NCV4296-2CSN50T1G [ONSEMI]
Low Dropout Voltage Regulator;型号: | NCV4296-2CSN50T1G |
厂家: | ONSEMI |
描述: | Low Dropout Voltage Regulator 光电二极管 输出元件 调节器 |
文件: | 总11页 (文件大小:159K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
NCV4296-2C
30 mA Low Dropout Voltage
Regulator with Inhibit
The NCV4296−2C is a monolithic integrated low dropout voltage
regulator with an output current capability of 30 mA available in the
TSOP–5 package.
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The output voltage is accurate within 4.0% with a maximum
dropout voltage of 250 mV with an input up to 45 V. Low quiescent
current is a feature typically drawing only 160 mA with a 1 mA load.
With Inhibit feature, the regulator can be turned off and the device
consumes less than 5 mA of quiescent current. This part is ideal for
automotive and all battery operated microprocessor equipment.
The regulator is protected against reverse battery, short circuit and
thermal overload conditions.
MARKING
DIAGRAM
5
TSOP−5
CASE 483
xxxAYWG
5
G
1
1
Features
xxx = Specific Device Code
• Output Voltage Options: 3.3 V, 5.0 V
• Output Voltage Accuracy: 4.0%
• Output Current: up to 30 mA
A
Y
W
G
= Assembly Location
= Year
= Work Week
= Pb−Free Package
• Low Quiescent Current (typ. 160 mA @ 1 mA)
• Low Dropout Voltage (typ. 65 mV @ 20 mA)
• Wide Input Voltage Operating Range: up to 45 V
• Inhibit Input
(Note: Microdot may be in either location)
PIN CONNECTIONS
• Protection Features:
GND
INH
1
2
3
5
♦ Current Limitation
GND
♦ Thermal Shutdown
♦ Reverse Polarity Protection and Reverse Bias Protection
V
in
V
out
4
• AEC−Q100 Grade 1 Qualified and PPAP Capable
• This is a Pb−Free Device
(Top View)
Typical Applications
ORDERING INFORMATION
See detailed ordering, marking and shipping information on
• Microprocessor Systems Power Supply
page 10 of this data sheet.
Output
Input
C
V
out
V
in
C
in
out
NCV4296−2C
100 nF
2.2 mF
INH
GND
Inhibit
Figure 1. Applications Circuit
©
Semiconductor Components Industries, LLC, 2015
1
Publication Order Number:
November, 2017 − Rev. 1
NCV4296−2C/D
NCV4296−2C
V
out
V
in
VOLTAGE
REFERENCE
V
REF
SP
INHIBIT
INH
V
REF
SATURATION
PROTECTION
SP
TSD
THERMAL
SHUTDOWN
TSD
GND
Figure 2. Simplified Block Diagram
PIN FUNCTION DESCRIPTION
Pin No.
TSOP−5
Pin Name
Description
1
2
3
4
5
INH
Inhibit Input. Low level disables the IC.
Power Supply Ground.
GND
V
in
Unregulated Positive Power Supply Input. Connect 0.1 mF capacitor to ground.
V
out
Regulated Positive Output Voltage. Connect 2.2 mF capacitor with ESR < 7 W to ground.
GND
Power Supply Ground.
ABSOLUTE MAXIMUM RATINGS
Rating
Symbol
Min
Max
Unit
Input Voltage DC (Note 1)
DC
V
in
V
−42
45
Input Voltage (Note 2)
U
V
s
Load Dump − Suppressed
−
60
30
Output Voltage
V
out
−6
V
V
Inhibit Input Voltage
DC
V
INH
−42
45
Inhibit Input Current Range
DC
I
mA
INH
−0.5
−5
−
5
Transient, −0.3 V ≤ V 45 V, t < 1 ms
in
p
Maximum Junction Temperature
Storage Temperature
T
−40
−50
150
150
°C
°C
J(max)
T
STG
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
2. Load Dump Test B (with centralized load dump suppression) according to ISO16750−2 standard. Guaranteed by design. Not tested in
production. Passed Class A according to ISO16750−1.
ESD CAPABILITY (Note 3)
Rating
Symbol
ESD
Min
Max
Unit
ESD Capability, Human Body Model
−2
2
kV
HBM
3. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per AEC−Q100−002 (JS−001−2010)
2
Field Induced Charge Device Model ESD characterization is not performed on plastic molded packages with body sizes <50mm due to the
inability of a small package body to acquire and retain enough charge to meet the minimum CDM discharge current waveform characteristic
defined in JEDEC JS−002−2014.
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2
NCV4296−2C
LEAD SOLDERING TEMPERATURE AND MSL (Note 4)
Rating
Symbol
Min
Max
Unit
Moisture Sensitivity Level
MSL
1
−
4. For more information, please refer to our Soldering and Mounting Techniques Reference Manual, SOLDERRM/D
THERMAL CHARACTERISTICS
Rating
Symbol
Value
Unit
Thermal Characteristics, TSOP−5
Thermal Resistance, Junction−to−Air (Note 5)
°C/W
R
θJA
136.2
2
2
5. Values based on copper area of 645 mm (or 1 in ) of 1 oz copper thickness and FR4 PCB substrate.
RECOMMENDED OPERATING RANGES
Rating
Symbol
Min
Max
45
Unit
V
Input Voltage (Note 6)
Inhibit Input Voltage
Junction Temperature
V
in
V
+ 0.5 or 3.5
out, nom
V
−0.3
−40
40
V
INH
T
150
°C
J
Functionaloperation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the
RecommendedOperating Ranges limits may affect device reliability.
6. Minimum V = V
+ 0.5 or 3.5, whichever is higher.
in
out, nom
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3
NCV4296−2C
ELECTRICAL CHARACTERISTICS V = 13.5 V, V
> 2.5 V, C = 0.1 mF, C = 2.2 mF, for typical values T = 25°C, for min/max
values T = −40°C to 150°C; unless otherwise noted. (Note 7)
in
INH
in
out
J
J
Parameter
REGULATOR OUTPUT
Output Voltage
Test Conditions
Symbol
Min
Typ
Max
Unit
5.0 V V = 13.5 V, I = 1 mA to 30 mA
V
out
4.80
4.80
3.17
3.17
5.00
5.00
3.30
3.30
5.20
5.20
3.43
3.43
V
in
in
out
V
= 6 V to 40 V, I = 10 mA
out
3.3 V V = 13.5 V, I = 1 mA to 30 mA
in
in
out
V
= 4.3 V to 40 V, I = 10 mA
out
Line Regulation
V
V
= V
= V
to 36 V, I = 5 mA, T = 25°C
Reg
−
−
5
20
30
mV
mV
mV
in
in
in, min
in, min
out
J
line
to 36 V, I = 5 mA
10
out
Load Regulation
I
I
= 1 mA to 25 mA, T = 25°C
= 1 mA to 25 mA
Reg
−
−
3
10
20
30
out
out
J
load
Dropout Voltage (Note 8)
I
= 20 mA
V
DO
−
65
250
out
DISABLE AND QUIESCENT CURRENTS
Disable Current
V
INH
V
INH
<= 0.4 V, TJ < 85°C
<= 0.4 V
I
−
−
0
0
1
5
μA
DIS
Quiescent Current, I = I − I
I
q
q
in
out
I
I
I
< 0.1 mA, T < 85°C
−
−
−
150
160
0.8
170
200
4
μA
μA
mA
out
out
out
J
< 1 mA
< 30 mA
CURRENT LIMIT PROTECTION
Current Limit
V
= V
– 100 mV
I
30
−
−
−
mA
dB
V
out
out, nom
LIM
PSRR
Power Supply Ripple Rejection
INHIBIT
f = 100 Hz, 0.5 V
PSRR
−
60
pp
Inhibit Input Threshold Voltage
Low (Off−State)
V
INH
V
out
< 0.1 V
> 0.95 x V
0.4
−
1.76
1.82
−
2.2
out
High (On−State)
V
out, nom
Inhibit Input Current
Low (Off−State)
High (On−State)
μA
°C
V
INH
V
INH
= 0 V
= 5 V
I
−2
−
2
INH_OFF
INH_ON
I
−
6
12
THERMAL SHUTDOWN
Thermal Shutdown Temperature
(Note 9)
T
SD
151
175
195
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performancemay not be indicated by the Electrical Characteristics if operated under different conditions.
7. Performanceguaranteed over the indicated operating temperature range by design and/or characterization tested at T [T . Low duty cycle
A
J
pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
8. Measuredwhen output voltage falls 100 mV below the regulated voltage at V = 13.5 V. If V
< 5 V, then V = V − V . Maximum dropout
in
out
DO in out
voltage value is limited by minimum input voltage V = V
+ 0.5 V recommended for guaranteed operation at maximum output current.
in
out, nom
9. Values based on design and/or characterization.
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4
NCV4296−2C
TYPICAL CHARACTERISTICS − 5.0 V VERSION
1000
Unstable Region
100
10
1
Stable Region
C
≥ 2.2 mF
out
0.1
T = 25°C
J
0.01
0
5
10
15
20
25
30
I
, OUTPUT CURRENT (mA)
out
Figure 3. Output Stability with Output
Capacitor ESR
5.10
5.05
5.00
6
V
= 13.5 V
in
R = 5 kW
5
4
3
2
L
4.95
4.90
R = 166 W
T = 25°C
J
1
0
L
−40
0
40
80
120
160
0
1
2
3
4
5
6
7
8
9
10
T , JUNCTION TEMPERATURE (°C)
J
V , INPUT VOLTAGE (V)
in
Figure 4. Output Voltage vs. Junction
Temperature
Figure 5. Output Voltage vs. Input Voltage
150
100
70
60
T = 125°C
J
50
40
30
20
T = 25°C
J
T = −40°C
J
50
0
V
out
= 0 V
10
0
T = 25°C
J
0
5
10
15
20
25
30
0
5
10
15
20
25
30
35
40 45
I
, OUTPUT CURRENT (mA)
V , INPUT VOLTAGE (V)
in
out
Figure 6. Dropout Voltage vs. Output Current
Figure 7. Maximum Output Current vs. Input
Voltage
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5
NCV4296−2C
TYPICAL CHARACTERISTICS − 5.0 V VERSION
0.8
0.7
0.6
0.5
0.4
0.3
0.2
300
200
V
= 13.5 V
in
T = 25°C
J
100
0
V
in
= 13.5 V
0.1
0
T = 25°C
J
0
5
10
15
20
25
30
0
1
2
3
4
5
I
, OUTPUT CURRENT (mA)
I
, OUTPUT CURRENT (mA)
out
out
Figure 8. Quiescent Current vs. Output Current
(High Load)
Figure 9. Quiescent Current vs. Output Current
(Low Load)
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
R = 166 W
T = 25°C
J
L
0.5
0
0
5
10
15
20
25
30
35
40
V , INPUT VOLTAGE (V)
in
Figure 10. Quiescent Current vs. Input Voltage
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6
NCV4296−2C
TYPICAL CHARACTERISTICS − 3.3 V VERSION
1000
Unstable Region
100
10
1
Stable Region
C
≥ 2.2 mF
out
0.1
T = 25°C
J
0.01
0
5
10
15
20
25
30
I
, OUTPUT CURRENT (mA)
out
Figure 11. Output Stability with Output
Capacitor ESR
3.40
3.35
3.30
4.0
V
= 13.5 V
in
3.5
3.0
2.5
2.0
1.5
1.0
R = 3.3 kW
L
3.25
3.20
R = 110 W
L
0.5
0
T = 25°C
J
−40
0
40
80
120
160
0
1
2
3
4
5
6
7
8
9
10
T , JUNCTION TEMPERATURE (°C)
J
V , INPUT VOLTAGE (V)
in
Figure 12. Output Voltage vs. Junction
Temperature
Figure 13. Output Voltage vs. Input Voltage
70
60
50
40
30
20
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
R = 110 W
T = 25°C
J
L
V
= 0 V
10
0
out
0.5
0
T = 25°C
J
0
5
10
15
20
25
30
35
40
45
0
5
10
15
20
25
30
35
40
V , INPUT VOLTAGE (V)
in
V , INPUT VOLTAGE (V)
in
Figure 14. Maximum Output Current vs. Input
Voltage
Figure 15. Quiescent Current vs. Input Voltage
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7
NCV4296−2C
TYPICAL CHARACTERISTICS − 3.3 V VERSION
0.8
0.7
0.6
0.5
0.4
0.3
0.2
300
200
V
= 13.5 V
in
T = 25°C
J
100
0
V
in
= 13.5 V
0.1
0
T = 25°C
J
0
5
10
15
20
25
30
0
1
2
3
4
5
I
, OUTPUT CURRENT (mA)
I
, OUTPUT CURRENT (mA)
out
out
Figure 16. Quiescent Current vs. Output
Current (High Load)
Figure 17. Quiescent Current vs. Output
Current (Low Load)
200
175
150
1 oz
2 oz
125
100
0
100
200
300
400
500
600
700
2
PCB Cu Area (mm )
Figure 18. RqJA vs. PCB Cu Area
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8
NCV4296−2C
DEFINITIONS
General
output load current. If Inhibit pin is set to LOW the
regulator reduces its internal bias and shuts off the output,
All measurements are performed using short pulse low
duty cycle techniques to maintain junction temperature as
close as possible to ambient temperature.
this term is called the disable current (I ).
DIS
Current Limit
Output voltage
Current Limit is value of output current by which output
voltage drops 100 mV below its nominal value. It means
that the device is capable to supply minimum 30 mA.
The output voltage parameter is defined for specific
temperature, input voltage and output current values or
specified over Line, Load and Temperature ranges.
PSRR
Line Regulation
Power Supply Rejection Ratio is defined as ratio of
output voltage and input voltage ripple. It is measured in
decibels (dB).
The change in output voltage for a change in input
voltage measured for specific output current over operating
ambient temperature range.
Thermal Protection
Load Regulation
Internal thermal shutdown circuitry is provided to
protect the integrated circuit in the event that the maximum
junction temperature is exceeded. When activated at
typically 175°C, the regulator turns off. This feature is
provided to prevent failures from accidental overheating.
The change in output voltage for a change in output
current measured for specific input voltage over operating
ambient temperature range.
Dropout Voltage
The input to output differential at which the regulator
output no longer maintains regulation against further
reductions in input voltage. It is measured when the output
drops 100 mV below its nominal value. The junction
temperature, load current, and minimum input supply
requirements affect the dropout level.
Maximum Package Power Dissipation
The power dissipation level is maximum allowed power
dissipation for particular package or power dissipation at
which the junction temperature reaches its maximum
operating value, whichever is lower.
Quiescent and Disable Currents
Quiescent Current (I ) is the difference between the input
q
current (measured through the LDO input pin) and the
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9
NCV4296−2C
APPLICATIONS INFORMATION
The NCV4296−2C low dropout regulator is
configuration on the PCB, the board material, and the
ambient temperature affect the rate of junction temperature
rise for the part. When the NCV4296−2C has good thermal
conductivity through the PCB, the junction temperature
will be relatively low with high power applications. The
maximum dissipation the NCV4296−2C can handle is
given by:
self−protected with internal thermal shutdown and internal
current limit. Typical characteristics are shown in Figure 3
to Figure 18.
Input Decoupling (Cin)
A ceramic or tantalum 0.1 mF capacitor is recommended
and should be connected close to the NCV4296−2C
package. Higher capacitance and lower ESR will improve
the overall line and load transient response.
ƪT
ƫ
J(MAX) * TA
(eq. 1)
PD(MAX)
+
RqJA
Since T is not recommended to exceed 150°C, then the
J
Output Decoupling (Cout
)
2
NCV4296−2C soldered on 645 mm , 1 oz copper area, FR4
The NCV4296−2C is a stable component and does not
require a minimum Equivalent Series Resistance (ESR) for
the output capacitor. Stability region of ESR vs. Output
Current is shown in Figures 3 and 11. The minimum output
decoupling value is 2.2 mF and can be augmented to fulfill
stringent load transient requirements. The regulator works
with ceramic chip capacitors as well as tantalum devices.
Larger values improve noise rejection and load transient
response.
can dissipate up to 0.92 W when the ambient temperature
(T ) is 25°C. See Figure 18 for R
versus PCB area. The
power dissipated by the NCV4296−2C can be calculated
A
thJA
from the following equations:
ǒ
Ǔ
ǒ
Ǔ
in * Vout
(eq. 2)
(eq. 3)
P
D [ Vin Iq@Iout ) Iout
V
or
ǒ
Ǔ
PD(MAX) ) Vout Iout
Iout ) Iq
Vin(MAX)
[
Inhibit Operation
The Inhibit pin will turn the regulator on or off. The
threshold limits are covered in the electrical characteristics
table in this data sheet.
Hints
V and GND printed circuit board traces should be as wide
in
as possible. When the impedance of these traces is high,
there is a chance to pick up noise or cause the regulator to
malfunction. Place external components, especially the
output capacitor, as close as possible to the NCV4296−2C
and make traces as short as possible.
Thermal Considerations
As power in the NCV4296−2C increases, it might
become necessary to provide some thermal relief. The
maximum power dissipation supported by the device is
dependent upon board design and layout. Mounting pad
ORDERING INFORMATION
†
Device
Marking
65V
Package
Shipping
NCV4296−2CSN50T1G
NCV4296−2CSN33T1G
TSOP−5
(Pb−Free)
3000 / Tape & Reel
63V
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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10
NCV4296−2C
PACKAGE DIMENSIONS
TSOP−5
CASE 483
ISSUE M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
NOTE 5
5X
D
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.15 PER SIDE. DIMENSION A.
5. OPTIONAL CONSTRUCTION: AN ADDITIONAL
TRIMMED LEAD IS ALLOWED IN THIS LOCATION.
TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2
FROM BODY.
0.20 C A B
2X
0.10
T
M
5
4
3
2X
0.20
T
B
S
1
2
K
B
A
DETAIL Z
G
A
MILLIMETERS
TOP VIEW
DIM
A
B
C
D
MIN
2.85
1.35
0.90
0.25
MAX
3.15
1.65
1.10
0.50
DETAIL Z
J
G
H
J
K
M
S
0.95 BSC
C
0.01
0.10
0.20
0
0.10
0.26
0.60
10
3.00
0.05
H
SEATING
PLANE
END VIEW
C
_
_
SIDE VIEW
2.50
SOLDERING FOOTPRINT*
1.9
0.074
0.95
0.037
2.4
0.094
1.0
0.039
0.7
0.028
mm
inches
ǒ
Ǔ
SCALE 10:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
MountingTechniques Reference Manual, SOLDERRM/D.
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NCV4296−2C/D
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