NL27WZ16DFT2 [ONSEMI]

Dual Buffer; 双缓冲
NL27WZ16DFT2
型号: NL27WZ16DFT2
厂家: ONSEMI    ONSEMI
描述:

Dual Buffer
双缓冲

文件: 总6页 (文件大小:63K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
NL27WZ16  
Dual Buffer  
The NL27WZ16 is a high performance dual buffer operating from a  
1.65 to 5.5 V supply. At V = 3 V, high impedance TTL compatible  
CC  
inputs significantly reduce current loading to input drivers while TTL  
compatible outputs offer improved switching noise performance.  
Extremely High Speed: t 2.0 ns (typical) at V = 5.0 V  
PD  
CC  
http://onsemi.com  
Designed for 1.65 V to 5.5 V V Operation  
CC  
MARKING  
DIAGRAMS  
Over Voltage Tolerant Inputs  
LVTTL Compatible − Interface Capability With 5.0 V TTL Logic  
with V = 3.0 V  
CC  
LVCMOS Compatible  
24 mA Balanced Output Sink and Source Capability  
SC−88 / SOT−363/SC−70  
DF SUFFIX  
MRd  
CASE 419B  
Near Zero Static Supply Current Substantially Reduces System  
Power Requirements  
1
Chip Complexity: FET = 72; Equivalent Gate = 18  
d = Date Code  
6
5
4
OUT Y1  
1
2
IN A1  
GND  
TSOP−6/SOT−23/SC−59  
DT SUFFIX  
MRd  
CASE 318G  
V
CC  
1
d = Date Code  
3
OUT Y2  
IN A2  
Figure 1. Pinout (Top View)  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 4 of this data sheet.  
1
1
IN A1  
IN A2  
OUT Y1  
OUT Y2  
Figure 2. Logic Symbol  
PIN ASSIGNMENT  
FUNCTION TABLE  
1
2
3
4
IN A1  
GND  
A Input  
Y Output  
L
L
IN A2  
H
H
OUT Y2  
5
6
V
CC  
OUT Y1  
Semiconductor Components Industries, LLC, 2004  
1
Publication Order Number:  
March, 2004 − Rev. 2  
NL27WZ16/D  
NL27WZ16  
MAXIMUM RATINGS (Note 1)  
Symbol  
Characteristics  
Value  
Unit  
V
V
V
V
DC Supply Voltage  
*0.5 to )7.0  
CC  
I
DC Input Voltage  
*0.5 V )7.0  
V
I
DC Output Voltage  
Output in Z or LOW State (Note 2)  
V < GND  
*0.5 V 7.0  
V
O
O
I
I
I
I
I
DC Input Diode Current  
*50  
*50  
mA  
mA  
mA  
mA  
mA  
°C  
IK  
I
DC Output Diode Current  
DC Output Sink Current  
V < GND  
O
OK  
O
$50  
DC Supply Current per Supply Pin  
DC Ground Current per Ground Pin  
Storage Temperature Range  
Power Dissipation in Still Air  
Thermal Resistance  
$100  
$100  
*65 to )150  
200  
CC  
GND  
T
STG  
P
D
SC−88, TSOP−6  
SC−88, TSOP−6  
mW  
°C/W  
°C  
q
333  
JA  
T
L
T
J
Lead Temperature, 1 mm from case for 10 s  
Junction Temperature under Bias  
ESD Withstand Voltage  
260  
)150  
°C  
V
ESD  
Human Body Model (Note 3)  
Machine Model (Note 4)  
> 2000  
> 200  
N/A  
V
Charged Device Model (Note 5)  
I
Latch−Up Performance  
Above V and Below GND at 85°C (Note 6)  
$500  
mA  
Latch−Up  
CC  
1. Absolute maximum continuous ratings are those values beyond which damage to the device may occur. Exposure to these conditions or  
conditions beyond those indicated may adversely affect device reliability. Functional operation under absolute−maximum−rated conditions  
is not implied.  
2. I absolute maximum rating must be observed.  
O
3. Tested to EIA/JESD22−A114−A  
4. Tested to EIA/JESD22−A115−A  
5. Tested to JESD22−C101−A  
6. Tested to EIA/JESD78  
RECOMMENDED OPERATING CONDITIONS  
Symbol  
Parameter  
Min  
Max  
Unit  
V
CC  
Supply Voltage  
Operating  
Data Retention Only  
1.65  
1.5  
5.5  
5.5  
V
V
V
Input Voltage  
0
0
5.5  
5.5  
V
V
I
Output Voltage  
(High or LOW State)  
O
T
Operating Free−Air Temperature  
Input Transition Rise or Fall Rate  
*40  
)85  
°C  
A
t/V  
V
V
= 1.8 V $0.15 V  
0
0
0
0
20  
20  
10  
5
ns/V  
CC  
= 2.5 V $0.2 V  
=3.0 V $0.3 V  
=5.0 V $0.5 V  
CC  
V
V
CC  
CC  
http://onsemi.com  
2
 
NL27WZ16  
DC ELECTRICAL CHARACTERISTICS  
T
A
= 255C  
Typ  
*405C v T v 855C  
A
V
(V)  
CC  
Min  
Max  
Min  
Max  
Symbol  
Parameter  
Unit  
Condition  
V
V
V
High−Level Input  
Voltage  
1.65 to 1.95 0.75 V  
0.75 V  
0.7 V  
V
IH  
CC  
CC  
CC  
CC  
2.3 to 5.5  
0.7 V  
Low−Level Input  
Voltage  
1.65 to 1.95  
2.3 to 5.5  
0.25 V  
0.3 V  
0.25 V  
0.3 V  
V
V
IL  
CC  
CC  
CC  
CC  
High−Level Output  
Voltage  
1.65  
1.8  
2.3  
3.0  
4.5  
1.55  
1.7  
2.2  
2.9  
4.4  
1.65  
1.8  
2.3  
3.0  
4.5  
1.55  
1.7  
2.2  
2.9  
4.4  
I
= −100 mA  
OH  
OH  
V
IN  
= V  
IH  
1.65  
2.3  
3.0  
3.0  
4.5  
1.29  
1.9  
2.4  
2.3  
3.8  
1.52  
2.15  
2.80  
2.68  
4.20  
1.29  
1.9  
2.4  
2.3  
3.8  
V
V
V
I
= −4 mA  
= −8 mA  
= −16 mA  
= −24 mA  
= −32 mA  
OH  
I
OH  
I
OH  
I
OH  
I
OH  
V
OL  
Low−Level Output  
Voltage  
1.65  
1.8  
2.3  
3.0  
4.5  
0.0  
0.0  
0.0  
0.0  
0.0  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
I
OL  
= 100 mA  
V
IN  
= V  
IL  
1.65  
2.3  
3.0  
3.0  
4.5  
0.08  
0.10  
0.15  
0.22  
0.22  
0.24  
0.30  
0.40  
0.55  
0.55  
0.24  
0.30  
0.40  
0.55  
0.55  
I
OL  
= 4 mA  
= 8 mA  
= 16 mA  
= 24 mA  
= 32 mA  
I
OL  
I
OL  
I
OL  
I
OL  
I
I
Input Leakage Current  
0 to 5.5  
0.0  
$1.0  
$1.0  
mA  
mA  
0 V v V v 5.5 V  
IN  
IN  
Power Off Leakage  
Current  
1.0  
10  
V
IN  
or V  
= 5.5 V  
OFF  
OUT  
I
Quiescent Supply  
Current  
1.65 to 5.5  
1.0  
10  
mA  
V
IN  
= 5.5 V, GND  
CC  
AC ELECTRICAL CHARACTERISTICS t = t = 2.5 ns; C = 50 pF; R = 500 Ω  
R
F
L
L
T
A
= 25°C  
*40°C T 85°C  
A
Min  
Typ  
8.0  
3.0  
2.3  
3.0  
1..8  
2.4  
Max  
9.6  
5.2  
3.6  
4.6  
2.9  
3.8  
Min  
1.8  
1.0  
0.8  
1.2  
0.5  
0.8  
Max  
10.2  
5.8  
Symbol  
Parameter  
Condition  
V
(V)  
Unit  
CC  
R = 1 MW, C = 15 pF  
1.8 $ 0.15  
2.5 $ 0.2  
3.3 $ 0.3  
1.8  
1.0  
0.8  
1.2  
0.5  
0.8  
t
Propagation Delay  
(Figure 3 and 4)  
ns  
L
L
PLH  
PHL  
t
R = 1 MW, C = 15 pF  
L
L
R = 1 MW, C = 15 pF  
4.0  
L
L
R = 500 W, C = 50 pF  
5.1  
L
L
R = 1 MW, C = 15 pF  
3.2  
5.0 $ 0.5  
L
L
R = 500 W, C = 50 pF  
4.2  
L
L
CAPACITIVE CHARACTERISTICS  
Symbol  
Parameter  
Input Capacitance  
Power Dissipation Capacitance (Note 7)  
Condition  
= 5.5 V, V = 0 V or V  
CC  
Typical  
Unit  
C
V
CC  
7.0  
pF  
pF  
IN  
I
C
10 MHz, V = 3.3 V, V = 0 V or V  
9
11  
PD  
CC  
I
CC  
CC  
10 MHz, V = 5.5 V, V = 0 V or V  
CC  
I
7. C is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.  
PD  
Average operating current can be obtained by the equation: I  
power consumption; P = C V  
) = C V f ) I . C is used to determine the no−load dynamic  
CC(OPR  
PD CC in CC PD  
2
f ) I V  
.
D
PD  
CC  
in  
CC  
CC  
http://onsemi.com  
3
 
NL27WZ16  
V
CC  
V
CC  
A
Y
50%  
GND  
PULSE  
GENERATOR  
t
t
PHL  
PLH  
DUT  
R
T
C
R
L
L
50% V  
CC  
PROPAGATION DELAYS  
t
R
= t = 2.5 ns, 10% to 90%; f = 1 MHz; t = 500 ns  
F
W
R = Z  
of pulse generator (typically 50 )  
T
OUT  
Figure 3. Switching Waveforms  
Figure 4. Test Circuit  
DEVICE ORDERING INFORMATION  
No. of  
Device Nomenclature  
Temp  
Logic  
Circuit  
Indicator  
Tape &  
Reel  
Suffix  
Gates  
per  
Package  
Package Type  
(Name/SOT#/  
Common Name)  
Device  
Package  
Suffix  
Range  
Device  
Tape and  
Reel Size  
Function  
Identifier  
Technology  
Order Number  
SC−88 / SOT−363  
/ SC−70  
178 mm (7”)  
3000 Unit  
NL27WZ16DFT2  
NL27WZ16DTT1  
NL  
NL  
2
2
7
7
WZ  
WZ  
16  
16  
DF  
DT  
T2  
T1  
TSOP−6 / SOT−23  
/ SC−59  
178 mm (7”)  
3000 Unit  
http://onsemi.com  
4
NL27WZ16  
PACKAGE DIMENSIONS  
SC70−6/SC−88/SOT−363  
DF SUFFIX  
CASE 419B−02  
ISSUE U  
A
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
G
2. CONTROLLING DIMENSION: INCH.  
3. 419B−01 OBSOLETE, NEW STANDARD 419B−02.  
INCHES  
DIM MIN MAX  
MILLIMETERS  
6
1
5
4
3
MIN  
1.80  
1.15  
0.80  
0.10  
MAX  
2.20  
1.35  
1.10  
0.30  
A
B
C
D
G
H
J
K
N
S
0.071 0.087  
0.045 0.053  
0.031 0.043  
0.004 0.012  
0.026 BSC  
−−− 0.004  
0.004 0.010  
0.004 0.012  
0.008 REF  
S
−B−  
2
0.65 BSC  
−−−  
0.10  
0.10  
0.10  
0.25  
0.30  
D6 PL  
0.20 REF  
M
M
0.2 (0.008)  
B
0.079 0.087  
2.00  
2.20  
N
J
C
H
K
SOLDERING FOOTPRINT*  
0.50  
0.0197  
0.65  
0.025  
0.65  
0.025  
0.40  
0.0157  
1.9  
0.0748  
mm  
inches  
ǒ
Ǔ
SCALE 20:1  
*For additional information on our Pb−Free strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
http://onsemi.com  
5
NL27WZ16  
PACKAGE DIMENSIONS  
SOT23−6/TSOP−6/SC59−6  
DT SUFFIX  
CASE 318G−02  
ISSUE L  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER  
ANSI Y14.5M, 1982.  
A
2. CONTROLLING DIMENSION: MILLIMETER.  
3. MAXIMUM LEAD THICKNESS INCLUDES  
LEAD FINISH THICKNESS. MINIMUM LEAD  
THICKNESS IS THE MINIMUM THICKNESS  
OF BASE MATERIAL.  
4. DIMENSIONS A AND B DO NOT INCLUDE  
MOLD FLASH, PROTRUSIONS, OR GATE  
BURRS.  
L
6
5
2
4
B
C
S
1
3
MILLIMETERS  
DIM MIN MAX  
INCHES  
MIN MAX  
D
A
B
C
D
G
H
J
K
L
M
S
2.90  
1.30  
0.90  
0.25  
0.85  
3.10 0.1142 0.1220  
1.70 0.0512 0.0669  
1.10 0.0354 0.0433  
0.50 0.0098 0.0197  
1.05 0.0335 0.0413  
G
M
J
0.013 0.100 0.0005 0.0040  
0.05 (0.002)  
0.10  
0.20  
1.25  
0
0.26 0.0040 0.0102  
0.60 0.0079 0.0236  
1.55 0.0493 0.0610  
K
H
10  
0
10  
_
_
_
_
2.50  
3.00 0.0985 0.1181  
SOLDERING FOOTPRINT*  
2.4  
0.094  
0.95  
0.037  
1.9  
0.075  
0.95  
0.037  
0.7  
0.028  
1.0  
mm  
inches  
0.039  
ǒ
Ǔ
SCALE 10:1  
*For additional information on our Pb−Free strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
ON Semiconductor and  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice  
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All  
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights  
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications  
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should  
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,  
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal  
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMENT:  
N. American Technical Support: 800−282−9855 Toll Free  
USA/Canada  
ON Semiconductor Website: http://onsemi.com  
Order Literature: http://www.onsemi.com/litorder  
Literature Distribution Center for ON Semiconductor  
P.O. Box 5163, Denver, Colorado 80217 USA  
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada  
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada  
Email: orderlit@onsemi.com  
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2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051  
Phone: 81−3−5773−3850  
For additional information, please contact your  
local Sales Representative.  
NL27WZ16/D  

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