NCV4279A50D1G [ONSEMI]
5.0 V Micropower 150 mA LDO Linear Regulator with DELAY, Adjustable RESET, and Sense Output; 5.0 V微150毫安LDO线性稳压器与延迟,可调复位和检测输出![NCV4279A50D1G](http://pdffile.icpdf.com/pdf1/p00141/img/icpdf/NCV42_782281_icpdf.jpg)
型号: | NCV4279A50D1G |
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描述: | 5.0 V Micropower 150 mA LDO Linear Regulator with DELAY, Adjustable RESET, and Sense Output |
文件: | 总14页 (文件大小:169K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
NCV4279A
5.0 V Micropower 150 mA
LDO Linear Regulator with
DELAY, Adjustable RESET,
and Sense Output
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The NCV4279A is a 5.0 V precision micropower voltage regulator
with an output current capability of 150 mA.
The output voltage is accurate within 2.0% with a maximum
dropout voltage of 0.5 V at 100 mA. Low quiescent current is a feature
drawing only 150 mA with a 1.0 mA load. This part is ideal for any and
all battery operated microprocessor equipment.
Microprocessor control logic includes an active reset output RO
with delay and a SI/SO monitor which can be used to provide an early
warning signal to the microprocessor of a potential impending reset
signal. The use of the SI/SO monitor allows the microprocessor to
finish any signal processing before the reset shuts the microprocessor
down.
The active Reset circuit operates correctly at an output voltage as
low as 1.0 V. The Reset function is activated during the power up
sequence or during normal operation if the output voltage drops
outside the regulation limits.
MARKING
DIAGRAMS
8
SO−8
D SUFFIX
CASE 751
4279A5
ALYW
G
8
1
1
14
SO−14
D SUFFIX
CASE 751A
NCV4279A5G
AWLYWW
14
1
1
A
= Assembly Location
WL, L = Wafer Lot
YY, Y = Year
WW, W = Work Week
The reset threshold voltage can be decreased by the connection of an
external resistor divider to the R
lead. The regulator is protected
ADJ
G, G
= Lead Free Indicators
against reverse battery, short circuit, and thermal overload conditions.
The device can withstand load dump transients making it suitable for
use in automotive environments. The device has also been optimized
for EMC conditions.
PIN CONNECTIONS
1
8
If the application requires pullup resistors at the logic outputs Reset
and Sense Out, the NCV4269A with integrated resistors can be used.
I
Q
SI
SO
RO
GND
R
Features
ADJ
D
• 5.0 V 2.0% Output
• Low 150 mA Quiescent Current
SO−8
• Active Reset Output Low Down to V = 1.0 V
Q
1
14
• Adjustable Reset Threshold
R
SI
ADJ
• 150 mA Output Current Capability
D
I
GND
GND
GND
GND
RO
GND
GND
GND
Q
• Fault Protection
♦ +60 V Peak Transient Voltage
♦ −40 V Reverse Voltage
♦ Short Circuit
SO
♦ Thermal Overload
SO−14
• Early Warning through SI/SO Leads
• Internally Fused Leads in SO−14 Package
• Very Low Dropout Voltage
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 12 of this data sheet.
• Electrical Parameters Guaranteed Over Entire Temperature Range
• These are Pb−Free Devices
• NCV Prefix for Automotive and Other Applications Requiring Site
and Change Controls
© Semiconductor Components Industries, LLC, 2009
1
Publication Order Number:
October, 2009 − Rev. 1
NCV4279A/D
NCV4279A
I
Q
Error
Amplifier
Current and
Reference
and Trim
Saturation
Control
RO
D
or
Reference
SO
R
ADJ
+
−
SI
GND
Figure 1. Block Diagram
PACKAGE PIN DESCRIPTION
Package Pin Number
SO−8
SO−14
Pin Symbol
Function
3
4
5
1
2
R
Reset Threshold Adjust; if not used to connect to GND.
Reset Delay; To Set Time Delay, Connect to GND with a Capacitor
Ground
ADJ
D
3, 4, 5, 6,
10, 11, 12
GND
6
7
8
1
2
7
8
RO
SO
Q
Reset Output; This is an Open−Collector Output. Leave Open if Not Used.
Sense Output; This is an Open−Collector Output. If not used, keep open.
5 V Output; Connect to GND with a 10 mF Capacitor, ESR < 10 W.
Input; Connect to GND Directly at the IC with a Ceramic Capacitor.
Sense Input; If not used, Connect to Q.
9
13
14
I
SI
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2
NCV4279A
MAXIMUM RATINGS (T = −40°C to 150°C)
J
Parameter
Symbol
Min
Max
Unit
Input to Regulator
V
I
−40
45
V
I
I
Internally Limited Internally Limited
Input Peak Transient Voltage
Sense Input
V
−
60
V
I
V
−40
−1
45
1
V
mA
SI
SI
I
Reset Threshold Adjust
Reset Delay
V
−0.3
−10
7
V
RADJ
RADJ
I
10
mA
V
−0.3
7
V
D
I
Internally Limited Internally Limited
D
Ground
I
50
−
mA
V
q
Reset Output
V
RO
RO
−0.3
7
I
Internally Limited Internally Limited
Sense Output
V
−0.3
7
V
SO
SO
I
Internally Limited Internally Limited
Regulated Output
V
Q
−0.5
−10
7.0
−
V
mA
Q
I
Junction Temperature
Storage Temperature
T
STG
−
−50
150
150
°C
°C
J
T
Input Voltage Operating Range
Junction Temperature Operating Range
V
J
−
−40
45
150
V
°C
I
T
Junction−to−Ambient Thermal Resistance
SO−8
R
−
200
70
k/W
q
q
JA
JP
SO−14
Junction−to−Pin 4, all GND Pins Grounded.
LEAD TEMPERATURE SOLDERING AND MSL
Parameter
SO−14
R
−
30
k/W
Symbol
Value
Unit
MSL, 8−Lead, 14−Lead, LS Temperature 260°C Peak (Notes 3)
MSL
1
−
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. This device series incorporates ESD protection and exceeds the following ratings:
Human Body Model (HBM) ≤ 4.0 kV per AEC−Q100−002.
Machine Model (MM) ≤ 200 V per AEC−Q100−003.
2. Latchup Current Maximum Rating: ≤ 150 mA per AEC−Q100−004.
3. Lead free: 60−150 Sec above 217°C, 40 Sec Max at Peak, 265°C Peak.
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3
NCV4279A
ELECTRICAL CHARACTERISTICS (T = −40°C ≤ T ≤ 125°C, V = 13.5 V unless otherwise specified)
J
J
I
Characteristic
REGULATOR
Symbol
Test Conditions
Min
Typ
Max
Unit
Output Voltage
Current Limit
V
1 mA v I v 100 mA; 6 V v V v 16 V
4.90
150
−
5.00
200
190
250
2.0
5.10
500
250
450
3.0
0.5
20
V
Q
Q
I
I
Q
−
mA
mA
mA
mA
V
Current Consumption; I = I – I
I
I
= 1 mA, RO, SO High
= 10 mA, RO, SO High
= 50 mA, RO, SO High
q
I
Q
Q
Q
q
q
q
Q
Current Consumption; I = I – I
I
I
I
I
−
q
I
Q
Current Consumption; I = I – I
−
q
I
Q
Dropout Voltage
Load Regulation
Line Regulation
V
dr
I
= 100 mA (Note 4)
= 5 mA to 100 mA
Q
−
0.25
10
Q
DV
DV
I
−
mV
mV
Q
V = 6 V to 26 V; I = 1 mA
−
10
30
Q
I
Q
RESET GENERATOR
Reset Switching Threshold
V
−
4.50
1.26
−
4.65
1.35
0.1
1.8
0.45
−
4.80
1.44
0.4
2.2
0.60
0.1
9.5
−
V
V
RT
Reset Adjust Switching Threshold
Reset Output Saturation Voltage
Upper Delay Switching Threshold
Lower Delay Switching Threshold
Saturation Voltage on Delay Capacitor
Charge Current
V
V > 3.5 V
Q
RADJ,TH
V
V
Q
< V , R = 20 kW
V
RO,SAT
RT RO
V
UD
−
−
1.4
0.3
−
V
V
V
LD
V
D,SAT
V
< V
RT
V
Q
I ,C
D
V
= 1 V
3.0
17
−
6.5
28
mA
ms
ms
D
Delay Time L ³ H
t
C
C
= 100 nF
= 100 nF
d
D
D
Delay Time H ³ L
t
3.15
−
RR
INPUT VOLTAGE SENSE
Sense Threshold High
V
−
−
1.24
1.16
−
1.31
1.20
0.1
1.38
1.28
0.4
V
V
SI,High
Sense Threshold Low
V
SI,Low
Sense Output Saturation Voltage
Sense Input Current
V
V
SI
< 1.20 V; V > 3 V; R = 20 kW
V
SO,Low
Q
SO
I
SI
−
−1.0
0.1
1.0
mA
4. Dropout voltage = V − V measured when the output voltage has dropped 100 mV from the nominal value obtained at 13.5 V input.
I
Q
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4
NCV4279A
I
I
I
Q
I
Q
C
Q
22 mF
C
I
R
1000 mF
ADJ1
R
470 nF
RO
R
SO
I
SI
I
RADJ
SI
D
RADJ
V
Q
GND
RO
SO
V
I
I
D
I
q
V
RO
V
SO
V
SI
V
RADJ
V
D
C
R
D
ADJ2
100 nF
Figure 2. Measuring Circuit
V
I
t
t
< t
RR
V
Q
V
RT
dV
dt
I
C
D
D
+
V
D
V
UD
V
LD
t
t
t
d
RR
V
RO
V
RO,SAT
t
Power−on−Reset
Thermal
Shutdown
Voltage Dip
at Input
Undervoltage
Secondary
Spike
Overload
at Output
Figure 3. Reset Timing Diagram
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5
NCV4279A
Sense Input Voltage
V
SI,High
V
SI,Low
t
Sense Output Voltage
High
Low
t
Figure 4. Sense Timing Diagram
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6
NCV4279A
TYPICAL PERFORMANCE CHARACTERISTICS
16
14
12
10
8
3.2
V = 13.5 V
I
V = 13.5 V
I
2.8
2.4
2.0
1.6
1.2
0.8
0.4
0
V
D
= 1.0 V
V
V
UD
6
4
LD
2
0
−40
0
40
80
120
160
−40
0
40
80
120
160
T (°C)
J
T (°C)
J
Figure 5. Charge Current ID,C vs. Temperature TJ
Figure 6. Switching Voltage VUD and VLD vs.
Temperature TJ
500
1.7
1.6
1.5
1.4
1.3
1.2
1.1
1.0
0.9
400
300
200
100
0
T = 125°C
J
T = 25°C
J
T = −40°C
J
0
30
60
90
(mA)
120
150
180
−40
0
40
80
120
160
I
Q
T (°C)
J
Figure 7. Drop Voltage Vdr vs. Output Current IQ
Figure 8. Reset Adjust Switching Threshold
RADJ,TH vs. Temperature TJ
V
35
30
25
20
15
10
5
12
10
8
R = 33 W
L
6
R = 50 W
L
4
R = 50 W
L
2
R = 200 W
L
R = 100 W
L
0
0
0
10
20
30
40
50
0
2
4
6
8
10
V (V)
I
V (V)
I
Figure 9. Current Consumption Iq vs.
Input Voltage VI
Figure 10. Output Voltage VQ vs.
Input Voltage VI
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NCV4279A
TYPICAL PERFORMANCE CHARACTERISTICS
5.2
1.6
1.5
1.4
1.3
1.2
1.1
1.0
V = 13.5 V
I
V = 13.5 V
I
5.1
5.0
4.9
4.8
4.7
4.6
Sense Output High
Sense Output Low
−40
0
40
80
120
160
−40
0
40
80
120
160
T (°C)
J
T (°C)
J
Figure 12. Output Voltage VQ vs. Temperature TJ
Figure 11. Sense Threshold VSI vs. Temperature TJ
350
300
250
T = 25°C
J
200
150
100
50
T = 125°C
J
0
0
10
20
30
40
50
V (V)
I
Figure 13. Output Current IQ vs. Input Voltage VI
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NCV4279A
TYPICAL PERFORMANCE CHARACTERISTICS
12
10
8
1.6
1.4
1.2
1.0
V = 13.5 V
T = 25°C
J
I
6
0.8
0.6
0.4
0.2
V = 13.5 V
T = 25°C
J
I
4
2
0
0
0
20
40
60
80
100
120
0
10
20
30
40
50
I
Q
(mA)
I (mA)
Q
Figure 14. Current Consumption Iq vs.
Output Current IQ
Figure 15. Current Consumption Iq vs.
Output Current IQ
7
6
5
4
3
2
1
0
250
200
150
100
50
T = 25°C
T = 25°C
J
J
I
= 100 mA
Q
I
= 100 mA
Q
I
= 50 mA
Q
I
= 10 mA
Q
0
6
8
10 12
14
16 18 20
22 24
26
6
8
10 12
14
16 18 20
V (V)
22 24
26
V (V)
I
I
Figure 16. Current Consumption Iq vs.
Input Voltage VI
Figure 17. Current Consumption Iq vs.
Input Voltage VI
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NCV4279A
APPLICATION DESCRIPTION
OUTPUT REGULATOR
If the reset adjust option is not needed, the R
pin
ADJ
The output is controlled by a precision trimmed reference.
The PNP output has drive quiescent current control for
regulation while the input voltage is low, preventing over
saturation. Current limit and voltage monitors complement
the regulator design to give safe operating signals to the
processor and control circuits.
should be connected to GND causing the reset threshold to
go to its default value (typically 4.65 V).
RESET DELAY (D)
The reset delay circuit provides a delay (programmable by
capacitor C ) on the reset output lead RO. The delay lead D
D
provides charge current I
(typically 6.5 mA) to the
D,C
RESET OUTPUT (RO)
A reset signal, Reset Output, RO, (low voltage) is
external delay capacitor C during the following times:
D
1. During Powerup (once the regulation threshold has
been exceeded).
2. After a reset event has occurred and the device is
back in regulation. The delay capacitor is set to
generated as the IC powers up. After the output voltage V
Q
increases above the reset threshold voltage V , the delay
RT
timer D is started. When the voltage on the delay timer V
D
passes V , the reset signal RO goes high. A discharge of
discharge when the regulation (V , reset
UD
RT
the delay timer V is started when V drops and stays below
threshold voltage) has been violated. When the
D
Q
the reset threshold voltage V . When the voltage of the
delay capacitor discharges to V , the reset signal
RT
LD
delay timer V drops below the lower threshold voltage V
RO pulls low.
D
LD
the reset output voltage V is brought low to reset the
RO
SETTING THE DELAY TIME
processor.
The delay time is set by the delay capacitor C and the
D
The reset output RO is an open collector NPN transistor,
controlled by a low voltage detection circuit. The circuit is
functionally independent of the rest of the IC, thereby
charge current I . The time is measured by the delay
D
capacitor voltage charging from the low level of V
to
DSAT
the higher level V . The time delay follows the equation:
UD
guaranteeing that RO is valid for V as low as 1.0 V.
Q
(eq. 2)
t
d
+ [C (V
* V )]ńI
D, SAT D
D
UD
RESET ADJUST (RADJ
)
Example:
Using C = 100 nF.
The reset threshold V can be decreased from a typical
RT
D
value of 4.65 V to as low as 3.5 V by using an external
voltage divider connected from the Q lead to the pin RADJ,
as shown in Figure 18. The resistor divider keeps the voltage
Use the typical value for V
= 0.1 V.
D,SAT
Use the typical value for V = 1.8 V.
UD
Use the typical value for Delay Charge Current I = 6.5 mA.
D
above the V
(typical 1.35 V) for the desired input
RADJ,TH
voltages, and overrides the internal threshold detector.
Adjust the voltage divider according to the following
relationship:
(eq. 3)
t
d
+ [100 nF(1.8 * 0.1 V)]ń6.5 mA + 26.2 ms
V
RT
+ V
@ (R
) R
)ńR
ADJ2 ADJ2
(eq. 1)
RADJ, TH
ADJ1
V
BAT
I
Q
V
DD
R
R
ADJ1
ADJ2
C *
0.1 mF
I
C **
10 mF
(2.2 mF)
Q
R
ADJ
NCV4279A
R
R
SI1
D
R
RO
SI
R
SO
SI2
C
D
RO
I/O
SO
I/O
GND
*C required if regulator is located far from the power supply filter.
I
** C − minimum cap required for stability is 2.2 mF while higher over/under−shoots may be ex-
Q
pected. Cap must operate at required temperature range.
Figure 18. Application Diagram
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10
NCV4279A
SENSE INPUT (SI) / SENSE OUTPUT (SO) VOLTAGE
MONITOR
solution, but, if the circuit operates at low temperatures
(−25°C to −40°C), both the value and ESR of the capacitor
will vary considerably. The capacitor manufacturer’s data
sheet usually provides this information.
An on−chip comparator is available to provide early
warning to the microprocessor of a possible reset signal. The
output is from an open collector driver. The reset signal
typically turns the microprocessor off instantaneously. This
can cause unpredictable results with the microprocessor.
The signal received from the SO pin will allow the
microprocessor time to complete its present task before
shutting down. This function is performed by a comparator
referenced to the band gap voltage. The actual trip point can
be programmed externally using a resistor divider to the
The 10 mF output capacitor C shown in Figure 18 should
Q
work for most applications; however, it is not necessarily the
optimized solution. Stability is guaranteed at CQ is min
2.2 mF and max ESR is 10 W. There is no min ESR limit
which was proved with MURATA’s ceramic caps
GRM31MR71A225KA01 (2.2 mF, 10 V, X7R, 1206) and
GRM31CR71A106KA01 (10 mF, 10 V, X7R, 1206) directly
soldered between output and ground pins.
input monitor SI (Figure 18). The values for R and R
SI1
SI2
CALCULATING POWER DISSIPATION IN A SINGLE
OUTPUT LINEAR REGULATOR
are selected for a typical threshold of 1.20 V on the SI Pin.
SIGNAL OUTPUT
Figure 19 shows the SO Monitor timing waveforms as a
result of the circuit depicted in Figure 18. As the output
The maximum power dissipation for a single output
regulator (Figure 18) is:
P
+ [V
I(max)
* V
]I
) V
I
(eq. 4)
D(max)
Q(min) Q(max)
I(max) q
voltage (V ) falls, the monitor threshold (V
), is
Q
SILOW
where:
crossed. This causes the voltage on the SO output to go low
sending a warning signal to the microprocessor that a reset
signal may occur in a short period of time. T
time the microprocessor has to complete the function it is
currently working on and get ready for the reset
shutdown signal. When the voltage on the SO goes low and
the RO stays high the current consumption is typically
560 mA at 1 mA load current.
V
I(max)
is the maximum input voltage,
V
Q(min)
is the minimum output voltage,
is the
WARNING
I
is the maximum output current for the application,
Q(max)
and I is the quiescent current the regulator consumes at
q
I
.
Q(max)
Once the value of P
is known, the maximum
D(max)
permissible value of R
can be calculated:
qJA
= (150°C – T ) / P
D
R
(eq. 5)
q
JA
A
V
Q
The value of R
can then be compared with those in the
qJA
package section of the data sheet. Those packages with R ’s
qJA
less than the calculated value in equation 2 will keep the die
temperature below 150°C. In some cases, none of the packages
will be sufficient to dissipate the heat generated by the IC, and
an external heatsink will be required. The current flow and
voltages are shown in the Measurement Circuit Diagram.
SI
V
SI,Low
V
RO
HEATSINKS
A heatsink effectively increases the surface area of the
package to improve the flow of heat away from the IC and
into the surrounding air.
SO
Each material in the heat flow path between the IC and the
outside environment will have a thermal resistance. Like
series electrical resistances, these resistances are summed to
T
WARNING
determine the value of R
:
Figure 19. SO Warning Waveform Time Diagram
q
JA
R
+ R
) R
) R
qCS qSA
(eq. 6)
qJA
qJC
STABILITY CONSIDERATIONS
where:
The input capacitor C in Figure 18 is necessary for
I
R
qJC
R
qCS
R
qSA
= the junction−to−case thermal resistance,
= the case−to−heat sink thermal resistance, and
= the heat sink−to−ambient thermal resistance.
compensating input line reactance. Possible oscillations
caused by input inductance and input capacitance can be
damped by using a resistor of approximately 1.0 W in series
R
qJC
appears in the package section of the data sheet. Like
with C
I.
R
qJA
, it too is a function of package type. R
and R
are
qCS
qSA
The output or compensation capacitor helps determine
three main characteristics of a linear regulator: startup delay,
load transient response and loop stability.
The capacitor value and type should be based on cost,
availability, size and temperature constraints. The
aluminum electrolytic capacitor is the least expensive
functions of the package type, heatsink and the interface
between them. These values appear in data sheets of
heatsink manufacturers. Thermal, mounting, and
heatsinking considerations are discussed in the
ON Semiconductor application note AN1040/D, available
on the ON Semiconductor website.
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11
NCV4279A
ORDERING INFORMATION
Device
†
Output Voltage
Package
Shipping
NCV4279A50D1G
SO−8
98 Units/Rail
2500 Tape & Reel
55 Units/Rail
(Pb−Free)
NCV4279A50D1R2G
NCV4279A50D2G
SO−8
(Pb−Free)
5.0 V
SO−14
(Pb−Free)
NCV4279A50D2R2G
SO−14
(Pb−Free)
2500 Tape & Reel
†For information on tape and reel specifications,including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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12
NCV4279A
PACKAGE DIMENSIONS
SO−8
D SUFFIX
CASE 751−07
ISSUE AJ
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
−X−
A
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
8
5
4
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
STANDARD IS 751−07.
S
M
M
B
0.25 (0.010)
Y
1
K
−Y−
G
MILLIMETERS
DIM MIN MAX
INCHES
MIN
MAX
0.197
0.157
0.069
0.020
A
B
C
D
G
H
J
K
M
N
S
4.80
3.80
1.35
0.33
5.00 0.189
4.00 0.150
1.75 0.053
0.51 0.013
C
N X 45
_
SEATING
PLANE
−Z−
1.27 BSC
0.050 BSC
0.10 (0.004)
0.10
0.19
0.40
0
0.25 0.004
0.25 0.007
1.27 0.016
0.010
0.010
0.050
8
0.020
0.244
M
J
H
D
8
0
_
_
_
_
0.25
5.80
0.50 0.010
6.20 0.228
M
S
S
X
0.25 (0.010)
Z
Y
SOLDERING FOOTPRINT*
1.52
0.060
7.0
4.0
0.275
0.155
0.6
0.024
1.270
0.050
mm
inches
ǒ
Ǔ
SCALE 6:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
13
NCV4279A
PACKAGE DIMENSIONS
SOIC−14
CASE 751A−03
ISSUE J
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
−A−
14
8
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.127
(0.005) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
−B−
P 7 PL
M
M
B
0.25 (0.010)
7
1
G
MILLIMETERS
DIM MIN MAX
INCHES
MIN MAX
F
R X 45
_
C
A
B
C
D
F
G
J
K
M
P
R
8.55
3.80
1.35
0.35
0.40
8.75 0.337 0.344
4.00 0.150 0.157
1.75 0.054 0.068
0.49 0.014 0.019
1.25 0.016 0.049
0.050 BSC
0.25 0.008 0.009
0.25 0.004 0.009
−T−
J
M
K
SEATING
1.27 BSC
D 14 PL
PLANE
0.19
0.10
0
M
S
S
0.25 (0.010)
T
B
A
7
0
7
_
_
_
_
5.80
0.25
6.20 0.228 0.244
0.50 0.010 0.019
SOLDERING FOOTPRINT*
7X
7.04
14X
1.52
1
14X
0.58
1.27
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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