MC10H124_16 [ONSEMI]
Quad TTLâtoâMECL Translator;
| 型号： | MC10H124_16 |
| 厂家： | 
ONSEMI |
| 描述： | Quad TTLâtoâMECL Translator |
| 文件： | 总6页 (文件大小：149K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MC10H124
Quad TTL‐to‐MECL
Translator With
TTL Strobe Input
Description
www.onsemi.com
The MC10H124 is a quad translator for interfacing data and control
signals between a saturated logic section and the MECL section of
digital systems. The 10H part is a functional/pinout duplication of the
standard MECL 10K™ family part, with 100% improvement in
propagation delay, and no increase in power-supply current.
Features
• Propagation Delay, 1.5 ns Typical
16
20
1
1
• Improved Noise Margin 150 mV
(Over Operating Voltage and Temperature Range)
• Voltage Compensated
PDIP−16
P SUFFIX
CASE 648−08
PLLC−20
FN SUFFIX
CASE 775−02
• MECL 10K Compatible
• These Devices are Pb-Free, Halogen Free and are RoHS Compliant
5
6
4
2
MARKING DIAGRAMS*
1 20
16
7
10
11
3
1
MC10H124P
AWLYYWWG
10H124G
AWLYYWW
12
15
1
13
14
A
= Assembly Location
WL, L = Wafer Lot
GND = PIN 16
( +5.0 VDC) = PIN 9
( -5.2 VDC) = PIN 8
YY, Y
= Year
V
V
WW, W = Work Week
G or G = Pb-Free Package
CC
EE
Figure 1. Logic Diagram
*For additional marking information, refer to
Application Note AND8002/D.
ORDERING INFORMATION
†
Device
Package
Shipping
MC10H124FNG
MC10H124FNR2G
MC10H124PG
PLCC−20
(Pb-Free)
46 Units/Tube
500/Tape & Reel
25 Units/Tube
PLCC−20
(Pb-Free)
PDIP−16
(Pb-Free)
†For information on tape and reel specifications, in-
cluding part orientation and tape sizes, please refer
to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2016
1
Publication Order Number:
August, 2016 − Rev. 12
MC10H124/D
MC10H124
Exposed Pad (EP)
GND C
D
D
OUT OUT OUT
B
A
B
A
GND
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
OUT
OUT
OUT
OUT
16
15
14
13
C
OUT
B
C
D
C
V
1
2
3
4
12
11
10
9
OUT
OUT
D
OUT
A
OUT
D
IN
IN
OUT
MC10H124
C
A
IN
OUT
B
OUT
COMMON
STROBE
D
IN
A
OUT
CC
C
B
IN
IN
V
CC
V
EE
5
6
7
8
A
COMMON B
STROBE
V
IN EE
IN
Pin assignment is for Dual-in-Line Package.
For PLCC pin assignment, see Table 1.
Pin assignment for QFN16 Package.
Figure 2. Pin Assignment
Table 1. DIP CONVERSION TABLE
16-Pin DIL to 20-Pin PLCC
16 PIN DIL
1
2
2
3
3
4
4
5
5
7
6
8
7
9
8
9
10
13
11
14
12
15
13
17
14
18
15
19
16
20
20 PIN PLCC
10
12
Table 2. MAXIMUM RATINGS
Symbol
Characteristic
Rating
Unit
V
Power Supply (V = 5.0 V)
−8.0 to 0
Vdc
Vdc
Vdc
mA
EE
CC
V
CC
Power Supply (V = −5.2 V)
0 to +7.0
EE
V
Input Voltage (V = 5.0 V) TTL
0 to V
I
CC
CC
I
Output Current
Continuous
Surge
out
50
100
T
Operating Temperature Range
0 to +75
°C
°C
A
T
stg
Storage Temperature Range
Plastic
Ceramic
−55 to +150
−55 to +165
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
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2
MC10H124
Table 3. ELECTRICAL CHARACTERISTICS (V = −5.2 V 5%, V = 5.0 V 5.0%)
EE
CC
0°
25°
75°
Symbol
Characteristic
Min
Max
Min
Max
Min
Max
Unit
I
E
Negative Power
Supply Drain Current
−
72
−
66
−
72
mA
I
Positive Power
Supply Drain Current
−
−
16
25
−
−
16
25
−
−
18
25
mA
CCH
CCL
I
I
R
Reverse Current
Pin 6
Pin 7
mA
−
−
200
50
−
−
200
50
−
−
200
50
I
F
Forward Current
Pin 6
Pin 7
mA
−
−
−12.8
−3.2
−
−
−12.8
−3.2
−
−
−12.8
−3.2
V
Input Breakdown Voltage
Input Clamp Voltage
High Output Voltage
Low Output Voltage
High Input Voltage
5.5
−
−
5.5
−
−
5.5
−
−
−1.5
−0.735
−1.60
−
Vdc
Vdc
Vdc
Vdc
Vdc
Vdc
(BR)in
V
I
−1.5
−0.84
−1.63
−
−1.5
−0.81
−1.63
−
V
−1.02
−1.95
2.0
−0.98
−1.95
2.0
−0.92
−1.95
2.0
OH
V
OL
V
IH
V
IL
Low Input Voltage
−
0.8
−
0.8
−
0.8
1. Each MECL 10Hꢀ series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been
established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 Ifpm is maintained.
Outputs are terminated through a 50 W resistor to −2.0 V.
Table 4. AC CHARACTERISTICS
0°
25°
75°
Symbol
Characteristic
Propagation Delay
Min
Max
Min
Max
Min
Max
Unit
t
pd
0.55
2.5
0.55
2.65
0.85
3.1
ns
t
Rise Time
Fall Time
0.5
0.5
1.5
1.5
0.5
0.5
1.6
1.6
0.5
0.5
1.7
1.7
ns
ns
r
t
f
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
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3
MC10H124
APPLICATIONS INFORMATION
The MC10H124 has TTL-compatible inputs and MECL
An advantage of this device is that TTL-level information
can be transmitted differentially, via balanced twisted pair
lines, to MECL equipment, where the signal can be received
by the MC10H115 or MC10H116 differential line receivers.
The power supply requirements are ground, +5.0 V, and
−5.2 V.
complementary open-emitter outputs that allow use as an
inverting/non-inverting translator or as a differential line
driver. When the common strobe input is at the low-logic
level, it forces all true outputs to a MECL low-logic state and
all inverting outputs to a MECL high-logic state.
Resource Reference of Application Notes
AN1405/D
AN1406/D
AN1503/D
AN1504/D
AN1568/D
AN1672/D
AND8001/D
AND8002/D
AND8020/D
AND8066/D
AND8090/D
−
−
−
−
−
−
−
−
−
−
−
ECL Clock Distribution Techniques
Designing with PECL (ECL at +5.0 V)
ECLinPSt I/O SPiCE Modeling Kit
Metastability and the ECLinPS Family
Interfacing Between LVDS and ECL
The ECL Translator Guide
Odd Number Counters Design
Marking and Date Codes
Termination of ECL Logic Devices
Interfacing with ECLinPS
AC Characteristics of ECL Devices
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4
MC10H124
PACKAGE DIMENSIONS
20 LEAD PLLC
CASE 775−02
ISSUE F
M
S
S
0.007 (0.180)
T
L-M
N
B
Y BRK
−N−
M
S
S
N
0.007 (0.180)
T
L-M
U
D
D
−L−
−M−
Z
W
20
1
S
S
S
0.010 (0.250)
T
L-M
N
G1
X
V
VIEW D−D
M
M
S
S
S
S
A
R
0.007 (0.180)
0.007 (0.180)
T
L-M
L-M
N
N
Z
T
M
S
S
N
0.007 (0.180)
T
L-M
H
C
K1
E
K
0.004 (0.100)
G
−T− SEATING
PLANE
J
M
S
S
N
0.007 (0.180)
T
L-M
F
VIEW S
G1
VIEW S
S
S
S
0.010 (0.250)
T
L-M
N
NOTES:
1. DIMENSIONS AND TOLERANCING PER ANSI Y14.5M,
1982.
INCHES
MIN MAX
MILLIMETERS
DIM
A
B
C
E
MIN
9.78
9.78
4.20
2.29
0.33
MAX
10.03
10.03
4.57
2.79
0.53
2. DIMENSIONS IN INCHES.
0.385
0.385
0.165
0.090
0.013
0.395
0.395
0.180
0.110
0.021
3. DATUMS −L−, −M−, AND −N− DETERMINED WHERE TOP
OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD
PARTING LINE.
4. DIMENSION G1, TRUE POSITION TO BE MEASURED AT
DATUM −T−, SEATING PLANE.
F
G
H
J
K
R
U
V
W
X
Y
0.050 BSC
1.27 BSC
5. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH.
ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE.
6. DIMENSIONS IN THE PACKAGE TOP MAY BE SMALLER
THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE
BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY
MISMATCH BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION
TO BE GREATER THAN 0.037 (0.940). THE DAMBAR
INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO
BE SMALLER THAN 0.025 (0.635).
0.026
0.020
0.025
0.350
0.350
0.042
0.042
0.042
−−−
0.032
−−−
−−−
0.66
0.51
0.64
8.89
8.89
1.07
1.07
1.07
−−−
2
0.81
−−−
−−−
9.04
9.04
1.21
1.21
1.42
0.50
10
0.356
0.356
0.048
0.048
0.056
0.020
10
Z
2
_
_
_
_
G1 0.310
K1 0.040
0.330
7.88
1.02
8.38
−−−
−−−
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5
MC10H124
PACKAGE DIMENSIONS
PDIP−16
CASE 648−08
ISSUE V
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. DIMENSIONS A, A1 AND L ARE MEASURED WITH THE PACK-
AGE SEATED IN JEDEC SEATING PLANE GAUGE GS−3.
4. DIMENSIONS D, D1 AND E1 DO NOT INCLUDE MOLD FLASH
OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS ARE
NOT TO EXCEED 0.10 INCH.
5. DIMENSION E IS MEASURED AT A POINT 0.015 BELOW DATUM
PLANE H WITH THE LEADS CONSTRAINED PERPENDICULAR
TO DATUM C.
D
A
16
9
E
H
E1
6. DIMENSION eB IS MEASURED AT THE LEAD TIPS WITH THE
LEADS UNCONSTRAINED.
7. DATUM PLANE H IS COINCIDENT WITH THE BOTTOM OF THE
LEADS, WHERE THE LEADS EXIT THE BODY.
8. PACKAGE CONTOUR IS OPTIONAL (ROUNDED OR SQUARE
CORNERS).
1
8
c
b2
NOTE 8
B
END VIEW
TOP VIEW
WITH LEADS CONSTRAINED
NOTE 5
A2
A
INCHES
DIM MIN MAX
−−−−
A1 0.015
MILLIMETERS
e/2
MIN
−−−
0.38
2.92
0.35
MAX
5.33
−−−
4.95
0.56
NOTE 3
A
0.210
−−−−
L
A2 0.115 0.195
b
b2
C
0.014 0.022
0.060 TYP
0.008 0.014
1.52 TYP
A1
D1
0.20
0.36
SEATING
PLANE
C
M
D
0.735 0.775 18.67 19.69
D1 0.005
0.300 0.325
E1 0.240 0.280
−−−−
0.13
7.62
6.10
−−−
8.26
7.11
E
eB
e
END VIEW
NOTE 6
16X
b
e
eB
L
0.100 BSC
−−−− 0.430
0.115 0.150
−−−− 10°
2.54 BSC
−−−
2.92
−−−
10.92
3.81
10°
M
M
M
B
0.010
C A
SIDE VIEW
M
STYLE 1:
STYLE 2:
PIN 1. CATHODE
2. CATHODE
3. CATHODE
4. CATHODE
5. CATHODE
6. CATHODE
7. CATHODE
8. CATHODE
9. ANODE
PIN 1. COMMON DRAIN
2. COMMON DRAIN
3. COMMON DRAIN
4. COMMON DRAIN
5. COMMON DRAIN
6. COMMON DRAIN
7. COMMON DRAIN
8. COMMON DRAIN
9. GATE
10. ANODE
11. ANODE
12. ANODE
13. ANODE
14. ANODE
15. ANODE
16. ANODE
10. SOURCE
11. GATE
12. SOURCE
13. GATE
14. SOURCE
15. GATE
16. SOURCE
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MC10H124/D
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