MC74LVX245M [ONSEMI]

LOW-VOLTAGE CMOS; 低电压CMOS
MC74LVX245M
型号: MC74LVX245M
厂家: ONSEMI    ONSEMI
描述:

LOW-VOLTAGE CMOS
低电压CMOS

总线驱动器 总线收发器 逻辑集成电路 光电二极管
文件: 总7页 (文件大小:167K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
SEMICONDUCTOR TECHNICAL DATA  
The MC74LVX245 is an advanced high speed CMOS octal bus  
transceiver.  
It is intended for two–way asynchronous communication between data  
buses. The direction of data transmission is determined by the level of the  
T/R input. The output enable pin (OE) can be used to disable the device,  
so that the buses are effectively isolated.  
All inputs are equipped with protection circuits against static discharge.  
LOW–VOLTAGE CMOS  
High Speed: t  
= 4.7ns (Typ) at V  
= 3.3V  
PD  
Low Power Dissipation: I  
CC  
= 4µA (Max) at T = 25°C  
CC  
A
Power Down Protection Provided on Inputs  
Balanced Propagation Delays  
Low Noise: V  
= 0.8V (Max)  
OLP  
DW SUFFIX  
20–LEAD SOIC PACKAGE  
CASE 751D–04  
Pin and Function Compatible with Other Standard Logic Families  
Latchup Performance Exceeds 300mA  
ESD Performance: HBM > 2000V; Machine Model > 200V  
APPLICATION NOTES  
1. Do not force a signal on an I/O pin when it is an active output, damage may  
occur.  
2. All floating (high impedence) input or I/O pins must be fixed by means of  
pull up or pull down resistors or bus terminator ICs.  
DT SUFFIX  
20–LEAD TSSOP PACKAGE  
CASE 948E–02  
3. AparasiticdiodeisformedbetweenthebusandV  
terminals. Therefore,  
the LVX245 cannot be used to interface 5V to 3V systems directly.  
CC  
V
OE  
19  
B0  
18  
B1  
17  
B2  
16  
B3  
15  
B4  
14  
B5  
13  
B6  
12  
B7  
11  
CC  
M SUFFIX  
20–LEAD SOIC EIAJ PACKAGE  
CASE 967–01  
20  
PIN NAMES  
Pins  
Function  
OE  
T/R  
A0–A7  
Output Enable Input  
Transmit/Receive Input  
Side A 3–State Inputs or 3–State  
Outputs  
Side B 3–State Inputs or 3–State  
Outputs  
1
2
3
4
5
6
7
9
8
10  
T/R  
A0  
A1  
A2  
A3  
A4  
A5  
A6  
A7  
GND  
Figure 1. 20–Lead Pinout (Top View)  
B0–B7  
6/97  
Motorola, Inc. 1997  
REV 0  
MC74LVX245  
OE 19  
T/R 1  
2
3
4
5
6
7
8
9
A0  
A1  
A2  
A3  
A4  
A5  
A6  
A7  
18  
17  
16  
15  
14  
13  
12  
11  
B0  
B1  
B2  
B3  
B4  
B5  
B6  
B7  
Figure 2. Logic Diagram  
INPUTS  
OPERATING MODE  
Non–Inverting  
OE  
T/R  
L
L
L
H
X
B Data to A Bus  
A Data to B Bus  
Z
H
H = High Voltage Level; L = Low Voltage Level; Z = High Impedance State; X = High or Low Voltage Level  
and Transitions are Acceptable; For I reasons, Do Not Float Inputs  
CC  
MOTOROLA  
2
MC74LVX245  
MAXIMUM RATINGS*  
Symbol  
Parameter  
Value  
Unit  
V
V
V
V
DC Supply Voltage  
–0.5 to +7.0  
–0.5 to +7.0  
CC  
DC Input Voltage (T/R, OE)  
DC Output Voltage  
V
in  
–0.5 to V  
+0.5  
V
I/O  
CC  
I
I
I
I
Input Diode Current  
–20  
mA  
mA  
mA  
mA  
mW  
C
IK  
Output Diode Current  
DC Output Current, per Pin  
±20  
±25  
OK  
out  
CC  
DC Supply Current, V  
Power Dissipation  
and GND Pins  
±75  
CC  
P
180  
D
T
Storage Temperature  
–65 to +150  
stg  
* Absolute maximum continuous ratings are those values beyond which damage to the device may occur. Exposure to these conditions or  
conditions beyond those indicated may adversely affect device reliability. Functional operation under absolute–maximum–rated conditions is  
not implied.  
RECOMMENDED OPERATING CONDITIONS  
Symbol  
Parameter  
Min  
2.0  
0
Max  
3.6  
Unit  
V
V
CC  
DC Supply Voltage  
V
V
DC Input Voltage (T/R, OE)  
DC Output Voltage  
5.5  
V
in  
0
V
CC  
V
I/O  
T
Operating Temperature, All Package Types  
Input Rise and Fall Time  
–40  
0
+85  
100  
C
A
t/V  
ns/V  
DC ELECTRICAL CHARACTERISTICS  
T
A
= 25°C  
T = – 40 to 85°C  
A
V
CC  
V
Symbol  
Parameter  
Test Conditions  
Unit  
Min  
Typ  
Max  
Min  
Max  
V
IH  
High–Level Input Voltage  
2.0  
3.0  
3.6  
1.5  
2.0  
2.4  
1.5  
2.0  
2.4  
V
V
V
V
Low–Level Input Voltage  
2.0  
3.0  
3.6  
0.5  
0.8  
0.8  
0.5  
0.8  
0.8  
V
V
V
IL  
High–Level Output Voltage  
I
I
I
= –50µA  
= –50µA  
= –4mA  
2.0  
3.0  
3.0  
1.9  
2.9  
2.58  
2.0  
3.0  
1.9  
2.9  
2.48  
OH  
OL  
OH  
OH  
OH  
(V = V or V  
in IH  
)
IL  
Low–Level Output Voltage  
I
I
I
= 50µA  
= 50µA  
= 4mA  
2.0  
3.0  
3.0  
0.0  
0.0  
0.1  
0.1  
0.36  
0.1  
0.1  
0.44  
OL  
OL  
OL  
(V = V or V  
in IH  
)
IL  
I
I
I
Input Leakage Current  
V
= 5.5V or GND  
3.6  
3.6  
3.6  
±0.1  
±0.25  
4.0  
±1.0  
±2.5  
40.0  
µA  
µA  
µA  
in  
in  
(T/R, OE)  
Maximum Three–State  
Leakage Current  
V
= V or V  
OZ  
CC  
in  
IL  
= V  
IH  
or GND  
V
out  
CC  
or GND  
Quiescent Supply Current  
V
in  
= V  
CC  
3
MOTOROLA  
MC74LVX245  
AC ELECTRICAL CHARACTERISTICS (Input t = t = 3.0ns)  
r
f
T
A
= 25°C  
T = – 40 to 85°C  
A
Symbol  
Parameter  
Test Conditions  
Unit  
Min  
Typ  
Max  
Min  
Max  
t
t
,
Propagation Delay  
Input to Output  
V
V
V
= 2.7V  
C
C
= 15pF  
= 50pF  
6.1  
8.6  
10.7  
14.2  
1.0  
1.0  
13.5  
17.0  
ns  
PLH  
PHL  
CC  
CC  
CC  
L
L
= 3.3 ± 0.3V  
= 2.7V  
C
C
= 15pF  
= 50pF  
4.7  
7.2  
6.6  
10.1  
1.0  
1.0  
8.0  
11.5  
L
L
t
t
,
Output Enable Time to  
High and Low Level  
C
C
= 15pF  
= 50pF  
9.0  
11.5  
16.9  
20.4  
1.0  
1.0  
20.5  
24.0  
ns  
ns  
ns  
PZL  
PZH  
L
L
R
= 1kΩ  
L
V
R
= 3.3 ± 0.3V  
= 1kΩ  
C
C
= 15pF  
= 50pF  
7.1  
9.6  
11.0  
14.5  
1.0  
1.0  
13.0  
16.5  
CC  
L
L
L
t
t
,
Output Disable Time From  
High and Low Level  
V
R
= 2.7V  
= 1kΩ  
C
= 50pF  
11.5  
18.0  
1.0  
21.0  
PLZ  
PHZ  
CC  
L
L
V
R
= 3.3 ± 0.3V  
= 1kΩ  
C
= 50pF  
9.6  
12.8  
1.0  
14.5  
CC  
L
L
t
t
Output–to–Output Skew  
(Note 1.)  
V
CC  
V
CC  
= 2.7V  
= 3.3 ±0.3V  
C
C
= 50pF  
= 50pF  
1.5  
1.5  
1.5  
1.5  
OSHL  
OSLH  
L
L
1. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device.  
The specification applies to any outputs switching in the same direction, either HIGH–to–LOW (t  
guaranteed by design.  
) or LOW–to–HIGH (t  
OSHL  
); parameter  
OSLH  
CAPACITIVE CHARACTERISTICS  
T
A
= 25°C  
T = – 40 to 85°C  
A
Symbol  
Parameter  
Input Capacitance (T/R, OE)  
Unit  
pF  
Min  
Typ  
4
Max  
Min  
Max  
C
10  
10  
in  
C
C
Maximum Three–State I/O Capacitance  
Power Dissipation Capacitance (Note 2.)  
8
pF  
I/O  
PD  
21  
pF  
2. C  
is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.  
PD  
Averageoperatingcurrentcanbeobtainedbytheequation:I  
=C  
V
f
+I  
/8(perbit).C isusedtodeterminetheno–load  
CC(OPR)  
PD CC in CC  
PD  
2
dynamic power consumption; P = C  
V
f
+ I  
in CC  
V
CC  
.
D
PD  
CC  
NOISE CHARACTERISTICS (Input t = t = 3.0ns, C = 50pF, V  
= 3.3V, Measured in SOIC Package)  
r
f
L
CC  
T
A
= 25°C  
Symbol  
Characteristic  
Unit  
V
Typ  
Max  
V
OLP  
Quiet Output Maximum Dynamic V  
0.5  
0.8  
–0.8  
2.0  
OL  
V
OLV  
Quiet Output Minimum Dynamic V  
–0.5  
V
OL  
V
IHD  
Minimum High Level Dynamic Input Voltage  
Maximum Low Level Dynamic Input Voltage  
V
V
ILD  
0.8  
V
MOTOROLA  
4
MC74LVX245  
SWITCHING WAVEFORMS  
V
CC  
T/R  
50%  
GND  
V
CC  
V
Input  
CC  
50% V  
OE  
50% V  
CC  
CC  
t
50%  
A or B  
GND  
t
GND  
PZL  
PLZ  
HIGH  
t
t
PHL  
PLH  
IMPEDANCE  
50% V  
Output  
B or A  
CC  
A or B  
A or B  
50% V  
CC  
V
+0.3V  
OL  
t
t
PHZ  
PZH  
V
–0.3V  
OH  
50% V  
CC  
HIGH  
IMPEDANCE  
Figure 3.  
Figure 4.  
TEST CIRCUITS  
TEST POINT  
TEST POINT  
1 k  
OUTPUT  
CONNECT TO V  
WHEN  
.
PZL  
CC  
AND t  
OUTPUT  
TESTING t  
PLZ  
CONNECT TO GND WHEN  
TESTING t AND t  
DEVICE  
UNDER  
TEST  
DEVICE  
UNDER  
TEST  
.
PZH  
PHZ  
C *  
C *  
L
L
* Includes all probe and jig capacitance  
* Includes all probe and jig capacitance  
Figure 5. Propagation Delay Test Circuit  
Figure 6. Three–State Test Circuit  
5
MOTOROLA  
MC74LVX245  
OUTLINE DIMENSIONS  
DW SUFFIX  
PLASTIC SOIC PACKAGE  
CASE 751D–04  
ISSUE E  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER  
–A–  
ANSI Y14.5M, 1982.  
20  
11  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSIONS A AND B DO NOT INCLUDE  
MOLD PROTRUSION.  
4. MAXIMUM MOLD PROTRUSION 0.150  
(0.006) PER SIDE.  
10X P  
–B–  
5. DIMENSION D DOES NOT INCLUDE  
DAMBAR PROTRUSION. ALLOWABLE  
DAMBAR PROTRUSION SHALL BE 0.13  
(0.005) TOTAL IN EXCESS OF D DIMENSION  
AT MAXIMUM MATERIAL CONDITION.  
M
M
0.010 (0.25)  
B
1
10  
MILLIMETERS  
INCHES  
20X D  
0.010 (0.25)  
DIM  
A
B
C
D
MIN  
12.65  
7.40  
2.35  
0.35  
0.50  
MAX  
12.95  
7.60  
2.65  
0.49  
0.90  
MIN  
MAX  
0.510  
0.299  
0.104  
0.019  
0.035  
J
0.499  
0.292  
0.093  
0.014  
0.020  
M
S
S
T
A
B
F
F
G
J
K
M
P
R
1.27 BSC  
0.050 BSC  
0.25  
0.10  
0
0.32  
0.25  
7
0.010  
0.004  
0
0.012  
0.009  
7
R X 45  
10.05  
0.25  
10.55  
0.75  
0.395  
0.010  
0.415  
0.029  
C
SEATING  
PLANE  
–T–  
M
18X G  
K
DT SUFFIX  
PLASTIC TSSOP PACKAGE  
CASE 948E–02  
ISSUE A  
20X K REF  
0.10 (0.004)  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
M
S
S
T
U
V
S
0.15 (0.006)  
T U  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,  
PROTRUSIONS OR GATE BURRS. MOLD FLASH  
OR GATE BURRS SHALL NOT EXCEED 0.15  
(0.006) PER SIDE.  
4. DIMENSION B DOES NOT INCLUDE INTERLEAD  
FLASH OR PROTRUSION. INTERLEAD FLASH OR  
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)  
PER SIDE.  
5. DIMENSION K DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE DAMBAR  
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN  
EXCESS OF THE K DIMENSION AT MAXIMUM  
MATERIAL CONDITION.  
6. TERMINAL NUMBERS ARE SHOWN FOR  
REFERENCE ONLY.  
K
K1  
20  
11  
2X L/2  
J J1  
B
L
–U–  
PIN 1  
IDENT  
SECTION N–N  
1
10  
0.25 (0.010)  
N
S
7. DIMENSION A AND B ARE TO BE DETERMINED  
AT DATUM PLANE –W–.  
0.15 (0.006)  
T U  
M
A
MILLIMETERS  
INCHES  
DIM  
A
B
C
D
MIN  
6.40  
4.30  
–––  
0.05  
0.50  
MAX  
6.60  
4.50  
1.20  
0.15  
0.75  
MIN  
MAX  
0.260  
0.177  
0.047  
0.006  
0.030  
–V–  
0.252  
0.169  
–––  
0.002  
0.020  
N
F
F
G
H
J
J1  
K
K1  
L
0.65 BSC  
0.026 BSC  
DETAIL E  
0.27  
0.09  
0.09  
0.19  
0.19  
0.37  
0.20  
0.16  
0.30  
0.25  
0.011  
0.004  
0.004  
0.007  
0.007  
0.015  
0.008  
0.006  
0.012  
0.010  
–W–  
C
6.40 BSC  
0.252 BSC  
G
D
M
0
8
0
8
H
DETAIL E  
0.100 (0.004)  
–T– SEATING  
PLANE  
MOTOROLA  
6
MC74LVX245  
OUTLINE DIMENSIONS  
M SUFFIX  
PLASTIC SOIC EIAJ PACKAGE  
CASE 967–01  
ISSUE O  
NOTES:  
1
DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2
3
CONTROLLING DIMENSION: MILLIMETER.  
DIMENSIONS D AND E DO NOT INCLUDE MOLD  
FLASH OR PROTRUSIONS AND ARE MEASURED  
AT THE PARTING LINE. MOLD FLASH OR  
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)  
PER SIDE.  
L
E
20  
11  
Q
1
4
5
TERMINAL NUMBERS ARE SHOWN FOR  
REFERENCE ONLY.  
H
E
E
M
THE LEAD WIDTH DIMENSION (b) DOES NOT  
INCLUDE DAMBAR PROTRUSION. ALLOWABLE  
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)  
TOTAL IN EXCESS OF THE LEAD WIDTH  
DIMENSION AT MAXIMUM MATERIAL CONDITION.  
DAMBAR CANNOT BE LOCATED ON THE LOWER  
RADIUS OR THE FOOT. MINIMUM SPACE  
BETWEEN PROTRUSIONS AND ADJACENT LEAD  
TO BE 0.46 ( 0.018).  
L
1
10  
DETAIL P  
Z
D
VIEW P  
MILLIMETERS  
INCHES  
e
A
DIM  
A
1
b
c
D
E
e
MIN  
–––  
MAX  
2.05  
0.20  
0.50  
0.27  
12.80  
5.45  
MIN  
MAX  
0.081  
0.008  
0.020  
0.011  
0.504  
0.215  
c
–––  
0.002  
0.014  
0.007  
0.486  
0.201  
A
0.05  
0.35  
0.18  
12.35  
5.10  
A
b
1
1.27 BSC  
0.050 BSC  
M
0.10 (0.004)  
0.13 (0.005)  
H
7.40  
0.50  
1.10  
0
8.20  
0.85  
1.50  
10  
0.291  
0.020  
0.043  
0
0.323  
0.033  
0.059  
10  
E
L
L
M
E
Q
Z
0.70  
–––  
0.90  
0.81  
0.028  
–––  
0.035  
0.032  
1
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding  
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and  
specificallydisclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola  
datasheetsand/orspecificationscananddovaryindifferentapplicationsandactualperformancemayvaryovertime. Alloperatingparameters,includingTypicals”  
must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of  
others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other  
applicationsintended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury  
ordeathmayoccur. ShouldBuyerpurchaseoruseMotorolaproductsforanysuchunintendedorunauthorizedapplication,BuyershallindemnifyandholdMotorola  
and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees  
arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that  
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Opportunity/Affirmative Action Employer.  
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MC74LVX245/D  

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