MC74ACT08NG [ONSEMI]

QUAD 2-INPUT AND GATE; 四2输入与门
MC74ACT08NG
型号: MC74ACT08NG
厂家: ONSEMI    ONSEMI
描述:

QUAD 2-INPUT AND GATE
四2输入与门

栅极 触发器 逻辑集成电路 光电二极管 输入元件
文件: 总8页 (文件大小:94K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
MC74AC08, MC74ACT08  
Quad 2−Input AND Gate  
Outputs Source/Sink 24 mA  
ACT08 Has TTL Compatible Inputs  
Pb−Free Packages are Available  
http://onsemi.com  
MAXIMUM RATINGS  
Rating  
Symbol  
Value  
Unit  
DC Supply Voltage (Referenced to GND)  
V
CC  
−0.5 to  
+7.0  
V
PDIP−14  
N SUFFIX  
CASE 646  
DC Input Voltage (Referenced to GND)  
DC Output Voltage (Referenced to GND)  
V
−0.5 to  
V
V
in  
14  
V
CC  
+0.5  
1
V
out  
−0.5 to  
V
CC  
+0.5  
DC Input Current, per Pin  
I
±20  
mA  
mA  
mA  
°C  
in  
SO−14  
D SUFFIX  
CASE 751A  
DC Output Sink/Source Current, per Pin  
I
±50  
±50  
out  
CC  
14  
DC V or GND Current per Output Pin  
I
CC  
1
Storage Temperature  
T
stg  
−65 to  
+150  
Maximum ratings are those values beyond which device damage can occur.  
Maximum ratings applied to the device are individual stress limit values (not  
normal operating conditions) and are not valid simultaneously. If these limits are  
exceeded, device functional operation is not implied, damage may occur and  
reliability may be affected.  
TSSOP−14  
DT SUFFIX  
CASE 948G  
14  
1
V
CC  
14  
13  
12  
11  
10  
9
8
SOEIAJ−14  
M SUFFIX  
CASE 965  
14  
1
1
2
3
4
5
6
7
GND  
Figure 1. Pinout: 14−Lead Packages Conductors  
(Top View)  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 5 of this data sheet.  
DEVICE MARKING INFORMATION  
See general marking information in the device marking  
section on page 5 of this data sheet.  
*For additional information on our Pb−Free strategy and soldering details, please  
download the ON Semiconductor Soldering and Mounting Techniques  
Reference Manual, SOLDERRM/D.  
Semiconductor Components Industries, LLC, 2004  
1
Publication Order Number:  
June, 2004 − Rev. 6  
MC74AC08/D  
MC74AC08, MC74ACT08  
RECOMMENDED OPERATING CONDITIONS  
Symbol  
Parameter  
Min  
2.0  
4.5  
0
Typ  
5.0  
5.0  
Max  
6.0  
Unit  
AC  
V
Supply Voltage  
V
CC  
ACT  
5.5  
V , V  
in out  
DC Input Voltage, Output Voltage (Ref. to GND)  
V
CC  
V
V
V
V
V
V
@ 3.0 V  
150  
40  
25  
10  
8.0  
ns/V  
CC  
Input Rise and Fall Time (Note 1)  
@ 4.5 V  
@ 5.5 V  
@ 4.5 V  
@ 5.5 V  
t , t  
CC  
CC  
CC  
CC  
r
f
AC Devices except Schmitt Inputs  
Input Rise and Fall Time (Note 2)  
t , t  
ns/V  
r
f
ACT Devices except Schmitt Inputs  
T
J
Junction Temperature (PDIP)  
Operating Ambient Temperature Range  
Output Current − High  
140  
85  
°C  
°C  
T
A
−40  
25  
I
−24  
24  
mA  
mA  
OH  
OL  
I
Output Current − Low  
1. V from 30% to 70% V ; see individual Data Sheets for devices that differ from the typical input rise and fall times.  
in  
CC  
2. V from 0.8 V to 2.0 V; see individual Data Sheets for devices that differ from the typical input rise and fall times.  
in  
DC CHARACTERISTICS  
74AC  
74AC  
T
A
=
−40°C to  
+85°C  
T
A
= +25°C  
V
CC  
(V)  
Typ  
Guaranteed Limits  
Symbol  
Parameter  
Conditions  
= 0.1 V  
OUT  
Unit  
V
V
V
Minimum High Level  
Input Voltage  
V
3.0  
4.5  
5.5  
1.5  
2.1  
2.1  
V
IH  
or V − 0.1 V  
2.25  
2.75  
3.15  
3.85  
3.15  
3.85  
CC  
Maximum Low Level  
Input Voltage  
V
= 0.1 V  
3.0  
4.5  
5.5  
1.5  
0.9  
0.9  
V
V
IL  
OUT  
or V − 0.1 V  
2.25  
2.75  
1.35  
1.65  
1.35  
1.65  
CC  
Minimum High Level  
Output Voltage  
I
= −50 mA  
3.0  
4.5  
5.5  
2.99  
4.49  
5.49  
2.9  
4.4  
5.4  
2.9  
4.4  
5.4  
OH  
OUT  
V
IN  
= V or V (Note 3)  
IL IH  
−12 mA  
−24 mA  
−24 mA  
3.0  
4.5  
5.5  
2.56  
3.86  
4.86  
2.46  
3.76  
4.76  
V
I
OH  
V
OL  
Maximum Low Level  
Output Voltage  
V
= V or V (Note 3)  
IL IH  
IN  
12 mA  
24 mA  
24 mA  
3.0  
4.5  
5.5  
0.36  
0.36  
0.36  
0.44  
0.44  
0.44  
V
I
OL  
I
IN  
Maximum Input  
Leakage Current  
V = V , GND  
5.5  
±0.1  
±1.0  
mA  
I
CC  
I
I
I
Minimum Dynamic (Note 4)  
Output Current  
V
V
= 1.65 V Max  
= 3.85 V Min  
5.5  
5.5  
75  
mA  
mA  
OLD  
OHD  
CC  
OLD  
−75  
OHD  
Maximum Quiescent  
Supply Current  
V
IN  
= V or GND  
5.5  
4.0  
.
40  
mA  
CC  
NOTE:  
I
and I @ 3.0 V are guaranteed to be less than or equal to the respective limit @ 5.5 V V  
IN CC CC  
3. All outputs loaded; thresholds on input associated with output under test.  
4. Maximum test duration 2.0 ms, one output loaded at a time.  
http://onsemi.com  
2
 
MC74AC08, MC74ACT08  
AC CHARACTERISTICS (For Figures and Waveforms − See Section 3 of the ON Semiconductor FACT Data Book, DL138/D)  
74AC  
74AC  
T
A
= −40°C  
to +85°C  
T
A
= +25°C  
C = 50 pF  
C = 50 pF  
L
L
Fig.  
No.  
V
(V)  
CC  
Min  
Typ  
Max  
Min  
Max  
(Note5 )  
Symbol  
Parameter  
Unit  
3.3  
5.0  
1.5  
1.5  
7.5  
5.5  
9.5  
7.5  
1.0  
1.0  
10.0  
8.5  
t
t
Propagation Delay  
Propagation Delay  
ns  
3−5  
3−5  
PLH  
3.3  
5.0  
1.5  
1.5  
7.0  
5.5  
8.5  
7.0  
1.0  
1.0  
9.0  
7.5  
ns  
PHL  
5. Voltage Range 3.3 V is 3.3 V ±0.3 V.  
Voltage Range 5.0 V is 5.0 V ±0.5 V.  
DC CHARACTERISTICS  
74ACT  
74ACT  
T
A
=
−40°C to  
+85°C  
T
A
= +25°C  
V
CC  
Typ  
1.5  
Guaranteed Limits  
(V)  
4.5  
5.5  
4.5  
5.5  
4.5  
5.5  
Symbol  
Parameter  
Conditions  
= 0.1 V  
OUT  
Unit  
V
V
V
Minimum High Level  
Input Voltage  
V
2.0  
2.0  
0.8  
0.8  
4.4  
5.4  
2.0  
2.0  
0.8  
0.8  
4.4  
5.4  
IH  
V
V
or V − 0.1 V  
1.5  
CC  
Maximum Low Level  
Input Voltage  
V
OUT  
= 0.1 V  
1.5  
IL  
or V − 0.1 V  
1.5  
CC  
Minimum High Level  
Output Voltage  
I
= −50 mA  
4.49  
5.49  
OH  
OUT  
V
V
V
IN  
= V or V (Note 6)  
IL  
IH  
−24 mA  
−24 mA  
4.5  
5.5  
4.5  
5.5  
3.86  
4.86  
0.1  
3.76  
4.76  
0.1  
V
OL  
Maximum Low Level  
Output Voltage  
I
= 50 mA  
0.001  
0.001  
OUT  
V
V
0.1  
0.1  
V
= V or V (Note 6)  
IL IH  
IN  
24 mA  
24 mA  
4.5  
5.5  
0.36  
0.36  
0.44  
0.44  
I
IN  
Maximum Input  
Leakage Current  
V = V , GND  
5.5  
±0.1  
±1.0  
mA  
I
CC  
DI  
Additional Max. I /Input  
V = V − 2.1 V  
5.5  
5.5  
5.5  
0.6  
1.5  
75  
mA  
mA  
mA  
CCT  
CC  
I
CC  
I
I
I
Minimum Dynamic (Note 7)  
Output Current  
V
= 1.65 V Max  
OLD  
OLD  
OHD  
V
= 3.85 V Min  
−75  
OHD  
CC  
Maximum Quiescent  
Supply Current  
V
IN  
= V or GND  
5.5  
4.0  
40  
mA  
CC  
6. All outputs loaded; thresholds on input associated with output under test.  
7. Maximum test duration 2.0 ms, one output loaded at a time.  
http://onsemi.com  
3
 
MC74AC08, MC74ACT08  
AC CHARACTERISTICS (For Figures and Waveforms − See Section 3 of the ON Semiconductor FACT Data Book, DL138/D)  
74ACT  
74ACT  
= −40°C  
T
A
to +85°C  
T
A
= +25°C  
C = 50 pF  
C = 50 pF  
L
L
Fig.  
No.  
V
(V)  
CC  
Min  
1.0  
1.0  
Typ  
Max  
9.0  
Min  
1.0  
1.0  
Max  
10.0  
10.0  
(Note 8)  
Symbol  
Parameter  
Unit  
t
t
Propagation Delay  
Propagation Delay  
5.0  
ns  
3−5  
3−5  
PLH  
5.0  
9.0  
ns  
PHL  
8. Voltage Range 5.0 V is 5.0 V ±0.5 V.  
CAPACITANCE  
Value  
Typ  
4.5  
20  
Symbol  
Parameter  
Test Conditions  
Unit  
C
C
Input Capacitance  
Power Dissipation Capacitance  
V
= 5.0 V  
= 5.0 V  
pF  
pF  
IN  
CC  
CC  
V
PD  
http://onsemi.com  
4
 
MC74AC08, MC74ACT08  
MARKING DIAGRAMS  
PDIP−14  
SOIC−14  
TSSOP−14  
SOEIAJ−14  
MC74AC08N  
AWLYYWW  
AC08  
AWLYWW  
AC  
08  
ALYW  
74AC08  
ALYW  
MC74ACT08N  
AWLYYWW  
ACT08  
AWLYWW  
ACT  
08  
ALYW  
74ACT08  
ALYW  
A
= Assembly Location  
WL, L = Wafer Lot  
YY, Y = Year  
WW, W = Work Week  
ORDERING INFORMATION  
Device  
Package  
PDIP−14  
SOIC−14  
Shipping  
MC74AC08N  
500 Units / Rail  
55 Units / Rail  
MC74AC08D  
MC74AC08DR2  
MC74AC08DTR2  
TSSOP−14  
2500 / Tape & Reel  
2500 / Tape & Reel  
TSSOP−14  
(Pb−Free)  
MC74AC08MEL  
SOEIAJ−14  
(Pb−Free)  
2000 / Tape & Reel  
MC74ACT08N  
PDIP−14  
SOIC−14  
SOIC−14  
500 Units / Rail  
55 Units / Rail  
MC74ACT08D  
MC74ACT08DR2  
MC74ACT08DTR2G  
2500 / Tape & Reel  
2500 / Tape & Reel  
SOIC−14  
(Pb−Free)  
MC74ACT08NG  
MC74ACT08MEL  
PDIP−14  
(Pb−Free)  
500 Units / Rail  
SOEIAJ−14  
(Pb−Free)  
2000 / Tape & Reel  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
http://onsemi.com  
5
MC74AC08, MC74ACT08  
PACKAGE DIMENSIONS  
PDIP−14  
N SUFFIX  
CASE 646−06  
ISSUE N  
NOTES:  
1. DIMENSIONING AND TOLERANCING  
PER ANSI Y14.5M, 1982.  
14  
1
8
7
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION L TO CENTER OF LEADS  
WHEN FORMED PARALLEL.  
4. DIMENSION B DOES NOT INCLUDE  
MOLD FLASH.  
B
5. ROUNDED CORNERS OPTIONAL.  
A
F
INCHES  
MILLIMETERS  
DIM  
A
B
C
D
F
MIN  
MAX  
0.770  
0.260  
0.185  
0.021  
0.070  
MIN  
18.16  
6.10  
3.69  
0.38  
1.02  
MAX  
18.80  
6.60  
4.69  
0.53  
1.78  
0.715  
0.240  
0.145  
0.015  
0.040  
L
N
C
G
H
J
K
L
0.100 BSC  
2.54 BSC  
0.052  
0.008  
0.115  
0.290  
−−−  
0.095  
0.015  
0.135  
0.310  
10  
1.32  
0.20  
2.92  
7.37  
−−−  
0.38  
2.41  
0.38  
3.43  
7.87  
10  
−T−  
SEATING  
PLANE  
J
K
D 14 PL  
M
N
H
G
_
_
M
0.015  
0.039  
1.01  
M
0.13 (0.005)  
SOIC−14  
D SUFFIX  
CASE 751A−03  
ISSUE G  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER  
ANSI Y14.5M, 1982.  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSIONS A AND B DO NOT INCLUDE  
MOLD PROTRUSION.  
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)  
PER SIDE.  
−A−  
14  
8
5. DIMENSION D DOES NOT INCLUDE  
DAMBAR PROTRUSION. ALLOWABLE  
DAMBAR PROTRUSION SHALL BE 0.127  
(0.005) TOTAL IN EXCESS OF THE D  
DIMENSION AT MAXIMUM MATERIAL  
CONDITION.  
−B−  
P 7 PL  
M
M
B
0.25 (0.010)  
7
1
MILLIMETERS  
DIM MIN MAX  
INCHES  
MIN MAX  
G
F
R X 45  
A
B
C
D
F
8.55  
3.80  
1.35  
0.35  
0.40  
8.75 0.337 0.344  
4.00 0.150 0.157  
1.75 0.054 0.068  
0.49 0.014 0.019  
1.25 0.016 0.049  
_
C
−T−  
SEATING  
PLANE  
G
J
K
M
P
R
1.27 BSC  
0.050 BSC  
0.25 0.008 0.009  
0.25 0.004 0.009  
J
M
K
0.19  
0.10  
0
D 14 PL  
M
S
S
0.25 (0.010)  
T
B
A
7
0
7
_
_
_
_
5.80  
0.25  
6.20 0.228 0.244  
0.50 0.010 0.019  
http://onsemi.com  
6
MC74AC08, MC74ACT08  
PACKAGE DIMENSIONS  
TSSOP−14  
DT SUFFIX  
CASE 948G−01  
ISSUE O  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,  
PROTRUSIONS OR GATE BURRS. MOLD FLASH  
OR GATE BURRS SHALL NOT EXCEED 0.15  
(0.006) PER SIDE.  
4. DIMENSION B DOES NOT INCLUDE INTERLEAD  
FLASH OR PROTRUSION. INTERLEAD FLASH OR  
PROTRUSION SHALL NOT EXCEED  
0.25 (0.010) PER SIDE.  
14X K REF  
M
S
S
0.10 (0.004)  
T U  
V
S
0.15 (0.006) T U  
N
0.25 (0.010)  
14  
8
2X L/2  
M
B
−U−  
5. DIMENSION K DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE DAMBAR  
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN  
EXCESS OF THE K DIMENSION AT MAXIMUM  
MATERIAL CONDITION.  
L
N
PIN 1  
IDENT.  
F
7
1
6. TERMINAL NUMBERS ARE SHOWN FOR  
REFERENCE ONLY.  
DETAIL E  
7. DIMENSION A AND B ARE TO BE DETERMINED  
AT DATUM PLANE −W−.  
S
K
0.15 (0.006) T U  
A
MILLIMETERS  
INCHES  
MIN  
K1  
DIM MIN  
MAX  
5.10  
4.50  
1.20  
0.15  
0.75  
MAX  
0.200  
0.177  
0.047  
0.006  
0.030  
−V−  
A
B
4.90  
4.30  
−−−  
0.193  
0.169  
−−−  
J J1  
C
D
0.05  
0.50  
0.002  
0.020  
F
SECTION N−N  
G
H
0.65 BSC  
0.026 BSC  
0.50  
0.09  
0.09  
0.19  
0.19  
0.60  
0.20  
0.16  
0.30  
0.25  
0.020  
0.004  
0.004  
0.007  
0.007  
0.024  
0.008  
0.006  
0.012  
0.010  
J
J1  
K
−W−  
C
K1  
L
6.40 BSC  
_
0.252 BSC  
0
0.10 (0.004)  
M
0
8
8
_
_
_
SEATING  
PLANE  
−T−  
H
G
DETAIL E  
D
SOEIAJ−14  
M SUFFIX  
CASE 965−01  
ISSUE O  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD  
FLASH OR PROTRUSIONS AND ARE MEASURED  
AT THE PARTING LINE. MOLD FLASH OR  
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)  
PER SIDE.  
L
E
14  
8
Q
1
4. TERMINAL NUMBERS ARE SHOWN FOR  
REFERENCE ONLY.  
H
E
_
E
M
5. THE LEAD WIDTH DIMENSION (b) DOES NOT  
INCLUDE DAMBAR PROTRUSION. ALLOWABLE  
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)  
TOTAL IN EXCESS OF THE LEAD WIDTH  
DIMENSION AT MAXIMUM MATERIAL CONDITION.  
DAMBAR CANNOT BE LOCATED ON THE LOWER  
RADIUS OR THE FOOT. MINIMUM SPACE  
BETWEEN PROTRUSIONS AND ADJACENT LEAD  
TO BE 0.46 ( 0.018).  
L
7
1
DETAIL P  
Z
D
MILLIMETERS  
INCHES  
MIN  
−−−  
VIEW P  
DIM MIN  
MAX  
MAX  
0.081  
0.008  
0.020  
0.011  
0.413  
0.215  
A
e
A
−−−  
0.05  
0.35  
0.18  
9.90  
5.10  
2.05  
c
A
1
b
c
0.20 0.002  
0.50 0.014  
0.27 0.007  
D
E
e
10.50 0.390  
5.45 0.201  
b
A
1
1.27 BSC  
0.050 BSC  
H
M
7.40  
0.50  
1.10  
8.20 0.291  
0.85 0.020  
1.50 0.043  
0.323  
0.033  
0.059  
0.13 (0.005)  
E
0.10 (0.004)  
0.50  
L
E
M
0
10  
0.90 0.028  
10  
_
0.035  
0.056  
0
_
_
_
Q
1
0.70  
−−−  
Z
1.42  
−−−  
http://onsemi.com  
7
MC74AC08, MC74ACT08  
ON Semiconductor and  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice  
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All  
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights  
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications  
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MC74AC08/D  

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