MC10H160L [ONSEMI]
12-Bit Parity Generator-Checker; 12位奇偶校验发生器，检查
| 型号： | MC10H160L |
| 厂家： | 
ONSEMI |
| 描述： | 12-Bit Parity Generator-Checker |
| 文件： | 总4页 (文件大小：115K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
The MC10H160 is a 12–bit parity generator–checker. The output
goes high when an odd number of inputs are high providing the odd
parity function. Unconnected inputs are pulled to a logic low allowing
parity detection and generation for less than 12 bits. The MC10H160
is a functional pin duplication of the standard 10K family part with
100% improvement in propagation delay and no increase in
power–supply current.
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MARKING
DIAGRAMS
• Propagation Delay, 2.5 ns Typical
• Power Dissipation, 320 mW Typical
• Improved Noise Margin 150 mV
(Over Operating Voltage and Temperature Range)
• Voltage Compensated
16
CDIP–16
L SUFFIX
CASE 620A
MC10H160L
AWLYYWW
1
16
• MECL 10K–Compatible
PDIP–16
P SUFFIX
CASE 648
MC10H160P
AWLYYWW
LOGIC DIAGRAM
V
= PIN 1
= PIN 16
= PIN 8
3
1
CC1
V
CC2
1
4
5
V
EE
TRUTH TABLE
PLCC–20
FN SUFFIX
CASE 775
6
7
INPUT
OUTPUT
10H160
Sum of
High Level
Inputs
AWLYYWW
Pin 2
9
10
2
Even
Odd
Low
11
12
High
A
= Assembly Location
13
14
WL = Wafer Lot
YY = Year
WW = Work Week
15
DIP
PIN ASSIGNMENT
ORDERING INFORMATION
Device
Package
Shipping
V
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
V
CC2
CC1
MC10H160L
CDIP–16
25 Units/Rail
OUT
IN1
IN2
IN3
IN4
IN5
IN12
IN11
IN10
IN9
MC10H160P
PDIP–16
PLCC–20
25 Units/Rail
46 Units/Rail
MC10H160FN
IN8
IN7
IN6
V
EE
Pin assignment is for Dual–in–Line Package.
For PLCC pin assignment, see the Pin Conversion Tables on page 18
of the ON Semiconductor MECL Data Book (DL122/D).
Semiconductor Components Industries, LLC, 2000
1
Publication Order Number:
May, 2000 – Rev. 7
MC10H160/D
MC10H160
MAXIMUM RATINGS
Symbol
Characteristic
Rating
Unit
Vdc
Vdc
mA
V
EE
Power Supply (V
= 0)
= 0)
–8.0 to 0
CC
V
I
Input Voltage (V
CC
0 to V
50
EE
I
Output Current– Continuous
– Surge
out
100
T
A
Operating Temperature Range
0 to +75
°C
T
stg
Storage Temperature Range– Plastic
– Ceramic
–55 to +150
–55 to +165
°C
°C
ELECTRICAL CHARACTERISTICS (V
= –5.2 V ±5%) (See Note 1.)
0°
EE
25°
75°
Symbol
Characteristic
Power Supply Current
Min
Max
Min
Max
Min
Max
Unit
mA
µA
I
E
–
88
–
78
–
88
I
Input Current High
Pins 3,5,7,10,12,14
Pins 4,6,9,11,13,15
inH
–
–
391
457
–
–
246
285
–
–
246
285
I
Input Current Low
High Output Voltage
Low Output Voltage
High Input Voltage
Low Input Voltage
0.5
–
0.5
–
0.3
–
µA
inL
V
–1.02
–1.95
–1.17
–1.95
–0.84
–1.63
–0.84
–1.48
–0.98
–1.95
–1.13
–1.95
–0.81
–1.63
–0.81
–1.48
–0.92
–1.95
–1.07
–1.95
–0.735
–1.60
–0.735
–1.45
Vdc
Vdc
Vdc
Vdc
OH
V
OL
V
IH
V
IL
AC PARAMETERS
t
Propagation Delay
Rise Time
1.1
3.1
1.5
1.5
1.1
3.3
1.6
1.6
1.2
3.5
1.7
1.7
ns
ns
ns
pd
t
r
0.55
0.55
0.55
0.55
0.75
0.75
t
f
Fall Time
1. Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been
established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 Ifpm is maintained.
Outputs are terminated through a 50–ohm resistor to –2.0 volts.
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2
MC10H160
PACKAGE DIMENSIONS
PLCC–20
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 775–02
ISSUE C
M
S
S
0.007 (0.180)
T L–M
N
B
Y BRK
–M–
–N–
M
S
S
0.007 (0.180)
T L–M
N
U
D
D
–L–
Z
W
20
1
S
S
S
0.010 (0.250)
T L–M
N
G1
X
V
A
VIEW D–D
M
M
S
S
S
S
0.007 (0.180)
0.007 (0.180)
T L–M
N
N
M
S
S
0.007 (0.180)
T L–M
N
H
Z
T L–M
R
K1
K
C
E
M
S
S
0.007 (0.180)
T L–M
N
F
0.004 (0.100)
VIEW S
G
–T– SEATING
PLANE
J
VIEW S
NOTES:
INCHES
MILLIMETERS
G1
1. DATUMS –L–, –M–, AND –N– DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC
BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
DIM MIN
MAX
0.395
0.395
0.180
0.110
0.019
MIN
9.78
9.78
4.20
2.29
0.33
MAX
10.03
10.03
4.57
2.79
0.48
S
S
S
0.010 (0.250)
T L–M
N
A
B
C
E
0.385
0.385
0.165
0.090
0.013
F
G
H
J
0.050 BSC
1.27 BSC
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
0.026
0.020
0.025
0.350
0.350
0.042
0.042
0.042
–––
0.032
–––
–––
0.356
0.356
0.048
0.048
0.056
0.020
10
0.66
0.51
0.64
8.89
8.89
1.07
1.07
1.07
–––
2
0.81
–––
–––
9.04
9.04
1.21
1.21
1.42
0.50
10
K
R
U
V
W
X
Y
Z
6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).
2
G1 0.310
K1 0.040
0.330
–––
7.88
1.02
8.38
–––
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3
MC10H160
CDIP–16
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620A–01
ISSUE O
B
B
NOTES:
A
A
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
16
1
9
8
E
F
5
THIS DRAWING REPLACES OBSOLETE
CASE OUTLINE 620–10.
INCHES
DIM MIN MAX
0.785 19.05
MILLIMETERS
MIN
MAX
19.93
7.49
A
B
C
D
E
0.750
0.240
–––
M
C
0.295
0.200
0.020
6.10
–––
0.39
5.08
0.50
0.015
0.050 BSC
1.27 BSC
L
K
F
0.055
0.065
1.40
1.65
SEATING
PLANE
T
G
H
K
L
0.100 BSC
2.54 BSC
0.21
3.18
0.008
0.125
0.015
0.170
0.38
4.31
N
G
0.300 BSC
7.62 BSC
16X J
M
N
0
15
0.040
0
0.51
15
1.01
16X D
0.020
M
0.25 (0.010)
T B
M
0.25 (0.010)
T A
NOTES:
–A–
PDIP–16
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
16
1
9
8
B
S
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
INCHES
DIM MIN MAX
0.770 18.80
MILLIMETERS
MIN
MAX
19.55
6.85
4.44
0.53
1.77
F
C
L
A
B
C
D
F
G
H
J
K
L
M
S
0.740
0.250
0.145
0.015
0.040
0.100 BSC
0.050 BSC
0.008
0.270
0.175
0.021
0.70
6.35
3.69
0.39
1.02
SEATING
PLANE
–T–
2.54 BSC
1.27 BSC
K
M
H
0.015
0.130
0.305
10
0.21
0.38
3.30
7.74
10
J
0.110
0.295
0
2.80
7.50
0
G
D 16 PL
M
M
0.25 (0.010)
T A
0.020
0.040
0.51
1.01
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MC10H160/D
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