NCP346SN1T1G

更新时间:2024-09-18 02:00:56
品牌:ONSEMI
描述:Overvoltage Protection IC

NCP346SN1T1G 概述

Overvoltage Protection IC 过压保护IC

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NCP346  
Overvoltage Protection IC  
The NCP346 Overvoltage Protection circuit (OVP) protects  
sensitive electronic circuitry from overvoltage transients and power  
supply faults when used in conjunction with an external Pchannel  
FET. The device is designed to sense an overvoltage condition and  
quickly disconnect the input voltage supply from the load before any  
damage can occur. The OVP consists of a precise voltage reference, a  
comparator with hysteresis, control logic, and a MOSFET gate driver.  
The OVP is designed on a robust BiCMOS process and is intended to  
withstand voltage transients up to 30 V.  
The device is optimized for applications that have an external  
AC/DC adapter or car accessory charger to power the product and/or  
recharge the internal batteries. The nominal overvoltage thresholds are  
4.45 and 5.5 V and can be adjusted upward with a resistor divider  
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THIN SOT235  
SN SUFFIX  
CASE 483  
5
1
PIN CONNECTIONS &  
MARKING DIAGRAM  
between the V , IN, and GND pins. It is suitable for single cell  
CC  
LiIon applications as well as 3/4 cell NiCD/NiMH applications.  
OUT  
V
CC  
1
2
3
5
Features  
GND  
Overvoltage TurnOff Time of Less Than 1.0 msec  
Accurate Voltage Threshold of 4.45 V and 5.5 V (Nominal)  
CNTRL Input Compatible with 1.8 V Logic Levels  
These are PbFree Devices  
4
CNTRL  
IN  
(Top View)  
xxx = SQZ for NCP346SN1  
xxx = SRD for NCP346SN2  
Typical Applications  
Y
= Year  
W
= Work Week  
Cellular Phones  
Digital Cameras  
ORDERING INFORMATION  
Portable Computers and PDAs  
Portable CD and other Consumer Electronics  
Device  
Package  
Shipping  
NCP346SN1T1G  
NCP346SN2T1G  
SOT235 3000 / Tape & Reel  
(PbFree) (7 inch Reel)  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
Schottky  
Diode  
PCH  
AC/DC Adapter or  
Accessory Charger  
(optional)  
IN  
V
CC  
+
+
C1  
LOAD  
FET  
Driver  
(optional)  
Logic  
OUT  
V
ref  
NCP346  
GND  
CNTRL  
Microprocessor port  
Note: This device contains 89 active transistors  
Figure 1. Simplified Application Diagram  
Semiconductor Components Industries, LLC, 2004  
1
Publication Order Number:  
December, 2004 Rev. 4  
NCP346/D  
 
NCP346  
V
CC  
(5)  
IN  
(4)  
V
CC  
V5  
Preregulator  
R1  
R2  
OUT  
(1)  
V
CC  
+
LOGIC  
BLOCK  
ON/OFF OUT  
DRIVER  
COMP  
Bandgap  
Reference  
CNTRL  
(3)  
GND  
(2)  
Figure 2. Detailed Block Diagram  
PIN FUNCTION DESCRIPTIONS  
Pin #  
Symbol  
Pin Description  
1
OUT  
This signal drives the gate of a Pchannel MOSFET. It is controlled by the voltage level on IN or the logic state of  
the CNTRL input. When an overvoltage event is detected, the OUT pin is driven to within 1.0 V of V in less  
CC  
than 1.0 msec provided that gate and stray capacitance is less than 12 nF.  
2
3
GND  
Circuit Ground  
CNTRL  
This logic signal is used to control the state of OUT and turnon/off the Pchannel MOSFET. A logic High results  
in the OUT signal being driven to within 1.0 V of V which disconnects the FET. The input is tied Low via an  
CC  
internal 50 kW pulldown resistor. It is recommended that the input be connected to GND if it is not used.  
4
5
IN  
This pin senses an external voltage point. If the voltage on this input rises above the overvoltage threshold (V ),  
th  
the OUT pin will be driven to within 1.0 V of V , thus disconnecting the FET. The nominal threshold level can be  
CC  
increased with the addition of an external resistor divider between IN, V , and GND.  
CC  
V
Positive Voltage supply. OUT is guaranteed to be in low state (MOSFET ON) as long as V remains above  
CC  
CC  
2.5 V, and below the overvoltage threshold.  
TRUTH TABLE  
IN  
CNTRL  
OUT  
<V  
<V  
>V  
>V  
L
H
L
GND  
th  
th  
th  
th  
V
V
V
CC  
CC  
CC  
H
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2
NCP346  
MAXIMUM RATINGS (T = 25°C unless otherwise noted.)  
A
Rating  
OUT Voltage to GND  
Pin  
Symbol  
Min  
Max  
Unit  
V
1
V
0.3  
30  
O
Input and CNTRL Pin Voltage to GND  
4
3
V
0.3  
0.3  
30  
13  
V
input  
V
CNTRL  
Input Pin Voltage to V  
4, 5  
5
V(V  
IN)  
CC,  
0.3  
0.3  
15  
30  
V
V
CC  
V
Maximum Range  
V
CC(max)  
CC  
Maximum Power Dissipation at T = 85°C  
P
0.216  
300  
150  
85  
W
A
D
Thermal Resistance, JunctiontoAir  
Junction Temperature  
R
°C/W  
°C  
°C  
V
q
JA  
T
J
Operating Ambient Temperature  
T
A
40  
0
V
Operating Voltage  
3
5.0  
CNTRL  
Storage Temperature Range  
T
stg  
65  
150  
°C  
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit  
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,  
damage may occur and reliability may be affected.  
ATTRIBUTES  
Characteristic  
Value  
ESD Protection  
Human Body Model (HBM) per JEDEC Standard JESD22A114  
Machine Model (MM) per JEDEC Standard JESD22A114  
v 2.5 kV  
v 250 V  
Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1)  
Transistor Count  
Level 1  
89  
Latchup Current Maximum Rating per JEDEC Standard EIA/JESD78  
1. For additional Moisture Sensitivity information, refer to Application Note AND8003/D.  
v 150 mA  
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3
 
NCP346  
ELECTRICAL CHARACTERISTICS (NCP346SN1T1)  
(For typical values T = 25°C, for min/max values T = 40°C to +85°C unless otherwise noted.)  
A
A
Characteristic  
Operating Voltage Range  
Pin  
5
Symbol  
Min  
2.5  
Typ  
Max  
25  
Unit  
V
V
V
CC(opt)  
CC  
Total Supply Current (IN Connected to V ; ON Mode, V = 4.0 V,  
4,5  
I
650  
1200  
mA  
CC  
CC  
cc on  
CNTRL Pin Floating, Steady State)  
Total Supply Current (IN Connected to V ; OFF Mode Driven by  
4,5  
4,5  
I
700  
750  
1200  
1200  
mA  
mA  
CC  
cc off  
CNTRL  
CNTRL Pin, V = 4.0 V, V  
= 1.5 V, Steady State)  
CC  
CNTRL  
Total Supply Current (IN Connected to V ; OFF Mode Driven by  
I
IN  
CC  
cc off  
Overvoltage, V = 5.0 V, CNTRL Pin Floating, Steady State)  
CC  
Input Threshold (IN Connected to V ; V Increasing)  
4
4
4
4
3
3
3
3
1
V
V
(LH)  
(HL)  
4.3  
4.3  
4.45  
4.4  
50  
55  
4.6  
4.6  
V
V
CC  
CC  
th  
Input Threshold (IN Connected to V ; V Decreasing)  
CC  
CC  
th  
Input Hysteresis (IN Connected to V  
)
CC  
V
mV  
kW  
V
hyst  
Input Impedance of IN Pin  
CNTRL Voltage High  
CNTRL Voltage Low  
R
in  
30  
1.5  
85  
V
IH  
V
0.5  
200  
20  
V
IL  
CNTRL Current High (V = 5.0 V)  
I
90  
9.0  
mA  
mA  
V
ih  
IH  
CNTRL Current Low (V = 0.5 V)  
I
il  
IL  
Output Voltage High (IN Connected to V , V = 5.0 V)  
V
oh  
CC  
CC  
V
1.0  
I
I
I
= 10 mA  
= 0.25 mA  
= 0 mA  
CC  
CC  
CC  
source  
source  
source  
V
0.25  
V
0.1  
Output Voltage Low (IN Connected to V , V = 4.0 V, CNTRL Pin  
1
V
ol  
0.1  
V
CC  
CC  
Floating)  
= 0 mA  
I
sink  
Output Sink Current (IN Connected to V , V = 4.0 V, CNTRL Pin  
1
1
1
1
I
sink  
4.0  
10  
1.8  
0.6  
0.5  
16  
3.5  
1.0  
1.0  
mA  
CC  
CC  
Floating, V  
= 1.0 V)  
OUT  
Turn ON Delay – Input (IN Connected to V ; V Steps Down from  
t
IN  
msec  
msec  
msec  
CC  
CC  
on  
off  
5.0 V to 4.0 V, C  
= 12 nF, Measured to V < 1.0 V)  
load  
out  
Turn OFF Delay – Input (IN Connected to V ; V Steps Up from  
t
IN  
CC  
CC  
4.0 V to 5.0 V, C  
= 12 nF, Measured to V > V 1.0 V)  
OUT CC  
load  
Turn OFF Delay – CNTRL (IN Connected to V ; V = 4.0 V, V  
t
off  
CNTRL  
CC  
CC  
CNTRL  
Steps from 0.5 V to 2.0 V, C  
1.0 V)  
= 12 nF, Measured to V  
> V  
load  
OUT  
CC  
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4
NCP346  
ELECTRICAL CHARACTERISTICS (NCP346SN2T1)  
(For typical values T = 25°C, for min/max values T = 40°C to +85°C unless otherwise noted.)  
A
A
Characteristic  
Operating Voltage Range  
Pin  
5
Symbol  
Min  
2.5  
Typ  
Max  
25  
Unit  
V
V
V
CC(opt)  
CC  
Total Supply Current (IN Connected to V ; ON Mode, V = 5.0 V,  
4, 5  
I
650  
1200  
mA  
CC  
CC  
cc on  
CNTRL Pin Floating, Steady State)  
Total Supply Current (IN Connected to V ; OFF Mode Driven by  
4, 5  
4, 5  
I
700  
750  
1200  
1200  
mA  
mA  
CC  
cc off  
CNTRL  
CNTRL Pin, V = 5.0 V, V  
= 1.5 V, Steady State)  
CC  
CNTRL  
Total Supply Current (IN Connected to V ; OFF Mode Driven by  
I
IN  
CC  
cc off  
Overvoltage, V = 6.0 V, CNTRL Pin Floating, Steady State)  
CC  
Input Threshold (IN Connected to V ; V Increasing)  
4
4
4
4
3
3
3
3
1
V
V
(LH)  
(HL)  
5.3  
5.3  
5.5  
5.45  
50  
60  
5.7  
5.7  
V
V
CC  
CC  
th  
Input Threshold (IN Connected to V ; V Decreasing)  
CC  
CC  
th  
Input Hysteresis (IN Connected to V  
)
CC  
V
mV  
kW  
V
hyst  
Input Impedance of IN Pin  
CNTRL Voltage High  
CNTRL Voltage Low  
R
in  
30  
1.5  
100  
V
IH  
V
0.5  
200  
20  
V
IL  
CNTRL Current High (V = 5.0 V)  
I
95  
9.0  
mA  
mA  
V
ih  
IH  
CNTRL Current Low (V = 0.5 V)  
I
il  
IL  
Output Voltage High (IN Connected to V , V = 6.0 V)  
V
oh  
CC  
CC  
V
1.0  
I
I
I
= 10 mA  
= 0.25 mA  
= 0 mA  
CC  
CC  
CC  
source  
source  
source  
V
0.25  
V
0.1  
Output Voltage Low (IN Connected to V , V = 5.0 V, CNTRL Pin  
1
V
ol  
0.1  
V
CC  
CC  
Floating)  
= 0 mA  
I
sink  
Output Sink Current (IN Connected to V , V = 5.0 V, CNTRL Pin  
1
1
1
1
I
sink  
4.0  
10  
1.8  
0.5  
0.6  
16  
4.5  
1.0  
1.0  
mA  
CC  
CC  
Floating, V  
= 1.0 V)  
OUT  
Turn ON Delay – Input (IN Connected to V ; V Steps Down from  
t
IN  
msec  
msec  
msec  
CC  
CC  
on  
off  
6.0 V to 5.0 V, C  
= 12 nF, Measured to V < 1.0 V)  
load  
out  
Turn OFF Delay – Input (IN Connected to V ; V Steps Up from  
t
IN  
CC  
CC  
5.0 V to 6.0 V, C  
= 12 nF, Measured to V > V 1.0 V)  
OUT CC  
load  
Turn OFF Delay – CNTRL (V  
Steps Up from 0.5 V to 2.0 V, V  
t
off  
ICNTRL  
CNTRL  
CC  
= 5.0 V, C  
= 12 nF, Measured to V  
> V 1.0 V)  
OUT CC  
load  
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5
NCP346  
APPLICATION INFORMATION  
NHTS4101PT1 MBRM130LT1  
Schottky  
Diode  
PCH  
AC/DC Adapter or  
Accessory Charger  
(optional)  
IN  
V
CC  
+
Zener  
Diode  
(optional)  
Zener  
+
C1  
LOAD  
FET  
Driver  
(opt.)  
Logic  
Diode  
OUT  
(optional)  
V
ref  
NCP346  
GND  
CNTRL  
Microprocessor  
port  
Figure 3.  
Introduction  
dV/dT rise that occurs during the brief time it takes to  
turnoff the MOSFET. For battery powered applications, a  
lowforward voltage Schottky diode such as the  
MBRM120LT3 can be placed in series with the MOSFET to  
block the body diode of the MOSFET and prevent shorting  
the battery out if the input is accidentally shorted to ground.  
This provides additional voltage margin at the load since  
there is a small forward drop across this diode that reduces  
the voltage at the load.  
When the protection circuit turns off the MOSFET, there  
can be a sudden rise in the input voltage of the device. This  
transient can be quite large depending on the impedance of  
the supply and the current being drawn from the supply at the  
time of an overvoltage event. This inductive spike can be  
clamped with a Zener diode from IN to ground. This diode  
breakdown voltage should be well above the worst case  
supply voltage provided from the AC/DC adapter or  
Cigarette Lighter Adapter (CLA), since the Zener is only  
intended to clamp the transient. The NCP346 is designed so  
In many electronic products, an external AC/DC wall  
adapter is used to convert the AC line voltage into a  
regulated DC voltage or a current limited source. Line  
surges or faults in the adapter may result in overvoltage  
events that can damage sensitive electronic components  
within the product. This is becoming more critical as the  
operating voltages of many integrated circuits have been  
lowered due to advances in submicron silicon lithography.  
In addition, portable products with removable battery packs  
pose special problems since the pack can be removed at any  
time. If the user removes a pack in the middle of charging,  
a large transient voltage spike can occur which can damage  
the product. Finally, damage can result if the user plugs in  
the wrong adapter into the charging jack. The challenge of  
the product designer is to improve the robustness of the  
design and avoid situations where the product can be  
damaged due to unexpected, but unfortunately, likely events  
that will occur as the product is used.  
that the IN and V pin can safely protect up to 25 V and  
CC  
Circuit Overview  
withstand transients to 30 V. Since these spikes can be very  
narrow in duration, it is important to use a high bandwidth  
probe and oscilloscope when prototyping the product to  
verify the operation of the circuit under all the transient  
conditions. A similar problem can result due to contact  
bounce as the DC source is plugged into the product.  
For portable products it is normal to have a capacitor to  
ground in parallel with the battery. If the product has a  
battery pack that is easily removable during charging, this  
scenario should be analyzed. Under that situation, the  
charging current will go into the capacitor and the voltage  
may rise rapidly depending on the capacitor value, the  
charging current and the power supply response time.  
To address these problems, the protection system above  
has been developed consisting of the NCP346 Overvoltage  
Protection IC and a Pchannel MOSFET switch such as the  
MGSF3441. The NCP346 monitors the input voltage and  
will not turn on the MOSFET unless the input voltage is  
within a safe operating window that has an upper limit of the  
overvoltage detection threshold. A Zener diode can be  
placed in parallel to the load to provide for secondary  
protection during the brief time that it takes for the NCP346  
to detect the overvoltage fault and disconnect the MOSFET.  
The decision to use this secondary diode is a function of the  
charging currents expected, load capacitance across the  
battery, and the desired protection voltage by analyzing the  
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6
 
NCP346  
Normal Operation  
which equates to:  
Figure 1 illustrates a typical configuration. The external  
adapter provides power to the protection system so the  
circuitry is only active when the adapter is connected. The  
OVP monitors the voltage from the charger and if the  
V
+ V (1 ) R R ) R ńR )  
1ń 2 in  
CC  
x
1
(eq. 2)  
(eq. 3)  
So, as R approaches infinity:  
in  
V
+ V (1 ) R ńR  
2)  
CC  
x
1
voltage exceeds the overvoltage threshold, V , the OUT  
th  
signal drives the gate of the MOSFET to within 1.0 V of  
This shows that R shifts the V detection point in  
in  
th  
V
CC  
, thus turning off the FET and disconnecting the source  
accordance to the ratio of R / R . However, if R << R ,  
1
in  
1
in  
from the load. The nominal time it takes to drive the gate to  
this state is 400 nsec (1.0 msec maximum for gate  
capacitance of < 12 nF). The CNTRL input can be used to  
interrupt charging and allow the microcontroller to measure  
the cell voltage under a normal condition to get a more  
accurate measure of the battery voltage. Once the  
overvoltage is removed, the NCP346 will turn on the  
MOSFET. The turn on circuitry is designed to turn on the  
MOSFET more gradually to limit the inrush current. This  
characteristic is a function of the threshold of the MOSFET  
and will vary depending on the device characteristics such  
as the gate capacitance.  
this shift can be minimized. The following steps show this  
procedure.  
Designing around the Maximum Voltage Rating  
Requirements, V(VCC, IN)  
The NCP346’s maximum breakdown voltage between  
pins V and IN is 15 V. Therefore, care must be taken that  
CC  
the design does not exceed this voltage. Normally, the  
designer shorts V to IN, V(V , IN) is shorted to 0 V, so  
CC  
CC  
there is no issue. However, one must take care when  
adjusting the overvoltage threshold.  
In Figure 4, the R1 resistor of the voltage divider divides  
the V(V , IN) voltage to a given voltage threshold equal to:  
CC  
There are two events that will cause the OVP to drive the  
gate of the FET to a HIGH state.  
Voltage on IN Rises Above the Overvoltage Detection  
Threshold  
(V , IN) + V  
CC CC  
* (R1ń(R1 ) (R2ńńR )))  
in  
(eq. 4)  
V(V , IN) worst case equals 15 V, and V worst case  
CC  
CC  
equals 30 V, therefore, one must ensure that:  
CNTRL Input is Driven to a Logic HIGH  
R1ń(R1 ) (R2ńńR )) t 0.5  
in  
(eq. 5)  
Adjusting the Overvoltage Detection Point with  
External Resistors  
Where 0.5 = V(V , IN)max/V  
CC  
CCmax  
Therefore, the NCP346 should only be adjusted to  
maximum overvoltage thresholds which are less than 15 V.  
If greater thresholds are desired than can be accommodated  
by the NCP346, ON Semiconductor offers the NCP345  
which can withstand those voltages.  
The separate IN and V pins allow the user to adjust the  
CC  
overvoltage threshold, V , upwards by adding a resistor  
th  
divider with the tap at the IN pin. However, R does play a  
in  
significant role in the calculation since it is several  
10’s of kW. The following equation shows the effects of R .  
in  
V
CC  
+ V (1 ) R ń(R ńńR ))  
x
1
2
in  
(eq. 1)  
V
CC  
R
R
1
I
N
R
in  
2
GND  
Figure 4. Voltage divider input to adjust overvoltage  
detection point  
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7
 
NCP346  
Design Steps for Adjusting the Overvoltage Threshold  
The specification takes into account the hysteresis of the  
comparator, so the minimum input threshold voltage (V )  
1. Use Typical R , and V Values from the Electrical  
th  
in  
th  
is the falling voltage detection point and the maximum is the  
rising voltage detection point. One should design the input  
supply such that its maximum supply voltage in normal  
operation is less than the minimum desired overvoltage  
threshold.  
Specifications  
2. Minimize R Effect by Selecting R << R since:  
in  
1
in  
(eq. 6)  
V
OV  
+ V (1 ) R ńR ) R ńR ).  
th 1 2 1 in  
3. Let X = R / R = 100.  
in  
1
8. Use worst case resistor tolerances to determine the  
4. Identify Required Nominal Overvoltage Threshold.  
5. Calculate nominal R and R from Nominal Values:  
maximum V(V ,IN)  
CC  
1
2
V(V , IN)min + V  
* (R1minń(R1min ) R2max))  
CC  
CCmax  
* (R1typń(R1typ ) R2typ))  
CCmax  
(eq. 7)  
R
1
+ R ńX  
in  
(eq. 12)  
R
1
R
2
+
(eq. 8)  
(V ńV * R ńR * 1)  
OV th in  
(eq. 13)  
V(V , IN)typ + V  
1
CC  
6. Pick Standard Resistor Values as Close as Possible to  
these Values  
V(V , IN)max + V  
CC CCmax  
* (R1maxń(R1max ) R2min))  
(eq. 14)  
7. Use min/max Data and Resistor Tolerances to  
Determine Overvoltage Detection Tolerance:  
This is shown empirically in Tables 2 through 4.  
The following tables show an example of obtaining a 6 V  
detection voltage from the NCP346SN2T2, which has a  
V
+ V  
(1 ) R  
ńR  
) R )  
ńR  
OVmin  
thmin 1min 2max  
1min inmax  
(eq. 9)  
typical V of 5.5 V.  
th  
V
+ V  
(1 ) R  
ńR  
) R )  
ńR  
OVtyp  
thtyp 1typ 2typ  
1typ intyp  
(eq. 10)  
V
+ V  
thmax  
(1 ) R  
R
) R  
ńR )  
1max inmin  
OVmax  
1min 2max  
(eq. 11)  
http://onsemi.com  
8
 
NCP346  
Table 1. Design Steps 15  
Parameter  
Typical  
Design Steps  
IN Pin Input Impedance (I )  
54000  
5.5  
(1)  
(1)  
N
Input Threshold (V )  
th  
Ratio of R to R (X)  
100  
6
(2, 3)  
(4)  
in  
1
Desired Overvoltage Threshold (V  
)
OV  
R
540  
6674  
(5)  
1
2
R
(5)  
Table 2. Design Steps 67 with 1% Resistors  
1% Resistors  
Parameter  
Min  
543.51  
6583.5  
5.3  
Typical  
549  
Max  
554.49  
6716.5  
5.7  
Design Steps  
R
1
R
2
(6)  
(6)  
(6)  
(6)  
(7)  
(8)  
6650  
5.5  
V
th  
R
in  
30000  
5.76  
54000  
6.01  
100000  
6.29  
V
OV  
V(V , IN) @ V  
2.25  
2.29  
2.33  
CC  
CCmax  
Table 3. Design Steps 67 with 5% Resistors  
5% Resistors  
Parameter  
Min  
532  
Typ  
560  
Max  
588  
Design Steps  
R
1
R
2
(6)  
(6)  
(6)  
(6)  
(7)  
(8)  
6460  
5.3  
6800  
5.5  
7140  
5.7  
V
th  
R
in  
30000  
5.72  
2.08  
54000  
6.01  
2.28  
100000  
6.33  
V
OV  
V(V , IN) @ V  
2.50  
CC  
CCmax  
Table 4. Design Steps 67 with 10% Resistors  
10% Resistors  
Parameter  
Min  
504  
Typ  
560  
Max  
616  
Design Steps  
R
1
R
2
(6)  
(6)  
(6)  
(6)  
(7)  
(8)  
6120  
5.3  
6800  
5.5  
7480  
5.7  
V
th  
R
in  
30000  
5.68  
1.89  
54000  
6.01  
2.28  
100000  
6.39  
V
OV  
V(V , IN) @ V  
2.74  
CC  
CCmax  
http://onsemi.com  
9
NCP346  
4.6  
4.55  
4.5  
5.7  
IN Shorted to V  
IN Shorted to V  
CC  
CC  
5.65  
5.6  
5.55  
5.5  
Vth (V Increasing)  
Vth (V Increasing)  
CC  
CC  
4.45  
4.4  
Vth (V Decreasing)  
Vth (V Decreasing)  
CC  
CC  
5.45  
5.4  
4.35  
4.3  
5.35  
5.3  
40 25 10  
5
20  
35  
50  
65  
80  
95  
40 25 10  
5
20  
35  
50  
65  
80 95  
AMBIENT TEMPERATURE (°C)  
AMBIENT TEMPERATURE (°C)  
Figure 5. Typical Vth Variation vs. Temperature  
(NCP346SN1)  
Figure 6. Typical Vth Variation vs. Temperature  
(NCP346SN2)  
900  
800  
700  
600  
500  
900  
800  
700  
600  
500  
Overvoltage Tripped (V = 6 V)  
CC  
Overvoltage Tripped (V = 5 V)  
CC  
Disabled by CNTRL Pin (V = 5 V)  
CC  
Disabled by CNTRL Pin (V = 4 V)  
CC  
Normal Operation (V = 5 V)  
CC  
Normal Operation (V = 4 V)  
CC  
40 25 10  
5
20  
35  
50  
65  
80 95  
40 25 10  
5
20  
35  
50  
65  
80 95  
AMBIENT TEMPERATURE (°C)  
AMBIENT TEMPERATURE (°C)  
Figure 7. Typical Supply Current (ICC + IIN) vs.  
Temperature (NCP346SN1)  
Figure 8. Typical Supply Current (ICC + IIN) vs.  
Temperature (NCP346SN2)  
5.0  
4.5  
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
5.0  
4.5  
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
0
2.5  
5
7.5 10 12.5 15 17.5 20 22.5 25 27.5 30  
(V)  
0
2.5  
5
7.5 10 12.5 15 17.5 20 22.5 25 27.530  
(V)  
V
V
CC  
CC  
Figure 9. Total Supply Current vs. VCC  
(NCP346SN1)  
Figure 10. Total Supply Current vs. VCC  
(NCP346SN2)  
http://onsemi.com  
10  
NCP346  
15  
14  
13  
12  
11  
10  
9
15  
14  
13  
12  
11  
10  
9
8
8
7
7
6
6
5
5
40 25 10  
5
20  
35  
50  
65  
80  
95  
40 25 10  
5
20  
35  
50  
65  
80  
95  
AMBIENT TEMPERATURE (°C)  
AMBIENT TEMPERATURE (°C)  
Figure 11. Typical OUT Sink Current vs.  
Temperature (NCP346SN1)  
Figure 12. Typical OUT Sink Current vs.  
Temperature (NCP346SN2)  
http://onsemi.com  
11  
NCP346  
MOSFET = NTHS4101PT1  
C1= N/C  
Load = 50 W  
(See Figure 3)  
V
CNTRL  
V
Load  
Figure 13. Typical Turnoff Time CNTRL (NCP346SN1)  
MOSFET = NTHS4101PT1  
C1 = N/C  
Load = 50 W  
(See Figure 3)  
V
CNTRL  
V
Load  
Figure 14. Typical Turnoff Time CNTRL (NCP346SN2)  
http://onsemi.com  
12  
NCP346  
MOSFET = NTHS4101PT1  
C1 = N/C  
V
CNTRL  
Load = 50 W  
(See Figure 3)  
V
Load  
Figure 15. Typical Turnon Time CNTRL (NCP346SN1)  
V
CNTRL  
MOSFET = NTHS4101PT1  
C1 =N/C  
Load = 50 W  
(See Figure 3)  
V
Load  
Figure 16. Typical Turnon Time CNTRL (NCP346SN2)  
http://onsemi.com  
13  
NCP346  
THIN SOT235 POWER DISSIPATION  
The power dissipation of the Thin SOT235 is a function  
The values for the equation are found in the maximum  
ratings table on the data sheet. Substituting these values into  
of the pad size. This can vary from the minimum pad size for  
soldering to a pad size given for maximum power  
dissipation. Power dissipation for a surface mount device is  
the equation for an ambient temperature T of 25°C, one can  
A
calculate the power dissipation of the device which in this  
case is 400 milliwatts.  
determined by T , the maximum rated junction  
J(max)  
temperature of the die, R , the thermal resistance from the  
device junction to ambient, and the operating temperature,  
qJA  
150°C – 25°C  
PD  
+
+ 417 milliwatts  
300°CńW  
T . Using the values provided on the data sheet for the  
A
The 300°C/W for the Thin SOT235 package assumes  
the use of the recommended footprint on a glass epoxy  
printed circuit board to achieve a power dissipation of  
417mw.  
Thin SOT235 package, P can be calculated as follows:  
D
TJ(max)–TA  
PD +  
RqJA  
http://onsemi.com  
14  
NCP346  
PACKAGE DIMENSIONS  
THIN SOT235  
SN SUFFIX  
CASE 48302  
ISSUE C  
NOTES:  
1
DIMENSIONING AND TOLERANCING PER  
ANSI Y14.5M, 1982.  
2
3
CONTROLLING DIMENSION: MILLIMETER.  
MAXIMUM LEAD THICKNESS INCLUDES  
LEAD FINISH THICKNESS. MINIMUM LEAD  
THICKNESS IS THE MINIMUM THICKNESS  
OF BASE MATERIAL.  
A AND B DIMENSIONS DO NOT INCLUDE  
MOLD FLASH, PROTRUSIONS, OR GATE  
BURRS.  
D
5
4
3
B
C
S
4
1
2
L
MILLIMETERS  
DIM MIN MAX  
INCHES  
MIN MAX  
G
A
B
C
D
G
H
J
K
L
M
S
2.90  
1.30  
0.90  
0.25  
0.85  
3.10 0.1142 0.1220  
1.70 0.0512 0.0669  
1.10 0.0354 0.0433  
0.50 0.0098 0.0197  
1.05 0.0335 0.0413  
A
J
0.013 0.100 0.0005 0.0040  
0.05 (0.002)  
0.10  
0.20  
1.25  
0
0.26 0.0040 0.0102  
0.60 0.0079 0.0236  
1.55 0.0493 0.0610  
H
M
K
10  
0
10  
_
_
_
_
2.50  
3.00 0.0985 0.1181  
SOLDERING FOOTPRINT*  
1.9  
0.074  
0.95  
0.037  
2.4  
0.094  
1.0  
0.039  
0.7  
0.028  
mm  
inches  
ǒ
Ǔ
SCALE 10:1  
*For additional information on our PbFree strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
ON Semiconductor and  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice  
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All  
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights  
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications  
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should  
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,  
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal  
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMENT:  
N. American Technical Support: 8002829855 Toll Free  
USA/Canada  
ON Semiconductor Website: http://onsemi.com  
Order Literature: http://www.onsemi.com/litorder  
Literature Distribution Center for ON Semiconductor  
P.O. Box 61312, Phoenix, Arizona 850821312 USA  
Phone: 4808297710 or 8003443860 Toll Free USA/Canada  
Fax: 4808297709 or 8003443867 Toll Free USA/Canada  
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For additional information, please contact your  
local Sales Representative.  
NCP346/D  

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