MC33680FTBR2 [ONSEMI]

Dual DC-DC Regulator for Electronic Organizer; 双路DC-DC稳压器的电子记事本
MC33680FTBR2
型号: MC33680FTBR2
厂家: ONSEMI    ONSEMI
描述:

Dual DC-DC Regulator for Electronic Organizer
双路DC-DC稳压器的电子记事本

稳压器 电子
文件: 总16页 (文件大小:343K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
The MC33680 is a dual DC–DC regulator designed for electronic  
organizer applications. Both regulators apply  
Pulse–Frequency–Modulation (PFM). The main step–up regulator  
output can be externally adjusted from 2.7V to 5V. An internal  
synchronous rectifier is used to ensure high efficiency (achieve 87%).  
The auxiliary regulator with a built–in power transistor can be  
configured to produce a wide range of positive voltage (can be used  
for LCD contrast voltage). This voltage can be adjusted from +5V to  
+25V by an external potentiometer.  
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32  
1
The MC33680 has been designed for battery powered hand–held  
products. With the low start–up voltage from 1V and the low quiescent  
current (typical 35 µA); the MC33680 is best suited to operate from 1  
to 2 AA/ AAA cell. Moreover, supervisory functions such as low  
battery detection, CPU Power–Good signal, and back–up battery  
control, for lithium battery or supercap are also included in the chip.  
32–LEAD LQFP  
FTB SUFFIX  
CASE 873A  
PIN CONNECTIONS &  
DEVICE MARKING  
FEATURES:  
Low Input Voltage, 1V up  
Low Quiescent Current in Standby Mode: 35µA typical  
PFM and Synchronous Rectification to ensure high efficiency  
(87% @60mA Load)  
NC  
VAUXSW  
VAUXEMR  
LIBATIN  
LIBATOUT  
NC  
VMAINGND  
VMAINSW  
VMAIN  
Adjustable Main Output: +2.7V to +5V  
nominal 3.3V @ 100mA max, with 1.8V input  
Auxiliary Output Voltage: +5V to +25V  
+5V @ 25mA max, with 1.8V input  
+25V @ 15mA max, with 1.8V input  
Current Limit Protection  
DGND  
MC33680  
LIBATCL  
LIBATON  
LOWBATB  
PORB  
FTB  
AWLYYWW  
DGND  
LOWBATSEN  
Power–Good Signal with Programmable Delay  
Battery Low Detection  
Lithium Battery or Supercap Back–up  
32–Pin LQFP Package  
(Top View)  
APPLICATIONS:  
Digital Organizer and Dictionary  
Dual Output Power Supply (For MPU, Logic, Memory, LCD)  
Handheld Battery Powered Device (1–2 AA/AAA cell)  
ORDERING INFORMATION  
Device  
Package  
Shipping  
MC33680FTB  
LQFP  
1250 Tray / Drypack  
1800 / Tape & Reel  
MC33680FTBR2  
LQFP  
Semiconductor Components Industries, LLC, 2000  
1
Publication Order Number:  
May, 2000 – Rev. 3  
MC33680/D  
MC33680  
Figure 1. Detailed Application Block Diagram  
VBAT  
CMAINb  
100 pF  
L1  
H
VBAT  
33  
+
+
MBRA130LT1  
CPOR  
80 nF  
CVDD  
20  
RIref  
480 k  
F
RMAINb  
1000 k  
IREF  
AGND  
VREF  
PDELAY  
VDD  
VBAT  
VBAT  
VMAINFB  
8
7
6
5
4
3
2
1
5
VBAT  
300 k  
RLBa  
ZLC  
31  
COMP3  
LOBAT–  
SEN  
VMAINSW  
VMAIN  
32  
9
+ve Edge Delay  
for Max. ON Time  
senseFET  
900 k  
RLBb  
V
DD  
M2  
+
CMAIN  
100  
F
DGND  
10  
M1  
R
Q
VMAINGND  
30  
DGND  
PORB  
11  
S
Qb  
Power–On  
Reset  
V
DD  
LIBATOUT  
1–SHOT  
x2  
28  
for Min. OFF Time  
LIBATIN  
R
S
Q
27  
DGND  
ILIM  
VBAT  
COMP2  
1.22 V  
COMP1  
Voltage  
Reference  
L2  
33  
VCOMP  
H
AGND  
Main Regulator  
with Synchronous Rectifier  
MBRA140T3  
25  
0.5 V  
VAUXSW  
+ve Edge Delay  
for Max. ON Time  
LOWBATB  
12  
AGND  
0.85 V,  
+
senseBJT  
CAUX  
30  
F
1.1 V  
Q1  
R
Q
LIBATON  
VCOMP  
COMP1  
Lithium  
Battery  
Backup  
13  
LIBATCL  
14  
VAUXEMR  
26  
S
Qb  
ILIM  
COMP2  
1–SHOT  
DGND  
15  
for Min. OFF Time  
Auxiliary Regulator  
Voltage Reference  
Current Bias  
& Supervisory  
AGND  
22  
17  
VAUXEN  
18  
VAUXFBP  
20  
21  
23  
VAUXBASE  
VBAT  
2200 k  
VAUXFBN  
VAUXBDV  
VAUXCHG  
RAUXb  
200 k  
RAUXa  
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2
MC33680  
TIMING DIAGRAMS  
VBAT  
V
MAINreg  
V
– 0.15 V  
MAINreg  
1.22  
0.5  
T
C
RIref  
por  
POR  
VMAIN  
t
PORC  
PORB  
VAUXEN  
Figure 2. Startup Timing  
VBAT  
LOWBAT Threshold  
LOWBATB  
VMAIN  
V
– 0.5 V  
MAINreg  
PORB  
Figure 3. Power Down Timing  
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3
MC33680  
PIN FUNCTION DESCRIPTION  
Pin  
No.  
Function  
VMAINFB  
VBAT  
Type/Direction  
Description  
Analog / Input  
Power  
Feedback pin for VMAIN  
Main battery supply  
Main battery supply  
1
2
VBAT  
Power  
3
VDD  
Analog / Output  
Analog / Input  
Analog / Output  
Analog Ground  
Analog / Input  
Analog / Input  
Digital Ground  
CMOS / Output  
CMOS / Output  
CMOS / Input  
Connect to decoupling capacitor for internal logic supply  
Capacitor connection for defining Power–On signal delay  
Bandgap Reference output voltage. Nominal voltage is 1.25V  
4
PDELAY  
VREF  
5
6
AGND  
7
IREF  
Resistor connection for defining internal current bias and PDELAY current  
Resistive network connection for defining low battery detect threshold  
8
LOWBATSEN  
DGND  
9
10  
11  
12  
13  
PORB  
Active LOW Power–On reset signal  
Active LOW low battery detect output  
LOWBATB  
LIBATON  
microprocessor control signal for Lithium battery backup switch, the switch is  
ON when LIBATON=HIGH and LIBATCL=HIGH  
LIBATCL  
CMOS / Input  
Digital Ground  
microprocessor control signal for Lithium battery backup switch, if it is HIGH,  
the switch is controlled by LIBATON, otherwise, controlled by internal logic  
14  
DGND  
NC  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
30  
31  
32  
no connection  
VAUXEN  
VAUXFBP  
NC  
CMOS / Input  
Analog / Input  
VAUX enable, Active high  
Feedback pin for VAUX  
no connection  
VAUXFBN  
VAUXBDV  
VAUXCHG  
VAUXBASE  
NC  
Analog / Input  
Power  
Feedback pin for VAUX  
VAUX BJT base drive circuit power supply  
test pin  
Analog / Output  
Analog / Output  
test pin  
no connection  
VAUXSW  
VAUXEMR  
LIBATIN  
LIBATOUT  
NC  
Analog / Output  
Analog / Output  
Analog / Input  
Analog / Output  
Collector output of the VAUX power BJT  
Emitter output of the VAUX power BJT  
Lithium battery input for backup purposes  
Lithium battery output  
no connection  
VMAINGND  
VMAINSW  
VMAIN  
Power Ground  
Analog / Input  
Analog / Output  
Ground for VMAIN low side switch  
VMAIN inductor connection  
VMAIN output  
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4
MC33680  
ABSOLUTE MAXIMUM RATINGS (T = 25°C, unless otherwise noted.)  
A
Parameter  
Symbol  
Min  
Max  
Unit  
Power Supply Voltage  
Digital Pin Voltage  
General Analog Pin Voltage  
V
–0.3  
–0.3  
–0.3  
–0.3  
7.0  
7.0  
7.0  
30  
Vdc  
Vdc  
Vdc  
Vdc  
BAT  
V
digital  
V
analog  
Pin VAUXSW to Pin VAUXEMR Voltage (Continuous)  
V
AUXCE  
Pin VMAINSW to Pin VMAIN Voltage (Continuous)  
Operating Junction Temperature  
Ambient Operating Temperature  
Storage Temperature  
V
0.3  
150  
70  
Vdc  
°C  
syn  
T
j (max)  
T
0
°C  
a
T
50  
150  
°C  
stg  
STATIC ELECTRICAL CHARACTERISTICS (Circuit of Figure 1, VP = 1.8V, I  
otherwise noted.)  
= 0 mA, T = 0 to 70°C unless  
A
load  
Rating  
Symbol  
Min  
1.0  
3.1  
2.7  
Typ  
Max  
Unit  
1
Operating Supply Voltage  
V
BAT  
V
V
VMAIN output voltage  
V
main  
3.3  
3.5  
5.0  
2
VMAIN output voltage range  
V
V
main_range  
3
VMAIN output current  
I
200  
100  
1.15  
25  
mA  
kHz  
A
3.3_1.8  
4
VMAIN maximum switching frequency  
VMAIN peak coil static current limit  
VAUX output voltage range  
Freq  
max_VM  
LIM_VM  
I
0.85  
5.0  
1.0  
VAUX_range  
V
VAUX maximum switching frequency  
VAUX peak coil static current limit  
Freq  
120  
kHz  
A
max_VL  
I
1.0  
35  
LIM_VL  
5
Quiescent Supply Current at Standby Mode  
Reference Voltage @ no load  
Iq  
standby  
60  
µA  
V
Vref  
1.16  
0.8  
1.22  
0.85  
1.1  
1.28  
0.9  
no_load  
LOBAT_L  
LOBAT_H  
6
Battery Low Detect lower hysteresis threshold  
V
V
Battery Low Detect upper hysteresis threshold  
PDELAY Pin output charging current  
PDELAY Pin voltage threshold  
V
1.05  
0.8  
1.15  
1.2  
V
Ichg  
1.0  
µA  
V
PDELAY  
Vth  
1.16  
1.22  
1.28  
PDELAY  
NOTE: 1. Output current capability is reduced with supply voltage due to decreased energy transfer. The supply voltage must not be higher than  
VMAIN+0.6V to ensure boost operation. Max Start–up loading is typically 1V at 400 µA, 1.8V at 4.4 mA, and 2.2V at 88 mA.  
NOTE: 2. Output voltage can be adjusted by external resistor to the VMAINFB pin.  
NOTE: 3. At VBAT = 1.8V, output current capability increases with VBAT.  
NOTE: 4. Only when current limit is not reached.  
NOTE: 5. This is average current consumed by the IC from VDD, which is low–pass filtered from VMAIN, when only VMAIN is enabled and at no loading.  
NOTE: 6. This is the minimum of ”LOWBATB” threshold for battery voltage, the threshold can be increased by external resistor divider from ”VBAT” to  
”LOWBATSEN”.  
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MC33680  
DYNAMIC ELECTRICAL CHARACTERISTICS (Refer to TIMING DIAGRAMS, T = 0 to 70°C unless otherwise noted.)  
A
Rating  
Minimum PORB to Control delay  
Symbol  
Min  
Typ  
Max  
Unit  
t
500  
nS  
PORC  
Figure 5. Efficiency of VMAIN versus Input  
Voltage (VMAIN = 3.3 V, L1 = 33 uH, Various I  
90%  
Figure 4. Efficiency of VMAIN versus Output  
Current (VMAIN = 3.3 V, L = 33 uH, Various V  
)
)
OUT  
IN  
90%  
85%  
80%  
85%  
80%  
I
= 10mA  
= 60mA  
= 100mA  
out  
V = 3V  
in  
I
out  
V = 1.8V  
in  
I
75%  
70%  
75%  
70%  
out  
V = 1.5V  
in  
V = 1V  
in  
0
10  
20  
30  
40  
50  
60  
70  
80  
90 100  
1
1.5  
2
2.5  
3
I
, MAIN OUTPUT CURRENT (mA)  
V , INPUT VOLTAGE (V)  
IN  
OUT_MAIN  
Figure 6. Efficiency of VAUX versus Output  
Figure 7. Efficiency of VAUX versus Input  
Voltage (VAUX = 25 V, L2 = 33 uH, Various I  
Current (VAUX = 25 V, L2 = 33 uH, Various V  
)
)
OUT  
IN  
80%  
75%  
70%  
65%  
60%  
80%  
75%  
70%  
65%  
60%  
V = 3V  
in  
I
= 1mA  
= 5mA  
= 10mA  
= 15mA  
out  
V = 1.8V  
in  
I
out  
V = 1.5V  
in  
V = 1V  
in  
I
55%  
50%  
55%  
50%  
out  
I
out  
2.5  
1
3
5
7
9
11  
13  
15  
1
1.5  
2
3
I
, AUX OUTPUT CURRENT (mA)  
V , INPUT VOLTAGE (V)  
IN  
OUT_AUX  
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MC33680  
Figure 8. Efficiency of VAUX versus Output  
Figure 9. Efficiency of VAUX versus Input  
Voltage (VAUX = 20 V, L2 = 33 uH, Various I  
Current (VAUX = 20 V, L2 = 33 uH, Various V  
)
)
OUT  
IN  
80%  
75%  
70%  
65%  
60%  
80%  
75%  
70%  
65%  
60%  
V = 3V  
in  
I
= 1mA  
= 5mA  
= 10mA  
= 15mA  
out  
V = 1.8V  
in  
I
out  
V = 1.5V  
in  
55%  
50%  
55%  
50%  
I
out  
V = 1V  
in  
I
out  
1
3
5
7
9
11  
13  
15  
1
1.5  
2
2.5  
3
I
, AUX OUTPUT CURRENT (mA)  
V , INPUT VOLTAGE (V)  
IN  
OUT_AUX  
Figure 11. Efficiency of VAUX versus Input  
Voltage (VAUX = 5 V, L2 = 82 uH, Various I  
Figure 10. Efficiency of VAUX versus Output  
Current (VAUX = 5 V, L2 = 82 uH, Various V  
)
)
OUT  
IN  
85%  
80%  
75%  
70%  
85%  
80%  
75%  
70%  
65%  
60%  
55%  
50%  
I
= 1V  
= 5V  
= 10V  
= 15V  
= 25V  
out  
V = 3V  
in  
I
out  
V = 2.4V  
in  
I
out  
V = 1.8V  
in  
I
out  
65%  
50%  
V = 1.5V  
in  
I
out  
45%  
40%  
V = 1V  
in  
1
5
10  
15  
20  
25  
30  
35  
1
1.5  
2
2.5  
3
I
, AUX OUTPUT CURRENT (mA)  
V , INPUT VOLTAGE (V)  
IN  
OUT_AUX  
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MC33680  
Figure 12. VMAIN Output Ripple (Medium Load)  
Figure 13. VMAIN Output Ripple (Heavy Load)  
20 uS / div  
10 uS / div  
1: VMAIN = 3.3 V (50 mV/div, AC COUPLED)  
2: Voltage at VMAINSW (1 V/div)  
1: VMAIN = 3.3 V (50 mV/div, AC COUPLED)  
2: Voltage at VMAINSW (1 V/div)  
Figure 14. VAUX Output Ripple (Medium Load)  
Figure 15. VAUX Output Ripple (Heavy Load)  
20 uS / div  
10 uS / div  
1: VAUX = 20 V (50 mV/div, AC COUPLED)  
2: Voltage at VAUXSW (10 V/div)  
1: VAUX = 20 V (50 mV/div, AC COUPLED)  
2: Voltage at VAUXSW (10 V/div)  
Figure 17. VAUX Startup  
Figure 16. VMAIN Startup and Power–Good Signal  
50 mS / div  
5 mS / div  
1: VMAIN from 1 V to 3.3 V (1 V/div)  
2: Voltage of PORB (2 V/div)  
1: VAUX from 1.8 V to 20 V (5 V/div)  
2: VAUXEN (2 V/div)  
3: Voltage of ENABLE (2 V/div)  
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8
MC33680  
DETAILED OPERATING DESCRIPTION  
General  
0.5  
RIref  
Iref  
(A)  
The MC33680 is a dual DC–DC regulator designed for  
electronic organizer applications. Both regulators apply  
Pulse–Frequency–Modulation (PFM). The main boost  
regulator output can be externally adjusted from 2.7V to 5V.  
An internal synchronous rectifier is used to ensure high  
efficiency (achieve 87%). The auxiliary regulator with a  
built–in power transistor can be configured to produce a  
wide range of positive voltage (can be used for LCD contrast  
voltage). This voltage can be adjusted from +5V to +25V by  
an external potentiometer.  
The MC33680 has been designed for battery powered  
hand–held products. With the low start–up voltage from 1V  
and the low quiescent current (typical 35 µA), the MC33680  
is best suited to operate from 1 to 2 AA/ AAA cell.  
Moreover, supervisory functions such as low battery  
detection, CPU Power–Good signal, and back–up battery  
control, are also included in the chip. It makes the MC33680  
the best one–chip power management solution for  
applications such as electronic organizers and PDAs.  
Thisbiascurrentisusedforallinternalcurrentbiasaswell  
as setting VMAIN value. For the latter application, Iref is  
doubled and fed as current sink at Pin 1. With external  
resistor RMAINb tied from Pin1 to Pin32, a constant voltage  
level shift is generated in between the two pins. In  
close–loop operation, voltage at Pin 1 (i.e. Output feedback  
voltage) is needed to be regulated at the internal reference  
voltage level, 1.22V. Therefore, the delta voltage across Pin  
1 and Pin 32 which can be adjusted by RMAINb determines  
the Main Output voltage. If the feedback voltage drops  
below 1.22V, internal comparator sets switching cycle to  
start. So, VMAIN can be calculated as follows.  
RMAINb  
RIref  
VMAIN  
1.22  
(V)  
From the above equation, although VMAIN can be  
adjusted by RMAINb and RIref ratio, for setting VMAIN, it  
is suggested, by changing RMAINb value with RIref kept at  
480K. Since changing RIref will alter internal bias current  
which will affect timing functions of Max ON time (T  
)
ON1  
). Their relationships are as  
Pulse Frequency Modulation (PFM)  
and Min OFF time (T  
follows;  
OFF1  
Both regulators apply PFM. With this switching scheme,  
every cycle is started as the feedback voltage is lower than  
the internal reference. This is normally performed by  
internal comparator. As cycle starts, Low–Side switch (i.e.  
M1 in Figure 1) is turned ON for a fixed ON time duration  
–11  
T
1.7 10  
RIref (S)  
RIref (S)  
ON1  
–12  
T
6.4 10  
OFF1  
(namely, T ) unless current limit comparator senses coil  
on  
current has reached its preset limit. In the latter case, M1 is  
Continuous Conduction Mode and Discontinuous  
Conduction Mode  
OFF instantly. So T is defined as the maximum ON time  
on  
of M1. When M1 is ON, coil current ramps up, so energy is  
being stored inside the coil. At the moment just after M1 is  
OFF, the Synchronous Rectifier (i.e. M2 in Figure 1) or any  
rectification device (such as Schottky Diode of Auxiliary  
Regulator) is turned ON to direct coil current to charge up  
the output bulk capacitor. Provided that coil current limit is  
not reached, every switching cycle delivers fixed amount of  
energy to the bulk capacitor. For higher loading, a larger  
amount of energy (Charge) is withdrawn from the bulk  
capacitor, and a larger amount of Charge is then supplied to  
the bulk capacitor to regulate output voltage. This implies  
switching frequency is increased; and vice–versa.  
In Figure 19, regulator is operating at Continuous  
Conduction Mode. A switching cycle is started as the output  
feedback voltage drops below internal voltage reference  
VREF. At that instant, the coil current is not yet zero, and it  
starts to ramp up for the next cycle. As the coil current ramps  
up, loading makes the output voltage to decrease as the  
energy supply path to the output bulk capacitor is  
disconnected. After T elapses, M1 is OFF, M2 is ON,  
on  
energy is pumped to the bulk capacitor. Output voltage is  
increased as excessive charge is pumped in, then it is  
decreased after the coil current drops below the loading.  
NoticetheabruptspikeofoutputvoltageisduetoESRofthe  
bulk capacitor. Feedback voltage can be resistor–divided  
down or level–shift down from the output voltage. As this  
feedback voltage drops below VREF, next switching cycle  
starts.  
Main Regulator  
Figure 18 shows the simplified block diagram of Main  
Regulator. Notice that precise bias current Iref is generated  
by a VI converter and external resistor RIref, where  
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9
MC33680  
DETAILED OPERATING DESCRIPTION (Cont’d)  
VBAT  
CMAINb  
100 pF  
L1  
33uH  
2 x Iref  
RMAINb  
1000 kOhm  
1
VMAINFB  
31 VMAINSW  
ZLC  
COMP3  
M2  
VMAIN  
32  
x2  
+
+ve Edge Delay  
for Max. ON Time  
0.5 V  
senseFET  
V
DD  
CMAIN  
100 uF  
Iref  
IREF  
8
M1  
R
S
Q
RIref  
480 kOhm  
VMAINGND  
30  
DGND  
VCOMP  
Qb  
1.22 V  
Voltage  
Reference  
COMP1  
V
DD  
1–SHOT  
for Min. OFF Time  
R
S
Q
DGND  
COMP2  
ILIM  
AGND  
Voltage Reference  
& Current Bias  
Main Regulator  
with Synchronous Rectifier  
AGND  
Figure 18. Simplified Block Diagram of Main Regulator  
In Figure 20, regulator is operating at Discontinuous  
T
ON  
Vin  
Vout  
T
(S);  
Conduction Mode, waveforms are similar to those of Figure  
19. However, coil current drops to zero before next  
switching cycle starts.  
SW  
1
I
Vin  
T
LOAD  
T
ON  
I
(A)  
To estimate conduction mode, below equation can be  
used.  
pk  
2
L
ON  
1
T
SW  
2
T
Vin  
ON  
Iroom  
I
LOAD  
For Discontinuous Conduction mode, provided that  
current limit is not reached,  
2
L
Vout  
is efficiency, refer to Figure 4  
where,  
η
2
ON  
T
Vin  
T
(S);  
if I  
room  
> 0, the regulator is at Discontinuous Conduction  
SW  
Vout  
Vin  
mode  
if I  
2
L
I
1
LOAD  
= 0, the regulator is at Critical Conduction mode  
room  
where coil current just drops to zero and next cycle starts.  
if I < 0, the regulator is at Continuous Conduction  
Vin  
L
I
T
(A)  
room  
mode  
pk  
ON  
For Continuous Conduction mode, provided that current  
limit is not reached,  
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10  
MC33680  
Cycle Starts  
VREF  
Feedback Voltage  
t
dl  
M1 ON  
M1 OFF  
M2 ON  
M1 ON  
M1 OFF  
M2 ON  
M1 ON  
M1 OFF  
M2 ON  
t
dh  
M2 OFF  
M2 OFF  
M2 OFF  
I
pk  
T
ON  
Loading Current, I  
LOAD  
T
SW  
Coil Current  
VMAIN + 1 V  
VMAIN  
V@SW  
0 V  
VMAIN Zoom–In  
Figure 19. Waveforms of Continuous Conduction Mode  
Cycle Starts  
Feedback Voltage  
VREF  
t
dl  
M1 ON  
M1 OFF  
M1 ON  
M1 OFF  
M1 ON  
M1 OFF  
t
dh  
M2 OFF  
M2 OFF  
M2 OFF  
I
pk  
T
ON  
Loading Current, I  
LOAD  
Coil Current  
T
SW  
VMAIN + 1 V  
VMAIN  
V
IN  
V@SW  
0 V  
VMAIN Zoom–In  
Figure 20. Waveforms of Discontinuous Conduction Mode  
http://onsemi.com  
11  
MC33680  
DETAILED OPERATING DESCRIPTION (Cont’d)  
Synchronous Rectification  
Therefore, determination on the offset voltage is essential  
A Synchronous Rectifier is used in the main regulator to  
enhance efficiency. Synchronous rectifier is normally  
realized by powerFET with gate control circuitry which,  
however, involved relative complicated timing concerns. In  
Figure 19, as main switch M1 is being turned OFF, if the  
synchronousswitch M2 is just turned ON with M1 not being  
completely turned OFF, current will be shunted from the  
output bulk capacitor through M2 and M1 to ground. This  
power loss lowers overall efficiency. So a certain amount of  
dead time is introduced to make sure M1 is completely OFF  
for optimum performance.  
Auxiliary Regulator  
The Auxiliary Regulator is a boost regulator, applies PFM  
scheme to enhance high efficiency and reduce quiescent  
current. An internal voltage comparator (COMP1 of Figure  
21) detects when the voltage of Pin VAUXFBN drops below  
that of Pin VAUXFBP. The internal power BJT is then  
switched ON for a fixed–ON–time (or until the internal  
current limit is reached), and coil current is allowed to build  
up. As the BJT is switched OFF, coil current will flow  
through the external Schottky diode to charge up the bulk  
capacitor. After a fixed–mimimum–OFF time elapses, next  
switching cycle will start if the output of the voltage  
comparator is HIGH. Refer to Figure 21, the VAUX  
regulation level is determined by the equation as follows,  
before M2 is being turned ON, this timing is indicated as t  
in Figure 20.  
dh  
Whenthe main regulator is operating in continuous mode,  
as M2 is being turned OFF, and M1 is just turned ON with  
M2notbeingcompletedOFF, theabovementionedsituation  
will occur. So dead time is introduced to make sure M2 is  
completed OFF before M1 is being turned ON, this is  
R
AUXb  
V
VAUXFBP  
1
(V)  
indicated as t in Figure 20.  
dl  
AUX  
R
AUXa  
When the main regulator is operating in discontinuous  
mode, as coil current is dropped to zero, M2 is supposed to  
be OFF. Fail to do so, reverse current will flow from the  
output bulk capacitor through M2 and then the inductor to  
the battery input. It causes damage to the battery. So  
M2–voltage–drop sensing comparator (COMP3 of Figure  
18) comes with fixed offset voltage to switch M2 OFF  
before any reverse current builds up. However, if M2 is  
switch OFF too early, large residue coil current flows  
throughthebodydiodeofM2andincreasesconductionloss.  
WhereMaxONTime, TON2, andMinOFFTime, TOFF2  
can be determined by the following equations.  
–11  
T
1.7 10  
2.1 10  
RIref (S)  
RIref (S)  
ON2  
–12  
T
OFF2  
As the Auxiliary Regulator control scheme is the same as  
the Main Regulator, equations for conduction mode, Tsw  
and Ipk can also be applied, However, to be used for  
calculation is referred to Figures 6, 8, or 10.  
VBAT  
L2  
33uH  
RAUXa  
RAUXb  
200 kOhm  
2200 kOhm  
VREF  
VBAT  
VAUXFBP  
18  
VAUXFBN  
20  
VAUXBDV  
VAUXSW  
25  
21  
+ve Edge Delay  
for Max. ON Time  
+
senseBJT  
CAUX  
33 uF  
Q1  
R
S
Q
VAUXEMR  
Qb  
VCOMP  
COMP1  
26  
1–SHOT  
for Min. OFF Time  
ILIM  
COMP2  
AGND  
Auxiliary Regulator  
Figure 21. Simplified Block Diagram of Auxiliary Regulator  
http://onsemi.com  
12  
MC33680  
DETAILED OPERATING DESCRIPTION (Cont’d)  
Current Limit for Both regulators  
R
R
LBa  
LBb  
V
1.1  
1
(V)  
(V)  
From Figure 18 and Figure 21, sense devices (senseFET  
or senseBJT) are applied to sample coil current as the  
low–side switch is ON. With that sample current flowing  
through a sense resistor, sense–voltage is developed.  
Threshold detector (COMP2 in both Figures) detects  
whether the sense–voltage is higher than preset level. If it  
happens, detector output reset the flip–flop to switch OFF  
low–side switch, and the switch can only be ON as next  
cycle starts.  
LOBAThigh  
R
R
LBa  
LBb  
V
0.85  
1
LOBATlow  
Lithium–Battery backup  
The backup conduction path which is provided by an  
internal power switch (typ. 13 Ohm) can be controlled by  
internal logic or microprocessor.  
If LIBATCL is LOW, the switch, which is then controlled  
by internal logic, is ON when the battery is removed and  
VMAIN is dropped below LIBATIN by more than 100mV,  
and returns OFF when the battery is plugged back in.  
If LIBATCL is HIGH, the switch is controlled by  
microprocessorthroughLIBATON. Thetruthtableisshown  
in Figure 22.  
Power–Good Signal  
During the startup period (see Figure 2), the internal  
startup circuitry is enabled to pump up VMAIN to a certain  
voltage level, which is the user–defined VMAIN output  
level minus an offset of 0.15V. The internal Power–Good  
signal is then enabled to activate the main regulator and  
conditionallythe auxiliary regulator. Meanwhile, thestartup  
circuitry will be shut down. The Power–Good signal block  
also starts to charge up the external capacitor tied from Pin  
PDELAYtogroundwithpreciseconstantcurrent. AsthePin  
PDELAY’s voltage reaches an internal set threshold, Pin  
PORB will go HIGH to awake the microprocessor. This  
delay is stated as follows;  
Efficiency and Output Ripple  
For both regulators, when large values are used for  
feedback resistors (> 50kOhm), stray capacitance of pin 1  
(VMAINFB) and pin 20 (VAUXFBN) can add ”lag” to the  
feedback response, destabilizing the regulator and creating  
a larger ripple at the output. From Figure 1, ripple of Main  
and AUX regulator can be reduced by capacitors in parallel  
withRMAINb, RAUXa andRAUXbrangingfrom 100pFto  
100nF respectively. Reducing the ripple is also with  
improving efficiency, systemdesignersarerecommendedto  
do experiments on capacitance values based on the PCB  
design.  
1.22  
0.5  
T
C
RIref (S)  
por  
POR  
From Figure 3, if, by any chance, VMAIN is dropped  
below the user–defined VMAIN output level minus 0.5V,  
PORB will go LOW to indicate the OUTPUT LOW  
situation. And, the IC will continue to function until the  
VMAIN is dropped below 2V.  
Bypass Capacitors  
If the metal lead from battery to coils are long, its stray  
resistance can put additional power loss to the system as AC  
current is being conducted. In that case, bypass capacitors  
should be placed closely to the coil, and connected from  
Low–Battery–Detect  
The Low–Battery–Detect block is actually a voltage  
comparator. PinLOWBATisLOW, ifthevoltageofexternal  
Pin LOWBATSEN is lower than 0.85V. The IC will neglect  
thiswarning signal. PinLOWBAT will become HIGH, ifthe  
voltage of external Pin LOWBATSEN is recovered to more  
than 1.1V. From Figure 1, with external resistors RLBa and  
RLBb, thresholds of Low–Battery–Detect can be adjusted  
based on the equations below.  
V
BAT  
toground.ThisreducesACcomponentofcoilcurrent  
passing through the long metal lead, thus minimizing that  
portion of power loss.  
LIBATCL  
LIBATON  
Action  
0
X
The switch is ON when the battery is removed and VMAIN is dropped below LIBATIN by  
more than 100mV;  
The switch is OFF when the battery is plugged in.  
1
1
0
1
The switch is OFF  
The switch is ON  
Figure 22. Lithium Battery Backup Control Truth Table  
http://onsemi.com  
13  
MC33680  
PACKAGE DIMENSIONS  
32–LEAD LQFP  
PLASTIC PACKAGE  
CASE 873A–02  
ISSUE A  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
4X  
A
A1  
0.20 (0.008) AB TU  
Z
Y14.5M, 1982.  
32  
25  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DATUM PLANE AB– IS LOCATED AT BOTTOM  
OF LEAD AND IS COINCIDENT WITH THE LEAD  
WHERE THE LEAD EXITS THE PLASTIC BODY AT  
THE BOTTOM OF THE PARTING LINE.  
4. DATUMS T–, –U–, AND Z– TO BE  
DETERMINED AT DATUM PLANE AB.  
5. DIMENSIONS S AND V TO BE DETERMINED AT  
SEATING PLANE AC–.  
6. DIMENSIONS A AND B DO NOT INCLUDE  
MOLD PROTRUSION. ALLOWABLE PROTRUSION  
IS 0.250 (0.010) PER SIDE. DIMENSIONS A AND B  
DO INCLUDE MOLD MISMATCH AND ARE  
DETERMINED AT DATUM PLANE AB.  
7. DIMENSION D DOES NOT INCLUDE DAMBAR  
PROTRUSION. DAMBAR PROTRUSION SHALL  
NOT CAUSE THE D DIMENSION TO EXCEED  
0.520 (0.020).  
BASE  
METAL  
1
N
–U–  
V1  
–T–  
F
D
B
V
B1  
DETAIL Y  
–Z–  
J
17  
8
9
SECTION AE–AE  
4X  
8. MINIMUM SOLDER PLATE THICKNESS SHALL  
BE 0.0076 (0.0003).  
9. EXACT SHAPE OF EACH CORNER MAY VARY  
FROM DEPICTION.  
0.20 (0.008) AC TU  
Z
9
S1  
S
MILLIMETERS  
DIM MIN MAX  
7.000 BSC  
INCHES  
MIN MAX  
0.276 BSC  
0.138 BSC  
0.276 BSC  
0.138 BSC  
DETAIL AD  
G
A
A1  
B
–AB–  
–AC–  
3.500 BSC  
7.000 BSC  
3.500 BSC  
1.400 1.600 0.055 0.063  
0.300 0.450 0.012 0.018  
1.350 1.450 0.053 0.057  
0.300 0.400 0.012 0.016  
SEATING  
PLANE  
B1  
C
0.10 (0.004) AC  
D
E
F
G
H
J
K
M
N
P
0.800 BSC  
0.031 BSC  
AE  
0.050 0.150 0.002 0.006  
0.090 0.200 0.004 0.008  
0.500 0.700 0.020 0.028  
12 REF  
0.090 0.160 0.004 0.006  
0.400 BSC 0.016 BSC  
P
8X M  
R
12 REF  
AE  
Q
R
1
5
1
5
E
DETAIL Y  
C
0.150 0.250 0.006 0.010  
S
9.000 BSC  
4.500 BSC  
9.000 BSC  
4.500 BSC  
0.200 REF  
1.000 REF  
0.354 BSC  
0.177 BSC  
0.354 BSC  
0.177 BSC  
0.008 REF  
0.039 REF  
S1  
V
V1  
W
X
W
Q
H
K
X
DETAIL AD  
http://onsemi.com  
14  
MC33680  
Notes  
http://onsemi.com  
15  
MC33680  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes  
withoutfurthernoticetoanyproductsherein. SCILLCmakesnowarranty,representationorguaranteeregardingthesuitabilityofitsproductsforanyparticular  
purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability,  
including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or  
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be  
validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others.  
SCILLCproductsarenotdesigned, intended, orauthorizedforuseascomponentsinsystemsintendedforsurgicalimplantintothebody, orotherapplications  
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or  
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PUBLICATION ORDERING INFORMATION  
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*Available from Germany, France, Italy, England, Ireland  
MC33680/D  

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