NCP706BMX300TAG [ONSEMI]
Precision Very Low Dropout Voltage Regulator;
| 型号： | NCP706BMX300TAG |
| 厂家： | 
ONSEMI |
| 描述： | Precision Very Low Dropout Voltage Regulator |
| 文件： | 总10页 (文件大小：205K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
NCP706B, NCP706AB
1 A, 1% Precision Very Low
Dropout Voltage Regulator
with Enable
The NCP706B/AB are a Very Low Dropout Regulators family
which provides up to 1 A of load current and maintains excellent
output voltage accuracy of 1% including line, load and temperature
variations. The operating input voltage range from 2.4 V up to 5.5 V
makes this device suitable for Li−ion battery powered products as well
as post−regulation applications. The product is available in 3.0 V fixed
output voltage option. NCP706B/AB are fully protected against
overheating and output short circuit and includes latched OCP
protection which automatically latches−off the device in the case of a
short circuit event and the NCP706AB has internal active discharge
circuit.
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MARKING
DIAGRAM
XXMG
XDFN8
CASE 711AS
G
XX = Specific Device Code
M
G
= Date Code
= Pb−Free Package
Very small 8−pin XDFN8 1.6 x 1.2, 04P package makes the device
especially suitable for space constrained portable applications such as
tablets and smartphones. Parts feature active output discharge
function.
(Note: Microdot may be in either location)
PIN CONNECTION
Features
• Operating Input Voltage Range: 2.4 V to 5.5 V
OUT
OUT
N/C
IN
1
2
3
4
8
7
6
5
• Fixed Output Voltage Option: 3.0 V
IN
Other Output Voltage Options Available on Request.
• Low Quiescent Current of Typ. 200 mA
EN
GND
• Very Low Dropout: 155 mV at I
= 1 A
OUT
SNS
•
1% Accuracy Over Load/Line/Temperature
(Top View)
• High PSRR: 58 dB at 1 kHz
• Internal Soft−Start to Limit the Inrush Current
• Thermal Shutdown and Current Limit Protections
• Stable with a 2.2 mF Ceramic Output Capacitor
• Active Output Discharge (NCP706AB)
• Available in XDFN8 1.6 x 1.2, 04P 8−pin Package
• Latched Overcurrent Protection
IN
IN
OUT
OUT
N/C
8
7
6
5
1
2
3
4
EN
GND
SNS
• These are Pb−Free Devices
(Bottom View)
Typical Applications
• Tablets, Smartphones,
ORDERING INFORMATION
See detailed ordering, marking and shipping information on
page 9 of this data sheet.
• Wireless Handsets, Portable Media Players
• Portable Medical Equipment
• Other Battery Powered Applications
V
= 2.4 (3.3) − 5.5 V
V
= 3.0 V @ 1 A
IN
OUT
IN
OUT
SNS
NCP706B/AB
GND
C
C
OUT
IN
EN
2.2 mF
Ceramic
ON
OFF
Figure 1. Typical Application Schematic
© Semiconductor Components Industries, LLC, 2016
1
Publication Order Number:
May, 2016 − Rev. 3
NCP706B/D
NCP706B, NCP706AB
Figure 2. Simplified Internal Schematic Block Diagram
PIN FUNCTION DESCRIPTION
Pin No.
XDFN8
Pin Name
OUT
OUT
N/C
Description
1
2
3
4
5
6
Regulated output voltage. A minimum 2.2 mF ceramic capacitor is needed from this pin to ground to
assure stability.
Not connected. This pin can be tied to ground to improve thermal dissipation.
Remote sense connection. This pin should be connected to the output voltage rail.
Power supply ground.
SNS
GND
EN
Enable pin. Driving EN over 0.9 V turns on the regulator. Driving EN below 0.4 V puts the regulator
into shutdown mode. In case of the NCP706B/AB pulling the EN low resets the OCP latch state.
7
8
−
IN
IN
Input pin. A small capacitor is needed from this pin to ground to assure stability.
Exposed
Pad
This pad enhances thermal performance and is electrically connected to GND. It is recommended
that the exposed pad is connected to the ground plane on the board or otherwise left open.
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2
NCP706B, NCP706AB
ABSOLUTE MAXIMUM RATINGS
Rating
Symbol
Value
−0.3 V to 6 V
−0.3 V to VIN + 0.3 V
−0.3 V to VIN + 0.3 V
Indefinite
Unit
V
Input Voltage (Note 1)
V
IN
Output Voltage
V
OUT
V
Enable Input
V
EN
V
Output Short Circuit Duration
Maximum Junction Temperature
Storage Temperature
t
s
SC
T
150
°C
°C
V
J(MAX)
T
−55 to 150
2000
STG
ESD Capability, Human Body Model (Note 2)
ESD Capability, Machine Model (Note 2)
ESD
HBM
ESD
200
V
MM
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
2. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per EIA/JESD22−A114
ESD Machine Model tested per EIA/JESD22−A115
Latch−up Current Maximum Rating tested per JEDEC standard: JESD78
THERMAL CHARACTERISTICS
Rating
Symbol
Value
Unit
Thermal Characteristics, XDFN8 1.6x1.2, 04P
Thermal Resistance, Junction−to−Air
R
160
°C/W
q
JA
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3
NCP706B, NCP706AB
ELECTRICAL CHARACTERISTICS − VOLTAGE VERSION 3.0 V
−40°C ≤ T ≤ 125°C; V = V
+ 0.3 V or 3.3 V, whichever is greater; I
= 10 mA, C = C
= 2.2 mF, V = 0.9 V, unless
OUT EN
J
IN
OUT(NOM)
OUT
IN
otherwise noted. Typical values are at T = +25°C. (Note 3)
J
Parameter
Operating Input Voltage
Undervoltage lock−out
Output Voltage Accuracy
Line Regulation
Test Conditions
Symbol
Min
Typ
Max
5.5
Unit
V
V
IN
2.4
1.2
V
V
V
rising, I
= 0
UVLO
1.6
3.0
2
1.9
V
IN
OUT
+ 0.3 V ≤ V ≤ 4.5 V, I
= 0 – 1 A
V
OUT
2.97
3.03
V
OUT
OUT
IN
OUT
+ 0.3 V ≤ V ≤ 4.5 V, I
= 10 mA
Reg
mV
mV
mV
IN
OUT
LINE
LOAD
LOAD
Load Regulation
I
= 0 mA to 1 A, V = 3.3 V
Reg
2
OUT
IN
Load Transient
I
= 10 mA to 1 A in 10 ms, V = 3.5 V
Tran
120
OUT
IN
C
= 10 mF
OUT
Dropout voltage (Note 4)
Output Current Limit
Quiescent current
Ground current
I
= 1 A, V
= 3.0 V
V
155
230
230
1
mV
A
OUT
OUT(nom)
DO
V
= 90% V
I
CL
1.1
0.9
OUT
OUT(nom)
I
= 0 mA
= 1 A
I
170
200
0.1
mA
mA
mA
V
OUT
OUT
Q
I
I
GND
Shutdown current
V
= 0 V, V = 2.0 to 5.5 V
EN
IN
EN Pin High Threshold
EN Pin Low Threshold
V
V
Voltage increasing
Voltage decreasing
V
EN_HI
EN_LO
EN
EN
V
0.4
EN Pin Input Current
V
V
= 5.5 V
I
300
10
700
nA
ms
EN
EN
Overcurrent Protection Blanking
Time (Note 5)
= V
down to V
= 0V
t
BLANK
OUT
OUT(nom)
OUT
(Output Shorted to GND)
Turn−on Time
C
= 2.2 mF, from assertion EN pin to 98%
t
150
ms
OUT
ON
V
out(nom)
Power Supply Rejection Ratio
V
= 3.5 V + 200 mVpp
f = 100 Hz
f = 1 kHz
f = 10 kHz
PSRR
65
58
52
dB
IN
modulation, V
= 3.0 V
OUT
I
= 0.5 A, C
= 4.7 mF
OUT
OUT
Output Noise Voltage
V
= 3.0 V, V = 4.0 V, I
= 0.5 A
V
NOISE
300
mV
rms
OUT
IN
OUT
f = 100 Hz to 100 kHz
Thermal Shutdown Temperature
Thermal Shutdown Hysteresis
Temperature increasing from T = +25°C
T
160
20
°C
J
SD
Temperature falling from T
T
SDH
°C
SD
Active Output Discharge
(NCP706AB only)
V
EN
≤ 0.4 V, V = 4.5 V
R
DIS
60
W
IN
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
3. Performance guaranteed over the indicated operating temperature range by design and/or characterization production tested at T = T =
J
A
25_C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
4. Characterized when V
falls 90 mV below the regulated voltage at V = 3.3 V, I
= 10 mA.
OUT
IN
OUT
5. For more information see APPLICATIONS INFORMATION section on page 8.
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4
NCP706B, NCP706AB
TYPICAL CHARACTERISTICS
3.004
3.5
3.0
2.5
2.0
1.5
1.0
3.002
3.000
V
IN
= V
EN
T = 25°C
A
2.998
2.996
C
= 2.2 mF
OUT
OUT(NOM)
V
= 3.0 V
V
IN
= 3.3 V
I
I
I
I
= 10 mA
= 50 mA
= 250 mA
= 500 mA
OUT
OUT
OUT
OUT
I
C
= 10 mA
= 2.2 mF
OUT
2.994
2.992
0.5
0.0
OUT
V
= 3.0 V
OUT(NOM)
−40 −20
0
20
40
60
80
100 120
0.0
1.0
2.0
3.0
4.0
5.0
TEMPERATURE (°C)
INPUT VOLTAGE (V)
Figure 3. Output Voltage vs. Temperature
Figure 4. Output Voltage vs. Input Voltage
240
220
200
180
160
140
120
260
240
220
200
I
= 0
= 2.2 mF
V
V
V
= 3.3 V
= 4.0 V
= 5.0 V
V
IN
V
IN
V
IN
= 3.5 V
= 4.5 V
= 5.5 V
OUT
IN
IN
IN
C
OUT
V
= 3.0 V
OUT(NOM)
T = 125°C
A
T = 25°C
A
180
160
140
T = −40°C
A
C
= 2.2 mF
OUT
T = 25°C
A
V
= 3.0 V
OUT(NOM)
3.0
3.5
4.0
4.5
5.0
5.5
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
OUTPUT CURRENT (A)
INPUT VOLTAGE (V)
Figure 5. Quiescent Current vs. Input Voltage
Figure 6. Ground Current vs. Output Current
1.8
1.7
1.6
1.5
1.4
1.3
200
180
160
140
120
100
V
= 0
= V
IN
= 2.2 mF
V
= V
IN
= 2.2 mF
OUT
EN
V
EN
125°C
C
OUT
C
V
= 3.0 V
OUT
OUT(NOM)
T = 25°C
A
25°C
V
= 3.0 V
OUT(NOM)
−40°C
80
60
40
20
0
1.2
3.0
3.5
4.0
4.5
5.0
5.5
0
0.2
0.4
0.6
0.8
1
INPUT VOLTAGE (V)
OUTPUT CURRENT (A)
Figure 7. Short Current Limitation vs. Input
Voltage
Figure 8. Dropout Voltage vs. Output Current
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5
NCP706B, NCP706AB
TYPICAL CHARACTERISTICS
2.5
2.0
1.5
1.0
0.5
0.0
80
60
40
20
V
= 3.5 V + 200 mV Modulation
PP
IN
V
= 5.5 V
IN
V
I
= 500 mA
OUT
= 0
EN
T = 25°C
A
C
= C
T = 25°C
= 4.7 mF
IN
OUT
A
C
C
C
= 2.2 mF
= 4.7 mF
= 10 mF
OUT
OUT
OUT
V
= 3.0 V
5.0
OUT(NOM)
0
0.01
0.1
1
10
100
1000
0.0
1.0
2.0
3.0
4.0
FREQUENCY (kHz)
FORCED OUTPUT VOLTAGE (V)
Figure 9. Reverse Leakage Current in
Shutdown
Figure 10. PSRR vs. Frequency & Output
Capacitor
80
3.5
3.0
2.5
2.0
1.5
1.0
I
= 500 mA
= 4.0 V
T = 25°C
V
= 3.5 V + 200 mV Modulation
PP
OUT
IN
V
IN
C
= 2.2 mF
OUT
T = 25°C
A
A
V
= 3.0 V
60
40
OUT(NOM)
C
= 2.2 mF
OUT
20
0
I
I
I
= 10 mA
= 100 mA
= 500 mA
OUT
OUT
OUT
0.5
0.0
0.01
0.1
1
10
100
1000
0.01
0.1
1
10
100
1000
FREQUENCY (kHz)
FREQUENCY (kHz)
Figure 11. PSRR vs. Frequency & Output
Current
Figure 12. Output Noise Density vs. Frequency
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6
NCP706B, NCP706AB
TYPICAL CHARACTERISTICS
Figure 13. Turn−on by Coupled Input and
Figure 14. Turn−on by Enable Signal
Enable Pins
Figure 15. Line Transient Response
Figure 16. Load Transient Response
Figure 17. Turn−off by Enable Signal
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7
NCP706B, NCP706AB
APPLICATIONS INFORMATION
Input Decoupling (Cin)
ambient temperature affect the rate of temperature rise for
the part. This is stating that when the NCP706B/AB has
good thermal conductivity through the PCB, the junction
temperature will be relatively low with high power
dissipation.
A 2.2 mF capacitor either ceramic or tantalum is
recommended and should be connected as close as possible
to the pins of NCP706B device. Higher values and lower
ESR will improve the overall line transient response.
The power dissipation across the device can be roughly
represented by the equation:
Output Decoupling (Cout)
The
minimum
decoupling
value
for
ǒ
Ǔ
(eq. 1)
PD + VIN * VOUT * IOUT [W]
NCP706BMX300TAG and NCP706ABMX300TAG
devices is 2.2 mF. The regulator accepts ceramic chip
capacitors MLCC. If a tantalum capacitor is used, and its
ESR is large, the loop oscillation may result. Larger values
improve noise rejection and PSRR.
The maximum power dissipation depends on the thermal
resistance of the case and circuit board, the temperature
differential between the junction and ambient, PCB
orientation and the rate of air flow.
The maximum allowable power dissipation can be
calculated using the following equation:
Enable Operation
The enable pin EN will turn on or off the regulator. These
limits of threshold are covered in the electrical specification
section of this data sheet. If the enable is not used then the
ǒ
Ǔ
(eq. 2)
PMAX + TJ * TA ńqJA [W]
Where (T − T ) is the temperature differential between
J
A
pin should be connected to V .
IN
the junction and the surrounding environment and q is the
JA
thermal resistance from the junction to the ambient.
Connecting the exposed pad and non connected pin 3 to
a large ground pad or plane helps to conduct away heat and
improves thermal relief.
Hints
Please be sure the V and GND lines are sufficiently wide.
If their impedance is high, noise pickup or unstable
operation may result.
in
Set external components, especially the output capacitor,
as close as possible to the circuit.
The sense pin SNS trace is recommended to be kept as far
from noisy power traces as possible and as close to load as
possible.
Overcurrent Latch Operation
The NCP706B/AB is equipped with latched overcurrent
protection feature which will automatically disable the LDO
in case of permanent output short circuit.
Initally during the OCP condition the current flowing
from the input to the output of the LDO is typically 1.65 A.
This current cause the die to heat−up and eventually when
the temperature rises up to the thermal shutdown threshold
the LDO becomes disabled. To resume the operation of the
device it is necessary to toggle the EN to ‘OFF’ state and
than back to ‘ON’ state again.
Thermal
As power across the NCP706B/AB increases, it might
become necessary to provide some thermal relief. The
maximum power dissipation supported by the device is
dependent upon board design and layout. Mounting pad
configuration on the PCB, the board material, and also the
1.2 V
1.2 V
Enable Voltage
0 V
0 V
3.0 V
3.0 V
Output Voltage
0 V
0 V
0 V
1.65 A
1.65 A
600 mA
600 mA
Output Current
0 mA
0 mA
t
t<t blank
t>tblank
Figure 18. Overcurrent Latch Operation
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8
NCP706B, NCP706AB
ORDERING INFORMATION
Nominal Ooutput
Active
Discharge
†
Voltage
Device
Marking
L3
Package
Shipping
NCP706BMX300TAG
NCP706ABMX300TAG
3.0 V
No
XDFN8
(Pb−Free)
3000 / Tape & Reel
3.0 V
CA
Yes
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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9
NCP706B, NCP706AB
PACKAGE DIMENSIONS
XDFN8 1.6x1.2, 0.4P
CASE 711AS
ISSUE D
NOTES:
L
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
D
A
B
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
8X
L1
DETAIL A
MILLIMETERS
OPTIONAL
DIM
A
A1
b
D
D2
E
E2
e
L
MIN
NOM
MAX
CONSTRUCTION
0.300 0.375 0.450
0.000 0.025 0.050
0.130 0.180 0.230
1.500 1.600 1.700
1.200 1.300 1.400
1.100 1.200 1.300
0.200 0.300 0.400
0.40 BSC
E
PIN ONE
IDENTIFIER
EXPOSED Cu
MOLD CMPD
TOP VIEW
DETAIL B
0.150 0.200 0.250
0.000 0.050 0.100
OPTIONAL
L1
A
CONSTRUCTION
DETAIL B
0.10
0.08
C
C
A1
8X
SEATING
PLANE
RECOMMENDED
MOUNTING FOOTPRINT*
NOTE 3
C
SIDE VIEW
D2
8X
0.35
1.44
PACKAGE
OUTLINE
DETAIL A
1
4
E2
1.40
8X
L1
1
0.44
0.40
PITCH
8X
0.26
8
5
8X b
8X
L
DIMENSIONS: MILLIMETERS
e
0.10
0.05
C
C
A
B
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
e/2
BOTTOM VIEW
ON Semiconductor and the
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.
SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed
at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation
or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets
and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each
customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended,
or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which
the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or
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expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim
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copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
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USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
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Phone: 81−3−5817−1050
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
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Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
For additional information, please contact your local
Sales Representative
NCP706B/D
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