NL17SZ08MU1TCG [ONSEMI]
Single 2-Input AND Gate;
| 型号： | NL17SZ08MU1TCG |
| 厂家： | 
ONSEMI |
| 描述： | Single 2-Input AND Gate 栅 |
| 文件： | 总7页 (文件大小：82K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
NL17SZ08
Single 2-Input AND Gate
The NL17SZ08 is a single 2−input AND Gate in three tiny footprint
packages. The device performs much as LCX multi−gate products in
speed and drive. They should be used wherever the need for higher
speed and drive are needed.
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Features
• Tiny SOT−353, SOT−553 and SOT−953 Packages
MARKING
DIAGRAMS
• 2.7 ns T at 5.0 V (typ)
PD
5
• Source/Sink 24 mA at 3.0 V
• Overvoltage Tolerant Inputs
1
SC−88A
(SC−70−5/SOT−353)
DF SUFFIX
L2 MG
• Pin For Pin with NC7SZ08P5X, TC7SZ08FU and TC7SZ08AFE
G
• Chip Complexity: FETs = 20
CASE 419A
• Designed for 1.65 V to 5.5 V V Operation
CC
5
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
1
L2 MG
SOT−553
XV5 SUFFIX
CASE 463B
G
V
A
V
CC
IN B
1
CC
L2 = Specific Device Marking
M
= Date Code*
5
1
GND
2
5
G
= Pb−Free Package
IN A
2
(Note: Microdot may be in either location)
*Date Code orientation and/or position may
vary depending upon manufacturing location.
B
3
Y
OUT Y
4
GND
3
4
SOT−953
Y M
CASE 527AE
1
SOT−953
SOT−353/SC70−5/
SC−88A/SOT−553
Y
M
= Specific Device Code
= Month Code
Figure 1. Pinout (Top View)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
IN A
IN B
&
OUT Y
Figure 2. Logic Symbol
© Semiconductor Components Industries, LLC, 2015
1
Publication Order Number:
November, 2015 − Rev. 20
NL17SZ08/D
NL17SZ08
PIN ASSIGNMENT
(SOT−353/SC70−5/SC−88A/SOT−553)
PIN ASSIGNMENT (SOT−953)
FUNCTION TABLE
Input
Pin
Function
Output
Y = AB
Pin
Function
1
IN A
1
IN B
2
3
4
5
GND
IN B
A
L
B
L
Y
L
2
3
4
5
IN A
GND
OUT Y
L
H
L
L
OUT Y
V
CC
H
H
L
V
CC
H
H
MAXIMUM RATINGS
Symbol
Parameter
Value
Units
V
DC Supply Voltage
DC Input Voltage
−0.5 to +7.0
−0.5 to +7.0
−0.5 to +7.0
V
V
CC
V
IN
V
DC Output Voltage (SOT−353/SC70−5/SC−88A/SOT−553 Packages)
DC Output Voltage (SOT−953 Package)
V
OUT
OUT
V
−0.5 to V + 0.5
V
CC
I
DC Input Diode Current
−50
50
mA
mA
IK
I
DC Output Diode Current
(SOT−953 Package)
V
OUT
< GND, V > V
OUT CC
OK
I
DC Output Diode Current (SOT−353/SC70−5/SC−88A/SOT−553 Packages) V
DC Output Sink Current
< GND
−50
50
mA
mA
mA
°C
OK
OUT
I
OUT
I
DC Supply Current per Supply Pin
100
CC
T
STG
Storage Temperature Range
−65 to +150
260
T
Lead Temperature, 1 mm from Case for 10 Seconds
Junction Temperature Under Bias
°C
L
T
+150
°C
J
q
Thermal Resistance
SOT−353 (Note 1)
SOT−553
350
496
°C/W
JA
P
D
Power Dissipation in Still Air at 85°C
SOT−353
SOT−553
186
135
mW
MSL
Moisture Sensitivity
Flammability Rating
ESD Classification
Level 1
F
R
Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in
ESD
Human Body Model (Note 2)
Machine Model (Note 3)
2000
200
V
Charged Device Model (Note 4)
N/A
I
Latchup Performance Above V and Below GND at 125°C (Note 5)
100
mA
LATCHUP
CC
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow.
2. Tested to EIA/JESD22−A114−A, rated to EIA/JESD22−A114−B.
3. Tested to EIA/JESD22−A115−A, rated to EIA/JESD22−A115−A.
4. Tested to JESD22−C101−A.
5. Tested to EIA/JESD78.
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2
NL17SZ08
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
1.65
0
Max
5.5
5.5
5.5
Units
V
V
CC
DC Supply Voltage
DC Input Voltage
V
IN
V
V
DC Output Voltage (SOT−353/SC70−5/SC−88A/SOT−553 Packages)
DC Output Voltage (SOT−953 Package)
0
V
OUT
OUT
V
0
V
CC
V
T
Operating Temperature Range
−55
+125
°C
ns/V
A
t , t
r
Input Rise and Fall Time
V
CC
V
CC
= 3.0 V 0.3 V
= 5.0 V 0.5 V
0
0
100
20
f
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
DC ELECTRICAL CHARACTERISTICS
T
A
= 255C
−555C 3 T 3 1255C
A
V
CC
(V)
Min
Typ
Max
Min
Max
Symbol
Parameter
Condition
Units
V
IH
High−Level Input Voltage
1.65 to 1.95 0.75 V
0.75 V
0.7 V
V
CC
CC
CC
CC
2.3 to 5.5
0.7 V
V
Low−Level Input Voltage
High−Level Output Voltage
1.65 to 1.95
2.3 to 5.5
0.25 V
0.3 V
0.25 V
0.3 V
V
V
IL
CC
CC
CC
CC
V
OH
I
I
= −100 mA
= −3 mA
= −8 mA
1.65 to 5.5
1.65
2.3
V
CC
− 0.1
V
V
CC
− 0.1
OH
CC
1.29
1.52
2.1
2.4
2.7
2.5
4.0
1.29
OH
V
IN
= V or V
IL IH
I
1.9
2.2
2.4
2.3
3.8
1.9
2.2
2.4
2.3
3.8
OH
I
= −12 mA
= −16 mA
= −24 mA
= −32 mA
2.7
OH
I
3.0
OH
I
3.0
OH
I
4.5
OH
V
OL
Low−Level Output Voltage
= V or V
I
= 100 mA
= 3 mA
1.65 to 5.5
1.65
2.3
0.1
0.24
0.3
0.1
0.24
0.3
V
OL
I
OL
0.08
0.20
0.22
0.28
0.38
0.42
V
IN
IH
OH
I
OL
= 8 mA
I
OL
= 12 mA
= 16 mA
= 24 mA
= 32 mA
2.7
0.4
0.4
I
OL
3.0
0.4
0.4
I
OL
3.0
0.55
0.55
0.55
0.55
I
OL
4.5
I
Input Leakage Current
V
GND
= 5.5 V or
0 to 5.5
0.1
1.0
mA
mA
mA
IN
IN
I
Quiescent Supply Current
V
IN
= 5.5 V or
5.5
0
1
10
CC
GND
I
Power Off Leakage Current
(SOT−353/SC70−5/
SC−88A/SOT−553
Packages)
V
V
= 5.5 V or
= 5.5 V
1
10
OFF
IN
OUT
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
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3
NL17SZ08
AC ELECTRICAL CHARACTERISTICS t = t = 3.0 ns
R
F
T
A
= 255C
Typ
6.3
−555C 3 T 3 1255C
A
V
CC
Min
2.0
2.0
0.8
0.5
1.5
0.5
0.8
Max
12
Min
2.0
2.0
0.8
0.5
1.5
0.5
0.8
Max
12.7
10.5
7.5
(V)
Symbol
Parameter
Condition
Units
t
Propagation Delay
(Figure 3 and 4)
1.65
ns
R = 1 MW, C = 15 pF
PLH
L
L
t
PHL
R = 1 MW, C = 15 pF
1.8
6.2
10
L
L
R = 1 MW, C = 15 pF
2.5 0.2
3.3 0.3
3.4
7.0
4.7
5.2
4.1
4.5
L
L
R = 1 MW, C = 15 pF
2.6
5.0
L
L
R = 500 W, C = 50 pF
3.3
5.5
L
L
5.0 0.5
2.2
4.4
R = 1 MW, C = 15 pF
L
L
R = 500 W, C = 50 pF
2.7
4.8
L
L
CAPACITIVE CHARACTERISTICS
Symbol
Parameter
Condition
= 5.5 V, V = 0 V or V
Typical
u4.0
25
Units
pF
C
Input Capacitance
V
CC
IN
I
CC
C
Power Dissipation Capacitance
(Note 6)
10 MHz, V = 3.3 V, V = 0 V or V
pF
PD
CC
I
CC
10 MHz, V = 5.5 V, V = 0 V or V
30
CC
I
CC
6. C is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
PD
Average operating current can be obtained by the equation: I
) = C ꢀ V ꢀ f + I . C is used to determine the no−load dynamic
CC(OPR
PD CC in CC PD
2
power consumption; P = C ꢀ V
ꢀ f + I ꢀ V
.
D
PD
CC
in
CC
CC
t = 3 ns
f
t = 3 ns
f
V
CC
V
CC
90%
50%
90%
50%
INPUT
A and B
10%
10%
OUTPUT
GND
INPUT
R
C
L
L
t
t
PHL
PLH
A 1−MHz square input wave is recommended for
propagation delay tests.
50%
50%
V
V
OH
OUTPUT Y
OL
Figure 3. Switching Waveform
Figure 4. Test Circuit
DEVICE ORDERING INFORMATION
Device Order Number
†
Package Type
Tape and Reel Size
NL17SZ08DFT2G
SC−88A/SC−70−5/SOT−353
(Pb−Free)
3000 / Tape & Reel
4000 / Tape & Reel
8000 / Tape & Reel
NL17SZ08XV5T2G
NL17SZ08P5T5G
SOT−553
(Pb−Free)
SOT−953
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
www.onsemi.com
4
NL17SZ08
PACKAGE DIMENSIONS
SC−88A (SC−70−5/SOT−353)
CASE 419A−02
ISSUE L
A
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419A−01 OBSOLETE. NEW STANDARD
419A−02.
G
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
5
4
3
−B−
S
INCHES
DIM MIN MAX
MILLIMETERS
MIN
1.80
1.15
0.80
0.10
MAX
2.20
1.35
1.10
0.30
1
2
A
B
C
D
G
H
J
0.071
0.045
0.031
0.004
0.087
0.053
0.043
0.012
0.026 BSC
0.65 BSC
M
M
B
D 5 PL
0.2 (0.008)
---
0.004
0.004
0.004
0.010
0.012
---
0.10
0.10
0.10
0.25
0.30
K
N
S
N
0.008 REF
0.20 REF
0.079
0.087
2.00
2.20
J
C
K
H
SOLDER FOOTPRINT*
0.50
0.0197
0.65
0.025
0.65
0.025
0.40
0.0157
1.9
0.0748
mm
inches
ǒ
Ǔ
SCALE 20:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
5
NL17SZ08
PACKAGE DIMENSIONS
SOT−553, 5 LEAD
XV5 SUFFIX
CASE 463B
ISSUE C
NOTES:
D
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
A
−X−
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL.
L
5
4
3
MILLIMETERS
INCHES
NOM
0.022
0.009
0.005
0.063
0.047
0.020 BSC
0.008
0.063
E
−Y−
DIM
A
b
c
D
E
MIN
0.50
0.17
0.08
1.55
1.15
NOM
0.55
0.22
0.13
1.60
MAX
MIN
MAX
0.024
0.011
0.007
0.065
0.049
H
E
0.60
0.27
0.18
1.65
1.25
0.020
0.007
0.003
0.061
0.045
1
2
b 5 PL
c
1.20
e
M
e
L
0.50 BSC
0.20
1.60
0.08 (0.003)
X Y
0.10
1.55
0.30
1.65
0.004
0.061
0.012
0.065
H
E
RECOMMENDED
SOLDERING FOOTPRINT*
0.3
0.0118
0.45
0.0177
1.0
0.0394
1.35
0.0531
0.5
0.5
0.0197 0.0197
mm
inches
ǒ
Ǔ
SCALE 20:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
6
NL17SZ08
PACKAGE DIMENSIONS
SOT−953
CASE 527AE
ISSUE E
NOTES:
X
Y
D
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
A
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF THE BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS.
5
4
3
PIN ONE
INDICATOR
H
E
E
1
2
MILLIMETERS
DIM MIN
NOM
0.37
0.15
0.12
1.00
MAX
0.40
0.20
0.17
1.05
0.85
A
b
0.34
0.10
0.07
0.95
0.75
C
TOP VIEW
e
C
D
SIDE VIEW
E
0.80
e
0.35 BSC
HE
0.95
1.00
1.05
0.175 REF
0.10
−−−
L
L2
L3
5X
L
0.05
−−−
0.15
0.15
5X
5X
L3
L2
SOLDERING FOOTPRINT*
5X
0.35
5X
0.20
5X
b
PACKAGE
OUTLINE
0.08 X
Y
BOTTOM VIEW
1.20
1
0.35
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and the
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.
SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed
at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation
or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets
and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each
customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended,
or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which
the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or
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expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim
alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable
copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
Literature Distribution Center for ON Semiconductor
19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
For additional information, please contact your local
Sales Representative
NL17SZ08/D
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