NCV7240_17 [ONSEMI]
Octal Low-Side Relay Driver;
| 型号： | NCV7240_17 |
| 厂家： | 
ONSEMI |
| 描述： | Octal Low-Side Relay Driver |
| 文件： | 总27页 (文件大小：235K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
NCV7240, NCV7240A,
NCV7240B
Octal Low-Side
Relay Driver
The NCV7240 is an automotive eight channel low−side driver
providing drive capability up to 600 mA per channel. Output control is
via a SPI port and offers convenient reporting of faults for open load
(or short to ground), over load, and over temperature conditions.
Additionally, parallel control of the outputs is addressable (in pairs)
via the INx pins.
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MARKING
DIAGRAM
A dedicated limp−home mode pin (LHI) enables OUT1−OUT4
while disabling OUT5−OUT8.
NCV7240x
AWLYWWG
Each output driver is protected for over load current and includes an
output clamp for inductive loads.
The NCV7240 is available in a SSOP−24 fused lead package.
SSOP−24
CASE 565AL
Features
NCV7240x = Specific Device Code
• 8 Channels
(x = blank, A or B)
= Assembly Location
= Wafer Lot
• 600 mA Low−Side Drivers
A
WL
Y
♦ R
1.5 W (Typ), 3 W (Max)
DS(on)
= Year
• 16−bit SPI Control
WW
G
= Work Week
= Pb−Free Package
♦ Frame Error Detection (8−bit)
♦ Daisy Chain Capable
• Parallel Input Pins for PWM operation
• Power Up Without Open Circuit Detection Active (for LED
applications)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 26 of this data sheet.
• Low Quiescent Current in Sleep and Standby Modes
• Limp Home Functionality
• 3.3 V and 5 V compatible Digital Input Supply Range
• Fault Reporting
♦ Open Load Detection (selectable)
♦ Over Load
♦ Over Temperature
• Power−on Reset (VDD, VDDA)
• SSOP−24 Package (internally fused leads)
• NCV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
• These are Pb−Free Devices
Applications
• Automotive Body Control Unit
• Automotive Engine Control Unit
• Relay Drive
• LED Drive
• Stepper Motor Driver
© Semiconductor Components Industries, LLC, 2017
1
Publication Order Number:
November, 2017 − Rev. 11
NCV7240/D
NCV7240, NCV7240A, NCV7240B
VDDA
VDD
Bias, Supply monitoring & POR
EN
OUT1
OUT2
OUT1
OUT2
CSB
SCLK
SI
SO
OUT3
OUT4
OUT3
OUT4
OUT5
OUT6
OUT5
OUT6
OUT7
OUT1−OUT4
ON
OUT7
SPI
OUT8
GND
OUT8
LHI
OUT1 & 5
OUT2 & 5
OUT3 & 7
OUT4 & 8
IN1
IN2
IN3
IN4
Figure 1. Basic Block Diagram
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2
NCV7240, NCV7240A, NCV7240B
NCV7240
Vbat
14V
VDDA
VDD
10uF
OUT1
OUT2
OUT3
OUT4
OUT5
OUT6
0.1uF
5V
3.3V
or
5V
0.1uF
SO
CSB
SCLK
SI
OUT7
OUT8
GND
GND
EN
GND
GND
IN1
IN2
IN3
IN4
LHI
Figure 2. Application Diagram (relay loads)
1
GND
VDDA
CSB
SI
GND
OUT1
OUT2
OUT3
OUT4
OUT5
OUT6
OUT7
OUT8
GND
EN
SCLK
SO
LHI
IN1
IN2
IN3
IN4
VDD
GND
Figure 3. Pinout
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3
NCV7240, NCV7240A, NCV7240B
PACKAGE PIN DESCRIPTION
SSOP−24
Symbol
GND
Description
1
2
Ground.
Ground.
GND
3
OUT1
OUT2
OUT3
OUT4
OUT5
OUT6
OUT7
OUT8
GND
Channel 1 low−side drive output. Requires an external pull−up device for operation.
Channel 2 low−side drive output. Requires an external pull−up device for operation.
Channel 3 low−side drive output. Requires an external pull−up device for operation.
Channel 4 low−side drive output. Requires an external pull−up device for operation.
Channel 5 low−side drive output. Requires an external pull−up device for operation.
Channel 6 low−side drive output. Requires an external pull−up device for operation.
Channel 7 low−side drive output. Requires an external pull−up device for operation.
Channel 8 low−side drive output. Requires an external pull−up device for operation.
Ground.
4
5
6
7
8
9
10
11
12
13
14
GND
Ground.
VDD
Digital Power Supply for SO output (3.3 V or 5 V).
IN4
Parallel control of OUT4 and OUT8
Ground if not used for best EMI performance.
Alternatively keep open and internal pull−down will hold the input low.
(120 kW pull down resistor).
15
16
17
18
IN3
IN2
IN1
LHI
Parallel control of OUT3 and OUT7
Ground if not used for best EMI performance.
Alternatively keep open and internal pull−down will hold the input low.
(120 kW pull down resistor).
Parallel control of OUT2 and OUT6.
Ground if not used for best EMI performance.
Alternatively keep open and internal pull−down will hold the input low.
(120 kW pull down resistor).
Parallel control of OUT1 and OUT5.
Ground if not used for best EMI performance.
Alternatively keep open and internal pull−down will hold the input low.
(120 kW pull down resistor).
Limp Home Input. Active High.
A high on this pin powers up the device and activates the respective output drive INx designator while
disabling outputs OUT5−OUT8.
Input SPI commands are ignored, but the output register reports faults.
(Read capability only. No write capability.)
All registers are reset coming out of LHI mode.
Ground if not used for best EMI performance.
Alternatively keep open and internal pull−down resistor (120 kW) will hold the input low.
19
20
21
22
23
24
SO
SCLK
EN
SPI serial data output. Output high voltage level referenced to pin VDD.
SPI clock (120 kW pull down resistor).
Global Enable (active high). (120 kW pull down resistor).
SPI serial data input (120 kW pull down resistor).
SPI Chip Select ”Bar” (120 kW pull up resistor to VDD).
Analog Power Supply Input voltage (5 V).
SI
CSB
VDDA
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4
NCV7240, NCV7240A, NCV7240B
MAXIMUM RATINGS
Parameter
Min
Max
5.5
Unit
Supply Input Voltage (VDDA, VDD)
DC
V
−0.3
Digital I/O pin voltage
V
V
−0.3
−0.3
5.5
(EN, LHI, Inx, CSB, SCLK, SI)
(SO)
V
+ 0.3
DD
High Voltage Pins (OUTx)
DC
−0.3
−1
36
Peak Transient
44 (Note 1)
Output Current (OUTx)
1.3
A
Clamping Energy
mJ
Maximum (single pulse)
−
−
75
−
Repetitive (multiple pulse) (Note 2)
Operating Junction Temperature Range
Storage Temperature Range
−40
−55
150
150
°C
°C
V
ESD Capability,
Human body model (100 pF, 1.5 kW) (OUTx pins)
Human body model (100 pF, 1.5 kW) (all other pins)
−4000
−2000
4000
2000
ESD Capability
V
Machine Model (200 pF)
−200
200
−
AECQ10x−12−RevA
Short Circuit Reliability Characterization
Grade A
PACKAGE
Moisture Sensitivity Level
MSL2
−
Lead Temperature Soldering: SMD style only, Reflow (Note 3)
Pb−Free Part 60 − 150 sec above 217°C, 40 sec max at peak
265 peak
°C
Package Thermal Resistance (per JESD51)
SSOP−24
°C/W
2
Junction−to−Ambient (1s0p + 600 mm Cu) (Note 4)
68
62
30
Junction−to−Ambient (2s2p) (Notes 4 and 5)
Junction−to−Pin (pins 1, 2, 11, 12) (Note 6)
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Internally limited. Specification applies to unpowered and powered modes. (0 V to VDDA, 0 V to VDD)
2. Testing particulars, 2M pulses, V = 15 V, 63 W, 390 mH, T = 25°C. (See Figure 4)
bat
A
3. For additional information, see or download ON Semiconductor’s Soldering and Mounting Techniques Reference Manual, SOLDERRM/D
and Application Note AND8083/D.
2
4. 76 mm x 76 mm x 1.5 mm FR4 PCB with additional heat spreading copper (2 oz) of 600 mm , LS1 to LS8 dissipating 100 mW each. No
vias.
5. Include 2 inner 1 oz copper layers. No vias.
6. One output dissipating 100 mW.
Figure 4. Repetitive Clamping Energy Test
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NCV7240, NCV7240A, NCV7240B
ELECTRICAL CHARACTERISTICS (3.0 V < VDD < VDDA, 4.5 V < VDDA (Note 7) < 5.5 V, −40°C v T v 150°C, EN = VDD,
J
LHI = 0 V unless otherwise specified).
Characteristic
Conditions
Min
Typ
Max
Unit
GENERAL
Operating Current (VDDA)
ON Mode
mA
−
3
5
(All Channels On)
Quiescent Current (VDDA)
Global Standby Mode
(All Channels Off)
SI = SCLK = 0 V, CSB = VDD
mA
mA
T = 25°C
−
−
−
32
35
40
J
T = 85°C
J
T = 150°C
J
Quiescent Current (VDDA)
Low Iq Mode
SI = SCLK = EN = 0 V, CSB = VDD
T = 25°C
−
−
−
−
−
−
10
10
20
J
T = 85°C
J
T = 150°C
J
Operating Current (VDD)
ON Mode
EN=high, SCLK = Inx = 0 V,
CSB = VDD = VDDA
mA
−
0.3
0.5
(All Channels On)
Quiescent Current (VDD)
Global Standby Mode
(All Channels Off)
CSB = VDD = VDDA, f
= 0 Hz
mA
SCLK
T = 25°C
−
−
−
−
−
−
20
20
40
J
T = 85°C
J
T = 150°C
J
Quiescent Current (VDD)
Low Iq Mode
EN = 0 V
mA
T = 25°C
−
−
−
−
−
−
5
5
20
J
T = 85°C
J
T = 150°C
J
NCV7240 / NCV7240A
Power−on Reset threshold (VDDA)
VDDA rising
−
3.80
200
3.60
3.30
200
4.15
350
3.85
3.50
350
V
mV
V
NCV7240 / NCV7240A
Power−on Reset hysteresis (VDDA)
150
−
NCV7240B
Power−on Reset threshold (VDDA)
VDDA rising
VDDA falling
NCV7240B
Power−on Reset threshold (VDDA)
3.00
150
V
NCV7240B
mV
Power−on Reset hysteresis (VDDA)
Power−on Reset threshold (VDD)
Power−on Reset Hysteresis (VDD)
Thermal Shutdown (Note 8)
Thermal Hysteresis
VDD rising
−
2.4
100
175
25
2.7
240
200
−
V
75
mV
°C
°C
Not ATE tested.
Not ATE tested.
150
10
OUTPUT DRIVER
Output Transistor R
IOUTx = 180 mA
−
1.5
3.0
1.3
W
A
DS(on)
Overload Detection Current
Output Leakage
0.6
0.95
OUTx = 13.5 V, 25°C
OUTx = 13.5 V
OUTx = 35 V
−
−
−
−
−
−
1
5
10
mA
Output Clamp Voltage
VDD = 0 V to 5.5 V
VDDA = 0 V to 5.5 V
IOUTx = 50 mA
36
40
44
V
Output Body Diode Voltage
IOUTx = −180mA
−
−
1.5
2.5
V
V
Open Load Detection Threshold Voltage (Vol)
Open Load Diagnostic Sink Current (Iol)
OUTPUT TIMING SPECIFICATIONS
Enable (EN) wake−up time
1.0
20
1.75
60
1 V < OUTx < 13.5 V, Output Disabled
100
mA
CSB = 0 V, EN going high 80% to SO active
−
−
−
200
−
ms
ms
Enable (EN) and LHI (Note 9) Signal Duration
50
7. Reduced performance down to 4 V provided VDDA Power−On Reset threshold has not been breached.
8. Each output driver is protected by its’ own individual thermal sensor.
9. Input signals H→L→H greater than 50usec are guaranteed to be detected.
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NCV7240, NCV7240A, NCV7240B
ELECTRICAL CHARACTERISTICS (3.0 V < VDD < VDDA, 4.5 V < VDDA (Note 7) < 5.5 V, −40°C v T v 150°C, EN = VDD,
J
LHI = 0 V unless otherwise specified).
Characteristic
Conditions
Min
Typ
Max
Unit
OUTPUT TIMING SPECIFICATIONS
Serial Control
Output turn−on time
All Channels
CSB going high 80% to OUTx going low
−
30
50
ms
20% V ,V = 13.5 V,
bat bat
I
= 180 mA resistive load
DS
Serial Control
Output turn−off time
All Channels
CSB going high 80% to OUTx going high
80% V , V = 13.5 V,
−
−
−
30
30
30
50
50
50
ms
ms
ms
bat
bat
I
= 180 mA resistive load
DS
Parallel Control
Output turn−on time
All Channels
INx going high 80% to OUTx going low
20% V , V = 13.5 V,
bat
bat
I
= 180 mA resistive load
DS
Parallel Control
Output turn−off time
All Channels
Inx going low 20% to OUTx going high
80% V , V = 13.5 V,
bat
bat
I
= 180 mA resistive load
DS
Over Load Shut−Down Delay Time
Open Load Detection Time
3
15
50
ms
ms
30
115
200
DIGITAL INTERFACE CHARACTERISTICS
INPUT CHARACTERISTICS
Digital Input Threshold
(CSB, SI, SCLK, LHI, EN,INx)
0.8
50
1.4
175
400
120
2.0
300
800
190
V
Digital Input Hysteresis
(CSB, SI, SCLK, INx)
mV
mV
kW
Digital Input Hysteresis
(LHI, EN)
150
50
Input Pulldown Resistance
(SI, SCLK, LHI, EN,INx)
Inx = SI = SCLK = LHI = EN = VDD
Input Pullup Resistance (CSB)
CSB Leakage to VDD
CSB = 0 V
50
−
120
−
190
100
100
kW
uA
uA
CSB = 5 V, VDD = 0 V
CSB = 5 V, VDDA = 0 V
CSB Leakage to VDDA
OUTPUT CHARACTERISTICS
SO – Output High
−
−
I(out) = −1.5 mA
V
−
−
−
V
DD
0.4
SO – Output Low
I(out) = 2.0 mA
CSB = VDD
−
−
0
0.6
3
V
SO Tri−state Leakage
−3
mA
SPI TIMING (all timing specifications measured at 20% and 80% voltage levels)
SCLK Frequency
−
200
85
85
50
50
100
1.5
85
−
−
−
−
−
−
−
−
−
−
−
5
−
MHz
ns
ns
ns
ns
ns
ns
ms
SCLK Clock Period
SCLK High Time
SCLK Low Time
SI Setup Time
Figure 5, #1
Figure 5, #2
−
−
Figure 5, #11
Figure 5, #12
Figure 5, #5, 6
Figure 5, #7
−
SI Hold Time
−
CSB Setup Time
CSB High Time
SCLK Setup Time
−
−
Figure 5, #3, 4
−
ns
ns
SO Output Enable Time
(CSB falling to SO valid)
Figure 5, #8, C
= 50 pF
200
load
Not ATE tested
SO Output Disable Time
(CSB rising to SO tri−state)
Figure 5, #9
Not ATE tested
−
−
−
−
200
100
ns
ns
SO Output Data Valid Time with capacitive load
Figure 5, #10, C
= 50 pF
load
Not ATE tested
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
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NCV7240, NCV7240A, NCV7240B
4
7
CSB
6
5
SCLK
1
2
3
CSB
SO
8
9
SI
12
SCLK
11
10
SO
Figure 5. Detailed SPI Timing (measured at 20% and 80% voltage levels)
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NCV7240, NCV7240A, NCV7240B
TYPICAL PERFORMANCE GRAPHS
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
6.0
5.0
4.0
3.0
2.0
1.0
150°C
−40°C
25°C
V
DD
= 5 V
0
−40 −20
0
20
40
60 80 100 120 140
3
3.5
4
4.5
5
5.5
TEMPERATURE (°C)
VDDA (V)
Figure 6. VDD Low Iq Current vs. Temperature
Figure 7. VDDA Low Iq Quiescent Current vs.
VDDA
4.5
4
1.4
1.2
3.5
3
1.0
0.8
0.6
0.4
0.2
0
2.5
2
150°C
1.5
1
25°C
V
= 5 V
0.5
DDA
−40°C
0
−40 −20
0
20
40
60 80 100 120 140
3
3.5
4
4.5
5
5.5
TEMPERATURE (°C)
VDD (V)
Figure 8. VDDA Low Iq Current vs.
Temperature
Figure 9. VDD Low Iq Current vs. VDD
44
43
42
41
40
39
38
37
36
44
43
42
41
40
39
38
37
36
180 mA
50 mA
50
70
90
110
130
150
170
−40 −20
0
20 40
60
80 100 120 140
OUTPUT CURRENT (mA)
TEMPERATURE (°C)
Figure 10. Output Clamp Voltage vs. Current
Figure 11. Output Clamp Voltage vs.
Temperature
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NCV7240, NCV7240A, NCV7240B
TYPICAL PERFORMANCE GRAPHS
1.3
1.2
3.0
2.5
2.0
1.5
1.0
I
= 600 mA
OUT
1.1
1.0
0.9
0.8
0.7
0.6
I
= 100 mA
OUT
0.5
0
−40 −20
0
20
40
60
80 100 120 140
−40 −20
0
20
40
60 80 100 120 140
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 12. Output RDS(on) vs. Temperature
Figure 13. Over Load Current vs. Temperature
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
T = 150°C
OUTx = 13.5 V
13.5 14
14.5 15 15.5
16 16.5 17
17.5 18
−40 −20
0
20
40
60 80 100 120 140
OUTPUT VOLTAGE (V)
TEMPERATURE (°C)
Figure 14. Output Leakage vs. Voltage (1505C)
Figure 15. Output Leakage vs. Temperature
2.5
2.0
1.5
1.0
0.5
0
100
90
80
70
60
50
40
30
20
10
0
OUTx = 13.5 V
−40 −20
0
20
40
60 80 100 120 140
−40 −20
0
20
40
60 80 100 120 140
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 16. Output Load Detection Current vs.
Temperature
Figure 17. Open Load Detection Voltage vs.
Temperature
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NCV7240, NCV7240A, NCV7240B
TYPICAL PERFORMANCE GRAPHS
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
I
= −180 mA
OUT
−40 −20
0
20
40
60 80 100 120 140
TEMPERATURE (°C)
Figure 18. Output Body Diode Voltage vs.
Temperature
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NCV7240, NCV7240A, NCV7240B
DETAILED OPERATING DESCRIPTION
Power Outputs
EN pin. The NCV7240 device will go through a power up
reset each time the EN pin is toggled high resulting in a
device setup of default values as described in the Register
Specifics section. Standby Mode, Input Mode, ON Mode,
and OFF Mode are all selectable via the SPI for each channel
independently.
The NCV7240 provides eight independent 600mA power
transistors with their source connection referenced to the
ground pin and with their drain connection brought out to
individual pins resulting in 8 independent low−side drivers.
Output driver location on one side of the IC layout provides
for optimum pcb layout to the loads.
Internal clamping structures are provided to limit
transient voltages when switching inductive loads. Each
output has an over load detection current of 0.6 A (min)
where the drivers turn−off and stay latched off. An Over
Load Current Shut−Down Delay Time of 3 ms (min) is
designed into the IC as a filter allowing for spikes in current
which may occur during normal operation and allowing for
protection from overload conditions.
Power up, Power−On Reset (UVLO mode)
Both VDD and VDDA supply an independent
power−on−reset function to the IC. Coming out of
power−on−reset all input bits are set to a 1 (OFF Mode) and
all output bits are set to a 0 except for the TER bit which is
set to a 1. The device cannot operate without both supplies
above their respective power−on reset thresholds with the
exception of LHI mode. During LHI mode, VDD POR is
ignored and the device is only affected by VDDA POR.
The NCV7240 powers up into the Global OFF Mode
without the open circuit diagnostic current enabled. This
allows the device to be turned on via EN = 0 to EN = 1 with
LED loads avoiding illumination of the LED loads
(reference Figure 21 State Diagram). All other paths to
Global OFF Mode enable open circuit diagnostic current.
Faults can be cleared with the SPI input register
(command 00) or via a power−on−reset. Fault detection is
provided in real time. Detection is provided both during
output turn−on and with output already on. (See Page 17,
Clearing the Fault Registers)
The NCV7240 is available in a SSOP−24 package.
Output Control (SPI)
Each output driver is controlled via a digital SPI port after
the device has powered up (out of POR) and enabled via the
Table 1. MODES OF OPERATION
Modes of
Operation
Conditions
Description
UVLO Mode
VDD or VDDA below their respective POR
thresholds
All outputs off in this mode.
Coming out of this mode
with EN = 1 sets all channels in the OFF mode
without open circuit diagnostic current enabled.
With LHI = 1 and EN = x, the part enters limp home mode.
OFF Mode
Global OFF Mode
ON Mode
SPI Control
(Command 11)
Output off.
Open circuit diagnostic current is disabled (powerup mode).
Open circuit diagnostic current is enabled (normal mode).
SPI Control
All Channels (Command 11)
Output off.
Open circuit diagnostic current is disabled (powerup mode).
Open circuit diagnostic current is enabled (normal mode).
SPI Control
(Command 10)
Output on.
Limp Home Mode
(LHI)
LHI = high, EN = x
Dedicated output turn on control of
OUT1−OUT4 using IN1−IN4.
OUT5−OUT8 are in OFF Mode.
Low Iq Mode
EN = LHI = low
Provides a state with the lowest quiescent current for V
and VDDA.
DD
Standby Mode
SPI Control
(Command 00)
Provides an OFF state with
Open circuit diagnostic current disabled.
Global
Standby Mode
SPI Control
All Channels (Command 00)
Provides a reduced quiescent current mode.
Provides an OFF state with
Open circuit diagnostic current disabled.
Input Mode
SPI Control
(Command 01)
Directs output channel to be driven from INx input pins.
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NCV7240, NCV7240A, NCV7240B
Figure 19. Basic State Diagram
Figure 20. Normal Operation State Diagram
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NCV7240, NCV7240A, NCV7240B
Figure 21. Detailed State Diagram
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NCV7240, NCV7240A, NCV7240B
Limp Home and PWM operation (INx control)
Pulse Width Modulation techniques are allowed utilizing the parallel inputs (INx).
Output pins (OUTx) are programmed for use in conjunction with the INx pins using the SPI command (command 01).
The LHI pin controls the operation of the INx pins.
LHI = Low and EN = High
With LHI=low, default pairs of outputs are controlled by the INx pins (via SPI programming).
IN1 controls channels OUT1 and OUT5.
IN2 controls channels OUT2 and OUT6.
IN3 controls channels OUT3 and OUT7.
IN4 controls channels OUT4 and OUT8.
Alternatively, any of the eight channels can be commanded off (e.g. if OUT5 is commanded off via a SPI
command, only OUT1 will be controlled via IN1).
Output pins (OUTx) are programmed for use in conjunction with the INx pins
using the SPI command (command 01).
It is important to note faults occurring during PWM operation (LHI = low) must be cleared via the SPI port.
LHI = High
To go into limp home mode, bring LHI=high, the corresponding outputs of IN1−IN4 will turn on or off, and
OUT5−OUT8 will be forced off.
During Limp Home Mode, over load and over temperature sensing are functional, and are reported via the SPI
port. But, since input SPI commands are ignored with LHI = high, driver turn−off (overload or over
temperature) occurring when LHI=high can only be re−initiated by toggling LHI or through a POR of VDDA.
All registers are reset coming out of LHI mode. The device enters OFF mode (EN = 1) or Low Iq Mode (EN
= 0) depending on the state of the EN pin. Open Load diagnostics are disabled in both cases.
UVLO (Under Voltage Lockout with LHI = High)
A breach of VDDA Power−On Reset thresholds will cause the outputs to turn off and enter the UVLO mode. In LHI mode
(LHI = 1), VDD POR is ignored. If VDD is below the operation of SO drive capability, fault information is preserved and can
be retrieved when SO drive capability is restored.
TER
A transmission error bit (TER) is set (”1”) when exiting the Limp Home Mode into Global Off Mode.
See Frame Detection Transmission Error Section for operation details.
Enable Input (EN)
The EN input pin is a logic controlled input with a voltage threshold between 0.8 V and 2.0 V. The device powers up when
EN goes from low to high, and exits Low Iq Mode (with LHI = 0 V) into global Off Mode. Device power up is also controlled
via the Limp Home Input (LHI) as an OR’d condition. The EN input is a don’t care when the LHI pin is driven from low to
high. In this situation, the device enters Limp Home Mode.
Output Drive Clamping
Internal zener diodes (Z1 & Z2, Figure 22) help to protect the output drive transistors from the expected fly back energy
generated from an inductive load turning off. Z1 provides the voltage setting of the clamp (along with V of the output
gs
transistor and Z2) while Z2 isolates Z1 from normal turn−on activity.
The output clamp voltage is specified between 36 V and 44 V. This includes clamping operation during unpowered input
supplies (VDD and VDDA). Device protection will be provided when the load is driven from an alternative driver source. This
is an important feature when considering protecting for load dump with an un−powered IC.
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15
NCV7240, NCV7240A, NCV7240B
VDD
OUTx
Vbat
VDDA
VBAT
Z1
GND
drain
VClamp = 36V (min) to 44V (max) Powered
Z2
g
s
VDD
OUTx
VDDA
VBAT
Alternative
Driver
Source
Vdrain =VZ 1+VZ 2+Vgs
GND
VClamp = 36V (min) to 44V (max) Un-pow
ered
Figure 22. Output Clamp
Over Temperature / Thermal Shutdown
The NCV7240 incorporates eight individual thermal sensors located in proximity to each output driver. A channel is latched
off upon the detection of an Over Temperature event. This allows operation of unaffected channels before, during, and after
a channel detection of over temperature. The thermal shutdown detection threshold is typically 175°C with 25°C of hysteresis.
Open Load Detection
Open Load Detection is achieved for each output with the Open Load Detection Threshold Voltage reference voltage (Vol)
and its’ corresponding Open Load Diagnostic Sink Current (when the output driver (OUTx) is off). The output driver maintains
its’ functionality with and without the open bit set (i.e. it can turn on and off).
Roc is the theoretical resistance in series with the external inductive load. During normal operation, the open circuit
impedance (Roc) is 0 W. This sets the voltage on OUTx to V
volts. As long as V
is above Vol no open circuit fault will
BAT
BAT
be recognized. The voltage appearing on OUTx is a result of V
created by Iol.
and the voltage drop across Roc realized by the current flow
BAT
The NCV7240 voltage level trip points are referenced to ground. The threshold range is between 1.0 V and 2.5 V.
With a nominal battery voltage (V ) of 14 V, the resultant worst case thresholds of detection are as follows.
BAT
ǒ
Ǔ
VBAT * OpenLoadDetectionThresholdVoltage
+ OpenLoad Impedance
OpenLoadDiagnosticSinkCurrent
ǒ
Ǔ
ǒ
Ǔ
14 V * 2.5 V
100 mA
14 V * 1.0 V
20 mA
+ 115 kW
+ 650 kW
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16
NCV7240, NCV7240A, NCV7240B
V
BAT
Open
Load
Flag
Channel x
+
−
Open Load
detection
Vol
Roc
1.75V
Iol
OUTx
60uA
Output
Turn−on
Control
GND
Open Load Detection
is active when the driver is off,
in LHI mode,
Vol = Open Load Detection Threshold Voltage
Iol = Open Load Diagnostic Sink Current
or OFF mode (command 11).
Figure 23. Open Load Detection
NOTE: Detection of an open load condition is limited by the Parallel Control Output turn−off time and the Open Load
Detection Time specifications. The maximum allowable frequency of operation for PWM (pulse width
modulation) using the INx inputs is calculated from the maximum limits of these specifications. INx must be low
for longer than the sum of these maximum specifications (50 msec and 200 msec). Assuming a 50% duty cycle
yields a maximum frequency of operation of [1/(2*(50m + 200m))]=2 kHz.
LED Loads
The NCV7240 features a power up feature for the Global OFF Mode enabling the part to power up in a mode without the
open load diagnostic current enabled. This averts any unintended illumination of LED loads during power up.
Programming Features
The NCV7240 provides two registers.
1. Input Register. Input for IC mode state and output driver state control.
2. Output Register. Provides diagnostic information on the output driver condition.
Clearing the Fault Registers
Registers are reset with the following conditions.
1. Channel in Standby Mode. (corresponding addressed channel)
2. Power−on reset of VDD. (all channels)
3. Power−on reset of VDDA. (all channels)
4. EN low. (all channels)
5. Coming out of Limp Home Mode(LHI). (all channels)
SPI−Interface
The device provides a 16 bit SPI−interface for output drive control and fault reporting. Data is imported into the NCV7240
through the SI (serial input) pin. Data is exported out of the NCV7240 through the SO (serial output) pin.
The input−frame (SI) (2 bits / channel) is used to command the output stages.
The response frame (SO) provides channel−specific (2 bits / channel) status information fault reporting.
Words should be composed of 16 bits MSB (most significant bit) transmitted first.
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17
NCV7240, NCV7240A, NCV7240B
SO Output Driver
The digital power supply connection (VDD) to the SO output driver enables the system designer interface the NCV7240 to
both 3.3V and 5V logic systems. Figure 24 shows the internal connection of the SO pin.
VDD
3.3V or 5V
SO
Figure 24. SO Output Driver
Over Load
Each output has an over load detection current of 0.6 A (min) where the drivers turn−off and stay latched off when an over
load condition is detected. A latched off condition must be cleared via the SPI port before it can be turned on. An Over load
Current Shut−Down Delay Time of 3 ms (min) is designed into the IC as a filter allowing for spikes in current which may occur
during normal operation and allowing for protection from overload conditions.
Overload is functional during Limp Home (LHI=high). Commands are ignored during Limp Home, but faults can still be
retrieved via the SPI.
Frame Detection Transmission Error (TER)
The NCV7240 detects the number of bits transmitted after CSB goes low. Bit counts not a multiple of 8 (16 bit minimum)
are reported as a fault on the TER bit. The transmission error information (TER) is available on SO after CSB goes low until
the first rising SCLK edge. Reference the Serial Peripheral Interface diagram (Figure 29).
In addition to unqualified bit counts setting TER = 1, the bit will also be set by
1. Coming out of UVLO.
2. Transitioning from Limp Home Mode to Global Off Mode.
3. Transitioning from Low Iq Mode to Global Off Mode.
The TER bit is cleared by sending a valid SPI command.
The TER bit is multiplexed with the SPI SO data and OR’d with the SI input (Figure 25) to allow for reporting in a serial
daisy chain configuration. A TER error bit as a “1” automatically propagates through the serial daisy chain circuitry from the
SO output of one device to the SI input of the next during the TER retrieval time when CSB goes low to the 1st rising edge
of the clock pulse. The SPI register controls the muxing of the output of the OR gate and the SO’ output of the SPI register
using the S mux select pin. This is shown in Figures 26 and 27 first as the daisy chained devices connected with no Transmission
Error (Figure 26) and subsequently with a Transmission Error in device 1 propagating through to device 2 (Figure 27).
TER False Reporting
st
SI should be in a low state during TER status retrieval (from CSB going low to the 1 rising edge of the clock pulse) reporting
the previous transmission status. Figure 28 demonstrates what could happen if SI is a one during TER status retrieval. In this
situation a “1” on SI propagates to SO regardless of the state of TER. Hence a transmission error (TER) could be reported when
it is not true.
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18
NCV7240, NCV7240A, NCV7240B
SO
SI
TER
SO
SI
SPI
S
Figure 25. TER SPI Link
SI
SO
SI
SO
“0”
“0”
“0”
TER
“0”
TER
“0”
Device #1
NCV7240
NCV7240
Device #2
Figure 26. TER (no error)
SI
SO
SI
SO
“1”
“0”
“1”
TER
“1”
TER
“0”
Device #1
NCV7240
NCV7240
Device #2
Figure 27. TER Error Propagation
SI
“1”
“1”
j
“1”
SO
“1”
k
“don’t care”
During TER
status retrieval
TER
During TER status retrieval, location j is
active in the output of the Mux. Location k
is not active in the output of the Mux.
SO’
SI’
SPI
register
Mux Select
S
Figure 28. TER False Reporting
st
NOTE: TER is valid from CSB going low until the 1 low−to−high transition of SCLK to allow for propagation of the SI signal. Reference
Figure 29.
For proper TER status retrieval, SI should be in a low state.
www.onsemi.com
19
NCV7240, NCV7240A, NCV7240B
TER Information Retrieval
TER information retrieval is as simple as bringing CSB high−to−low. No clock signals are required.
CSB
MSB
B15
LSB
B0
B14
B14
B13
B13
B12
B11
B11
B10
B9
B9
B8
B7
B7
B6
B5
B4
B3
B3
B2
B1
B1
SI
SCLK
SO
B12
B10
B8
B6
B5
B4
B2
TER
B15
B0
Figure 29. Serial Peripheral Interface
The timing diagram highlighted in Figure 29 shows the SPI interface communication.
Note:
1. The MSB (most significant bit) is the first transmitted bit.
2. Data is sampled from SI on the falling edge of SCLK
3. Data is shifted out from SO on the rising edge of SCLK
4. SCLK should be in a low state when CSB makes a transition.
5. SI should be in a low state during TER retrieval time.
Frame Detection
Input word integrity (SI) is evaluated by the use of a frame consistency check. The word frame length is compared to an
n * 8 bit (where n is an integer) acceptable word length (16−bit minimum) before the data is latched into the input register. This
guarantees the proper word length has been imported and allows for daisy chain operation applications with 8−bit SPI devices.
The frame length detector is enabled with the CSB falling edge and the SCLK rising edge.
Reference the valid SPI frame shown below. (Figure 29)
Frame detection mode ends with
CSB rising edge.
Frame detection starts
after the CSB falling edge
and the SCLK rising edge.
CSB
SCLK
B15
B14
B13
B12
4
B11
B10
B9
B8
B7
B6
B5
B4
B3
B2
14
B1
B0
SI
Internal Counter
1
2
3
5
6
7
8
9
10
11
12
13
15
16
Valid 16 bits shown
Figure 30. Frame Detection
www.onsemi.com
20
NCV7240, NCV7240A, NCV7240B
DAISY CHAIN SETUP
Serial Connection
Daisy chain setups are possible with the NCV7240. The serial setup shown in Figure 31 highlights the NCV7240 along with
any 16 bit device using a similar SPI protocol. Particular attention should be focused on the fact that the first 16 bits which are
clocked out of the SO pin when the CSB pin transitions from a high to a low will be the Diagnostic Output Data from the Fault
Output Register. These are the bits representing the status of the IC. Additional programming bits should be clocked in which
follow the Diagnostic Output bits. The timing diagram shows a typical transfer of data from the microprocessor to the SPI
connected IC’s.
CSB SCLK
CSB SCLK
IC3
CSB SCLK
IC2
CSB SCLK
IC1
IC4
NCV7240
Any IC
using 16 Bit
SPI
Any IC
using 16 Bit
SPI
Any IC
using 16 Bit
SPI
protocol
protocol
protocol
SO
SO
SO
SO
SI
SI
SI
SI
Figure 31. Serial Daisy Chain
CSB
SCLK
SI
1
st CMD
2nd CMD
3rd CMD
4th CMD
Figure 32. Serial Daisy Chain Timing Diagram
Table 2. SERIAL DAISY CHAIN DATA PATTERN
CLK = 16 bits
CLK = 32 bits
2nd CMD
1st CMD
CLK = 48 bits
3rd CMD
CLK = 64 bits
4th CMD
IC4
IC3
1st CMD
IC4 DIAG
IC3 DIAG
IC2 DIAG
IC1 DIAG
2nd CMD
1st CMD
3rd CMD
IC2
IC4 DIAG
IC3 DIAG
IC2 DIAG
2nd CMD
1st CMD
IC1
IC4 DIAG
IC3 DIAG
micro
IC4 DIAG
Table 2 refers to the transition of data over time of the Serial Daisy Chain setup of Figure 31 as word bits are shifted through
the system. 64 bits are needed for complete transport of data in the example system. Each column of the table displays the status
after transmittal of each word (in 16 bit increments) and the location of each word packet along the way.
www.onsemi.com
21
NCV7240, NCV7240A, NCV7240B
8−bit Devices
The NCV7240 is also compatible with 8 bit devices due to the features of the frame detection circuitry. The internal bit
counter of the NCV7240 starts counting clock pulses when CSB goes low. The 1st valid word consists of 16 bits and each
subsequent word must be comprised of just 8−bits (reference the Frame Detection Section).
Compatibility
Note the SCLK timing requirements of the NCV7240.
CSB SCLK
CSB SCLK
IC1
The NCV7240
is also
compatible with
8−bit devices
Data is sampled from SI on the falling edge of SCLK.
Data is shifted out of SO on the rising edge of SCLK.
Devices with similar characteristics are required for
operation in a daisy chain setup.
IC2
NCV7240
Any IC
using 8 Bit
SPI
protocol
SO
SO
SI
SI
Figure 33. Serial Daisy Chain with 8−bit Devices
Parallel Connection
A more efficient way (time focused) to control multiple SPI compatible devices is to connect them in a parallel fashion and
allow each device to be controlled in a multiplex mode. Figure 34 shows a typical connection between the microprocessor or
microcontroller and multiple SPI compatible devices. In a serial daisy chain configuration, the programming information for
the last device in the serial string must first pass through all the previous devices. The parallel control setup eliminates that
requirement, but at the cost of additional control pins from the microprocessor for each individual CSB (chip select bar) pin
for each controllable device. Serial data is only recognized by the device that is activated through its’ respective CSB pin.
Figure 35 shows the waveforms for typical operation when addressing IC1.
NCV7240
CSB1
CSB2
IC1
SI
SCLK
SI
SCLK
CSB
SO
OUT1
OUT2
OUT3
SO
CSB
chip1
NCV7240
IC2
SI
CSB
SCLK
CSB
SO
chip2
CSB3
SCLK
OUT1
OUT2
OUT3
CSB
chip3
NCV7240
IC3
SI
SCLK
CSB
SO
OUT1
OUT2
OUT3
SI
Figure 34. Parallel Connection
Figure 35. Parallel Connection Timing Diagram
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22
NCV7240, NCV7240A, NCV7240B
Stepper Motor Operation
The NCV7240 device is capable of driving stepper motors. Each stepper motor requires 4 low−side drive outputs.
Consequently, each NCV7240 device is capable of driving two stepper motors. Figure 36 below illustrates a Unipolar stepper
motor setup. For proper operation, the code listed in Table 3 should be used (and repeated) for one way operation (clockwise).
For reverse direction, simply reverse the code and repeat (counterclockwise). Outputs 1−4 are utilized for one stepper usage.
nd
For a 2 stepper motor, repeat the code used for outputs 1−4 to outputs 5−8. During operation waveforms similar to Figure 37
can be expected on the OUTx pins.
V
BAT
STEPPER
MOTOR
OUT1
OUT2
OUT3
OUT4
V
= 12 V
BAT
Figure 37. Typical Stepper Motor Waveform
(Unipolar Portescap 35L048L32U)
NCV7240
Figure 36. Stepper Motor Operation Setup
Table 3. NCV7240 STEPPER MOTOR CODE
OUT 4
OFF
ON
OUT 3
ON
OUT 2
OFF
OFF
ON
OUT 1
ON
OFF
OFF
ON
ON
ON
OFF
OFF
OFF
ON
{Repeat}
www.onsemi.com
23
NCV7240, NCV7240A, NCV7240B
SPI
CSB
SCLK
SI
Input Register(via SPI)
Command
00=Stand−by Mode
Output On / Off Control
01=Input Mode
10=ON Mode
11=OFF Mode
SO
Output Register(via SO)
Fault Output Register
Open Load / (Over Load or
Over temperature)
Transmission Error Bit – Only valid from CSB going low to
SCLK going high.
Figure 38. SPI Register Overview
Figure 38 displays the functions controlled and reported via the SPI port.
The input register controls the input source (parallel or SPI) and the SPI input data.
The output register transmits the output fault bits and the frame detection integrity.
www.onsemi.com
24
NCV7240, NCV7240A, NCV7240B
SI SPI Input Data (16-bit serial structure of input word)
The 16−bit data received (SI) is decoded into instructions for each channel per the table below.
After a power−on reset, all register bits are set to a 1.
Table 4. SPI INPUT DATA
Channel 8
MSB
Channel 7
Channel 6
Channel 5
Channel 4
Channel 3
Channel 2
Channel 1
LSB
B15
B14
B13
B12
B11
B10
B9
B8
B7
B6
B5
B4
B3
B2
B1
B0
INPUT DATA REGISTER
Field
Bits
Description
channel x
(x = 1−8)
15, 14
13, 12
11, 10
9, 8
Command
00
Channel Stand−by Mode
Fast channel turn off
Corresponding Channel Fault Register reset
7, 6
5, 4
3, 2
1, 0
Diagnostic Current
Disabled
01
Input Mode
Channel Input directed to INx.
(reference PWM operation section).
Diagnostic Current
Enabled in OFF State.
10
11
ON Mode
Channel turned on.
Diagnostic Current
Disabled
OFF Mode
Channel turned off.
Diagnostic Current
Enabled (Disabled after POR)*
*For proper LED load operation.
SO (fault diagnostic retrieval)
Output fault diagnostics from the output fault diagnostic register are shifted out on any 16 bit word clocked into Serial Input
(SI).
Only output fault diagnostics and frame detection errors are available through the serial output (SO).
Table 5. SPI OUTPUT DATA
TER
OL8
D8
OL7
D7
OL6
D6
OL5
D5
OL4
D4
OL3
D3
OL2
D2
OL1
D1
FAULT DIAGNOSTIC REGISTER
Field
Bits
Description
TER
CSB high−to−low
prior to 1st
SCLK low−to−high
Transmission Error.
0 Successful transmission in previous communication.
1 Frame detection error in previous transmission
or exiting Limp Home Mode, exiting UVLO Mode, or exiting Low Iq mode to Global Off Mode.
Oln
(n = 1 − 8)
1, 3, 5,
7, 9, 11,
13, 15
Open Load
0 Normal Operation
1 Fault detected
Dn
(n = 1 − 8)
0, 2, 4,
6, 8, 10,
12, 14
Over Load or Over Temperature
0 Normal Operation
1 Fault detected
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25
NCV7240, NCV7240A, NCV7240B
Table 6. FAULT CONDITIONS
Output
Fault
Fault
Memory
Condition
Miscellaneous
Open Load
Latched
Detected in Driver Off State (1.75 V [Typ] threshold) when detection is enabled.
Reported in Output Fault Diagnostics Register until cleared via the SPI port.
Output will maintain turn−on capability.
Short to
Ground
Latched
Detected as part of the Open Load circuitry described above.
Short to V
N/A
Protected via Over Load and Over Temperature functions.
bat
Over Load
Latched
Detected in Driver On State
0.6 A [min], 1.3 A [max].
A latched off condition must be cleared via the SPI port before it can be turned on.
Over
Temperature
Latched
Detected in IC On State (T = 175°C [Typ])
J
A latched off condition must be cleared via the SPI port before it can be turned on.
DEVICE ORDERING INFORMATION
Part Number
†
Package Type
Shipping
NCV7240DPR2G
SSOP−24
(Pb−Free)
NCV7240ADPR2G
2500 / Tape & Reel
NCV7240BDPR2G
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
www.onsemi.com
26
NCV7240, NCV7240A, NCV7240B
PACKAGE DIMENSIONS
SSOP24 NB
CASE 565AL
ISSUE O
0.20 C D
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION.
2X
D
D
A
24
13
4. DIMENSION D DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE
BURRS SHALL NOT EXCEED 0.15 PER SIDE.
DIMENSION E1 DOES NOT INLCUDE INTER-
LEAD FLASH OR PROTRUSION. INTERLEAD
FLASH OR PROTRUSION SHALL NOT EX-
CEED 0.15 PER SIDE. D AND E1 ARE DE-
TERMINED AT DATUM H.
0.20 C D
L2
GAUGE
PLANE
2X
E1
E
L
DETAIL A
SEATING
PLANE
C
PIN 1
REFERENCE
5. DATUMS A AND B ARE DETERMINED AT DA-
TUM H.
1
12
0.25 C D
e
MILLIMETERS
2X 12 TIPS
DIM MIN
MAX
1.75
0.25
1.50
0.30
0.25
24X b
B
TOP VIEW
A
A1
A2
b
1.35
0.10
1.25
0.20
0.19
M
0.25
C A-B D
c
D
8.65 BSC
A
A2
h
x 45°
E
6.00 BSC
3.90 BSC
0.65 BSC
H
0.10 C
0.10 C
E1
e
M
h
0.22
0.50
1.27
L
0.40
L2
M
0.25 BSC
c
A1
SEATING
PLANE
0
8
_
_
DETAIL A
24X
END VIEW
C
SIDE VIEW
RECOMMENDED
SOLDERING FOOTPRINT*
24X
0.42
24X
1.12
24
13
6.40
1
12
0.65
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
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Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
For additional information, please contact your local
Sales Representative
NCV7240/D
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