MC10EP16VAMNR4G [ONSEMI]
3.3V / 5V ECL Differential Receiver/Driver with High Gain; 3.3V / 5V ECL差分接收器/驱动器，具有高增益
| 型号： | MC10EP16VAMNR4G |
| 厂家： | 
ONSEMI |
| 描述： | 3.3V / 5V ECL Differential Receiver/Driver with High Gain |
| 文件： | 总11页 (文件大小：167K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MC10EP16VA, MC100EP16VA
3.3V / 5VꢀECL Differential
Receiver/Driver with High
Gain
Description
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MARKING DIAGRAMS*
The EP16VA is a world−class differential receiver/driver. The
device is functionally equivalent to the EP16 and LVEP16 devices but
with high gain output. Q and Q outputs have a DC gain several
HG
HG
times larger than the DC gain of an EP16.
8
8
The V pin, an internally generated voltage supply, is available to
BB
8
HEP64
ALYW
G
KEP64
ALYW
G
this device only. For single-ended input conditions, the unused
1
differential input is connected to V as a switching reference voltage.
BB
SOIC−8
D SUFFIX
CASE 751
V
BB
may also rebias AC coupled inputs. When used, decouple V
1
1
BB
and V via a 0.01 mF capacitor and limit current sourcing or sinking
CC
to 0.5 mA. When not used, V should be left open.
BB
Under open input conditions (pulled to V ) internal input clamps
EE
will force the Q output LOW.
Special considerations are required for differential inputs under No
Signal conditions to prevent instability.
8
8
1
HG
8
1
HP64
KP64
ALYWG
ALYWG
TSSOP−8
DT SUFFIX
CASE 948R
The 100 Series contains temperature compensation.
G
G
1
Features
• 270 ps Typical Propagation Delay
• Gain > 20
• 20 mV Minimum Input Voltage Swing
• Maximum Frequency > 3 GHz Typical
1
4
1
4
DFN8
MN SUFFIX
CASE 506AA
• PECL Mode Operating Range: V = 3.0 V to 5.5 V
CC
with V = 0 V
EE
• NECL Mode Operating Range: V = 0 V
CC
H
K
= MC10
= MC100
5N = MC10
3E = MC100
A
L
Y
W
G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
with V = −3.0 V to −5.5 V
EE
• Open Input Default State
• V Output
BB
M
= Date Code
• Pb−Free Packages are Available
(Note: Microdot may be in either location)
*For additional marking information, refer to
Application Note AND8002/D.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 8 of this data sheet.
© Semiconductor Components Industries, LLC, 2006
1
Publication Order Number:
December, 2006 − Rev. 8
MC10EP16VA/D
MC10EP16VA, MC100EP16VA
Table 1. PIN DESCRIPTION
NC
D
1
2
8
7
V
CC
PIN
FUNCTION
D*, D*
ECL Data Inputs
Q
, Q
ECL High Gain Data Outputs
Reference Voltage Output
Positive Supply
HG
BB
CC
EE
HG
Q
Q
HG
HG
V
V
V
Negative Supply
D
3
4
6
5
NC
EP
No Connect
Exposed pad must be connected
to a sufficient thermal conduit.
Electrically connect to the most
negative supply or leave floating
open.
V
BB
V
EE
*
Pins will default LOW when left open.
Figure 1. 8−Lead Pinout (Top View) and Logic Diagram
Table 2. ATTRIBUTES
Characteristics
Value
75 kW
N/A
Internal Input Pulldown Resistor
Internal Input Pullup Resistor
ESD Protection
Human Body Model
Machine Model
Charged Device Model
> 4 kV
> 200 V
> 2 kV
Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1)
Pb Pkg
Pb−Free Pkg
SOIC−8
Level 1
Level 1
Level 1
Level 1
Level 3
Level 1
TSSOP−8
DFN8
Flammability Rating
Transistor Count
Oxygen Index: 28 to 34
UL−94 V−0 @ 0.125 in
167
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
1. For additional information, see Application Note AND8003/D.
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2
MC10EP16VA, MC100EP16VA
Table 3. MAXIMUM RATINGS
Symbol
Parameter
Condition 1
= 0 V
Condition 2
Rating
Unit
V
V
CC
V
EE
V
I
PECL Mode Power Supply
NECL Mode Power Supply
V
V
6
EE
= 0 V
−6
V
CC
PECL Mode Input Voltage
NECL Mode Input Voltage
V
V
= 0 V
= 0 V
V ꢀ V
6
−6
V
V
EE
I
CC
V ꢁ V
CC
I
EE
I
I
Output Current
Continuous
Surge
50
100
mA
mA
out
V
BB
Sink/Source
± 0.5
mA
°C
BB
T
Operating Temperature Range
Storage Temperature Range
−40 to +85
−65 to +150
A
T
°C
stg
q
Thermal Resistance (Junction−to−Ambient) 0 lfpm
500 lfpm
8 SOIC
8 SOIC
190
130
°C/W
°C/W
JA
q
q
Thermal Resistance (Junction−to−Case)
Standard Board
Thermal Resistance (Junction−to−Ambient) 0 lfpm
500 lfpm
Standard Board
Thermal Resistance (Junction−to−Ambient) 0 lfpm
8 SOIC
41 to 44
°C/W
JC
JA
8 TSSOP
8 TSSOP
185
140
°C/W
°C/W
q
q
Thermal Resistance (Junction−to−Case)
8 TSSOP
41 to 44
°C/W
JC
JA
DFN8
DFN8
129
84
°C/W
°C/W
500 lfpm
T
sol
Wave Solder
Pb <2 to 3 sec @ 248°C
Pb−Free <2 to 3 sec @ 260°C
265
265
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
Table 4. 10EP DC CHARACTERISTICS, PECL V = 3.3 V, V = 0 V (Note 2)
CC
EE
−40°C
25°C
Typ
85°C
Typ
Symbol
Characteristic
Power Supply Current
Min
Typ
28
Max
31
Min
22
Max
38
Min
24
Max Unit
I
EE
20
30
32
40
mA
mV
mV
mV
mV
mV
V
V
V
V
V
V
V
Output HIGH Voltage (Note 3)
Output LOW Voltage (Note 3)
Input HIGH Voltage (Single−Ended)
Input LOW Voltage (Single−Ended)
Output Voltage Reference
2165
1365
2090
1365
1790
2.0
2240
1490
2415
1615
2415
1690
1990
3.3
2230
1430
2155
1460
1855
2.0
2355
1555
2480
1680
2480
1755
2055
3.3
2290
1490
2215
1490
1915
2.0
2415
1615
2540
1740
2540
1815
2115
3.3
OH
OL
IH
IL
1950
2000
2040
BB
Input HIGH Voltage Common Mode
Range (Differential Configuration) (Note 4)
IHCMR
I
I
Input HIGH Current
Input LOW Current
150
150
150
mA
mA
IH
0.5
0.5
0.5
IL
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
2. Input and output parameters vary 1:1 with V . V can vary +0.3 V to −2.2 V.
CC
EE
3. All loading with 50 W to V − 2.0 V.
CC
4. V
min varies 1:1 with V , V
max varies 1:1 with V . The V
range is referenced to the most positive side of the differential
IHCMR
EE IHCMR
CC
IHCMR
input signal.
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3
MC10EP16VA, MC100EP16VA
Table 5. 10EP DC CHARACTERISTICS, PECL V = 5.0 V, V = 0 V (Note 5)
CC
EE
−40°C
25°C
Typ
85°C
Typ
Symbol
Characteristic
Power Supply Current
Min
Typ
28
Max
31
Min
22
Max
38
Min
24
Max Unit
I
EE
20
30
32
40
mA
mV
mV
mV
mV
mV
V
V
V
V
V
V
V
Output HIGH Voltage (Note 6)
Output LOW Voltage (Note 6)
Input HIGH Voltage (Single−Ended)
Input LOW Voltage (Single−Ended)
Output Voltage Reference
3865
3065
3790
3065
3490
2.0
3940
3190
4115
3315
4115
3390
3690
5.0
3930
3130
3855
3130
3555
2.0
4055
3255
4180
3380
4180
3455
3755
5.0
3990
3190
3915
3190
3615
2.0
4115
3315
4240
3440
4240
3515
3815
5.0
OH
OL
IH
IL
3633
3670
3710
BB
Input HIGH Voltage Common Mode
Range (Differential Configuration) (Note 7)
IHCMR
I
I
Input HIGH Current
Input LOW Current
150
150
150
mA
mA
IH
0.5
0.5
0.5
IL
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
5. Input and output parameters vary 1:1 with V . V can vary +2.0 V to −0.5 V.
CC
EE
6. All loading with 50 W to V − 2.0 V.
CC
7. V
min varies 1:1 with V , V
max varies 1:1 with V . The V
range is referenced to the most positive side of the differential
IHCMR
EE IHCMR
CC
IHCMR
input signal.
Table 6. 10EP DC CHARACTERISTICS, NECL V = 0 V; V = −5.5 V to −3.0 V (Note 8)
CC
EE
−40°C
25°C
Typ
30
85°C
Typ
32
Symbol
Characteristic
Power Supply Current
Min
20
Typ
Max
Min
Max
Min
Max
40
Unit
mA
mV
I
EE
28
31
22
38
24
V
V
V
V
V
V
Output HIGH Voltage (Note 9)
Output LOW Voltage (Note 9)
Input HIGH Voltage (Single−Ended)
Input LOW Voltage (Single−Ended)
Output Voltage Reference
−1135 −1060 −885 −1070 −945
−820 −1010 −885
−760
OH
−1935 −1810 −1685 −1870 −1745 −1620 −1810 −1685 −1560 mV
OL
−1210
−1935
−885 −1145
−1610 −1870
−820 −1085
−1545 −1810
−760
mV
IH
−1485 mV
IL
−1510 −1367 −1310 −1445 −1330 −1245 −1385 −1290 −1185 mV
BB
Input HIGH Voltage Common Mode
Range (Differential Configuration)
(Note 10)
V
EE
+2.0
0.0
V
EE
+2.0
0.0
V
EE
+2.0
0.0
V
IHCMR
I
I
Input HIGH Current
Input LOW Current
150
150
150
mA
mA
IH
0.5
0.5
0.5
IL
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
8. Input and output parameters vary 1:1 with V
.
CC
9. All loading with 50 W to V − 2.0 V.
CC
10.V
min varies 1:1 with V , V
max varies 1:1 with V . The V
range is referenced to the most positive side of the differential
IHCMR
EE IHCMR
CC
IHCMR
input signal.
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4
MC10EP16VA, MC100EP16VA
Table 7. 100EP DC CHARACTERISTICS, PECL V = 3.3 V, V = 0 V (Note 11)
CC
EE
−40°C
25°C
Typ
85°C
Typ
Symbol
Characteristic
Power Supply Current
Min
20
Typ
28
Max
36
Min
22
Max
38
Min
24
Max Unit
I
EE
30
32
40
mA
mV
mV
mV
mV
mV
V
V
V
V
V
V
V
Output HIGH Voltage (Note 12)
Output LOW Voltage (Note 12)
Input HIGH Voltage (Single−Ended)
Input LOW Voltage (Single−Ended)
Output Voltage Reference
2155
1355
2075
1355
1775
2.0
2280
1480
2405
1605
2420
1675
1975
3.3
2155
1355
2075
1355
1775
2.0
2280
1480
2405
1605
2420
1675
1975
3.3
2155
1355
2075
1355
1775
2.0
2280
1480
2405
1605
2420
1675
1975
3.3
OH
OL
IH
IL
1875
1875
1875
BB
Input HIGH Voltage Common Mode
Range (Differential Configuration)
(Note 13)
IHCMR
I
I
Input HIGH Current
Input LOW Current
150
150
150
mA
mA
IH
0.5
0.5
0.5
IL
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
11. Input and output parameters vary 1:1 with V . V can vary +0.3 V to −2.2 V.
CC
EE
12.All loading with 50 W to V − 2.0 V.
CC
13.V
min varies 1:1 with V , V
max varies 1:1 with V . The V
range is referenced to the most positive side of the differential
IHCMR
EE IHCMR
CC
IHCMR
input signal.
Table 8. 100EP DC CHARACTERISTICS, PECL V = 5.0 V, V = 0 V (Note 14)
CC
EE
−40°C
25°C
Typ
85°C
Typ
Symbol
Characteristic
Power Supply Current
Min
20
Typ
28
Max
36
Min
22
Max
38
Min
24
Max Unit
I
EE
30
32
40
mA
mV
mV
mV
mV
mV
V
V
V
V
V
V
V
Output HIGH Voltage (Note 15)
Output LOW Voltage (Note 15)
Input HIGH Voltage (Single−Ended)
Input LOW Voltage (Single−Ended)
Output Voltage Reference
3855
3055
3775
3055
3475
2.0
3980
3180
4105
3305
4120
3375
3675
5.0
3855
3055
3775
3055
3475
2.0
3980
3180
4105
3305
4120
3375
3675
5.0
3855
3055
3775
3055
3475
2.0
3980
3180
4105
3305
4120
3375
3675
5.0
OH
OL
IH
IL
3575
3575
3575
BB
Input HIGH Voltage Common Mode
Range (Differential Configuration)
(Note 16)
IHCMR
I
I
Input HIGH Current
Input LOW Current
150
150
150
mA
mA
IH
0.5
0.5
0.5
IL
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
14.Input and output parameters vary 1:1 with V . V can vary +2.0 V to −0.5 V.
CC
EE
15.All loading with 50 W to V − 2.0 V.
CC
16.V
min varies 1:1 with V , V
max varies 1:1 with V . The V
range is referenced to the most positive side of the differential
IHCMR
EE IHCMR
CC
IHCMR
input signal.
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5
MC10EP16VA, MC100EP16VA
Table 9. 100EP DC CHARACTERISTICS, NECL V = 0 V; V = −5.5 V to −3.0 V (Note 17)
CC
EE
−40°C
Typ
28
25°C
Typ
30
85°C
Typ
32
Symbol
Characteristic
Power Supply Current
Min
20
Max
Min
Max
Min
Max
Unit
mA
mV
I
EE
36
22
38
24
40
V
V
V
V
V
V
Output HIGH Voltage (Note 18)
Output LOW Voltage (Note 18)
Input HIGH Voltage (Single−Ended)
Input LOW Voltage (Single−Ended)
Output Voltage Reference
−1145 −1020 −895 −1145 −1020 −895 −1145 −1020 −895
OH
OL
−1945 −1820 −1695 −1945 −1820 −1695 −1945 −1820 −1695 mV
−1225
−1945
−880 −1225
−1625 −1945
−880 −1225
−1625 −1945
−880
mV
IH
−1625 mV
IL
−1525 −1425 −1325 −1525 −1425 −1325 −1525 −1425 −1325 mV
BB
Input HIGH Voltage Common Mode
Range (Differential Configuration)
(Note 19)
V
EE
+2.0
0.0
V
EE
+2.0
0.0
V
EE
+2.0
0.0
V
IHCMR
I
I
Input HIGH Current
Input LOW Current
150
150
150
mA
mA
IH
0.5
0.5
0.5
IL
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
17.Input and output parameters vary 1:1 with V
.
CC
18.All loading with 50 W to V − 2.0 V.
CC
19.V
min varies 1:1 with V , V
max varies 1:1 with V . The V
range is referenced to the most positive side of the differential
IHCMR
EE IHCMR
CC
IHCMR
input signal.
Table 10. AC CHARACTERISTICS V = 0 V; V = −3.0 V to −5.5 V or V = 3.0 V to 5.5 V; V = 0 V (Note 20)
CC
EE
CC
EE
−40°C
25°C
85°C
Symbol
Characteristic
Min Typ Max Min Typ Max Min Typ Max Unit
f
Maximum Frequency
(See Figure 2 F /JITTER)
> 3
> 3
> 3
GHz
ps
max
max
t
t
,
Propagation Delay to
Output Differential
200 260 320 220 270 340 250 320 390
PLH
PHL
t
t
Duty Cycle Skew (Note 21)
5.0
0.2
20
5.0
0.2
20
5.0
0.2
20
ps
ps
SKEW
Cycle−to−Cycle Jitter
< 1
< 1
< 1
JITTER
(See Figure 2 F
/JITTER)
max
V
Input Voltage Swing (Differential Configuration)
(See Figure 3)
20
70
800 120
0
20
80
800 120
0
20
80
800 120
0
mV
ps
PP
t
r
t
f
Output Rise/Fall Times
(20% − 80%)
Q, Q
110
170
110
180
120 200
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
20.Measured using a 750 mV source, 50% duty cycle clock source. All loading with 50 W to V −2.0 V.
CC
21.Skew is measured between outputs under identical transitions. Duty cycle skew is defined only for differential operation when the delays
are measured from the cross point of the inputs to the cross point of the outputs.
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MC10EP16VA, MC100EP16VA
9
900
800
700
600
500
400
300
200
100
0
8
7
6
5
4
3
2
1
(JITTER)
0
1000
2000
3000
4000
5000
FREQUENCY (MHz)
Figure 2. Fmax/Jitter
800
700
600
500
400
300
200
100
0
20
15
10
5
0
V
(mV)
INpp
Figure 3. Gain vs. Input Voltage (50 MHz)
Z = 50 W
Q
Q
D
D
o
Receiver
Device
Driver
Device
Z = 50 W
o
50 W
50 W
V
TT
V
TT
= V − 2.0 V
CC
Figure 4. Typical Termination for Output Driver and Device Evaluation
(See Application Note AND8020/D − Termination of ECL Logic Devices.)
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MC10EP16VA, MC100EP16VA
ORDERING INFORMATION
Device
†
Package
Shipping
MC10EP16VAD
SOIC−8
98 Units / Rail
98 Units / Rail
MC10EP16VADG
SOIC−8
(Pb−Free)
MC10EP16VADR2
MC10EP16VADR2G
SOIC−8
2500 / Tape & Reel
2500 / Tape & Reel
SOIC−8
(Pb−Free)
MC10EP16VADT
TSSOP−8
100 Units / Rail
100 Units / Rail
MC10EP16VADTG
TSSOP−8
(Pb−Free)
MC10EP16VADTR2
MC10EP16VADTR2G
TSSOP−8
2500 / Tape & Reel
2500 / Tape & Reel
TSSOP−8
(Pb−Free)
MC10EP16VAMNR4
MC10EP16VAMNR4G
DFN8
1000 / Tape & Reel
1000 / Tape & Reel
DFN8
(Pb−Free)
MC100EP16VAD
SOIC−8
98 Units / Rail
98 Units / Rail
MC100EP16VADG
SOIC−8
(Pb−Free)
MC100EP16VADR2
MC100EP16VADR2G
SOIC−8
2500 / Tape & Reel
2500 / Tape & Reel
SOIC−8
(Pb−Free)
MC100EP16VADT
MC100EP16VADTG
TSSOP−8
100 Units / Rail
100 Units / Rail
TSSOP−8
(Pb−Free)
MC100EP16VADTR2
MC100EP16VADTR2G
TSSOP−8
2500 / Tape & Reel
2500 / Tape & Reel
TSSOP−8
(Pb−Free)
MC100EP16VAMNR4
MC100EP16VAMNR4G
DFN8
1000 / Tape & Reel
1000 / Tape & Reel
DFN8
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
Resource Reference of Application Notes
AN1405/D
AN1406/D
AN1503/D
AN1504/D
AN1568/D
AN1672/D
AND8001/D
AND8002/D
AND8020/D
AND8066/D
AND8090/D
−
−
−
−
−
−
−
−
−
−
−
ECL Clock Distribution Techniques
Designing with PECL (ECL at +5.0 V)
ECLinPSt I/O SPiCE Modeling Kit
Metastability and the ECLinPS Family
Interfacing Between LVDS and ECL
The ECL Translator Guide
Odd Number Counters Design
Marking and Date Codes
Termination of ECL Logic Devices
Interfacing with ECLinPS
AC Characteristics of ECL Devices
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8
MC10EP16VA, MC100EP16VA
PACKAGE DIMENSIONS
SOIC−8 NB
CASE 751−07
ISSUE AH
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
−X−
A
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
8
5
4
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
STANDARD IS 751−07.
S
M
M
B
0.25 (0.010)
Y
1
K
−Y−
G
MILLIMETERS
DIM MIN MAX
INCHES
MIN
MAX
0.197
0.157
0.069
0.020
A
B
C
D
G
H
J
K
M
N
S
4.80
3.80
1.35
0.33
5.00 0.189
4.00 0.150
1.75 0.053
0.51 0.013
C
N X 45
_
SEATING
PLANE
−Z−
1.27 BSC
0.050 BSC
0.10 (0.004)
0.10
0.19
0.40
0
0.25 0.004
0.25 0.007
1.27 0.016
0.010
0.010
0.050
8
0.020
0.244
M
J
H
D
8
0
_
_
_
_
0.25
5.80
0.50 0.010
6.20 0.228
M
S
S
X
0.25 (0.010)
Z
Y
SOLDERING FOOTPRINT*
1.52
0.060
7.0
4.0
0.275
0.155
0.6
0.024
1.270
0.050
mm
inches
ǒ
Ǔ
SCALE 6:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
9
MC10EP16VA, MC100EP16VA
PACKAGE DIMENSIONS
TSSOP−8
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948R−02
ISSUE A
8x K REF
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
M
S
S
V
0.10 (0.004)
T U
S
0.15 (0.006) T U
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.
2X L/2
8
5
4
0.25 (0.010)
B
−U−
L
1
M
PIN 1
IDENT
5. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
6. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE −W−.
S
0.15 (0.006) T U
A
−V−
F
DETAIL E
MILLIMETERS
INCHES
MIN
DIM MIN
MAX
3.10
3.10
MAX
0.122
0.122
0.043
0.006
0.028
A
B
C
D
F
2.90
2.90
0.80
0.05
0.40
0.114
0.114
C
1.10 0.031
0.15 0.002
0.70 0.016
0.10 (0.004)
−W−
SEATING
PLANE
D
−T−
G
G
K
L
0.65 BSC
0.026 BSC
0.25
0.40 0.010
0.016
4.90 BSC
0.193 BSC
0
DETAIL E
M
0
6
6
_
_
_
_
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10
MC10EP16VA, MC100EP16VA
PACKAGE DIMENSIONS
DFN8
CASE 506AA−01
ISSUE D
1
NOTES:
D
A
B
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994 .
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
PIN ONE
REFERENCE
MILLIMETERS
DIM MIN
MAX
1.00
0.05
E
A
A1
A3
b
0.80
0.00
0.20 REF
0.20
0.30
2 X
D
D2
E
E2
e
K
2.00 BSC
0.10
C
1.10
1.30
2.00 BSC
2 X
0.70
0.90
0.50 BSC
0.10
C
TOP VIEW
0.20
0.25
−−−
0.35
L
A
0.10
0.08
C
C
8 X
(A3)
SIDE VIEW
D2
A1
SEATING
PLANE
C
e
e/2
4
1
8 X L
E2
K
8
5
0.10 C A B
0.05
8 X b
C
NOTE 3
BOTTOM VIEW
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are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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