NL27WZ02USG-L22190 [ONSEMI]

Dual 2-Input NOR Gate;
NL27WZ02USG-L22190
型号: NL27WZ02USG-L22190
厂家: ONSEMI    ONSEMI
描述:

Dual 2-Input NOR Gate

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NL27WZ02  
Dual 2−Input NOR Gate  
The NL27WZ02 is a high performance dual 2−input NOR Gate  
operating from a 1.65 V to 5.5 V supply.  
Features  
Extremely High Speed: t 2.5 ns (typical) at V = 5.0 V  
PD  
CC  
http://onsemi.com  
MARKING  
Designed for 1.65 V to 5.5 V V Operation  
CC  
Over Voltage Tolerant Inputs  
DIAGRAM  
LVTTL Compatible − Interface Capability With 5.0 V TTL Logic  
with V = 3.0 V  
CC  
8
8
LVCMOS Compatible  
1
24 mA Balanced Output Sink and Source Capability  
L3 M G  
Near Zero Static Supply Current Substantially Reduces System  
G
US8  
Power Requirements  
US SUFFIX  
CASE 493  
1
Replacement for NC7WZ02  
Chip Complexity: FET = 112  
L3 = Specific Device Code  
Pb−Free Package is Available  
M
G
= Date Code*  
= Pb−Free Package  
(Note: Microdot may be in either location)  
*Date Code orientation may vary depending upon  
manufacturing location.  
8
7
6
A1  
B1  
V
CC  
1
2
PIN ASSIGNMENT  
Pin  
Function  
1
A1  
Y1  
B2  
A2  
2
3
4
5
6
7
8
B1  
Y2  
Y2  
3
4
GND  
A2  
5
B2  
GND  
Y1  
V
CC  
Figure 1. Pinout  
FUNCTION TABLE  
Output  
Input  
Y = A + B  
A1  
w1  
B1  
A2  
Y1  
Y2  
A
L
B
L
Y
H
L
L
H
L
B2  
H
H
L
Figure 2. Logic Symbol  
H
L
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 4 of this data sheet.  
© Semiconductor Components Industries, LLC, 2006  
1
Publication Order Number:  
May, 2006 − Rev. 8  
NL27WZ02/D  
NL27WZ02  
MAXIMUM RATINGS  
Parameter  
Symbol  
Value  
*0.5 to )7.0  
*0.5 to )7.0  
*0.5 to )7.0  
*50  
Unit  
V
DC Supply Voltage  
V
CC  
DC Input Voltage  
V
V
I
O
DC Output Voltage  
V
V
DC Input Diode Current  
DC Output Diode Current  
DC Output Sink Current  
DC Supply Current per Supply Pin  
DC Ground Current per Ground Pin  
Storage Temperature Range  
V < GND  
I
IK  
mA  
mA  
mA  
mA  
mA  
°C  
I
V
O
< GND  
I
*50  
OK  
I
O
$50  
I
$100  
CC  
I
$100  
GND  
T
STG  
*65 to )150  
260  
Lead Temperature, 1 mm from Case for 10 Seconds  
Junction Temperature under Bias  
Thermal Resistance (Note 1)  
Power Dissipation in Still Air at 85°C  
Moisture Sensitivity  
T
L
°C  
T
)150  
°C  
J
q
250  
°C/W  
mW  
JA  
P
D
250  
MSL  
Level 1  
Flammability Rating  
Oxygen Index: 28 to 34  
F
R
UL 94 V−0 @ 0.125 in  
ESD Withstand Voltage  
Human Body Model (Note 2)  
Machine Model (Note 3)  
Charged Device Model (Note 4)  
V
ESD  
> 2000  
> 200  
N/A  
V
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the  
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect  
device reliability.  
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace with no air flow.  
2. Tested to EIA/JESD22−A114−A.  
3. Tested to EIA/JESD22−A115−A.  
4. Tested to JESD22−C101−A.  
RECOMMENDED OPERATING CONDITIONS  
Parameter  
Symbol  
Min  
Max  
Unit  
Supply Voltage  
Operating  
Data Retention Only  
V
CC  
1.65  
1.5  
5.5  
5.5  
V
Input Voltage (Note 5)  
V
0
0
5.5  
V
V
I
Output Voltage  
(HIGH or LOW State)  
V
O
V
CC  
Operating Free−Air Temperature  
Input Transition Rise or Fall Rate  
T
*40  
)85  
°C  
A
V
= 1.8 V $0.15 V  
Dt/DV  
0
0
0
0
20  
20  
10  
5
ns/V  
CC  
V
V
V
= 2.5 V $0.2 V  
= 3.0 V $0.3 V  
= 5.0 V $0.5 V  
CC  
CC  
CC  
5. Unused inputs may not be left open. All inputs must be tied to a high−logic voltage level or a low−logic input voltage level.  
http://onsemi.com  
2
 
NL27WZ02  
DC ELECTRICAL CHARACTERISTICS  
T
A
= 255C  
Typ  
*405C v T v 855C  
A
V
(V)  
CC  
Symbol  
Min  
Max  
Min  
Max  
Parameter  
Condition  
Unit  
High−Level Input  
Voltage  
V
IH  
1.65  
2.3 to 5.5  
0.75 V  
0.7 V  
0.75 V  
0.7 V  
V
CC  
CC  
CC  
CC  
Low−Level Input  
Voltage  
V
1.65  
2.3 to 5.5  
0.25 V  
0.3 V  
0.25 V  
0.3 V  
V
V
IL  
CC  
CC  
CC  
CC  
High−Level Output  
Voltage  
I
I
= −100 mA  
V
OH  
1.65 to 5.5  
1.65  
2.3  
V
CC  
− 0.1  
1.29  
V
V
CC  
− 0.1  
1.29  
OH  
OH  
CC  
= −4 mA  
= −8 mA  
= −12 mA  
= −16 mA  
= −24 mA  
= −32 mA  
1.5  
2.1  
2.4  
2.7  
2.5  
4.0  
V
IN  
= V or V  
I
1.9  
2.2  
2.4  
2.3  
3.8  
1.90  
2.20  
2.40  
2.30  
3.80  
IL  
IH  
OH  
I
2.7  
3.0  
3.0  
4.5  
OH  
I
OH  
I
OH  
I
OH  
Low−Level Output  
Voltage  
I
= 100 mA  
= 4 mA  
V
OL  
1.65 to 5.5  
1.65  
2.3  
0.0  
0.1  
0.24  
0.3  
0.4  
0.4  
0.55  
0.55  
0.1  
0.24  
0.3  
0.4  
0.4  
0.55  
0.55  
V
OL  
I
OL  
0.08  
0.20  
0.22  
0.28  
0.38  
0.42  
V
IN  
= V or V  
I = 8 mA  
IH  
OH  
OL  
I
OL  
= 12 mA  
= 16 mA  
= 24 mA  
= 32 mA  
2.7  
3.0  
3.0  
4.5  
I
OL  
I
OL  
I
OL  
Input Leakage  
Current  
V
= V or GND  
I
IN  
0 to 5.5  
5.5  
$0.1  
$1.0  
mA  
mA  
IN  
CC  
Quiescent Supply  
Current  
V
IN  
= V or GND  
I
1.0  
10  
CC  
CC  
AC ELECTRICAL CHARACTERISTICS t = t = 3.0 ns  
R
F
T
A
= 255C  
Typ  
*405C v T v 855C  
A
V
CC  
Min  
2.0  
1.2  
Max  
9.5  
Min  
2.0  
1.2  
Max  
(V)  
Parameter  
Condition  
R = 1 MW, C = 15 pF  
Symbol  
Unit  
Propagation Delay  
(Figure 3 and 4)  
t
t
1.8 $ 0.15  
2.5 $ 0.20  
3.3 $ 0.30  
7.4  
9.7  
ns  
L
L
PLH  
PHL  
3.3  
5.4  
5.8  
R = 1 MW, C = 15 pF  
0.8  
1.2  
2.6  
3.2  
3.9  
4.8  
0.8  
1.2  
4.3  
5.2  
L
L
R = 500 W, C = 50 pF  
L
L
R = 1 MW, C = 15 pF  
5.0 $ 0.50  
0.5  
0.8  
1.9  
2.5  
3.1  
3.7  
0.5  
0.8  
3.3  
4.0  
L
L
R = 500 W, C = 50 pF  
L
L
CAPACITIVE CHARACTERISTICS  
Parameter  
Condition  
= 5.5 V, V = 0 V or V  
Symbol  
Typical  
Unit  
pF  
Input Capacitance  
V
CC  
C
2.5  
I
CC  
IN  
Power Dissipation Capacitance  
(Note 6)  
10 MHz, V = 3.3 V, V = 0 V or V  
C
9.0  
11.0  
pF  
CC  
I
CC  
CC  
PD  
10 MHz, V = 5.5 V, V = 0 V or V  
CC  
I
6. C is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.  
PD  
Average operating current can be obtained by the equation: I  
power consumption; P = C V  
) = C V f + I . C is used to determine the no−load dynamic  
CC(OPR  
PD CC in CC PD  
2
f + I V  
.
D
PD  
CC  
in  
CC  
CC  
http://onsemi.com  
3
 
NL27WZ02  
t = 3 ns  
f
t = 3 ns  
f
V
CC  
90%  
50%  
90%  
50%  
INPUT  
A and B  
INPUT  
10%  
10%  
OUTPUT  
GND  
R
C
L
L
t
t
PHL  
PLH  
V
V
OH  
OUTPUT Y  
50%  
50%  
A 1−MHz square input wave is recommended for  
propagation delay tests.  
OL  
Figure 3. Switching Waveform  
Figure 4. Test Circuit  
ORDERING INFORMATION  
Device Nomenclature  
Logic  
No. of  
Temp  
Device  
Function  
Package  
Suffix  
Circuit  
Indicator  
Device  
Gates per  
Package  
Range  
Identifier  
Technology  
Package  
Shipping  
NL27WZ02US  
NL  
NL27WZ02USG  
2
7
WZ  
02  
US  
US8  
3000/Tape & Reel  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
http://onsemi.com  
4
NL27WZ02  
PACKAGE DIMENSIONS  
US8  
CASE 493−02  
ISSUE B  
NOTES:  
−X−  
−Y−  
1. DIMENSIONING AND TOLERANCING PER  
ANSI Y14.5M, 1982.  
A
J
2. CONTROLLING DIMENSION: MILLIMETERS.  
3. DIMENSION “A” DOES NOT INCLUDE MOLD  
FLASH, PROTRUSION OR GATE BURR.  
MOLD FLASH. PROTRUSION AND GATE  
BURR SHALL NOT EXCEED 0.140 MM  
(0.0055”) PER SIDE.  
4. DIMENSION “B” DOES NOT INCLUDE  
INTER−LEAD FLASH OR PROTRUSION.  
INTER−LEAD FLASH AND PROTRUSION  
SHALL NOT E3XCEED 0.140 (0.0055”) PER  
SIDE.  
8
5
DETAIL E  
B
L
5. LEAD FINISH IS SOLDER PLATING WITH  
THICKNESS OF 0.0076−0.0203 MM.  
(300−800 “).  
6. ALL TOLERANCE UNLESS OTHERWISE  
SPECIFIED 0.0508 (0.0002 “).  
1
4
R
S
G
P
U
MILLIMETERS  
INCHES  
DIM  
A
B
C
D
F
G
H
J
K
L
M
N
P
MIN  
1.90  
2.20  
0.60  
0.17  
0.20  
0.50 BSC  
0.40 REF  
0.10  
MAX  
2.10  
2.40  
0.90  
0.25  
0.35  
MIN  
MAX  
0.083  
0.094  
0.035  
0.010  
0.014  
0.075  
0.087  
0.024  
0.007  
0.008  
0.020 BSC  
0.016 REF  
0.004  
C
H
−T−  
SEATING  
PLANE  
0.10 (0.004)  
T
K
N
D
R 0.10 TYP  
M
M
0.10 (0.004)  
T
X Y  
0.18  
0.10  
3.20  
6
0.007  
0.004  
0.126  
6
V
0.00  
3.00  
0
0.000  
0.118  
0
_
_
_
_
5
10  
5
10  
_
_
_
_
0.23  
0.23  
0.37  
0.60  
0.34  
0.33  
0.47  
0.80  
0.010  
0.009  
0.015  
0.024  
0.013  
0.013  
0.019  
0.031  
F
R
S
U
V
DETAIL E  
0.12 BSC  
0.005 BSC  
SOLDERING FOOTPRINT*  
3.8  
0.15  
1.8  
0.07  
0.50  
0.0197  
0.30  
0.012  
1.0  
0.0394  
mm  
inches  
ǒ
Ǔ
SCALE 8:1  
*For additional information on our Pb−Free strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
ON Semiconductor and  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice  
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All  
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights  
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications  
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should  
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,  
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal  
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMENT:  
N. American Technical Support: 800−282−9855 Toll Free  
USA/Canada  
Europe, Middle East and Africa Technical Support:  
Phone: 421 33 790 2910  
Japan Customer Focus Center  
Phone: 81−3−5773−3850  
ON Semiconductor Website: www.onsemi.com  
Order Literature: http://www.onsemi.com/orderlit  
Literature Distribution Center for ON Semiconductor  
P.O. Box 5163, Denver, Colorado 80217 USA  
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada  
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada  
Email: orderlit@onsemi.com  
For additional information, please contact your local  
Sales Representative  
NL27WZ02/D  

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