MC10EP131MNR4G [ONSEMI]

3.3 V / 5.0 V ECL Quad D Flip-Flop with Set, Reset, and Differential Clock, QFN32, 5x5, 0.5P, 3.1x3.1EP, 1000-REEL;
MC10EP131MNR4G
型号: MC10EP131MNR4G
厂家: ONSEMI    ONSEMI
描述:

3.3 V / 5.0 V ECL Quad D Flip-Flop with Set, Reset, and Differential Clock, QFN32, 5x5, 0.5P, 3.1x3.1EP, 1000-REEL

逻辑集成电路 触发器
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MC10EP131, MC100EP131  
3.3V / 5VꢀECL Quad D  
Flip−Flop with Set, Reset,  
and Differential Clock  
Description  
http://onsemi.com  
MARKING  
The MC10/100EP131 is a Quad Masterslaved D flipflop with  
common set and separate resets. The device is an expansion of the  
E131 with differential common clock and individual clock enables.  
With AC performance faster than the E131 device, the EP131 is ideal  
for applications requiring the fastest AC performance available.  
Each flipflop may be clocked separately by holding Common  
DIAGRAM*  
MCxxx  
EP131  
AWLYYWWG  
Clock (C ) LOW and C HIGH, then using the differential Clock  
C
C
Enable inputs for clocking (C , C ).  
03 03  
Common clocking is achieved by holding the differential inputs  
LQFP32  
FA SUFFIX  
CASE 873A  
C
LOW and C  
HIGH while using the differential Common  
03  
03  
Clock (C ) to clock all four flipflops. When left floating open, any  
C
differential input will disable operation due to input pulldown resistors  
forcing an output default state.  
1
Individual asynchronous resets (R ) and an asynchronous set  
03  
MCxxx  
EP131  
(SET) are provided.  
Data enters the master when both C and C  
transfers to the slave when either C or C (or both) go HIGH.  
The 100 Series contains temperature compensation.  
32  
1
are LOW, and  
C
03  
AWLYYWWG  
QFN32  
MN SUFFIX  
CASE 488AM  
C
03  
G
Features  
xxx  
A
= 10 or 100  
= Assembly Location  
460 ps Typical Propagation Delay  
Maximum Frequency > 3 GHz Typical  
Differential Individual and Common Clocks  
Individual Asynchronous Resets  
Asynchronous Set  
WL, L = Wafer Lot  
YY, Y = Year  
WW, W = Work Week  
G or G = PbFree Package  
(Note: Microdot may be in either location)  
PECL Mode Operating Range: V = 3.0 V to 5.5 V  
*For additional marking information, refer to  
Application Note AND8002/D.  
CC  
with V = 0 V  
EE  
NECL Mode Operating Range: V = 0 V  
CC  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 9 of this data sheet.  
with V = 3.0 V to 5.5 V  
EE  
Open Input Default State  
Safety Clamp on Inputs  
Q Output Will Default LOW with Inputs Open or at V  
PbFree Packages are Available  
EE  
©
Semiconductor Components Industries, LLC, 2006  
1
Publication Order Number:  
November, 2006 Rev. 10  
MC10EP131/D  
MC10EP131, MC100EP131  
Q
Q
Q
Q
Q
Q
Q
Q
0
3
3
2
2
1
1
0
D2 SET R3 D3  
V
C3 C3 V  
CC  
EE  
32 31 30 29 28  
27 26  
25  
1
2
3
4
5
6
7
8
R2  
C2  
C2  
CC  
CC  
C1  
C1  
D1  
24  
23  
Q3  
Q3  
24 23 22 21 20 19 18 17  
25  
26  
27  
28  
29  
30  
31  
32  
16  
15  
14  
13  
12  
11  
10  
9
V
V
CC  
CC  
C
3
C
3
R
D
0
22 Q2  
0
21  
20  
19  
Q2  
Q1  
Q1  
MC10EP131  
MC100EP131  
V
V
CC  
EE  
32Lead LQFP Pinout  
D
R
C
C
R
(Top View)  
3
0
3
0
18  
17  
Q0  
Q0  
SET  
1
9
10  
11 12 13 14 15 16  
D0 R0  
D
2
V
EE  
1
2
3
4
5
6
7
8
V
R1 C0 C0  
V
V
CC  
EE  
CC  
Figure 2. 32Lead QFN Pinout (Top View)  
R
2
C
2
C
2
C
C
C
C
C
1
C
1
D
1
S
Warning: All V and V pins must be externally connected  
to Power Supply to guarantee proper operation.  
CC  
EE  
Q
Q
D
D
Q
Q
3
3
3
C
C
Figure 1. 32Lead LQFP Pinout (Top View)  
3
3
R
S
Table 1. PIN DESCRIPTION  
R
3
PIN  
FUNCTION  
D
*
ECL Data Inputs  
03  
D
Q
Q
Q
Q
2
D
2
2
C
03  
*, C  
*
03  
ECL Separate Clock Inputs  
ECL Common Clock Inputs  
C
C
2
C *, C *  
C
C
2
R
03  
*
ECL Asynchronous Reset  
ECL Asynchronous Set  
ECL Data Outputs  
R
R
2
SET*  
Q
, Q  
03  
03  
CC  
EE  
SET  
V
V
Positive Supply  
Negative Supply  
C
C
C
C
EP for  
QFN32, only  
The Exposed Pad (EP) on the  
QFN32 package bottom is  
thermally connected to the die  
for improved heat transfer out  
of package. The exposed pad  
must be attached to a heat−  
sinking conduit. The pad is  
R
1
R
C
C
1
Q
Q
Q
Q
1
1
1
electrically connected to V  
.
EE  
D
1
D
S
R
*
Pins will default LOW when left open.  
R
0
Table 2. TRUTH TABLE  
C
C
D
S*  
R*  
CLK  
Q
0
Q
Q
Q
Q
0
0
0
L
H
X
X
X
L
L
H
L
H
L
L
Z
Z
X
X
X
L
H
D
0
L
H
D
S
H
H
L
Undef  
V
EE  
Z = LOW to HIGH Transition  
* Pins will default low when left open.  
Figure 3. Logic Diagram  
http://onsemi.com  
2
MC10EP131, MC100EP131  
Table 3. ATTRIBUTES  
Characteristics  
Internal Input Pulldown Resistor  
Value  
75 kW  
N/A  
Internal Input Pullup Resistor  
ESD Protection  
Human Body Model  
Machine Model  
Charged Device Model  
> 2 kV  
> 100 V  
> 2 kV  
Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1)  
LQFP32  
Pb Pkg  
Level 2  
PbFree Pkg  
Level 2  
Level 1  
QFN32  
Flammability Rating  
Transistor Count  
Oxygen Index: 28 to 34  
UL 94 V0 @ 0.125 in  
935 Devices  
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test  
1. For additional information, see Application Note AND8003/D.  
Table 4. MAXIMUM RATINGS  
Symbol  
Parameter  
PECL Mode Power Supply  
NECL Mode Power Supply  
Condition 1  
= 0 V  
Condition 2  
Rating  
Unit  
V
V
V
V
V
V
6
CC  
EE  
I
EE  
CC  
= 0 V  
6  
V
PECL Mode Input Voltage  
NECL Mode Input Voltage  
V
V
= 0 V  
= 0 V  
V V  
6
6  
V
V
EE  
CC  
I
CC  
V V  
I
EE  
I
I
Output Current  
Continuous  
Surge  
50  
100  
mA  
mA  
out  
V
Sink/Source  
BB  
± 0.5  
mA  
°C  
BB  
T
Operating Temperature Range  
Storage Temperature Range  
40 to +85  
65 to +150  
A
T
°C  
stg  
q
Thermal Resistance (JunctiontoAmbient) 0 lfpm  
500 lfpm  
32 LQFP  
32 LQFP  
80  
55  
°C/W  
°C/W  
JA  
q
q
Thermal Resistance (JunctiontoCase)  
Standard Board  
Thermal Resistance (JunctiontoAmbient) 0 lfpm  
500 lfpm  
2S2P  
32 LQFP  
12 to 17  
°C/W  
JC  
JA  
QFN32  
QFN32  
31  
27  
°C/W  
°C/W  
q
Thermal Resistance (JunctiontoCase)  
QFN32  
12  
°C/W  
°C  
JC  
T
sol  
Wave Solder  
Pb  
PbFree  
265  
265  
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the  
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect  
device reliability.  
http://onsemi.com  
3
 
MC10EP131, MC100EP131  
Table 5. 10EP DC CHARACTERISTICS, PECL V = 3.3 V, V = 0 V (Note 2)  
CC  
EE  
40°C  
25°C  
Typ  
85°C  
Typ  
Symbol  
Characteristic  
Power Supply Current  
Min  
70  
Typ  
95  
Max  
120  
Min  
70  
Max  
120  
Min  
70  
Max  
120  
Unit  
mA  
mV  
mV  
mV  
mV  
V
I
95  
95  
EE  
V
Output HIGH Voltage (Note 3)  
Output LOW Voltage (Note 3)  
2165  
1365  
2090  
1365  
2.0  
2290  
1490  
2415  
1615  
2415  
1690  
3.3  
2230  
1430  
2155  
1460  
2.0  
2355  
1555  
2480  
1680  
2480  
1755  
3.3  
2290  
1490  
2215  
1490  
2.0  
2415  
1615  
2540  
1740  
2540  
1815  
3.3  
OH  
OL  
V
V
V
V
Input HIGH Voltage (SingleEnded)  
Input LOW Voltage (SingleEnded)  
IH  
IL  
Input HIGH Voltage Common Mode  
Range (Differential Configuration)  
(Note 4)  
IHCMR  
I
I
Input HIGH Current  
Input LOW Current  
150  
150  
150  
mA  
mA  
IH  
IL  
0.5  
0.5  
0.5  
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit  
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared  
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit  
values are applied individually under normal operating conditions and not valid simultaneously.  
2. Input and output parameters vary 1:1 with V . V can vary +0.3 V to 2.2 V.  
CC  
EE  
3. All loading with 50 W to V 2.0 V.  
CC  
4. V  
min varies 1:1 with V , V  
max varies 1:1 with V . The V  
range is referenced to the most positive side of the differential  
IHCMR  
EE IHCMR  
CC  
IHCMR  
input signal.  
Table 6. 10EP DC CHARACTERISTICS, PECL V = 5.0 V, V = 0 V (Note 5)  
CC  
EE  
40°C  
25°C  
Typ  
85°C  
Typ  
Symbol  
Characteristic  
Power Supply Current  
Min  
70  
Typ  
95  
Max  
120  
Min  
70  
Max  
120  
Min  
70  
Max  
120  
Unit  
mA  
mV  
mV  
mV  
mV  
V
I
95  
95  
EE  
V
Output HIGH Voltage (Note 6)  
Output LOW Voltage (Note 6)  
3865  
3065  
3790  
3065  
2.0  
3990  
3190  
4115  
3315  
4115  
3390  
5.0  
3930  
3130  
3855  
3130  
2.0  
4055  
3255  
4180  
3380  
4180  
3455  
5.0  
3990  
3190  
3915  
3190  
2.0  
4115  
3315  
4240  
3440  
4240  
3515  
5.0  
OH  
OL  
V
V
V
V
Input HIGH Voltage (SingleEnded)  
Input LOW Voltage (SingleEnded)  
IH  
IL  
Input HIGH Voltage Common Mode  
Range (Differential Configuration)  
(Note 7)  
IHCMR  
I
I
Input HIGH Current  
Input LOW Current  
150  
150  
150  
mA  
mA  
IH  
IL  
0.5  
0.5  
0.5  
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit  
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared  
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit  
values are applied individually under normal operating conditions and not valid simultaneously.  
5. Input and output parameters vary 1:1 with V . V can vary +2.0 V to 0.5 V.  
CC  
EE  
6. All loading with 50 W to V 2.0 V.  
CC  
7. V  
min varies 1:1 with V , V  
max varies 1:1 with V . The V  
range is referenced to the most positive side of the differential  
IHCMR  
EE IHCMR  
CC  
IHCMR  
input signal.  
http://onsemi.com  
4
 
MC10EP131, MC100EP131  
Table 7. 10EP DC CHARACTERISTICS, NECL V = 0 V, V = 5.5 V to 3.0 V (Note 8)  
CC  
EE  
40°C  
Typ  
95  
25°C  
Typ  
95  
85°C  
Typ  
95  
Symbol  
Characteristic  
Min  
70  
Max  
Min  
Max  
Min  
Max  
120  
Unit  
mA  
mV  
mV  
mV  
mV  
V
I
Power Supply Current  
120  
70  
120  
70  
EE  
V
Output HIGH Voltage (Note 9)  
Output LOW Voltage (Note 9)  
Input HIGH Voltage (SingleEnded)  
Input LOW Voltage (SingleEnded)  
1135 1010 885 1070 945  
820 1010 885  
760  
OH  
OL  
V
V
V
V
1935 1810 1685 1870 1745 1620 1810 1685 1560  
1210  
1935  
885 1145  
1610 1870  
820 1085  
1545 1810  
760  
1485  
0.0  
IH  
IL  
Input HIGH Voltage Common Mode  
Range (Differential Configuration)  
(Note 10)  
V
+2.0  
0.0  
V
+2.0  
0.0  
V
+2.0  
EE  
IHCMR  
EE  
EE  
I
I
Input HIGH Current  
Input LOW Current  
150  
150  
150  
mA  
mA  
IH  
IL  
0.5  
0.5  
0.5  
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit  
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared  
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit  
values are applied individually under normal operating conditions and not valid simultaneously.  
8. Input and output parameters vary 1:1 with V  
.
CC  
9. All loading with 50 W to V 2.0 V.  
CC  
10.V  
min varies 1:1 with V , V  
max varies 1:1 with V . The V  
range is referenced to the most positive side of the differential  
IHCMR  
EE IHCMR  
CC  
IHCMR  
input signal.  
Table 8. 100EP DC CHARACTERISTICS, PECL V = 3.3 V, V = 0 V (Note 11)  
CC  
EE  
40°C  
Typ  
25°C  
Typ  
85°C  
Typ  
Symbol  
Characteristic  
Power Supply Current  
Min  
70  
Max  
Min  
75  
Max  
120  
Min  
80  
Max  
130  
Unit  
mA  
mV  
mV  
mV  
mV  
V
I
95  
120  
2405  
1605  
2420  
1675  
3.3  
97  
105  
EE  
V
Output HIGH Voltage (Note 12)  
Output LOW Voltage (Note 12)  
Input HIGH Voltage (SingleEnded)  
Input LOW Voltage (SingleEnded)  
2155  
1355  
2075  
1355  
2.0  
2280  
1480  
2155  
1355  
2075  
1355  
2.0  
2280  
1480  
2405  
1605  
2420  
1675  
3.3  
2155  
1355  
2075  
1355  
2.0  
2280  
1480  
2405  
1605  
2420  
1675  
3.3  
OH  
OL  
V
V
V
V
IH  
IL  
Input HIGH Voltage Common Mode  
Range (Differential Configuration)  
(Note 13)  
IHCMR  
I
I
Input HIGH Current  
Input LOW Current  
150  
150  
150  
mA  
mA  
IH  
IL  
0.5  
0.5  
0.5  
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit  
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared  
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit  
values are applied individually under normal operating conditions and not valid simultaneously.  
11. Input and output parameters vary 1:1 with V . V can vary +0.3 V to 2.2 V.  
CC  
EE  
12.All loading with 50 W to V 2.0 V.  
CC  
13.V  
min varies 1:1 with V , V  
max varies 1:1 with V . The V  
range is referenced to the most positive side of the differential  
IHCMR  
EE IHCMR  
CC  
IHCMR  
input signal.  
http://onsemi.com  
5
 
MC10EP131, MC100EP131  
Table 9. 100EP DC CHARACTERISTICS, PECL V = 5.0 V, V = 0 V (Note 14)  
CC  
EE  
40°C  
Typ  
25°C  
Typ  
85°C  
Typ  
Symbol  
Characteristic  
Power Supply Current  
Min  
70  
Max  
Min  
75  
Max  
120  
Min  
80  
Max  
130  
Unit  
mA  
mV  
mV  
mV  
mV  
V
I
95  
120  
4105  
3305  
4120  
3375  
5.0  
97  
105  
EE  
V
Output HIGH Voltage (Note 15)  
Output LOW Voltage (Note 15)  
Input HIGH Voltage (SingleEnded)  
Input LOW Voltage (SingleEnded)  
3855  
3055  
3775  
3055  
2.0  
3980  
3180  
3855  
3055  
3775  
3055  
2.0  
3980  
3180  
4105  
3305  
4120  
3375  
5.0  
3855  
3055  
3775  
3055  
2.0  
3980  
3180  
4105  
3305  
4120  
3375  
5.0  
OH  
OL  
V
V
V
V
IH  
IL  
Input HIGH Voltage Common Mode  
Range (Differential Configuration)  
(Note 16)  
IHCMR  
I
I
Input HIGH Current  
Input LOW Current  
150  
150  
150  
mA  
mA  
IH  
IL  
0.5  
0.5  
0.5  
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit  
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared  
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit  
values are applied individually under normal operating conditions and not valid simultaneously.  
14.Input and output parameters vary 1:1 with V . V can vary +2.0 V to 0.5 V.  
CC  
EE  
15.All loading with 50 W to V 2.0 V.  
CC  
16.V  
min varies 1:1 with V , V  
max varies 1:1 with V . The V  
range is referenced to the most positive side of the differential  
IHCMR  
EE IHCMR  
CC  
IHCMR  
input signal.  
Table 10. 100EP DC CHARACTERISTICS, NECL V = 0 V, V = 5.5 V to 3.0 V (Note 17)  
CC  
EE  
40°C  
25°C  
Typ  
97  
85°C  
Typ  
105  
Symbol  
Characteristic  
Min  
Typ  
Max  
Min  
Max  
Min  
Max  
Unit  
mA  
mV  
mV  
mV  
mV  
V
I
Power Supply Current  
70  
95  
120  
75  
120  
80  
130  
EE  
V
Output HIGH Voltage (Note 18)  
Output LOW Voltage (Note 18)  
Input HIGH Voltage (SingleEnded)  
Input LOW Voltage (SingleEnded)  
1145 1020 895 1145 1020 895 1145 1020 895  
1945 1820 1695 1945 1820 1695 1945 1820 1695  
OH  
OL  
V
V
V
V
1225  
1945  
880 1225  
1625 1945  
880 1225  
1625 1945  
880  
1625  
0.0  
IH  
IL  
Input HIGH Voltage Common Mode  
Range (Differential Configuration)  
(Note 19)  
V
+2.0  
0.0  
V
+2.0  
0.0  
V
+2.0  
EE  
IHCMR  
EE  
EE  
I
I
Input HIGH Current  
Input LOW Current  
150  
150  
150  
mA  
mA  
IH  
IL  
0.5  
0.5  
0.5  
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit  
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared  
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit  
values are applied individually under normal operating conditions and not valid simultaneously.  
17.Input and output parameters vary 1:1 with V  
.
CC  
18.All loading with 50 W to V 2.0 V.  
CC  
19.V  
min varies 1:1 with V , V  
max varies 1:1 with V . The V  
range is referenced to the most positive side of the differential  
IHCMR  
EE IHCMR  
CC  
IHCMR  
input signal.  
http://onsemi.com  
6
 
MC10EP131, MC100EP131  
Table 11. AC CHARACTERISTICS V = 0 V; V = 3.0 V to 5.5 V or V = 3.0 V to 5.5 V; V = 0 V (Note 20)  
CC  
EE  
CC  
EE  
40°C  
Typ  
25°C  
Typ  
> 3  
85°C  
Typ  
> 3  
Symbol  
Characteristic  
Maximum Frequency  
Min  
Max  
Min  
Max  
Min  
Max  
Unit  
f
> 3  
GHz  
max  
(See Figure 4. Frequency vs. V  
and JITTER)  
OUTpp  
t
t
,
Propagation Delay to  
Output Differential  
C
03  
320  
320  
320  
300  
450  
450  
430  
430  
520  
520  
520  
550  
380  
400  
380  
380  
460  
500  
480  
460  
580  
600  
580  
580  
450  
450  
450  
400  
560  
560  
560  
530  
650  
650  
700  
650  
ps  
PLH  
PHL  
C
C
R
03  
SET  
t
Set/R03 Recovery  
290  
120  
210  
80  
290  
120  
210  
80  
350  
120  
280  
80  
ps  
ps  
RR  
t
t
Setup Time  
Hold Time  
S
H
t
Minimum Pulse Rate  
03  
SET,  
550  
400  
0.2  
550  
400  
0.2  
550  
400  
0.2  
PW  
R
t
CycletoCycle Jitter  
< 1  
< 1  
< 1  
ps  
ps  
JITTER  
(See Figure 4. Frequency vs. V  
and JITTER)  
OUTpp  
t
t
Output Rise/Fall Times  
Q, Q  
110  
180  
250  
125  
200  
275  
150  
230  
300  
r
f
(20% 80%)  
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit  
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared  
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit  
values are applied individually under normal operating conditions and not valid simultaneously.  
20.Measured using a 750 mV source, 50% duty cycle clock source. All loading with 50 W to V 2.0 V.  
CC  
http://onsemi.com  
7
 
MC10EP131, MC100EP131  
800  
700  
600  
500  
400  
300  
200  
100  
0
8
7
6
5
4
3
2
1
(JITTER)  
0
1000  
2000  
3000  
4000  
5000  
6000  
FREQUENCY (MHz)  
Figure 4. Frequency vs. VOUTpp and JITTER  
Z = 50 W  
Q
Q
D
D
o
Receiver  
Device  
Driver  
Device  
Z = 50 W  
o
50 W  
50 W  
V
TT  
V
= V 2.0 V  
TT  
CC  
Figure 5. Typical Termination for Output Driver and Device Evaluation  
(See Application Note AND8020/D Termination of ECL Logic Devices.)  
http://onsemi.com  
8
MC10EP131, MC100EP131  
ORDERING INFORMATION  
Device  
Package  
Shipping  
MC10EP131FA  
LQFP32  
250 Units / Tray  
250 Units / Tray  
MC10EP131FAG  
LQFP32  
(PbFree)  
MC10EP131FAR2  
MC10EP131FAR2G  
LQFP32  
2000 / Tape & Reel  
2000 / Tape & Reel  
LQFP32  
(PbFree)  
MC100EP131FA  
LQFP32  
250 Units / Tray  
250 Units / Tray  
MC100EP131FAG  
LQFP32  
(PbFree)  
MC100EP131FAR2  
MC100EP131FAR2G  
LQFP32  
2000 / Tape & Reel  
2000 / Tape & Reel  
LQFP32  
(PbFree)  
MC10EP131MNG  
74 Units / Tray  
1000 / Tape & Reel  
74 Units / Tray  
MC10EP131MNR4G  
MC100EP131MNG  
MC100EP131MNR4G  
QFN32  
(PbFree)  
1000 / Tape & Reel  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
Resource Reference of Application Notes  
AN1405/D  
AN1406/D  
AN1503/D  
AN1504/D  
AN1568/D  
AN1672/D  
AND8001/D  
AND8002/D  
AND8020/D  
AND8066/D  
AND8090/D  
ECL Clock Distribution Techniques  
Designing with PECL (ECL at +5.0 V)  
ECLinPSt I/O SPiCE Modeling Kit  
Metastability and the ECLinPS Family  
Interfacing Between LVDS and ECL  
The ECL Translator Guide  
Odd Number Counters Design  
Marking and Date Codes  
Termination of ECL Logic Devices  
Interfacing with ECLinPS  
AC Characteristics of ECL Devices  
http://onsemi.com  
9
MC10EP131, MC100EP131  
PACKAGE DIMENSIONS  
32 LEAD LQFP  
CASE 873A02  
ISSUE C  
4X  
A
A1  
0.20 (0.008) AB T−U  
Z
32  
25  
1
AE  
AE  
U−  
T−  
P
B
V
B1  
DETAIL Y  
BASE  
METAL  
DETAIL Y  
V1  
17  
8
N
9
4X  
Z−  
0.20 (0.008) AC T−U  
Z
9
F
D
S1  
S
_
8X M  
J
R
DETAIL AD  
G
SECTION AEAE  
AB−  
AC−  
E
C
SEATING  
PLANE  
0.10 (0.004) AC  
W
_
Q
H
K
X
DETAIL AD  
NOTES:  
MILLIMETERS  
DIM MIN MAX  
7.000 BSC  
INCHES  
MIN MAX  
0.276 BSC  
1. DIMENSIONING AND TOLERANCING  
PER ANSI Y14.5M, 1982.  
A
2. CONTROLLING DIMENSION:  
MILLIMETER.  
A1  
B
3.500 BSC  
7.000 BSC  
3.500 BSC  
0.138 BSC  
0.276 BSC  
0.138 BSC  
3. DATUM PLANE ABIS LOCATED AT  
BOTTOM OF LEAD AND IS COINCIDENT  
WITH THE LEAD WHERE THE LEAD  
EXITS THE PLASTIC BODY AT THE  
BOTTOM OF THE PARTING LINE.  
4. DATUMS T, U, AND ZTO BE  
DETERMINED AT DATUM PLANE AB.  
5. DIMENSIONS S AND V TO BE  
DETERMINED AT SEATING PLANE AC.  
6. DIMENSIONS A AND B DO NOT INCLUDE  
MOLD PROTRUSION. ALLOWABLE  
PROTRUSION IS 0.250 (0.010) PER SIDE.  
DIMENSIONS A AND B DO INCLUDE  
MOLD MISMATCH AND ARE  
DETERMINED AT DATUM PLANE AB.  
7. DIMENSION D DOES NOT INCLUDE  
DAMBAR PROTRUSION. DAMBAR  
PROTRUSION SHALL NOT CAUSE THE  
D DIMENSION TO EXCEED 0.520 (0.020).  
8. MINIMUM SOLDER PLATE THICKNESS  
SHALL BE 0.0076 (0.0003).  
B1  
C
1.400  
1.600 0.055  
0.063  
0.018  
0.057  
0.016  
D
0.300  
1.350  
0.300  
0.450 0.012  
1.450 0.053  
0.400 0.012  
E
F
G
H
0.800 BSC  
0.031 BSC  
0.050  
0.090  
0.450  
0.150 0.002  
0.200 0.004  
0.750 0.018  
0.006  
0.008  
0.030  
J
K
M
N
12_ REF  
12_ REF  
0.090  
0.160 0.004  
0.006  
P
0.400 BSC  
1_  
0.016 BSC  
1_  
Q
R
5_  
5 _  
0.150  
0.250 0.006  
0.010  
S
9.000 BSC  
0.354 BSC  
S1  
V
4.500 BSC  
9.000 BSC  
4.500 BSC  
0.200 REF  
1.000 REF  
0.177 BSC  
0.354 BSC  
0.177 BSC  
0.008 REF  
0.039 REF  
V1  
W
X
9. EXACT SHAPE OF EACH CORNER MAY  
VARY FROM DEPICTION.  
http://onsemi.com  
10  
MC10EP131, MC100EP131  
PACKAGE DIMENSIONS  
QFN32 5*5*1 0.5 P  
CASE 488AM01  
ISSUE O  
A
B
NOTES:  
1. DIMENSIONS AND TOLERANCING PER  
ASME Y14.5M, 1994.  
D
2. CONTROLLING DIMENSION: MILLIMETERS.  
3. DIMENSION b APPLIES TO PLATED  
TERMINAL AND IS MEASURED BETWEEN  
0.25 AND 0.30 MM TERMINAL  
PIN ONE  
LOCATION  
4. COPLANARITY APPLIES TO THE EXPOSED  
PAD AS WELL AS THE TERMINALS.  
E
MILLIMETERS  
DIM MIN  
0.800 0.900 1.000  
A1 0.000 0.025 0.050  
NOM MAX  
A
2 X  
0.15  
C
TOP VIEW  
A3  
b
D
0.200 REF  
0.180 0.250 0.300  
5.00 BSC  
2 X  
0.15  
C
C
D2 2.950 3.100 3.250  
5.00 BSC  
E2 2.950 3.100 3.250  
E
(A3)  
0.10  
0.08  
e
K
L
0.500 BSC  
0.200 −−−  
0.300 0.400 0.500  
A
−−−  
SEATING  
PLANE  
32 X  
C
A1  
SIDE VIEW  
D2  
C
L
EXPOSED PAD  
32 X  
K
16  
9
32 X  
17  
SOLDERING FOOTPRINT*  
8
5.30  
E2  
3.20  
1
24  
32 X  
0.63  
25  
32  
32 X  
b
e
0.10  
0.05  
C
A
B
3.20 5.30  
C
BOTTOM VIEW  
32 X  
0.28  
28 X  
0.50 PITCH  
*For additional information on our PbFree strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
ECLinPS is a trademark of Semiconductor Components INdustries, LLC (SCILLC).  
ON Semiconductor and  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice  
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All  
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights  
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications  
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should  
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,  
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal  
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMENT:  
N. American Technical Support: 8002829855 Toll Free  
USA/Canada  
Europe, Middle East and Africa Technical Support:  
Phone: 421 33 790 2910  
Japan Customer Focus Center  
Phone: 81357733850  
ON Semiconductor Website: www.onsemi.com  
Order Literature: http://www.onsemi.com/orderlit  
Literature Distribution Center for ON Semiconductor  
P.O. Box 5163, Denver, Colorado 80217 USA  
Phone: 3036752175 or 8003443860 Toll Free USA/Canada  
Fax: 3036752176 or 8003443867 Toll Free USA/Canada  
Email: orderlit@onsemi.com  
For additional information, please contact your local  
Sales Representative  
MC10EP131/D  

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