NCP4586DSQ12T1G [ONSEMI]
150 mA, Low Noise, Low Dropout Regulator; 150毫安，低噪声，低压差稳压器
| 型号： | NCP4586DSQ12T1G |
| 厂家： | 
ONSEMI |
| 描述： | 150 mA, Low Noise, Low Dropout Regulator |
| 文件： | 总18页 (文件大小：335K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
NCP4586
150 mA, Low Noise, Low
Dropout Regulator
The NCP4586 is a CMOS 150 mA low dropout linear with low
noise, high ripple rejection, low dropout, high output voltage accuracy
and low supply current. The device is available in three
configurations: enable high, enable low and enable high plus
auto−discharge. Small packages allow mounting on high density
PCBs. This is an excellent general purpose regulator, well suited to
many applications.
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MARKING
DIAGRAMS
Features
XX
1
MM
• Operating Input Voltage Range: 1.7 V to 6.5 V
• Output Voltage Range: 1.2 to 5.0 V (available in 0.1 V steps)
• Very Low Dropout: 320 mV Typ. at 150 mA
UDFN4
CASE 517BR
1
•
1% Output Voltage Accuracy (V
> 2 V, T = 25°C)
OUT J
XX
MM
• High PSRR: 80 dB at 1 kHz
• Current Fold Back Protection
• Stable with a 0.47 mF Ceramic Capacitors
• Available in 1.0 x 1.0 UDFN, SC−82AB and SOT23−5 Package
• These are Pb−Free Devices
1
SC−82AB
CASE 419C
Typical Applications
XXX
MM
• Battery Powered Equipment
• Portable Communication Equipment
• Cameras, MP3 Players and Camcorder
• High Stability Voltage Reference
SOT−23−5
CASE 1212
XX, XXX= Specific Product Code
MM = Lot Number
NCP4586x
VIN
VOUT
VIN
VOUT
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 15 of this data sheet.
C1
470n
C2
470n
CE
GND
Figure 1. Typical Application Schematic
© Semiconductor Components Industries, LLC, 2011
1
Publication Order Number:
May, 2011 − Rev. 4
NCP4586/D
NCP4586
NCP4586Lxxxxxxxx
NCP4586Hxxxxxxxx
VIN
VOUT
VIN
VOUT
Vref
Vref
Current Limit
Current Limit
CE
CE
GND
GND
NCP4586Dxxxxxxxx
VIN
VOUT
Vref
Current Limit
CE
GND
Figure 2. Simplified Schematic Block Diagram
PIN FUNCTION DESCRIPTION
Pin No.
UDFN4
Pin No.
SC82−AB
Pin No.
SOT23−5
Pin Name
VIN
Description
4
2
3
1
−
4
2
1
3
−
1
2
3
5
4
Input pin
Ground
GND
CE/CE
VOUT
NC
Chip enable pin (“L” active / “H” active)
Output pin
No connection
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2
NCP4586
ABSOLUTE MAXIMUM RATINGS
Rating
Symbol
VIN
Value
7
Unit
V
Input Voltage (Note 1)
Output Voltage
VOUT
VCE
−0.3 to VIN + 0.3
−0.3 to 7
200
V
Chip Enable Input
V
Output Current
I
mA
OUT
Power Dissipation UDFN4
Power Dissipation SC−82AB
Power Dissipation SOT23−5
Maximum Junction Temperature
Operating Ambient Temperature
Storage Temperature
P
400
D
380
mW
420
T
+150
°C
°C
°C
V
J(MAX)
T
A
−40 to +85
−55 to +125
2000
T
STG
ESD Capability, Human Body Model (Note 2)
ESD Capability, Machine Model (Note 2)
ESD
HBM
ESD
200
V
MM
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Refer to ELECTRICAL CHARACTERISTIS and APPLICATION INFORMATION for Safe Operating Area.
2. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114)
ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115)
Latchup Current Maximum Rating tested per JEDEC standard: JESD78.
THERMAL CHARACTERISTICS
Rating
Symbol
Value
Unit
Thermal Characteristics, UDFN4
Thermal Resistance, Junction−to−Air
R
250
°C/W
q
JA
Thermal Characteristics, SOT23−5
Thermal Resistance, Junction−to−Air
R
238
263
°C/W
°C/W
q
JA
Thermal Characteristics, SC 82AB
Thermal Resistance, Junction−to−Air
R
q
JA
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NCP4586
ELECTRICAL CHARACTERISTICS −40°C ≤ T ≤ 85°C; V = V
+ 1 V or 2.5 V, whichever is greater; I
= 1 mA, C
=
A
IN
OUT(NOM)
OUT
IN
C
= 0.47 mF, unless otherwise noted. Typical values are at T = +25 °C.
OUT
A
Parameter
Test Conditions
Symbol
VIN
Min
1.7
Typ
Max
6.5
Unit
V
Operating Input Voltage
Output Voltage
TA = +25 °C
V
V
V
V
> 2 V
≤ 2 V
> 2 V
≤ 2 V
VOUT
x0.99
−20
x1.01
20
V
OUT
OUT
OUT
OUT
mV
V
−40°C ≤ TA ≤ 85°C
x0.985
−30
x1.015
30
mV
Output Voltage Temp. Coefficient
Line Regulation
T = −40 to 85°C
20
0.02
10
ppm/°C
%/V
mV
A
V
IN
= VOUT + 0.5 V to 5 V
Line
0.10
30
Reg
Load Regulation
IOUT = 1 mA to 150 mA
Load
Reg
Dropout Voltage
I
= 150 mA
1.2 V ≤ V
1.5 V ≤ V
1.7 V ≤ V
2.0 V ≤ V
2.5 V ≤ V
< 1.5 V
VDO
0.67
0.54
0.46
0.41
0.32
0.24
1.00
0.81
0.68
0.60
0.51
0.37
V
OUT
OUT
OUT
OUT
OUT
OUT
< 1.7 V
< 2.0 V
< 2.5 V
< 4.0 V
4.0 V ≤ V
OUT
Output Current
IOUT
150
1.0
mA
mA
mA
Short Current Limit
Quiescent Current
Standby Current
V
= 0 V
I
40
38
OUT
SC
IOUT = 0 mA
IQ
58
1
V
= V (L version), V = 0 V(H and
ISTB
0.1
mA
CE
IN
CE
D version), T = 25°C
A
CE/CE Pin Threshold Voltage
CE / CE Input Voltage “H”
CE / CE Input Voltage “L”
H and D version
VCEH
VCEL
IPD
V
0.4
CE Pull Down Current
0.4
80
mA
Power Supply Rejection Ratio
VIN = V
OUT
+ 1 V or 3.0 V whichever is higher,
IOUT = 30 mA, f = 1 kHz
PSRR
dB
Output Noise Voltage
V
OUT
= 1.2 V, I
= 30 mA, f = 10 Hz to
VN
30
30
mV
rms
OUT
100 kHz
Low Output N−ch Tr. On
Resistance
D Version only, V = 4 V, V = 0 V
R
LOW
W
IN
CE
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NCP4586
TYPICAL CHARACTERISTICS
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
3.0
4.2 V
6.0 V
2.5
3.6 V
V
IN
= 2.2 V
6.0 V
4.2 V
2.0
V
= 6.5 V
IN
3.8 V
1.5
1.0
0.5
0.0
6.5 V
0
100
200
300
400
500
0
100
200
300
(mA)
400
500
I
(mA)
I
OUT
OUT
Figure 3. Output Voltage vs. Output Current
Figure 4. Output Voltage vs. Output Current
1.2 V Version (TA = 25 5C)
2.8 V Version (TA = 25 5C)
6
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
5
4
3
2
1
0
6.0 V
25°C
V
IN
= 6.5 V
85°C
−40°C
0
100
200
300
400
500
0
100
200
300
(mA)
OUT
400
500
I
(mA)
I
OUT
Figure 5. Output Voltage vs. Output Current
Figure 6. Dropout Voltage vs. Output Current
1.2 V version
5.0 V version (TA = 255C)
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0.00
0.30
0.25
0.20
0.15
0.10
0.05
0.00
25°C
25°C
85°C
85°C
−40°C
−40°C
0
100
200
300
400
500
0
25
50
75
(mA)
100
125
150
I
(mA)
I
OUT
OUT
Figure 7. Dropout Voltage vs. Output Current
2.8 V Version
Figure 8. Dropout Voltage vs. Output Current
5.0 V Version
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NCP4586
TYPICAL CHARACTERISTICS
2.85
1.25
1.23
1.21
1.19
1.17
1.15
V
IN
= 2.2 V
V
IN
= 3.8 V
2.83
2.81
2.79
2.77
2.75
−40
−20
0
20
40
60
80
−40
−20
0
20
40
60
80
T , JUNCTION TEMPERATURE (°C)
J
T , JUNCTION TEMPERATURE (°C)
J
Figure 9. Output Voltage vs. Temperature, 1.2 V
Version
Figure 10. Output Voltage vs. Temperature,
2.8 V version
5.05
5.04
5.03
5.02
5.01
5.00
4.99
4.98
4.97
4.96
4.95
50.0
45.0
40.0
35.0
30.0
25.0
20.0
15.0
10.0
5.0
V
IN
= 6.0 V
0.0
−40
−20
0
20
40
60
80
0
1
2
3
4
5
6
T , JUNCTION TEMPERATURE (°C)
J
V
IN
(V)
Figure 11. Output Voltage vs. Temperature,
5.0 V Version
Figure 12. Supply Current vs. Input Voltage,
1.2 V Version
50.0
45.0
40.0
35.0
30.0
25.0
20.0
15.0
10.0
5.0
50.0
45.0
40.0
35.0
30.0
25.0
20.0
15.0
10.0
5.0
0.0
0.0
0
1
2
3
4
5
6
0
1
2
3
4
5
6
V
IN
(V)
V
IN
(V)
Figure 14. Supply Current vs. Input Voltage,
2.8 V Version
Figure 13. Supply Current vs. Input Voltage,
5.0 V version
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NCP4586
TYPICAL CHARACTERISTICS
40.0
39.0
38.0
37.0
36.0
35.0
34.0
33.0
32.0
31.0
30.0
40.0
V
= 2.2 V
V
IN
= 3.8 V
IN
39.0
38.0
37.0
36.0
35.0
34.0
33.0
32.0
31.0
30.0
−40
−20
0
20
40
60
80
−40
−20
0
20
40
60
80
T , JUNCTION TEMPERATURE (°C)
J
T , JUNCTION TEMPERATURE (°C)
J
Figure 15. Supply Current vs. Temperature,
1.2 V Version
Figure 16. Supply Current vs. Temperature,
2.8 V Version
45
44
43
42
41
40
39
38
37
36
35
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
V
= 6.0 V
IN
1 mA
30 mA
I
= 50 mA
OUT
−40
−20
0
20
40
60
80
0
1
2
3
4
5
6
7
T , JUNCTION TEMPERATURE (°C)
J
V
IN
(V)
Figure 17. Supply Current vs. Temperature,
5.0 V Version
Figure 18. Output Voltage vs. Input Voltage,
1.2 V Version
3.0
2.5
2.0
1.5
1.0
0.5
0.0
6.0
5.0
4.0
3.0
2.0
1.0
0.0
1 mA
30 mA
1 mA
30 mA
I
= 50 mA
2
OUT
I
= 50 mA
OUT
0
1
3
4
5
6
7
0
1
2
3
4
5
6
7
V
IN
(V)
V
IN
(V)
Figure 19. Output Voltage vs. Input Voltage,
2.8 V Version
Figure 20. Output Voltage vs. Input Voltage,
5.0 V Version
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NCP4586
TYPICAL CHARACTERISTICS
100
90
80
70
60
50
40
30
20
10
0
100
90
1 mA
1 mA
30 mA
= 150 mA
80
30 mA
= 150 mA
70
I
OUT
I
OUT
60
50
40
30
20
10
0
0.01
0.1
1
10
100
1000
0.01
0.1
1
10
100
1000
FREQUENCY (kHz)
FREQUENCY (kHz)
Figure 21. PSRR, 1.2 V Version
Figure 22. PSRR, 2.8 V Version
100
90
80
70
60
50
40
30
20
10
0
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
1 mA
30 mA
= 150 mA
I
OUT
0.01
0.1
1
10
100
1000
0.01
0.1
1
10
100
1000
FREQUENCY (kHz)
FREQUENCY (kHz)
Figure 23. PSRR, 5.0 V Version
Figure 24. Output Voltage Noise, 1.2 V Version
7.0
6.0
5.0
4.0
3.0
2.0
1.0
0
7.0
6.0
5.0
4.0
3.0
2.0
1.0
0
0.01
0.1
1
10
100
1000
0.01
0.1
1
10
100
1000
FREQUENCY (kHz)
FREQUENCY (kHz)
Figure 25. Output Voltage Noise, 2.8 V Version
Figure 26. Output Voltage Noise, 5.0 V Version
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NCP4586
TYPICAL CHARACTERISTICS
4
3
2
1
1.205
1.200
1.195
1.190
0
10 20 30 40 50 60 70 80 90 100
t (ms)
Figure 27. Line Transients, 1.2 V Version,
tR = tF = 5 ms, IOUT = 30 mA
6
5
4
3
2.805
2.800
2.795
2.790
0
10 20 30 40 50 60 70 80 90 100
t (ms)
Figure 28. Line Transients, 2.8 V Version,
tR = tF = 5 ms, IOUT = 30 mA
7
6
5
4
5.005
5.000
4.995
4.990
0
10 20 30 40 50 60 70 80 90 100
t (ms)
Figure 29. Line Transients, 5.0 V Version, tR
=
tF = 5 ms, IOUT = 30 mA
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NCP4586
TYPICAL CHARACTERISTICS
200
150
100
50
0
1.23
1.22
1.21
1.20
1.19
1.18
0
10 20 30 40 50 60 70 80 90 100
t (ms)
Figure 30. Load Transients, 1.2 V Version,
IOUT = 50 − 100 mA, tR = tF = 0.5 ms, VIN = 2.2 V
200
150
100
50
0
2.83
2.82
2.81
2.80
2.79
2.78
0
10 20 30 40 50 60 70 80 90 100
t (ms)
Figure 31. Load Transients, 2.8 V Version,
IOUT = 50 − 100 mA, tR = tF = 0.5 ms, VIN = 3.8 V
200
150
100
50
0
5.03
5.02
5.01
4.99
4.98
0
10 20 30 40 50 60 70 80 90 100
t (ms)
Figure 32. Load Transients, 5.0 V Version,
IOUT = 50 − 100 mA, tR = tF = 0.5 ms, VIN = 6.0 V
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NCP4586
TYPICAL CHARACTERISTICS
200
150
100
50
0
1.30
1.25
1.20
1.15
1.10
1.05
0
0
0
10 20 30 40 50 60 70 80 90 100
t (ms)
Figure 33. Load Transients, 1.2 V Version,
OUT = 1 − 150 mA, tR = tF = 0.5 ms, VIN = 2.2 V
I
200
150
100
50
0
2.90
2.85
2.80
2.75
2.70
2.65
10 20 30 40 50 60 70 80 90 100
t (ms)
Figure 34. Load Transients, 2.8 V Version,
OUT = 1 − 150 mA, tR = tF = 0.5 ms, VIN = 3.8 V
I
200
150
100
50
0
5.10
5.05
5.00
4.95
4.90
4.85
10 20 30 40 50 60 70 80 90 100
t (ms)
Figure 35. Load Transients, 5.0 V Version,
OUT = 1 − 150 mA, tR = tF = 0.5 ms, VIN = 6.0 V
I
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NCP4586
TYPICAL CHARACTERISTICS
4
3
2
1
0
Chip Enable
2.0
1.5
I
= 150 mA
OUT
1.0
I
= 1 mA
OUT
0.5
0.0
−0.5
0
2
4
6
8
10 12 14 16 18 20
t (ms)
Figure 36. Start−up, 1.2 V Version, VIN = 2.2 V
5
4
3
2
1
Chip Enable
4
3
2
I
= 1 mA
OUT
I
= 150 mA
OUT
1
0
−1
0
2
4
6
8
10 12 14 16 18 20
t (ms)
Figure 37. Start−up, 2.8 V Version, VIN = 3.8 V
10
8
Chip Enable
6
4
2
8
6
0
4
I
= 1 mA
OUT
I
= 150 mA
OUT
2
0
−2
0
5
10 15 20 25 30 35 40 45 50
t (ms)
Figure 38. Start−up, 5.0 V Version, VIN = 6.0 V
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NCP4586
TYPICAL CHARACTERISTICS
4
3
2
1
0
Chip Enable
2.0
1.5
I
= 1 mA
OUT
1.0
I
= 30 mA
OUT
0.5
0.0
I
= 150 mA
OUT
−0.5
0
10 20 30 40 50 60 70 80 90 100
t (ms)
Figure 39. Shutdown, 1.2 V Version D,
V
IN = 2.2 V
5
4
3
2
1
Chip Enable
2.0
1.5
I
= 1 mA
1.0
OUT
I
= 30 mA
OUT
0.5
0.0
I
= 150 mA
OUT
−0.5
0
10 20 30 40 50 60 70 80 90 100
t (ms)
Figure 40. Shutdown, 2.8 V Version D,
V
IN = 3.8 V
10
8
6
4
2
Chip Enable
0
8
6
4
I
= 1 mA
OUT
I
= 30 mA
OUT
2
0
I
= 150 mA
OUT
−2
0
10 20 30 40 50 60 70 80 90 100
t (ms)
Figure 41. Shutdown, 5.0 V version D,
V
IN = 6.0 V
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NCP4586
APPLICATION INFORMATION
A typical application circuit for NCP4586 series is shown
in Figure 42.
version of IC. Active high or low versions are available;
please see the ordering information table. The Enable pin
has an internal pull down current source for versions H and
D. If the enable function is not needed connect the CE pin to
ground for version L or connect the CE pin to VIN for
versions H and D.
NCP4586x
VIN
VOUT
VIN
VOUT
C1
470n
C2
470n
CE
Output Discharger
GND
The D version includes a transistor between VOUT and
GND that is used for faster discharging of the output
capacitor. This function is activated when the IC goes into
disable mode.
Thermal
Figure 42. Typical Application Schematic
As power across the IC increases, it might become
necessary to provide some thermal relief. The maximum
power dissipation supported by the device is dependent
upon board design and layout. Mounting pad configuration
on the PCB, the board material, and also the ambient
temperature affect the rate of temperature rise for the part.
That is to say, when the device has good thermal
conductivity through the PCB, the junction temperature will
be relatively low with high power dissipation applications.
Input Decoupling Capacitor (C1)
A 470 nF ceramic input decoupling capacitor should be
connected as close as possible to the input and ground pin of
the NCP4586. Higher values and lower ESR improves line
transient response.
Output Decoupling Capacitor (C2)
A 470 nF or larger ceramic output decoupling capacitor is
sufficient to achieve stable operation of the IC. If a tantalum
capacitor is used, and its ESR is high, loop oscillation may
result. The capacitors should be connected as close as
possible to the output and ground pins. Larger values and
lower ESR improves dynamic parameters.
PCB Layout
Make VIN and GND line sufficient. If their impedance is
high, noise pickup or unstable operation may result. Connect
capacitors C1 and C2 as close as possible to the IC, and make
wiring as short as possible.
Enable Operation
The Enable pin CE or CE may be used for turning the
regulator on and off. Control polarity is dependent on
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NCP4586
ORDERING INFORMATION
Nominal Output
†
Voltage
1.2 V
1.8 V
2.8 V
3.0 V
3.3 V
5.0 V
1.2 V
1.4 V
1.5 V
1.8 V
2.5 V
2.8 V
3.0 V
3.3 V
5.0 V
1.2 V
1.8 V
2.8 V
3.0 V
3.3 V
5.0 V
Device
Description
Marking
Package
Shipping
NCP4586DSQ12T1G
NCP4586DSQ18T1G
NCP4586DSQ28T1G
NCP4586DSQ30T1G
NCP4586DSQ33T1G
NCP4586DSQ50T1G
NCP4586DMU12TCG
NCP4586DMU14TCG
NCP4586DMU15TCG
NCP4586DMU18TCG
NCP4586DMU25TCG
NCP4586DMU28TCG
NCP4586DMU30TCG
NCP4586DMU33TCG
NCP4586DMU50TCG
NCP4586DSN12T1G
NCP4586DSN18T1G
NCP4586DSN28T1G
NCP4586DSN30T1G
NCP4586DSN33T1G
NCP4586DSN50T1G
LA
LG
MH
NA
SC82AB
3000 / Tape & Reel
10000 / Tape & Reel
3000 / Tape & Reel
(Pb−Free)
ND
QA
VA
VC
VD
VG
VQ
VT
Enable High,
Auto discharge
UDFN4
(Pb−Free)
VW
VZ
WS
H2A
H2G
H2T
H2W
H2Z
J2S
SOT−23−5
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
NOTE: To order other package and voltage variants, please contact your ON Semiconductor sales representative.
http://onsemi.com
15
NCP4586
PACKAGE DIMENSIONS
UDFN4 1.0x1.0, 0.65P
CASE 517BR−01
ISSUE O
NOTES:
4X
L3
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
A
B
D
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.20 mm FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
c 0.18
PIN ONE
REFERENCE
typ
L2
E
DETAIL A
2X
0.05
C
MILLIMETERS
DIM MIN
−−−
A1 0.00
MAX
0.60
0.05
A
0.05
C
2X
3X
0.43
4X
0.23
A3
b
D
0.10 REF
0.20
1.00 BSC
0.53
1.00 BSC
0.65 BSC
TOP VIEW
0.30
(A3)
0.05
0.05
C
D2 0.43
E
e
L
A
0.20
0.30
0.37
0.12
3X
0.10
C
L2 0.27
L3 0.02
DETAIL B
SEATING
PLANE
NOTE 4
A1
C
SIDE VIEW
RECOMMENDED
MOUNTING FOOTPRINT*
e
e/2
3X L
D2
0.65
DETAIL A
1
4
2
PITCH
DETAIL B
2X
0.52
PACKAGE
OUTLINE
D2
455
3
1.30
4X b
M
0.05
C A B
NOTE 3
4X
0.30
0.53
BOTTOM VIEW
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
16
NCP4586
PACKAGE DIMENSIONS
SC−82AB
CASE 419C−02
ISSUE E
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. 419C−01 OBSOLETE. NEW STANDARD IS
419C−02.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
A
G
C
D 3 PL
N
MILLIMETERS
INCHES
MIN
DIM
A
B
C
D
F
G
H
J
MIN
1.8
1.15
0.8
MAX
2.2
1.35
1.1
MAX
0.087
0.053
0.043
0.016
0.020
0.059
0.004
0.010
−−−
4
3
2
0.071
0.045
0.031
0.008
0.012
0.043
0.000
0.004
0.004
K
B
F
S
1
0.2
0.3
0.4
0.5
1.1
0.0
1.5
0.1
H
J
0.10
0.1
0.26
−−−
K
L
L
0.05 (0.002)
0.05 BSC
0.2 REF
1.8
0.002 BSC
0.008 REF
0.07 0.09
N
S
2.4
SOLDERING FOOTPRINT*
1.30
0.0512
0.65
0.026
1.90
0.075
0.95
0.037
0.90
0.035
0.70
0.028
mm
inches
ǒ
Ǔ
SCALE 10:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
17
NCP4586
PACKAGE DIMENSIONS
SOT−23 5−LEAD
CASE 1212−01
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSIONS: MILLIMETERS.
3. DATUM C IS THE SEATING PLANE.
A
A2
B
A
D
S
A1
0.05
MILLIMETERS
5
1
4
3
DIM MIN
MAX
1.45
0.10
1.30
0.50
0.25
3.10
3.10
1.80
E
L
A
A1
A2
b
---
0.00
1.00
0.30
0.10
2.70
2.50
1.50
2
E1
5X b
L1
C
c
M
S
S
A
D
0.10
C B
e
C
E
E1
e
0.95 BSC
L
0.20
0.45
---
0.75
L1
RECOMMENDED
SOLDERING FOOTPRINT*
5X
0.85
3.30
5X
0.95
0.56
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
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NCP4586/D
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