MC74LCX16646DTR2 [ONSEMI]
LVC/LCX/Z SERIES, DUAL 8-BIT REGISTERED TRANSCEIVER, TRUE OUTPUT, PDSO56, PLASTIC, TSSOP-56;型号: | MC74LCX16646DTR2 |
厂家: | ONSEMI |
描述: | LVC/LCX/Z SERIES, DUAL 8-BIT REGISTERED TRANSCEIVER, TRUE OUTPUT, PDSO56, PLASTIC, TSSOP-56 输入元件 光电二极管 输出元件 逻辑集成电路 |
文件: | 总21页 (文件大小:540K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
SEMICONDUCTOR TECHNICAL DATA
LOW–VOLTAGE CMOS
16–BIT TRANSCEIVER/
REGISTERED TRANSCEIVER
The MC74LCX16646 is a high performance, non–inverting 16–bit
transceiver/registered transceiver operating from a 2.7 to 3.6V supply.
The device is byte controlled. Each byte has separate control inputs
which can be tied together for full 16–bit operation. High impedance TTL
compatible inputs significantly reduce current loading to input drivers
while TTL compatible outputs offer improved switching noise
performance. A V specification of 5.5V allows MC74LCX16646 inputs to
I
be safely driven from 5V devices. The MC74LCX16646 is suitable for
memory address driving and all TTL level bus oriented transceiver
applications.
Data on the A or B bus will be clocked into the registers as the
appropriate clock pin goes from a LOW–to–HIGH logic level. Output
Enable (OEn) and Direction Control (DIRn) pins are provided to control
the transceiver outputs. In the transceiver mode, data present at the high
impedance port may be stored in either the A or the B register or in both.
The select controls (SBAn, SABn) can multiplex stored and real–time
(transparent mode) data. The DIR determines which bus will receive data
when OE is active LOW. In the isolation mode (OE HIGH), A data may be
stored in the B register or B data may be stored in the A register. Only one
of the two buses, A or B, may be driven at one time.
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 1202–01
• Designed for 2.7 to 3.6V V
CC
Operation
• 5.2ns Maximum t
pd
• 5V Tolerant — Interface Capability With 5V TTL Logic
• Supports Live Insertion and Withdrawal
PIN NAMES
Pins
Function
• I
OFF
Specification Guarantees High Impedance When V
= 0V
CC
A0–A15
B0–B15
CABn, CBAn
SABn, SBAn
DIRn, OEn
Side A Inputs/Outputs
Side B Inputs/Outputs
Clock Pulse Inputs
Select Control Inputs
Output Enable Inputs
• LVTTL Compatible
• LVCMOS Compatible
• 24mA Balanced Output Sink and Source Capability
• Near Zero Static Supply Current in All Three Logic States (20µA)
Substantially Reduces System Power Requirements
• Latchup Performance Exceeds 500mA
• ESD Performance: Human Body Model >2000V; Machine Model >200V
This document contains information on a new product. Specifications and information herein are subject to
change without notice.
11/96
REV 0.2
206
Motorola, Inc. 1996
MC74LCX16646
DIR1
CAB1
SAB1
GND
A0
OE1
CBA1
SBA1
GND
B0
1
2
56
55
54
53
52
3
4
5
A1
6
51 B1
V
V
CC
7
50
49
48
47
46
45
CC
A2
A3
B2
8
B3
9
A4
B4
10
11
12
GND
A5
GND
B5
A6 13
44 B6
A7
A8
B7
14
15
16
17
18
19
43
42
41
40
39
38
B8
A9
B9
A10
GND
A11
B10
GND
B11
A12 20
37 B12
A13
B13
21
22
23
24
25
26
27
28
36
35
34
33
32
31
30
29
V
CC
V
CC
A14
B14
A15
GND
SAB2
CAB2
DIR2
B15
GND
SBA2
CBA2
OE2
LCX DATA
207
MOTOROLA
BR1339 — REV 3
MC74LCX16646
LOGIC DIAGRAM
55
CBA1
1
DIR1
56
OE1
54
SBA1
3
SAB1
2
CAB1
C
Q
A0:7
D
C
Q
B0:7
D
1 of 8 Channels
To 7 Other Channels
30
CBA2
28
DIR2
29
OE2
31
SBA2
26
SAB2
27
CAB2
C
Q
A8:15
D
C
Q
B8:15
D
1 of 8 Channels
To 7 Other Channels
MOTOROLA
208
LCX DATA
BR1339 — REV 3
MC74LCX16646
BUS APPLICATIONS
Real Time Transfer – Bus B to
Bus A
Real Time Transfer – Bus A to
Bus B
OE
L
DIR
L
CAB CBA SAB
SBA
L
OE
L
DIR
H
CAB CBA SAB
SBA
X
X
X
X
X
X
L
Store Data from Bus A, Bus B or
Busses A and B
Transfer Storage Data to Bus A
or Bus B
OE
DIR
CAB CBA SAB
SBA
OE
DIR
CAB CBA SAB
SBA
X
X
H
X
X
X
↑
X
↑
X
↑
↑
X
X
X
X
X
X
L
L
L
H
X
H or L
H or L
X
X
H
H
X
LCX DATA
BR1339 — REV 3
209
MOTOROLA
MC74LCX16646
FUNCTION TABLE
Inputs
CBAn
Data Ports
Operating Mode
OEn
DIRn
CABn
SABn
SBAn
An
Bn
H
X
Input
Input
↑
↑
↑
↑
X
X
X
X
X
X
Isolation, Hold Storage
l
X
X
l
Store A and/or B Data
h
X
X
h
L
H
Input
Output
↑
↑
X*
X*
L
X
L
H
L
H
Real Time A Data to B Bus
H
L
X
X
X
QA
Stored A Data to B Bus
l
h
L
H
Real Time A Data to B Bus; Store A Data
H
X
L
H
QA
QA
Clock A Data to B Bus; Store A Data
L
L
Output
Input
X*
X*
↑
↑
X
L
L
H
L
H
Real Time B Data to A Bus
X
X
H
L
QB
X
Stored B Data to A Bus
L
H
l
h
Real Time B Data to A Bus; Store B Data
X
H
QB
QB
L
H
Clock B Data to A Bus; Store B Data
H = High Voltage Level; h = High Voltage Level One Setup Time Prior to the Low–to–High Clock Transition; L = Low Voltage Level; l = Low Voltage Level One Setup
TimePriortotheLow–to–HighClockTransition;X=Don’tCare;↑ =Low–to–HighClockTransition;↑ =NOTLow–to–HighClockTransition;QA=Ainputstorageregister;
QB = B input storage register; * = The clocks are not internally gated with either the Output Enables or the Source Inputs. Therefore, data at the A or B ports may be
clocked into the storage registers, at any time. For I
reasons, Do Not Float Inputs.
CC
ABSOLUTE MAXIMUM RATINGS*
Symbol
CC
Parameter
DC Supply Voltage
Value
Condition
Unit
V
V
V
V
–0.5 to +7.0
DC Input Voltage
–0.5 ≤ V ≤ +7.0
V
I
I
DC Output Voltage
–0.5 ≤ V ≤ +7.0
Output in 3–State
Note 1.
V
O
O
–0.5 ≤ V ≤ V
+ 0.5
V
O
CC
I
I
DC Input Diode Current
DC Output Diode Current
–50
–50
V < GND
mA
mA
mA
mA
mA
mA
°C
IK
I
V
O
< GND
OK
+50
V > V
O CC
I
I
I
DC Output Source/Sink Current
DC Supply Current Per Supply Pin
DC Ground Current Per Ground Pin
Storage Temperature Range
±50
O
±100
±100
CC
GND
T
–65 to +150
STG
* Absolutemaximumcontinuousratingsarethosevaluesbeyondwhichdamagetothedevicemayoccur. Exposuretotheseconditionsorconditions
beyond those indicated may adversely affect device reliability. Functional operation under absolute–maximum–rated conditions is not implied.
1. Output in HIGH or LOW State. I absolute maximum rating must be observed.
O
MOTOROLA
210
LCX DATA
BR1339 — REV 3
MC74LCX16646
RECOMMENDED OPERATING CONDITIONS
Symbol
CC
Parameter
Min
Typ
Max
Unit
V
Supply Voltage
Operating
Data Retention Only
2.0
1.5
3.3
3.3
3.6
3.6
V
V
V
Input Voltage
0
5.5
V
V
I
Output Voltage
(HIGH or LOW State)
(3–State)
0
0
V
CC
O
5.5
–24
24
I
I
I
I
HIGH Level Output Current, V
= 3.0V – 3.6V
mA
mA
mA
mA
°C
OH
OL
OH
OL
CC
LOW Level Output Current, V
= 3.0V – 3.6V
= 2.7V – 3.0V
= 2.7V – 3.0V
CC
HIGH Level Output Current, V
–12
12
CC
LOW Level Output Current, V
CC
T
A
Operating Free–Air Temperature
Input Transition Rise or Fall Rate, V from 0.8V to 2.0V,
–40
0
+85
10
∆t/∆V
ns/V
IN
V
CC
= 3.0V
DC ELECTRICAL CHARACTERISTICS
T
A
= –40°C to +85°C
Symbol
Characteristic
HIGH Level Input Voltage (Note 2.)
LOW Level Input Voltage (Note 2.)
HIGH Level Output Voltage
Condition
Min
2.0
Max
Unit
V
V
V
V
2.7V ≤ V
≤ 3.6V
IH
CC
2.7V ≤ V
2.7V ≤ V
≤ 3.6V
= –100µA
0.8
V
IL
CC
≤ 3.6V; I
V
– 0.2
V
OH
CC
OH
CC
V
CC
V
CC
V
CC
= 2.7V; I
= 3.0V; I
= 3.0V; I
= –12mA
= –18mA
= –24mA
2.2
OH
OH
OH
2.4
2.2
V
LOW Level Output Voltage
2.7V ≤ V
CC
≤ 3.6V; I
= 100µA
OL
0.2
0.4
V
OL
V
= 2.7V; I = 12mA
OL
CC
CC
CC
V
V
= 3.0V; I
= 3.0V; I
= 16mA
= 24mA
0.4
OL
OL
0.55
±5.0
±5.0
I
I
Input Leakage Current
3–State Output Current
2.7V ≤ V
CC
≤ 3.6V; 0V ≤ V ≤ 5.5V
µA
µA
I
I
2.7 ≤ V
CC
≤ 3.6V; 0V ≤ V ≤ 5.5V;
O
I
OZ
V = V or V
IH
IL
I
I
Power–Off Leakage Current
Quiescent Supply Current
V
= 0V; V or V = 5.5V
10
20
µA
µA
µA
µA
OFF
CC
I
O
2.7 ≤ V
≤ 3.6V; V = GND or V
CC
CC
I
CC
2.7 ≤ V
CC
≤ 3.6V; 3.6 ≤ V or V ≤ 5.5V
±20
500
I
O
∆I
Increase in I
per Input
2.7 ≤ V
CC
≤ 3.6V; V = V
IH
– 0.6V
CC
CC
CC
2. These values of V are used to test DC electrical characteristics only.
I
LCX DATA
211
MOTOROLA
BR1339 — REV 3
MC74LCX16646
AC CHARACTERISTICS (Note 3.; t = t = 2.5ns; C = 50pF; R = 500Ω)
R
F
L
L
Limits
T
A
= –40°C to +85°C
V
= 3.0V to 3.6V
Max
V
= 2.7V
CC
CC
Symbol
Parameter
Waveform
Min
Min
Max
Unit
MHz
ns
f
Clock Pulse Frequency
3
1
170
max
t
t
Propagation Delay
Input to Output
1.5
1.5
5.2
5.2
1.5
1.5
6.0
6.0
PLH
PHL
t
t
Propagation Delay
Clock to Output
3
1
2
2
1.5
1.5
6.0
6.0
1.5
1.5
7.0
7.0
ns
ns
ns
ns
PLH
PHL
t
t
Propagation Delay
Select to Output
1.5
1.5
6.0
6.0
1.5
1.5
7.0
7.0
PLH
PHL
t
t
Output Enable Time to
High and Low Level
1.5
1.5
7.5
7.5
1.5
1.5
8.5
8.5
PZH
PZL
t
t
Output Disable Time From
High and Low Level
1.5
1.5
6.5
6.5
1.5
1.5
7.5
7.5
PHZ
PLZ
t
t
t
Setup Time, HIGH or LOW Data to Clock
Hold Time, HIGH or LOW Data to Clock
Clock Pulse Width, HIGH or LOW
3
3
3
2.5
1.5
3.0
2.5
1.5
3.0
ns
ns
ns
ns
s
h
w
t
t
Output–to–Output Skew
(Note 4.)
1.0
1.0
OSHL
OSLH
3. These AC parameters are preliminary and may be modified prior to release.
4. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device.
The specification applies to any outputs switching in the same direction, either HIGH–to–LOW (t
guaranteed by design.
) or LOW–to–HIGH (t
OSHL
); parameter
OSLH
DYNAMIC SWITCHING CHARACTERISTICS
T
A
= +25°C
Symbol
Characteristic
Condition
Min
Typ
0.8
0.8
Max
Unit
V
V
V
Dynamic LOW Peak Voltage (Note 5.)
Dynamic LOW Valley Voltage (Note 5.)
V
V
= 3.3V, C = 50pF, V = 3.3V, V = 0V
L IH IL
OLP
CC
= 3.3V, C = 50pF, V = 3.3V, V = 0V
IH IL
V
OLV
CC
L
5. Number of outputs defined as “n”. Measured with “n–1” outputs switching from HIGH–to–LOW or LOW–to–HIGH. The remaining output is
measured in the LOW state.
CAPACITIVE CHARACTERISTICS
Symbol
Parameter
Input Capacitance
Condition
= 3.3V, V = 0V or V
Typical
Unit
pF
C
C
C
V
V
7
8
IN
CC
I
CC
CC
Input/Output Capacitance
= 3.3V, V = 0V or V
pF
I/O
PD
CC
I
Power Dissipation Capacitance
10MHz, V
CC
= 3.3V, V = 0V or V
CC
20
pF
I
MOTOROLA
212
LCX DATA
BR1339 — REV 3
MC74LCX16646
2.7V
0V
An, Bn,
SBAn, SABn
1.5V
t
, t
PLH PHL
V
OH
Bn, An
1.5V
V
OL
WAVEFORM 1 – SAB to B and SBA to A, An to Bn PROPAGATION DELAYS
t
R
= t = 2.5ns, 10% to 90%; f = 1MHz; t = 500ns
F
W
2.7V
0V
OEn
1.5V
1.5V
DIRn
t
t
PHZ
PZH
V
OH
– 0.3V
1.5V
1.5V
An, Bn
≈ 0V
t
t
PLZ
PZL
≈ 3.0V
An, Bn
V
OL
+ 0.3V
WAVEFORM 2 – OE/DIR to An/Bn OUTPUT ENABLE AND DISABLE TIMES
= t = 2.5ns, 10% to 90%; f = 1MHz; t = 500ns
t
R
F
W
Figure 1. AC Waveforms
LCX DATA
213
MOTOROLA
BR1339 — REV 3
MC74LCX16646
2.7V
An, Bn
1.5V
0V
t
s
t
h
2.7V
CABn,
CBAn
t
w
1.5V
1.5V
0V
f
max
t
, t
PLH PHL
V
OH
Bn, An
1.5V
V
OL
WAVEFORM 3 – CLOCK to Bn/An PROPAGATION DELAYS, CLOCK MINIMUM PULSE WIDTH,
An/Bn to CLOCK SETUP AND HOLD TIMES
t
R
= t = 2.5ns, 10% to 90%; f = 1MHz; t = 500ns except when noted
F W
t
w
NEGATIVE
PULSE
1.5V
1.5V
1.5V
1.5V
POSITIVE
PULSE
t
w
WAVEFORM 4 – INPUT PULSE DEFINITION
= t = 2.5ns, 10% to 90% of 0V to 2.7V
t
R
F
Figure 1. AC Waveforms (continued)
V
CC
6V
OPEN
GND
R
1
PULSE
GENERATOR
DUT
R
T
C
L
R
L
TEST
SWITCH
Open
6V
t , t
PLH PHL
t , t
PZL PLZ
Open Collector/Drain t
PLH
and t
PHL
6V
t
, t
GND
PZH PHZ
C
R
R
= 50pF or equivalent (Includes jig and probe capacitance)
L
L
T
= R = 500Ω or equivalent
1
OUT
= Z
of pulse generator (typically 50Ω)
Figure 2. Test Circuit
MOTOROLA
214
LCX DATA
BR1339 — REV 3
SEMICONDUCTOR TECHNICAL DATA
Device Nomenclature
MC 74 XXXX YYYYYY ZZ
Motorola
Package Type
Circuit Identifier
• D
= Plastic Narrow JECDEC SOIC
• DW = Plastic Wide JEDEC SOIC
• M = Plastic EIAJ SOIC
• SD = Plastic SSOP
• DT = Plastic TSSOP
Temperature Range
• 74 = –40 to +85°C
Family Identifier
• LCX = 5V–Tolerant Low–Voltage CMOS
• LVX = Low–Voltage CMOS
• LVXC = Configurable Low–Voltage CMOS
Function Type
• A = Modified LCX Spec
251
MOTOROLA
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751A–03
ISSUE F
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
–A–
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
14
1
8
7
P 7 PL
–B–
M
M
0.25 (0.010)
B
MILLIMETERS
INCHES
MIN MAX
G
F
R X 45°
DIM MIN
MAX
8.75
4.00
1.75
0.49
1.25
C
A
B
C
D
F
G
J
K
M
P
8.55
3.80
1.35
0.35
0.40
0.337 0.344
0.150 0.157
0.054 0.068
0.014 0.019
0.016 0.049
0.050 BSC
J
M
SEATING
PLANE
K
D 14 PL
1.27 BSC
0.19
0.10
0°
0.25
0.25
7°
0.008 0.009
0.004 0.009
M
S
S
0.25 (0.010)
T
B
A
0°
7°
5.80
0.25
6.20
0.50
0.228 0.244
0.010 0.019
R
M SUFFIX
PLASTIC SOIC EIAJ PACKAGE
CASE 965–01
ISSUE O
NOTES:
1
DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2
3
CONTROLLING DIMENSION: MILLIMETER.
DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
L
E
14
8
7
Q
1
E H
4
5
TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
E
M
THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
L
1
DETAIL P
Z
D
VIEW P
e
MILLIMETERS
INCHES
A
DIM MIN
MAX
MIN
---
MAX
0.081
c
A
---
2.05
A
0.05
0.35
0.18
0.20 0.002 0.008
0.50 0.014 0.020
0.27 0.007
1
b
c
0.011
D
E
e
9.90 10.50 0.390 0.413
b
A
1
5.10
5.45 0.201 0.215
M
1.27 BSC
0.050 BSC
8.20 0.291 0.323
0.85 0.020 0.033
1.50 0.043 0.059
0.13 (0.005)
0.10 (0.004)
H
7.40
0.50
1.10
0
0.70
---
E
L
L
E
M
Q
10
0.90 0.028 0.035
1.42 --- 0.056
0
10
1
Z
MOTOROLA
252
Case Outlines
(continued)
SD SUFFIX
PLASTIC SSOP PACKAGE
CASE 940A–03
NOTES:
ISSUE B
6
DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
14X K REF
7
8
CONTROLLING DIMENSION: MILLIMETER.
DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
M
S
S
0.12 (0.005)
T U
V
0.25 (0.010)
N
9
DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
14
8
L/2
M
N
10 DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION/INTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF K DIMENSION AT MAXIMUM
MATERIAL CONDITION. DAMBAR INTRUSION
SHALL NOT REDUCE DIMENSION K BY MORE
THAN 0.07 (0.002) AT LEAST MATERIAL
CONDITION.
B
L
F
PIN 1
IDENT
1
7
DETAIL E
–U–
11 TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
12 DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
A
–V–
K
J
J1
M
S
MILLIMETERS
DIM MIN MAX
INCHES
MIN MAX
0.20 (0.008)
T U
A
B
C
D
F
6.07
5.20
1.73
0.05
0.63
6.33 0.238 0.249
5.38 0.205 0.212
1.99 0.068 0.078
0.21 0.002 0.008
0.95 0.024 0.037
K1
SECTION N–N
G
H
J
J1
K
K1
L
0.65 BSC
0.026 BSC
1.22 0.042 0.048
0.20 0.003 0.008
0.16 0.003 0.006
0.38 0.010 0.015
0.33 0.010 0.013
1.08
0.09
0.09
0.25
0.25
7.65
0
–W–
C
0.076 (0.003)
SEATING
PLANE
–T–
7.90 0.301
0.311
8
D
G
M
8
0
DETAIL E
H
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948G–01
ISSUE O
NOTES:
1
14X K REF
DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
M
S
S
0.10 (0.004)
T U
V
2
3
CONTROLLING DIMENSION: MILLIMETER.
DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
S
0.15 (0.006) T U
N
0.25 (0.010)
14
4
5
8
7
2X L/2
M
B
L
N
–U–
PIN 1
IDENT.
F
1
6
7
TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
DETAIL E
K
S
0.15 (0.006) T U
A
MILLIMETERS
DIM MIN MAX
INCHES
MIN MAX
K1
–V–
A
B
4.90
4.30
–––
5.10 0.193 0.200
4.50 0.169 0.177
J J1
C
1.20
––– 0.047
D
F
G
H
J
J1
K
K1
L
0.05
0.50
0.65 BSC
0.50
0.09
0.09
0.19
0.19
0.15 0.002 0.006
0.75 0.020 0.030
SECTION N–N
0.026 BSC
0.60 0.020 0.024
0.20 0.004 0.008
0.16 0.004 0.006
0.30 0.007 0.012
0.25 0.007 0.010
–W–
C
0.10 (0.004)
6.40 BSC
0.252 BSC
SEATING
PLANE
–T–
H
G
M
0
8
0
8
DETAIL E
D
253
MOTOROLA
Case Outlines
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751B–05
ISSUE J
–A–
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
16
1
9
8
–B–
P 8 PL
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
M
M
0.25 (0.010)
B
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
G
MILLIMETERS
INCHES
MIN MAX
DIM MIN
MAX
A
B
C
D
F
G
J
K
M
P
9.80 10.00
0.386 0.393
0.150 0.157
0.054 0.068
0.014 0.019
0.016 0.049
0.050 BSC
F
K
R X 45°
3.80
1.35
0.35
0.40
4.00
1.75
0.49
1.25
C
1.27 BSC
–T–
SEATING
0.19
0.10
0°
0.25
0.25
7°
0.008 0.009
0.004 0.009
J
M
PLANE
D 16 PL
0°
7°
5.80
0.25
6.20
0.50
0.229 0.244
0.010 0.019
M
S
S
0.25 (0.010)
T
B
A
R
M SUFFIX
PLASTIC SOIC EIAJ PACKAGE
CASE 966–01
ISSUE O
NOTES:
1
DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2
3
CONTROLLING DIMENSION: MILLIMETER.
DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
L
E
16
9
8
Q
1
E H
4
5
TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
E
M
THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
L
1
DETAIL P
Z
D
VIEW P
e
MILLIMETERS
INCHES
A
DIM MIN
MAX
MIN
---
MAX
0.081
0.008
0.020
0.011
0.413
0.215
c
A
---
2.05
A
0.05
0.35
0.18
9.90
5.10
0.20 0.002
0.50 0.014
0.27 0.007
10.50 0.390
5.45 0.201
1
b
c
D
E
e
A
1
b
0.13 (0.005)
1.27 BSC
0.050 BSC
M
0.10 (0.004)
H
7.40
0.50
1.10
0
8.20 0.291
0.85 0.020
1.50 0.043
0.323
0.033
0.059
10
E
L
L
E
M
Q
10
0
0.70
---
0.90 0.028
0.78
0.035
0.031
1
Z
---
MOTOROLA
254
Case Outlines
(continued)
SD SUFFIX
PLASTIC SSOP PACKAGE
CASE 940B–03
NOTES:
6
DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
7
8
CONTROLLING DIMENSION: MILLIMETER.
DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
ISSUE B
16X K REF
M
S
S
0.12 (0.005)
T U
V
0.25 (0.010)
9
DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
N
10 DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION/INTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF K DIMENSION AT MAXIMUM
MATERIAL CONDITION. DAMBAR INTRUSION
SHALL NOT REDUCE DIMENSION K BY MORE
THAN 0.07 (0.002) AT LEAST MATERIAL
CONDITION.
11 TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
12 DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
16
9
L/2
M
N
B
L
F
PIN 1
IDENT
1
8
DETAIL E
K
–U–
A
–V–
MILLIMETERS
DIM MIN MAX
INCHES
J
J1
MIN
MAX
0.249
0.212
0.078
0.008
0.037
A
B
6.07
5.20
1.73
0.05
0.63
6.33 0.238
5.38 0.205
1.99 0.068
0.21 0.002
0.95 0.024
M
S
0.20 (0.008)
T U
K1
C
D
F
SECTION N–N
G
H
J
J1
K
K1
L
0.65 BSC
0.026 BSC
0.73
0.09
0.09
0.25
0.25
7.65
0
0.90 0.028
0.20 0.003
0.16 0.003
0.38 0.010
0.33 0.010
7.90 0.301
0.035
0.008
0.006
0.015
0.013
0.311
8
–W–
C
0.076 (0.003)
SEATING
PLANE
–T–
D
G
M
8
0
DETAIL E
H
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948F–01
NOTES:
1
DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
ISSUE O
2
3
CONTROLLING DIMENSION: MILLIMETER.
DIMENSION A DOES NOT INCLUDE MOLD FLASH.
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
16X KREF
M
S
S
0.10 (0.004)
T U
V
4
5
DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
S
0.15 (0.006) T U
K
K1
16
9
2X L/2
J1
B
–U–
SECTION N–N
6
7
L
J
PIN 1
IDENT.
N
MILLIMETERS
DIM MIN MAX
INCHES
8
1
0.25 (0.010)
MIN
MAX
0.200
0.177
0.047
0.006
0.030
A
B
C
4.90
4.30
–––
5.10 0.193
4.50 0.169
1.20
M
–––
S
0.15 (0.006) T U
D
F
0.05
0.50
0.15 0.002
0.75 0.020
A
N
–V–
G
H
J
J1
K
K1
L
0.65 BSC
0.026 BSC
0.18
0.09
0.09
0.19
0.19
0.28 0.007
0.20 0.004
0.16 0.004
0.30 0.007
0.25 0.007
0.011
0.008
0.006
0.012
0.010
F
DETAIL E
6.40 BSC
0.252 BSC
0
–W–
M
0
8
8
C
0.10 (0.004)
DETAIL E
H
SEATING
PLANE
–T–
D
G
255
MOTOROLA
Case Outlines
DW SUFFIX
PLASTIC SOIC PACKAGE
CASE 751D–04
ISSUE E
-A-
NOTES:
1. DIMENSIONING AND TOLERANCING PER
20
11
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
-B-
P 10 PL
4. MAXIMUM MOLD PROTRUSION 0.150
(0.006) PER SIDE.
M
M
0.010 (0.25)
B
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.13
(0.005) TOTAL IN EXCESS OF D DIMENSION
AT MAXIMUM MATERIAL CONDITION.
1
10
D 20 PL
J
MILLIMETERS
DIM MIN MAX
12.65 12.95 0.499 0.510
INCHES
M
S
S
0.010 (0.25)
T
A
B
MIN MAX
A
B
C
D
F
7.40
2.35
0.35
0.50
7.60 0.292 0.299
2.65 0.093 0.104
0.49 0.014 0.019
0.90 0.020 0.035
F
R X 45°
G
J
K
M
P
1.27 BSC
0.050 BSC
0.32 0.010 0.012
0.25 0.004 0.009
0.25
0.10
0°
C
7°
0°
7°
10.05 10.55 0.395 0.415
0.25 0.75 0.010 0.029
-T-
R
M
SEATING
PLANE
K
G 18 PL
M SUFFIX
PLASTIC SOIC EIAJ PACKAGE
CASE 967–01
NOTES:
ISSUE O
1
DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2
3
CONTROLLING DIMENSION: MILLIMETER.
DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
L
E
20
11
Q
1
4
5
TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
E H
E
M
THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
L
10
1
DETAIL P
Z
D
VIEW P
MILLIMETERS
INCHES
e
A
DIM MIN
MAX
MIN
---
MAX
0.081
0.008
0.020
0.011
0.504
0.215
c
A
---
0.05
0.35
0.18
12.35
5.10
2.05
A
0.20 0.002
0.50 0.014
0.27 0.007
12.80 0.486
5.45 0.201
1
b
c
D
E
e
A
b
1
1.27 BSC
0.050 BSC
M
0.10 (0.004)
0.13 (0.005)
H
7.40
0.50
1.10
0
8.20 0.291
0.85 0.020
1.50 0.043
0.323
0.033
0.059
10
E
L
L
E
M
Q
10
0
0.70
---
0.90 0.028
0.81
0.035
0.032
1
Z
---
MOTOROLA
256
Case Outlines
(continued)
SD SUFFIX
PLASTIC SSOP PACKAGE
CASE 940C–03
ISSUE B
20X K REF
NOTES:
6
M
S
S
DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
0.12 (0.005)
T U
V
0.25 (0.010)
7
8
CONTROLLING DIMENSION: MILLIMETER.
DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
N
20
11
10
L/2
M
9
DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
B
N
L
F
10 DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION/INTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF K DIMENSION AT MAXIMUM
MATERIAL CONDITION. DAMBAR INTRUSION
SHALL NOT REDUCE DIMENSION K BY MORE
THAN 0.07 (0.002) AT LEAST MATERIAL
CONDITION.
PIN 1
IDENT
1
DETAIL E
–U–
A
K
–V–
11 TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
12 DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
M
S
J
0.20 (0.008)
T U
J1
MILLIMETERS
DIM MIN MAX
INCHES
K1
MIN
MAX
0.288
0.212
0.078
0.008
0.037
A
B
C
D
F
7.07
5.20
1.73
0.05
0.63
7.33 0.278
5.38 0.205
1.99 0.068
0.21 0.002
0.95 0.024
SECTION N–N
–W–
C
G
H
J
J1
K
K1
L
0.65 BSC
0.026 BSC
0.076 (0.003)
0.59
0.09
0.09
0.25
0.25
7.65
0
0.75 0.023
0.20 0.003
0.16 0.003
0.38 0.010
0.33 0.010
7.90 0.301
0.030
0.008
0.006
0.015
0.013
0.311
8
SEATING
PLANE
–T–
D
G
DETAIL E
H
M
8
0
257
MOTOROLA
Case Outlines
(continued)
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948E–02
ISSUE A
20X K REF
NOTES:
13 DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
M
S
S
0.10 (0.004)
T U
V
S
0.15 (0.006) T U
14 CONTROLLING DIMENSION: MILLIMETER.
15 DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
16 DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.
17 DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
K
K1
20
11
2X L/2
J J1
B
L
–U–
PIN 1
IDENT
SECTION N–N
1
10
0.25 (0.010)
18 TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
N
S
19 DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
0.15 (0.006) T U
M
A
–V–
MILLIMETERS
DIM MIN MAX
INCHES
MIN
MAX
0.260
0.177
0.047
0.006
0.030
A
B
C
6.40
4.30
–––
6.60 0.252
4.50 0.169
1.20
N
–––
D
F
0.05
0.50
0.15 0.002
0.75 0.020
F
G
H
J
J1
K
K1
L
0.65 BSC
0.026 BSC
DETAIL E
0.27
0.09
0.09
0.19
0.19
0.37
0.011
0.015
0.008
0.006
0.012
0.010
0.20 0.004
0.16 0.004
0.30 0.007
0.25 0.007
–W–
C
6.40 BSC
0.252 BSC
G
D
M
0
8
0
8
H
DETAIL E
0.100 (0.004)
–T– SEATING
PLANE
MOTOROLA
258
Case Outlines
DW SUFFIX
PLASTIC SOIC PACKAGE
CASE 751E–04
ISSUE E
-A-
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
24
13
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
-B-
P 12 PL
M
M
0.010 (0.25)
B
1
12
D 24 PL
MILLIMETERS
INCHES
MIN MAX
J
F
DIM MIN
MAX
M
S
S
0.010 (0.25)
T
A
B
A
B
C
D
F
G
J
K
M
P
15.25 15.54
0.601 0.612
0.292 0.299
0.093 0.104
0.014 0.019
0.016 0.035
0.050 BSC
7.40
2.35
0.35
0.41
7.60
2.65
0.49
0.90
R X 45°
1.27 BSC
0.23
0.13
0°
0.32
0.29
8°
0.009 0.013
0.005 0.011
C
0°
8°
10.05 10.55
0.25 0.75
0.395 0.415
0.010 0.029
-T-
SEATING
PLANE
R
M
K
G 22 PL
SD SUFFIX
PLASTIC SSOP PACKAGE
CASE 940D–03
ISSUE B
NOTES:
24X K REF
20 DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
M
S
S
0.12 (0.005)
T U
V
21 CONTROLLING DIMENSION: MILLIMETER.
22 DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
23 DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
K
J
J1
L/2
24
13
K1
B
L
24 DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION/INTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF K DIMENSION AT MAXIMUM
MATERIAL CONDITION. DAMBAR INTRUSION
SHALL NOT REDUCE DIMENSION K BY MORE
THAN 0.07 (0.002) AT LEAST MATERIAL
CONDITION.
SECTION N–N
PIN 1
IDENT
1
12
0.25 (0.010)
–U–
A
–V–
N
25 TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
26 DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
M
S
0.20 (0.008)
T U
M
N
MILLIMETERS
DIM MIN MAX
INCHES
MIN
MAX
0.328
0.212
0.078
0.008
0.037
F
A
B
8.07
5.20
1.73
0.05
0.63
8.33 0.317
5.38 0.205
1.99 0.068
0.21 0.002
0.95 0.024
DETAIL E
C
D
F
G
H
J
J1
K
K1
L
0.65 BSC
0.026 BSC
0.44
0.09
0.09
0.25
0.25
7.65
0
0.60 0.017
0.20 0.003
0.16 0.003
0.38 0.010
0.33 0.010
7.90 0.301
0.024
0.008
0.006
0.015
0.013
0.311
8
–W–
C
0.076 (0.003)
SEATING
PLANE
–T–
G
D
DETAIL E
H
M
8
0
259
MOTOROLA
Case Outlines
(continued)
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948H–01
ISSUE O
24X KREF
M
S
S
0.10 (0.004)
T U
V
S
0.15 (0.006) T U
NOTES:
1
DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
24
13
2X L/2
2
3
CONTROLLING DIMENSION: MILLIMETER.
DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
B
–U–
L
4
5
PIN 1
IDENT.
12
1
S
0.15 (0.006) T U
A
–V–
6
7
TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
MILLIMETERS
DIM MIN MAX
INCHES
MIN
MAX
0.311
0.177
0.047
0.006
0.030
C
A
B
C
7.70
4.30
–––
7.90 0.303
4.50 0.169
1.20
–––
0.10 (0.004)
D
F
0.05
0.50
0.15 0.002
0.75 0.020
SEATING
PLANE
–T–
G
H
D
G
H
J
J1
K
K1
L
0.65 BSC
0.026 BSC
0.27
0.09
0.09
0.19
0.19
0.37
0.011
0.015
0.008
0.006
0.012
0.010
0.20 0.004
0.16 0.004
0.30 0.007
0.25 0.007
–W–
6.40 BSC
0.252 BSC
M
0
8
0
8
DETAIL E
N
0.25 (0.010)
K
K1
M
N
J1
F
SECTION N–N
DETAIL E
J
MOTOROLA
260
Case Outlines
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 1201–01
ISSUE A
48X K REF
K
K1
NOTES:
M
S
S
0.12 (0.005)
T U
V
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
J
J1
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS OR GATE
BURRS. MOLD FLASH OR GATE BURRS
SHALL NOT EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
48
25
SECTION N–N
B
–U–
L
N
5. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
1
24
6. DIMENSIONS A AND B ARE TO BE
DETERMINED AT DATUM PLANE –W–.
MILLIMETERS
DIM MIN MAX
12.40 12.60 0.488 0.496
INCHES
MIN MAX
A
–V–
PIN 1
IDENT.
A
B
N
6.00
–––
6.20 0.236 0.244
1.10 ––– 0.043
C
M
F
D
F
0.05
0.50
0.15 0.002 0.006
0.75 0.020 0.030
0.25 (0.010)
DETAIL E
G
H
J
J1
K
K1
L
0.50 BSC
0.0197 BSC
0.37
0.09
0.09
0.17
0.17
7.95
0
––– 0.015 –––
0.20 0.004 0.008
0.16 0.004 0.006
0.27 0.007
0.23 0.007 0.009
8.25 0.313 0.325
D
0.011
C
–W–
0.076 (0.003)
M
8
0
8
DETAIL E
–T–
SEATING
PLANE
H
G
261
MOTOROLA
Case Outlines
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 1202–01
ISSUE A
56X K REF
K
K1
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
M
S
S
0.12 (0.005)
T U
V
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS OR GATE
BURRS. MOLD FLASH OR GATE BURRS
SHALL NOT EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL
IN EXCESS OF THE K DIMENSION AT
MAXIMUM MATERIAL CONDITION.
5. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
J
J1
56
29
28
SECTION N–N
B
L
–U–
N
1
6. DIMENSIONS A AND B ARE TO BE
DETERMINED AT DATUM PLANE –W–.
MILLIMETERS
DIM MIN MAX
INCHES
MIN
MAX
0.555
0.244
0.043
0.006
0.030
A
–V–
PIN 1
A
B
C
13.90
6.00
–––
14.10 0.547
6.20 0.236
1.10
IDENT.
N
–––
D
F
0.05
0.50
0.15 0.002
0.75 0.020
F
M
G
H
J
J1
K
K1
L
0.50 BSC
0.0197 BSC
0.12
0.09
0.09
0.17
0.17
7.95
0
––– 0.005
0.20 0.004
0.16 0.004
0.27 0.007
0.23 0.007
8.25 0.313
–––
0.008
0.006
0.011
0.009
0.325
8
0.25 (0.010)
DETAIL E
D
C
–W–
M
8
0
0.076 (0.003)
DETAIL E
–T–
SEATING
PLANE
H
G
MOTOROLA
262
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