL转换器型号: | MC100H603FNR2G |
厂家: | ONSEMI |
描述: | 9−Bit Latch ECL to TTL Translator |
文件: | 总7页 (文件大小:113K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
MC10H603, MC100H603
9−Bit Latch ECLꢀ to TTL
Translator
Description
The MC10H/100H603 is a 9−bit, dual supply ECL to TTL
translator. Devices in the ON Semiconductor 9−bit translator series
utilize the 28−lead PLCC for optimal power pinning, signal
flow−through and electrical performance.
http://onsemi.com
The devices feature a 48 mA TTL output stage, and AC
performance is specified into both a 50 pF and 200 pF load
capacitance. Latching is controlled by Latch Enable (LEN), and
Master Reset (MR) resets the latches. A HIGH on OEECL sends the
outputs into the high impedance state. All control inputs are ECL
level.
PLCC−28
FN SUFFIX
CASE 776
The 10H version is compatible with MECL 10Ht ECL logic levels.
The 100H version is compatible with 100K levels.
Features
• 9−Bit Ideal for Byte−Parity Applications
• 3−State TTL Outputs
• Flow−Through Configuration
• Extra TTL and ECL Power Pins to Minimize Switching Noise
MARKING DIAGRAM*
1
• Dual Supply
• 6.0 ns Max Delay into 50 pF, 12 ns into 200 pF
(all Outputs Switching)
MCxxxH603G
AWLYYWW
• PNP TTL Inputs for Low Loading
• Pb−Free Packages are Available*
xxx
= 10 or 100
A
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
WL
YY
WW
G
*For additional marking information, refer to
Application Note AND8002/D.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
©
Semiconductor Components Industries, LLC, 2006
1
Publication Order Number:
November, 2006 − Rev. 10
MC10H603/D
MC10H603, MC100H603
Q5 GND V
Q6 GND Q7 Q8
Table 1. PIN NAMES
CCT
PIN
FUNCTION
25
24
23
22
21
20
19
26
27
28
18
17
16
D8
Q4
Q3
GND
TTL Ground (0 V)
D7
V
V
V
V
ECL V (0 V)
CCE
CCT
EE
CC
TTL Supply (+5.0 V)
ECL Supply (−5.2/−4.5 V)
Data Inputs (ECL)
Data Outputs (TTL)
3-State Control (ECL)
Latch Enable (ECL)
Master Reset (ECL)
V
CCT
Q2
CCE
D6
D5
D4
D3
15
14
13
12
D0−D8
Q0−Q8
OEECL
LEN
GND
Q1
2
3
4
MR
Q0
5
6
7
8
9
10
11
MR LEN OEECL V D0 D1 D2
EE
Figure 1. PLCC−28 Pinout (Top View)
OEECL
Table 2. TRUTH TABLE
D
LEN
MR OEECL
Q
Q0
D Q
EN
D0
D1
L
H
X
X
X
L
L
H
X
X
L
L
L
L
L
L
H
L
H
D Q
EN
Q1
Q2
Q3
Q4
Q5
Q6
Q7
Q8
L
Q
0
H
X
L
Z
D2
D3
D4
D5
D6
D Q
EN
D Q
EN
ECL
TTL
D Q
EN
D Q
EN
D Q
EN
D Q
EN
D7
D8
D Q
EN
LEN
MR
Figure 2. Logic Diagram
http://onsemi.com
2
MC10H603, MC100H603
10H ECL DC CHARACTERISTICS: V
= 5.0 V ± 10%; V = −5.2 V ± 5%
CCT
EE
0°C
25°C
85°C
Min
Max
−64
255
Min
Max
−64
175
Min
Max
−64
175
Symbol
Parameter
Unit
I
Power Supply Current
mA
EE
I
I
Input HIGH Current
Input LOW Current
mA
mA
INH
INL
0.5
0.5
0.5
V
V
Input HIGH Voltage
Input LOW Voltage
−1170
−840 −1130
−810 −1060
−720
mV
IH
IL
−1950 −1480 −1950 −1480 −1950 −1445
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
100H ECL DC CHARACTERISTICS: V
= 5.0 V ± 10%; V = −4.2 V to −5.5 V
CCT
EE
0°C
25°C
85°C
Min
Max
Min
Max
−64
175
Min
Max
−68
175
Symbol
Parameter
Unit
I
Power Supply Current
−63
mA
EE
I
I
Input HIGH Current
Input LOW Current
255
mA
mA
INH
INL
0.5
0.5
0.5
V
V
Input HIGH Voltage
Input LOW Voltage
−1165
−880 −1165
−880 −1165
−880
mV
IH
IL
−1810 −1475 −1810 −1475 −1810 −1475
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
TTL DC CHARACTERISTICS: V
= 5.0 V ± 10%; V = −5.2 V ± 5% (10H); V = −4.2 V to −5.5 V (100H)
EE EE
CCT
0°C
25°C
85°C
Min
Max
110
Min
Max
110
Min
Max
110
Symbol
CCH
Parameter
Condition
Unit
I
I
I
I
Power Supply Current
mA
110
110
110
CCL
Power Supply Current
110
110
110
CCZ
Output Short Circuit Current
V
= 0 V
−100
−225
−100
−225
−100
−225
mA
OS
OUT
I
I
Output Disable Current HIGH
Output Disable Current LOW
V
V
= 2.7 V
= 0.5 V
50
−50
50
−50
50
−50
mA
OZH
OZL
OUT
OUT
V
Output HIGH Voltage
I
I
= −3.0 mA
= −15 mA
2.5
2.0
2.5
2.0
2.5
2.0
V
OHT
OH
OH
V
Output LOW Voltage
I
= 48 mA
0.55
0.55
0.55
V
OLT
OL
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
http://onsemi.com
3
MC10H603, MC100H603
AC CHARACTERISTICS: V
= 5.0 V ± 10%; V = −5.2 V ± 5% (10H); V = −4.2 V to −5.5 V (100H)
CCT
EE
EE
0°C
25°C
85°C
Min
Max
Min
Max
Min
Max
Symbol
Parameter
Condition
C = 50 pF
Unit
t
t
Propagation Delay
D
3.0
6.4
6.0
12
3.0
6.4
6.0
12
3.0
6.4
6.0
12
ns
ns
PLH
PHL
L
to Output
C = 200 pF
L
LEN
MR
C = 50 pF
L
3.5
7.0
6.5
13
3.5
7.0
6.5
13
3.5
7.0
6.5
13
ns
ns
L
C = 200 pF
C = 50 pF
3.0
6.0
6.0
12
3.0
6.0
6.0
12
3.0
6.0
6.0
12
ns
ns
L
C = 200 pF
L
t
t
Output Disable Time
Output Enable Time
C = 50 pF
L
2.5
4.2
6.5
13
2.5
4.2
6.5
13
2.5
4.2
6.5
13
ns
ns
PLZ
PHZ
L
C = 200 pF
t
t
C = 50 pF
2.0
4.0
5.0
10
2.0
4.0
5.0
10
2.0
4.0
5.0
10
ns
ns
PZL
PZH
L
C = 200 pF
L
t
t
t
Setup Time
D to LEN
D to LEN
1.5
0.8
2.0
1.5
0.8
2.0
1.5
0.8
2.0
ns
ns
ns
s
Hold Time
h
LEN Pulse Width, LOW
w(L)
t
t
Output Rise/Fall Time
1.0 V−2.0 V
C = 50 pF
L
0.2
0.2
1.2
3.0
0.2
0.2
1.2
3.0
0.2
0.2
1.2
3.0
ns
ns
R
F
L
C = 200 pF
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
ORDERING INFORMATION
†
Device
Package
Shipping
MC10H603FN
PLCC−28
37 Units / Rail
37 Units / Rail
MC10H603FNG
PLCC−28
(Pb−Free)
MC10H603FNR2
PLCC−28
500 / Tape & Reel
500 / Tape & Reel
MC10H603FNR2G
PLCC−28
(Pb−Free)
MC100H603FN
PLCC−28
37 Units / Rail
37 Units / Rail
MC100H603FNG
PLCC−28
(Pb−Free)
MC100H603FNR2
MC100H603FNR2G
PLCC−28
500 / Tape & Reel
500 / Tape & Reel
PLCC−28
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
http://onsemi.com
4
MC10H603, MC100H603
Resource Reference of Application Notes
AN1405/D
AN1406/D
AN1503/D
AN1504/D
AN1568/D
AN1672/D
AND8001/D
AND8002/D
AND8020/D
AND8066/D
AND8090/D
−
−
−
−
−
−
−
−
−
−
−
ECL Clock Distribution Techniques
Designing with PECL (ECL at +5.0 V)
ECLinPSt I/O SPiCE Modeling Kit
Metastability and the ECLinPS Family
Interfacing Between LVDS and ECL
The ECL Translator Guide
Odd Number Counters Design
Marking and Date Codes
Termination of ECL Logic Devices
Interfacing with ECLinPS
AC Characteristics of ECL Devices
http://onsemi.com
5
MC10H603, MC100H603
PACKAGE DIMENSIONS
PLCC−28
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 776−02
ISSUE E
M
S
S
0.007 (0.180)
T
L−M
N
B
Y BRK
D
−N−
M
S
S
N
0.007 (0.180)
T
L−M
U
Z
−M−
−L−
W
D
S
S
S
N
0.010 (0.250)
T
L−M
X
G1
V
28
1
VIEW D−D
M
S
S
S
A
0.007 (0.180)
0.007 (0.180)
T
L−M
L−M
N
M
S
S
N
0.007 (0.180)
T
L−M
H
Z
M
S
T
N
R
K1
C
E
0.004 (0.100)
G
K
SEATING
PLANE
−T−
J
M
S
S
N
0.007 (0.180)
T
L−M
F
VIEW S
G1
S
S
S
N
0.010 (0.250)
T
L−M
VIEW S
NOTES:
INCHES
MILLIMETERS
1. DATUMS −L−, −M−, AND −N− DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS
PLASTIC BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM −T−, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE
MOLD FLASH. ALLOWABLE MOLD FLASH IS
0.010 (0.250) PER SIDE.
4. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN
THE PACKAGE BOTTOM BY UP TO 0.012
(0.300). DIMENSIONS R AND U ARE
DETERMINED AT THE OUTERMOST
EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR
BURRS, GATE BURRS AND INTERLEAD
FLASH, BUT INCLUDING ANY MISMATCH
BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
DIM MIN
MAX
0.495
0.495
0.180
0.110
0.019
MIN
12.32
12.32
4.20
MAX
12.57
12.57
4.57
A
B
C
E
F
0.485
0.485
0.165
0.090
0.013
2.29
0.33
2.79
0.48
G
H
J
0.050 BSC
1.27 BSC
0.026
0.020
0.025
0.450
0.450
0.042
0.042
0.042
0.032
−−−
−−−
0.66
0.51
0.64
11.43
11.43
1.07
1.07
1.07
−−−
0.81
−−−
K
R
U
V
W
X
Y
Z
−−−
0.456
0.456
0.048
0.048
0.056
11.58
11.58
1.21
1.21
1.42
0.50
10
−−− 0.020
10
2
2
_
_
_
_
G1 0.410
K1 0.040
0.430
−−−
10.42
1.02
10.92
−−−
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037
(0.940). THE DAMBAR INTRUSION(S) SHALL
NOT CAUSE THE H DIMENSION TO BE
SMALLER THAN 0.025 (0.635).
http://onsemi.com
6
MC10H603, MC100H603
ECLinPS is a trademark of Semiconductor Components Industries, LLC (SCILLC).
MECL 10H is a trademark of Motorola, Inc.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5773−3850
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
For additional information, please contact your local
Sales Representative
MC10H603/D
相关型号:
MC100H604FNR2G
HEX TTL TO ECL TRANSLATOR, COMPLEMENTARY OUTPUT, PQCC28, LEAD FREE, PLASTIC, LCC-28
ONSEMI
©2020 ICPDF网 联系我们和版权申明