NB3L02 [ONSEMI]
2.8 V, High Precision 1:2 Clock Fanout Buffer; 2.8 V ，精度高1 ： 2时钟扇出缓冲器
| 型号： | NB3L02 |
| 厂家： | 
ONSEMI |
| 描述： | 2.8 V, High Precision 1:2 Clock Fanout Buffer |
| 文件： | 总4页 (文件大小：200K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
NB3L02
2.8 V, High Precision 1:2
Clock Fanout Buffer
Description
The NB3L02 is a low−skew, low jitter 1:2 clock fanout buffer, ideal
for use in portable end−equipment, such as mobile phones or tablet
applications. The MCLK_IN pin has an integrated AC coupling
capacitor and will directly accept a square or sine wave clock input,
such as a temperature compensated crystal oscillator (TCXO). The
minimum acceptable input amplitude of the sine wave is 800 mV
peak−to−peak. The NB3L02 is offered in a 0.4 mm pitch 6−ball,
wafer−level chip−scale package (WLCSP) (0.77 mm x 1.17 mm).
http://onsemi.com
WLCSP6
FC SUFFIX
CASE 567HJ
Features
• 800 mV Single Ended Outputs
MARKING DIAGRAM
• Low Phase Noise: −144 dbc/Hz @ 10 kHz Offset
• Ultra Small Package: 0.4 mm Pitch WLCSP6 (0.77 mm x 1.17 mm)
• Exceeds JEDEC ESD Standards: 4000 V HBM, 200 V MM
• Industrial Temperature Range: −40°C to +85°C
• These are Pb−Free Devices
L2MG
L2 = Specific Device Code
M
G
= Date Code
= Pb−Free Package
PIN DESCRIPTIONS
PINOUT DIAGRAM
Ball No.
A1
Name
I/O
I
Description
Power Supply Voltage
Clock Output 1
Master Clock Input
Ground
V
DD
A2
CLK_OUT1
MCLK_IN
GND
O
I
B1
B2
−
C1
GND
−
Ground
C2
CLK_OUT2
O
Clock Output 2
Figure 1. Simplified Block Diagram
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 3 of this data sheet.
© Semiconductor Components Industries, LLC, 2013
1
Publication Order Number:
June, 2013 − Rev. 0
NB3L02/D
NB3L02
Table 1. MAXIMUM RATINGS
Symbol
Parameter
Condition
Min
Max
+ 0.3
Unit
Voltage Range (Note 1)
MCLK_IN,CLK_OUT1,
CLK_OUT2
-0.3
V
V
DD
IO
Continuous Output Current
CLK_OUT1/2
20
150
150
mA
°C
T
J
Operating Junction Temperature Range
Storage Temperature Range
−40
−55
T
stg
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. All voltage values are with respect to network ground terminal.
Table 2. ATTRIBUTES
Characteristic
Value
ESD Protection
Human Body Model
Machine Model
WLCSP6
>4 kV
>200 V
Moisture Sensitivity
Level 1
Maximum Soldering Temperature for Lead−free Devices Using a Lead−free Solder Paste
Flammability Rating Oxygen Index: 28 to 34
260
UL 94 V−0 @ 0.125 in
149
Transistor Count
Meets or Exceeds JEDEC Spec EIA/JESD78 IC Latchup Test II
Table 3. ELECTRICAL CHARACTERISTICS (T = −40°C to +85°C)
A
Symbol
Characteristic
Min
2.3
Typ
Max
Unit
V
V
DD
Supply Voltage
2.8
3.465
V
Input Voltage p-p
800
0.6
V
mV
V
IN
DD
V
Output Voltage p-p
Dynamic Current at 26 MHz
0.8
3.5
26
1.0
5
OUT
DDdynamic
I
mA
MHz
ns
F
IN
MCLK_IN Frequency Range with 800 mV input p−p
MCLK_IN to CLK_OUT_n Propagation Delay, input = 1 Vp−p @ 26 MHz
CLK_OUT_n Duty Cycle
10
2.0
45
52
6.5
55
t
4.0
50
PD
DC
%
−
Phase Noise, F = 26 MHz, input t /t < 1 ns
1 kHz Offset
10 kHz Offset
100 kHz Offset
−134
−144
−148
dbc/Hz
dbc/Hz
dbc/Hz
IN
r f
t /t
Output Rise Time 20%-80% with 10 pF Load,
= 800 mVp−p, 26 MHz, input slew rate < 1 ns/V
0.5
0.6
0.8
1.2
ns
r
f
V
IN
t
sk
Channel to Channel Skew
High Level Output (V −V not to exceed V )
OUT
10
0.8
0
30
ps
V
V
oh
1.0
oh ol
V
ol
Low Level Output (V −V not to exceed V )
OUT
V
oh ol
http://onsemi.com
2
NB3L02
Figure 2. Typical Phase Noise
ORDERING INFORMATION
Device
†
Package
Shipping
NB3L02FCT2G
WLCSP6
(Pb−Free)
3000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
http://onsemi.com
3
NB3L02
PACKAGE DIMENSIONS
WLCSP6, 1.17x0.77
CASE 567HJ
ISSUE O
NOTES:
A B
E
D
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
PIN A1
REFERENCE
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
MILLIMETERS
2X
0.10
0.10
C
C
DIM
A
A1
b
D
E
e
MIN
−−−
0.13
0.21
0.77 BSC
1.17 BSC
0.40 BSC
MAX
0.50
0.17
0.25
2X
6X
TOP VIEW
0.10
0.05
C
C
A
RECOMMENDED
SOLDERING FOOTPRINT*
A1
SEATING
PLANE
C
NOTE 3
SIDE VIEW
PACKAGE
OUTLINE
0.40
PITCH
e/2
6X
b
e
0.05
0.03
C
C
A B
C
B
A
6X
A1
e
0.23
0.40
PITCH
1
2
DIMENSIONS: MILLIMETERS
BOTTOM VIEW
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
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NB3L02/D
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