NHPD660T4G [ONSEMI]

Switch Mode Power Rectifier;
NHPD660T4G
型号: NHPD660T4G
厂家: ONSEMI    ONSEMI
描述:

Switch Mode Power Rectifier

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NHPD660, NRVHPD660  
Switch Mode  
Power Rectifier  
DPAK Surface Mount Package  
www.onsemi.com  
These state−of−the−art devices are designed for use in switching  
power supplies, inverters and as free wheeling diodes.  
PLANAR ULTRAFAST RECTIFIER  
6.0 AMPERES, 600 VOLTS  
Features  
Ultrafast 30 Nanosecond Recovery Time  
175°C Operating Junction Temperature  
High Voltage Capability of 600 V  
Low Forward Drop  
Low Leakage Specified @ 125°C Case Temperature  
NRV Prefix for Automotive and Other Applications Requiring  
Unique Site and Control Change Requirements; AEC−Q101  
Qualified and PPAP Capable  
DPAK  
CASE 369C  
1
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS  
4
3
Compliant  
Mechanical Characteristics  
MARKING DIAGRAM  
Case: Epoxy, Molded  
Weight: 0.4 Gram (Approximately)  
Finish: All External Surfaces Corrosion Resistant and Terminal  
Leads are Readily Solderable  
AYWW  
NHP  
D660T  
Lead and Mounting Surface Temperature for Soldering Purposes:  
A
Y
= Assembly Location  
= Year  
260°C Max. for 10 Seconds  
ESD Ratings:  
WW = Work Week  
G
Machine Model = C (> 400 V)  
Human Body Model = 3B (> 8 kV)  
= Pb−Free Package  
ORDERING INFORMATION  
Applications  
Boost Rectifier for SMPS PFC Operating in Continuous Conduction  
Mode (CCM)  
Device  
Package  
Shipping  
NHPD660T4G  
DPAK  
(Pb−Free)  
2,500/Tape & Reel  
16 mm  
LED Lighting Power Conversion  
Automotive Diesel Piezo Injection  
Thin and Ultra Thin Flat Panel Display  
NRVHPD660T4G  
DPAK  
(Pb−Free)  
2,500/Tape & Reel  
16 mm  
Output Rectification in High Frequency High Output Voltage  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
Applications  
*For additional information on our Pb−Free strategy  
and soldering details, please download the  
ON Semiconductor Soldering and Mounting  
Techniques Reference Manual, SOLDERRM/D.  
© Semiconductor Components Industries, LLC, 2014  
1
Publication Order Number:  
December, 2014 − Rev. 0  
NHPD660/D  
NHPD660, NRVHPD660  
MAXIMUM RATINGS  
Rating  
Symbol  
Value  
Unit  
Peak Repetitive Reverse Voltage  
Working Peak Reverse Voltage  
DC Blocking Voltage  
V
600  
V
RRM  
V
RWM  
V
R
Average Rectified Forward Current  
I
A
A
F(AV)  
(Rated V , T = 145°C)  
6.0  
R
C
Peak Repetitive Forward Current  
I
FRM  
(Rated V , Square Wave, 20 kHz, T = 135°C)  
12.0  
R
C
Non−Repetitive Peak Surge Current  
(Surge Applied at Rated Load Conditions Halfwave, 60 Hz)  
I
A
FSM  
60  
Operating Junction and Storage Temperature Range  
T , T  
−65 to +175  
°C  
J
stg  
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality  
should not be assumed, damage may occur and reliability may be affected.  
THERMAL CHARACTERISTICS  
Characteristics  
Thermal Resistance − Junction−to−Case  
Symbol  
Value  
4.2  
Unit  
°C/W  
°C/W  
R
q
JC  
JA  
Thermal Resistance − Junction−to−Ambient (Note 1)  
R
95.7  
q
1. Rating applies when surface mounted on the minimum pad sizes recommended.  
ELECTRICAL CHARACTERISTICS  
Characteristic  
Test Conditions  
Symbol  
Typ  
Max  
Unit  
Instantaneous Forward Voltage  
(Note 2)  
(i = 6 A, T = 125°C)  
v
1.45  
2.4  
1.8  
3.0  
V
F
C
F
(i = 6 A, T = 25°C)  
F
C
Instantaneous Reverse Current  
(Note 2)  
(Rated DC Voltage, T = 125°C)  
i
35  
0.035  
300  
30  
mA  
ns  
C
R
(Rated DC Voltage, T = 25°C)  
C
Reverse Recovery Time  
(I = 0.5 A, I = 0.25 A, I = 1 A)  
t
30  
50  
F
rr  
R
rr  
(I = 1 A, dI /dt = −50 A/ms, V = 30 V)  
F
F
R
Reverse Recovery Time  
Peak Reverse Recovery Current  
Total Reverse Recovery Charge  
Softness Factor  
(I = 6 A, d /d = −200 A/ms, T = 25°C)  
t
30  
2.3  
37  
2
50  
3
50  
ns  
A
nC  
F
IF  
t
C
rr  
I
RM  
Q
S
rr  
Reverse Recovery Time  
Peak Reverse Recovery Current  
Total Reverse Recovery Charge  
Softness Factor  
(I = 6 A, d /d = −200 A/ms, T = 125°C)  
t
rr  
45  
5.5  
150  
0.35  
ns  
A
nC  
F
IF  
t
C
I
RM  
Q
rr  
S
Forward Recovery Time  
Forward Voltage Time  
(I = 6 A, d /d = 120 A/ms, T = 25°C)  
t
fr  
200  
6
ns  
V
F
IF  
t
C
V
FP  
2. Pulse Test: Pulse Width = 300 ms, Duty Cycle 2.0%.  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
www.onsemi.com  
2
 
NHPD660, NRVHPD660  
TYPICAL CHARACTERISTICS  
100  
10  
1
100  
T = 175°C  
A
T = 175°C  
A
T = 150°C  
A
T = 150°C  
A
10  
1
T = 125°C  
A
T = 125°C  
A
0.1  
0.1  
T = 25°C  
A
T = 25°C  
A
0.01  
0.01  
T = −40°C  
T = −40°C  
A
A
0.001  
0.001  
0
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
3.5  
0
0
0
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
3.5  
V , INSTANTANEOUS FORWARD VOLTAGE (V)  
V , INSTANTANEOUS FORWARD VOLTAGE (V)  
F
F
Figure 1. Typical Instantaneous Forward  
Characteristics  
Figure 2. Maximum Instantaneous Forward  
Characteristics  
1.E−02  
1.E−03  
1.E−04  
1.E−05  
1.E−06  
1.E−07  
1.E−08  
1.E−09  
1.E−10  
1.E−02  
1.E−03  
1.E−04  
1.E−05  
1.E−06  
1.E−07  
1.E−08  
1.E−09  
1.E−10  
T = 175°C  
A
T = 125°C  
A
T = 125°C  
A
T = 150°C  
T = 175°C  
A
A
T = 150°C  
A
T = 25°C  
A
T = 25°C  
A
T = −40°C  
A
T = −40°C  
A
1.E−11  
1.E−12  
0
100  
200  
300  
400  
500  
600  
100  
200  
300  
400  
500  
600  
V , INSTANTANEOUS REVERSE VOLTAGE (V)  
R
V , INSTANTANEOUS REVERSE VOLTAGE (V)  
R
Figure 3. Typical Reverse Characteristics  
Figure 4. Maximum Reverse Characteristics  
12  
11  
10  
9
1000  
T = 25°C  
J
DC  
8
Square Wave  
7
100  
6
5
4
3
2
R
= 4.2°C/W  
1
0
q
JC  
10  
0
20 40 60 80 100 120 140 160 180 200  
20  
40  
60  
80 100 120 140 160 180  
V , REVERSE VOLTAGE (V)  
R
T , CASE TEMPERATURE (°C)  
C
Figure 5. Typical Junction Capacitance  
Figure 6. Current Derating  
www.onsemi.com  
3
NHPD660, NRVHPD660  
TYPICAL CHARACTERISTICS  
3.0  
2.5  
2.0  
1.5  
1.0  
35  
35  
30  
25  
20  
15  
10  
I
/I  
= 20  
I /I = 10  
PK AV  
T = 175°C  
PK AV  
J
T
rr  
30  
I
/I = 5  
PK AV  
25  
20  
15  
10  
V = 30 V  
r
d /d = 50 A/ms  
i
t
dc  
Q
rr  
Square Wave  
0.5  
0
5
0
5
0
0
0.5  
1.0  
1.5  
2.0  
0
1
2
3
4
5
6
7
8
I , AVERAGE FORWARD CURRENT (A)  
F(AV)  
I , AVERAGE FORWARD CURRENT (A)  
F(AV)  
Figure 7. Forward Power Dissipation  
Figure 8. Typical Recovery Characteristics  
100  
50% (DUTY CYCLE)  
20%  
10%  
5.0%  
10  
1
2.0%  
1.0%  
0.1  
0.01  
SINGLE PULSE  
0.001  
0.000001 0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
1000  
PULSE TIME (s)  
Figure 9. Thermal Response  
www.onsemi.com  
4
NHPD660, NRVHPD660  
PACKAGE DIMENSIONS  
DPAK (SINGLE GAUGE)  
CASE 369C−01  
ISSUE D  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ASME  
Y14.5M, 1994.  
2. CONTROLLING DIMENSION: INCHES.  
3. THERMAL PAD CONTOUR OPTIONAL WITHIN DI-  
MENSIONS b3, L3 and Z.  
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD  
FLASH, PROTRUSIONS, OR BURRS. MOLD  
FLASH, PROTRUSIONS, OR GATE BURRS SHALL  
NOT EXCEED 0.006 INCHES PER SIDE.  
5. DIMENSIONS D AND E ARE DETERMINED AT THE  
OUTERMOST EXTREMES OF THE PLASTIC BODY.  
6. DATUMS A AND B ARE DETERMINED AT DATUM  
PLANE H.  
C
A
D
A
E
c2  
b3  
B
4
2
L3  
L4  
Z
H
DETAIL A  
1
3
INCHES  
DIM MIN MAX  
0.086 0.094  
A1 0.000 0.005  
0.025 0.035  
MILLIMETERS  
MIN  
2.18  
0.00  
0.63  
0.76  
4.57  
0.46  
0.46  
5.97  
6.35  
MAX  
2.38  
0.13  
0.89  
1.14  
5.46  
0.61  
0.61  
6.22  
6.73  
A
b2  
c
b
b
b2 0.030 0.045  
b3 0.180 0.215  
M
0.005 (0.13)  
C
H
e
c
0.018 0.024  
c2 0.018 0.024  
GAUGE  
SEATING  
PLANE  
L2  
PLANE  
C
D
E
e
0.235 0.245  
0.250 0.265  
0.090 BSC  
2.29 BSC  
9.40 10.41  
1.40 1.78  
2.74 REF  
0.51 BSC  
0.89 1.27  
H
L
L1  
L2  
0.370 0.410  
0.055 0.070  
0.108 REF  
L
A1  
L1  
0.020 BSC  
DETAIL A  
ROTATED 905 CW  
L3 0.035 0.050  
L4  
Z
−−− 0.040  
0.155 −−−  
−−−  
3.93  
1.01  
−−−  
SOLDERING FOOTPRINT*  
6.20  
0.244  
3.00  
0.118  
2.58  
0.102  
5.80  
0.228  
1.60  
0.063  
6.17  
0.243  
mm  
inches  
ǒ
Ǔ
SCALE 3:1  
*For additional information on our Pb−Free strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
ON Semiconductor and the  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.  
SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed  
at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation  
or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and  
specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets  
and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each  
customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended,  
or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which  
the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or  
unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and  
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim  
alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable  
copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMENT:  
N. American Technical Support: 800−282−9855 Toll Free  
USA/Canada  
Europe, Middle East and Africa Technical Support:  
Phone: 421 33 790 2910  
Japan Customer Focus Center  
Phone: 81−3−5817−1050  
ON Semiconductor Website: www.onsemi.com  
Order Literature: http://www.onsemi.com/orderlit  
Literature Distribution Center for ON Semiconductor  
P.O. Box 5163, Denver, Colorado 80217 USA  
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada  
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada  
Email: orderlit@onsemi.com  
For additional information, please contact your local  
Sales Representative  
NHPD660/D  

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