NL17SZ125DBVT1G [ONSEMI]
Non-Inverting 3-State Buffer;
| 型号： | NL17SZ125DBVT1G |
| 厂家： | 
ONSEMI |
| 描述： | Non-Inverting 3-State Buffer |
| 文件： | 总14页 (文件大小：200K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
NL17SZ125
Non-Inverting 3-State Buffer
The NL17SZ125 is a single non−inverting 3−state buffer in tiny
footprint packages.
Features
• Designed for 1.65 V to 5.5 V V Operation
CC
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• 2.7 ns t at V = 5 V (typ)
PD
CC
• Inputs/Outputs Overvoltage Tolerant up to 5.5 V
MARKING
DIAGRAMS
• I
Supports Partial Power Down Protection
• Source/Sink 24 mA at 3.0 V
OFF
SC−88A
DF SUFFIX
CASE 419A
• Available in SC−88A, SC−74A, TSOP−5, SOT−553, SOT−953 and
UDFN6 Packages
XX MG
G
• Chip Complexity < 100 FETs
• NLV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
SC−74A
DBV SUFFIX
CASE 318BQ
XXX MG
G
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
5
OE
A
EN
TSOP−5
DT SUFFIX
CASE 483
Y
XX MG
5
G
1
1
Figure 1. Logic Symbol
SOT−553
XV5 SUFFIX
CASE 463B
XX MG
G
SOT−953
P5 SUFFIX
CASE 527AE
X M
XM
1
UDFN6
1.45 x 1.0
CASE 517AQ
1
UDFN6
1.0 x 1.0
CASE 517BX
X M
1
XX
M
G
= Specific Device Code
= Date Code*
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or position may
vary depending upon manufacturing location.
ORDERING INFORMATION
See detailed ordering, marking and shipping information in the
package dimensions section on page 7 of this data sheet.
© Semiconductor Components Industries, LLC, 2015
1
Publication Order Number:
November, 2018 − Rev. 19
NL17SZ125/D
NL17SZ125
V
V
A
OE
1
CC
CC
OE
A
1
2
3
6
5
V
CC
5
5
1
A
2
GND
2
NC
Y
GND
3
OE
3
Y
Y
4
4
GND
4
SOT−953
(SC−88A/SOT−553/
TSOP−5/ SC−74A)
UDFN6
Figure 2. Pinout (Top View)
PIN ASSIGNMENT (SOT−953)
PIN ASSIGNMENT
(SC−88A/SOT−553/ TSOP−5/SC−74A)
PIN ASSIGNMENT (UDFN)
Pin
Function
Pin
Function
Pin
Function
1
OE
1
A
1
OE
2
3
4
5
A
GND
Y
2
3
4
5
GND
OE
Y
2
3
4
5
6
A
GND
Y
V
CC
V
CC
NC
V
CC
FUNCTION TABLE
Input
Output
OE
A
L
Y
L
L
L
H
X
H
Z
H
X = Don’t Care
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2
NL17SZ125
MAXIMUM RATINGS
Symbol
Characteristics
Value
Unit
V
CC
DC Supply Voltage
UDFN6, SOT−553, TSOP−5, SC−88A (NLV)
SC−74A, SC−88A, SOT−953
−0.5 to +7.0
−0.5 to +6.5
V
V
DC Input Voltage
UDFN6, SOT−553, TSOP−5, SC−88A (NLV)
SC−74A, SC−88A, SOT−953
−0.5 to +7.0
−0.5 to +6.5
V
V
IN
DC Output Voltage
TSOP−5, SC−88A (NLV),
UDFN6, SOT−553
Active−Mode (High or Low State)
Tri−State Mode (Note 1)
−0.5 to V + 0.5
V
OUT
CC
−0.5 to +7.0
−0.5 to +7.0
Power−Down Mode (V = 0 V)
CC
DC Output Voltage
SC−74A, SC−88A, SOT−953
Active−Mode (High or Low State)
Tri−State Mode (Note 1)
−0.5 to V + 0.5
−0.5 to +6.5
−0.5 to +6.5
V
CC
Power−Down Mode (V = 0 V)
CC
I
DC Input Diode Current
V
< GND
< GND
−50
50
mA
mA
mA
mA
°C
IK
IN
I
DC Output Diode Current
V
OUT
OK
I
DC Output Source/Sink Current
DC Supply Current per Supply Pin or Ground Pin
Storage Temperature Range
50
OUT
I
or I
100
CC
GND
T
−65 to +150
260
STG
T
Lead Temperature, 1 mm from Case for 10 secs
Junction Temperature Under Bias
Thermal Resistance (Note 2)
°C
L
T
+150
°C
J
q
SC−88A
SC−74A
TSOP−5
SOT−553
SOT−953
UDFN6
659
555
555
562
560
382
°C/W
JA
P
D
Power Dissipation in Still Air
SC−88A
SC−74A
TSOP−5
SOT−553
SOT−953
UDFN6
190
225
225
222
223
327
mW
MSL
Moisture Sensitivity
Level 1
−
−
V
F
R
Flammability Rating
Oxygen Index: 28 to 34
UL 94 V−0 @ 0.125 in
V
ESD
ESD Withstand Voltage (Note 3)
Human Body Model
Charged Device Model
2000
1000
I
Latchup Performance (Note 4)
$100
mA
Latchup
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Applicable to devices with outputs that may be tri−stated.
2. Measured with minimum pad spacing on an FR4 board, using 10mm−by−1inch, 2 ounce copper trace no air flow.
3. HBM tested to ANSI/ESDA/JEDEC JS−001−2017. CDM tested to EIA/JESD22−C101−F. JEDEC recommends that ESD qualification to
EIA/JESD22−A115−A (Machine Model) be discontinued per JEDEC/JEP172A.
4. Tested to EIA/JESD78 Class II.
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3
NL17SZ125
RECOMMENDED OPERATING CONDITIONS
Symbol
Characteristics
Min
1.65
0
Max
5.5
Unit
V
V
CC
Positive DC Supply Voltage
DC Input Voltage
V
IN
5.5
V
V
OUT
DC Output Voltage
Active−Mode (High or Low State)
Tri−State Mode (Note 1)
0
0
0
V
CC
5.5
5.5
Power−Down Mode (V = 0 V)
CC
T
A
Operating Temperature Range
−55
+125
°C
Input Rise and Fall Time
(TSOP−5, SC−88A (NLV), UDFN6, SOT−553)
V
CC
V
CC
= 3.0 V to 3.6 V
= 4.5 V to 5.5 V
0
0
100
20
t , t
ns/V
r
f
Input Rise and Fall Time
(SC−74A, SC−88A, SOT−953)
V
= 1.65 V to 1.95 V
0
0
0
0
20
20
10
5
CC
V
V
V
= 2.3 V to 2.7 V
= 3.0 V to 3.6 V
= 4.5 V to 5.5 V
CC
CC
CC
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
DC ELECTRICAL CHARACTERISTICS
T
A
= 255C
Typ
−555C 3 T 3 1255C
A
V
(V)
CC
Min
Max
Min
Max
Symbol
Parameter
Condition
Units
1.65 to 1.95 0.65 V
−
−
−
−
−
−
0.65 V
−
−
V
High−Level Input
V
CC
CC
CC
IH
Voltage
2.3 to 5.5
1.65 to 1.95
2.3 to 5.5
0.70 V
0.70 V
CC
−
−
0.35 V
−
−
0.35 V
V
Low−Level Input
Voltage
V
V
CC
CC
IL
0.30 V
0.30 V
CC
CC
V
OH
High−Level Output
Voltage
V
= V or V
IH IL
IN
I
= −100 mA
= −4 mA
1.65 to 5.5
1.65
2.3
V
CC
− 0.1
V
−
−
−
−
−
−
−
V − 0.1
CC
1.29
−
−
−
−
−
−
−
OH
OH
CC
I
1.29
1.4
I
= −8 mA
1.9
2.2
2.4
2.3
3.8
1.9
2.2
2.4
2.3
3.8
OH
2.1
2.4
2.7
2.5
4.0
I
= −12 mA
= −16 mA
= −24 mA
= −32 mA
2.7
OH
I
3.0
OH
I
3.0
OH
I
4.5
OH
V
OL
Low−Level Output
Voltage
V
= V or V
V
IN
IH
IL
I
= 100 mA
= 4 mA
1.65 to 5.5
1.65
2.3
−
−
−
−
−
−
−
0.1
0.24
0.3
0.4
0.4
0.55
0.55
−
−
−
−
−
−
−
0.1
0.24
0.3
0.4
0.4
0.55
0.55
OL
OL
I
0.08
0.2
0.22
0.28
0.38
0.42
I
OL
= 8 mA
OL
I
= 12 mA
= 16 mA
= 24 mA
= 32 mA
2.7
I
3.0
OL
I
3.0
OL
I
4.5
OL
I
Input Leakage Current
V
= 5.5 V or GND
1.65 to 5.5
1.65 to 5.5
−
−
−
−
0.1*
0.5
−
−
1.0
5.0
mA
mA
IN
IN
I
3−State Output
Leakage Current
V
OUT
= 0 V to 5.5 V
OZ
I
Power Off Leakage
Current
V
V
= 5.5 V or
OUT
0
−
−
−
−
1.0
1.0
−
−
10
10
mA
mA
OFF
IN
= 5.5 V
I
Quiescent Supply
Current
V
IN
= V or GND
5.5
CC
CC
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
*Guaranteed by design.
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4
NL17SZ125
AC ELECTRICAL CHARACTERISTICS (t = t = 3.0 ns)
R
F
T
= 255C
−555C 3 T 3 1255C
A
A
V
(V)
CC
Min Typ Max
Min
Max
10.5
8.0
5.5
6.0
4.8
5.3
10
Symbol
Parameter
Condition
Units
t
Propagation Delay, A to Y
(Figures 3 and 4)
1.65 to 1.95
2.3 to 2.7
3.0 to 3.6
−
−
−
−
−
−
−
−
−
−
−
−
−
6.0
3.4
2.5
2.9
2.0
2.3
6.5
3.6
2.8
2.0
5.0
3.3
2.7
2.6
10
7.5
5.2
5.7
4.5
5.0
9.5
8.5
6.2
5.5
10
−
ns
R = 1 MW, C = 15 pF
PLH
L
L
t
PHL
R = 1 MW, C = 15 pF
−
L
L
R = 1 MW, C = 15 pF
−
L
L
R = 500 W, C = 50 pF
−
L
L
4.5 to 5.5
−
R = 1 MW, C = 15 pF
L
L
R = 500 W, C = 50 pF
−
L
L
t
Output Enable Time,
OE to Y
1.65 to 1.95
2.3 to 2.7
3.0 to 3.6
4.5 to 5.5
1.65 to 1.95
2.3 to 2.7
3.0 to 3.6
4.5 to 5.5
−
ns
ns
PZH
PZL
t
−
9.0
6.5
5.8
10.5
8.5
6.0
5.0
(Figures 3 and 4)
−
−
t
Output Disable Time,
OE to Y
(Figures 3 and 4)
−
PHZ
t
PLZ
8.0
5.7
4.7
−
−
−
CAPACITIVE CHARACTERISTICS (t = t = 3.0 ns)
R
F
Symbol
Parameter
Input Capacitance
Output Capacitance
Condition
Typical
2.5
Units
pF
C
V
V
= 5.5 V, V = 0 V or V
IN
IN
CC
CC
CC
C
= 5.5 V, V = 0 V or V
2.5
pF
OUT
CC
IN
C
Power Dissipation Capacitance
(Note 5)
10 MHz, V = 3.3 V, V = 0 V or V
9
11
pF
PD
CC
IN
CC
CC
10 MHz, V = 5.5 V, V = 0 V or V
CC
IN
5. C is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
PD
Average operating current can be obtained by the equation: I
) = C ꢀ V ꢀ f + I . C is used to determine the no−load dynamic
CC(OPR
PD CC in CC PD
2
power consumption; P = C ꢀ V
ꢀ f + I ꢀ V
.
D
PD
CC
in
CC
CC
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5
NL17SZ125
OPEN
Test
Switch
C , pF
L
R , W R , W
L 1
2 x V
DUT
GND
Position
CC
t
/ t
Open
See AC Characteristics Table
PLH PHL
R
1
L
t
/ t
2 x V
50
50
500
500
500
500
PLZ PZL
CC
t
/ t
GND
OUTPUT
PHZ PZH
X = Don’t Care
R
R
T
C *
L
C includes probe and jig capacitance
L
R is Z
of pulse generator (typically 50 W)
T
OUT
f = 1 MHz
Figure 3. Test Circuit
V
CC
t = 3 ns
r
t = 3 ns
f
V
CC
90%
90%
INPUT
V
mi
V
mi
V
mi
V
mi
INPUT
GND
~V
10%
10%
GND
t
t
PLZ
PZL
t
t
PLH
PHL
CC
V
OH
V
OUTPUT
OUTPUT
mo
V
V
V
V
OUTPUT
OUTPUT
mo
mo
V
OL
+ V
OL
Y
V
V
V
OL
t
t
PHZ
PZH
t
t
PLH
PHL
V
OH
Y
OH
V
OH
− V
V
mo
mo
mo
V
OL
~0 V
Figure 4. Switching Waveforms
V , V
mo
t
, t
t
, t , t , t
PZL PLZ PZH PHZ
V
CC
, V
V
mi
, V
V , V
Y
PLH PHL
1.65 to 1.95
2.3 to 2.7
3.0 to 3.6
4.5 to 5.5
V
CC
V
CC
V
CC
V
CC
/2
/2
/2
/2
(V − V )/2
V
CC
V
CC
V
CC
V
CC
/2
/2
/2
/2
0.15
0.15
0.3
OH
OL
(V − V )/2
OH
OL
(V − V )/2
OH
OL
(V − V )/2
0.3
OH
OL
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6
NL17SZ125
DEVICE ORDERING INFORMATION
Pin 1 Orientation
(See below)
†
Device
Packages
Specific Device Code
Shipping
NL17SZ125DFT2G
NLV17SZ125DFT2G*
SC−88A
SC−88A
SC−74A
M0
M0
Q4
Q4
Q4
3000 / Tape & Reel
3000 / Tape & Reel
3000 / Tape & Reel
NL17SZ125DBVT1G
(In Development)
TBD
NL17SZ125DTT1G
NL17SZ125XV5T2G
NL17SZ125P5T5G
TSOP−5
SOT−553
SOT−953
M0
M0
Q4
Q4
Q2
3000 / Tape & Reel
3000 / Tape & Reel
4000 / Tape & Reel
Q
(Rotated 180° CW)
NL17SZ125MU1TCG
(In Development)
UDFN6, 1.45 x 1.0 x 0.35P
UDFN6, 1.0 x 1.0 x 0.35P
TBD
Q4
Q4
3000 / Tape & Reel
3000 / Tape & Reel
NL17SZ125MU3TCG
(In Development)
A
(Rotated 90° CCW)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
Pin 1 Orientation in Tape and Reel
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7
NL17SZ125
PACKAGE DIMENSIONS
SC−88A (SC−70−5/SOT−353)
CASE 419A−02
ISSUE L
A
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
G
2. CONTROLLING DIMENSION: INCH.
3. 419A−01 OBSOLETE. NEW STANDARD
419A−02.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
5
4
3
−B−
S
INCHES
DIM MIN MAX
MILLIMETERS
MIN
1.80
1.15
0.80
0.10
MAX
2.20
1.35
1.10
0.30
1
2
A
B
C
D
G
H
J
0.071
0.045
0.031
0.004
0.087
0.053
0.043
0.012
0.026 BSC
0.65 BSC
M
M
B
D 5 PL
0.2 (0.008)
---
0.004
0.004
0.004
0.010
0.012
---
0.10
0.10
0.10
0.25
0.30
K
N
S
N
0.008 REF
0.20 REF
0.079
0.087
2.00
2.20
J
C
K
H
SOLDER FOOTPRINT*
0.50
0.0197
0.65
0.025
0.65
0.025
0.40
0.0157
1.9
0.0748
mm
inches
ǒ
Ǔ
SCALE 20:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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8
NL17SZ125
PACKAGE DIMENSIONS
SC−74A
CASE 318BQ
ISSUE B
5X b
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
0.20 C A B
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.15 PER SIDE.
M
5
4
E1
E
1
2
3
0.05
A1
L
B
e
DETAIL A
A
D
MILLIMETERS
DIM
A
A1
b
c
D
E
E1
e
MIN
0.90
0.01
0.25
0.10
2.85
2.50
1.35
MAX
1.10
0.10
0.50
0.26
3.15
3.00
1.65
TOP VIEW
SIDE VIEW
A
DETAIL A
c
0.95 BSC
SEATING
END VIEW
C
PLANE
L
M
0.20
0
0.60
10
_
_
RECOMMENDED
SOLDERING FOOTPRINT*
0.95
PITCH
2.40
5X
1.00
5X
0.70
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
9
NL17SZ125
PACKAGE DIMENSIONS
TSOP−5
CASE 483−02
ISSUE M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
NOTE 5
5X
D
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.15 PER SIDE. DIMENSION A.
5. OPTIONAL CONSTRUCTION: AN ADDITIONAL
TRIMMED LEAD IS ALLOWED IN THIS LOCATION.
TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2
FROM BODY.
0.20 C A B
2X
0.10
T
M
5
4
3
2X
0.20
T
B
S
1
2
K
B
A
DETAIL Z
G
A
MILLIMETERS
TOP VIEW
DIM
A
B
C
D
MIN
2.85
1.35
0.90
0.25
MAX
3.15
1.65
1.10
0.50
DETAIL Z
J
G
H
J
K
M
S
0.95 BSC
C
0.01
0.10
0.20
0
0.10
0.26
0.60
10
3.00
0.05
H
SEATING
PLANE
END VIEW
C
_
_
SIDE VIEW
2.50
SOLDERING FOOTPRINT*
1.9
0.074
0.95
0.037
2.4
0.094
1.0
0.039
0.7
0.028
mm
inches
ǒ
Ǔ
SCALE 10:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
10
NL17SZ125
PACKAGE DIMENSIONS
SOT−553, 5 LEAD
CASE 463B
ISSUE C
NOTES:
D
−X−
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
A
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL.
L
5
4
3
MILLIMETERS
INCHES
NOM
0.022
0.009
0.005
E
−Y−
DIM
A
b
c
D
E
e
L
H
MIN
0.50
0.17
0.08
1.55
1.15
NOM
0.55
MAX
MIN
MAX
0.024
0.011
0.007
0.065
0.049
H
E
0.60
0.27
0.18
1.65
1.25
0.020
0.007
0.003
0.061
0.045
1
2
0.22
0.13
1.60
0.063
0.047
b 5 PL
c
1.20
e
M
0.50 BSC
0.20
1.60
0.020 BSC
0.008
0.063
0.08 (0.003)
X Y
0.10
1.55
0.30
1.65
0.004
0.061
0.012
0.065
E
SOLDERING FOOTPRINT*
0.3
0.0118
0.45
0.0177
1.0
0.0394
1.35
0.0531
0.5
0.5
0.0197 0.0197
mm
inches
ǒ
Ǔ
SCALE 20:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
11
NL17SZ125
PACKAGE DIMENSIONS
SOT−953
CASE 527AE
ISSUE E
NOTES:
X
Y
D
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
A
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF THE BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS.
5
4
3
PIN ONE
H
E
INDICATOR
E
1
2
MILLIMETERS
DIM MIN
NOM
0.37
0.15
0.12
1.00
MAX
0.40
0.20
0.17
1.05
0.85
A
b
0.34
0.10
0.07
0.95
0.75
C
TOP VIEW
e
C
D
SIDE VIEW
E
e
0.80
0.35 BSC
HE
L
0.95
1.00
0.175 REF
1.05
5X
L
L2
L3
0.05
−−−
0.10
−−−
0.15
0.15
5X
5X
L3
L2
SOLDERING FOOTPRINT*
5X
0.35
5X
0.20
5X
b
PACKAGE
OUTLINE
0.08 X
Y
BOTTOM VIEW
1.20
1
0.35
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
12
NL17SZ125
PACKAGE DIMENSIONS
UDFN6, 1.45x1.0, 0.5P
CASE 517AQ
ISSUE O
A
B
D
L
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
L1
DETAIL A
PIN ONE
OPTIONAL
E
MILLIMETERS
REFERENCE
CONSTRUCTIONS
DIM MIN
0.45
A1 0.00
MAX
0.55
0.05
A
0.10
C
EXPOSED Cu
MOLD CMPD
A2
b
0.07 REF
0.20
1.45 BSC
TOP VIEW
0.30
0.10
C
D
E
e
1.00 BSC
0.50 BSC
DETAIL B
L
L1
0.30
−−−
0.40
0.15
DETAIL B
OPTIONAL
0.05
0.05
C
C
CONSTRUCTIONS
A
MOUNTING FOOTPRINT
6X
A1
6X
SEATING
PLANE
A2
C
0.30
SIDE VIEW
e
PACKAGE
OUTLINE
6X L
1.24
3
1
DETAIL A
6X
0.53
1
0.50
PITCH
DIMENSIONS: MILLIMETERS
6
4
6X b
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
0.10 C A B
NOTE 3
C
0.05
BOTTOM VIEW
www.onsemi.com
13
NL17SZ125
PACKAGE DIMENSIONS
UDFN6, 1x1, 0.35P
CASE 517BX
ISSUE O
L1
NOTES:
L
A B
D
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.20 MM FROM TERMINAL TIP.
4. PACKAGE DIMENSIONS EXCLUSIVE OF
BURRS AND MOLD FLASH.
PIN ONE
L3
REFERENCE
E
DETAIL A
ALTERNATE TERMINAL
CONSTRUCTION
2X
0.08
C
MILLIMETERS
DIM MIN
MAX
0.65
0.05
A
A1
A3
b
0.50
0.00
0.13 REF
2X
0.08
C
TOP VIEW
EXPOSED Cu
MOLD CMPD
0.17
0.23
DETAIL B
0.05
C
C
D
E
e
L
L1
L3
1.00 BSC
1.00 BSC
0.35
A3
DETAIL B
A
0.20
−−−
0.26
0.40
0.15
0.33
ALTERNATE
CONSTRUCTION
0.05
A1
SEATING
PLANE
C
SIDE VIEW
e
RECOMMENDED
SOLDERING FOOTPRINT*
DETAIL A
6X
0.52
6X L
6X
0.25
3
1
1.20
PACKAGE
OUTLINE
1
6
4
6X b
0.35
M
0.07
0.05
C A
B
PITCH
M
C
NOTE 3
BOTTOM VIEW
DIMENSION: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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