NLSV1T34AMUTAG [ONSEMI]
Bus Driver;
| 型号： | NLSV1T34AMUTAG |
| 厂家： | 
ONSEMI |
| 描述： | Bus Driver 驱动 逻辑集成电路 |
| 文件： | 总9页 (文件大小：139K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
1-Bit Dual-Supply
Non-Inverting Level
Translator
NLSV1T34
The NLSV1T34 is a 1−bit configurable dual−supply voltage level
translator. The input A and output B ports are designed to track two
www.onsemi.com
MARKING
n
n
different power supply rails, V
and V
respectively. Both
CCA
CCB
supply rails are configurable from 0.9 V to 4.5 V allowing universal
low−voltage translation from the input A to the output B port.
DIAGRAMS
n
n
Features
UDFN6
MU SUFFIX
CASE 517AA
M
G
• Wide V
and V
Operating Range: 0.9 V to 4.5 V
CCA
CCB
1
1
• High−Speed w/ Balanced Propagation Delay
• Inputs and Outputs have OVT Protection to 4.5 V
UDFN6
MU SUFFIX
CASE 517AQ
A M
• Non−preferential V
• Power−Off Protection
and V
Sequencing
CCA
CCB
• Power−Off High Impedance Inputs and Outputs
ULLGA6
MX1 SUFFIX
CASE 613AF
• Ultra−Small Packaging: 1.45 mm x 1.0 mm ULLGA6
QM
2.0 mm x 2.1 mm SC−88A
1
1.2 mm x 1.0 mm UDFN6
1.45 mm x 1.0 mm UDFN6
5
SC−88A
(SOT−353/SC−70)
DF SUFFIX
• NLV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
• These are Pb−Free Devices
Q M G
G
1
CASE 419A
1
Typical Applications
Q, A = Device Code
M
G
= Date Code*
= Pb−Free Package
• Mobile Phones, PDAs, Other Portable Devices
(Note: Microdot may be in either location)
Important Information
*Date Code orientation and/or position may vary
depending upon manufacturing location.
• ESD Protection for All Pins:
HBM (Human Body Model) > 3000 V
PIN ASSIGNMENT
V
CCA
V
CCB
1
2
3
6 V
CCB
V
1
2
3
5 V
CCB
V
CCA
CCA
B
A
5
4
A
NC
A
GND
B
4
GND
B
Figure 1. Logic Diagram
ULLGA6/UDFN6
(Top View)
SC−88A
(Top View)
ORDERING INFORMATION
See detailed ordering and shipping information on page 5 of
this data sheet.
© Semiconductor Components Industries, LLC, 2015
1
Publication Order Number:
November, 2019 − Rev. 10
NLSV1T34/D
NLSV1T34
PIN ASSIGNMENT
PIN
TRUTH TABLE
FUNCTION
INPUTS
OUTPUTS
V
V
Input Port DC Power Supply
Output Port DC Power Supply
Ground
A
L
B
L
CCA
CCB
GND
A
H
H
Input Port
B
Output Port
MAXIMUM RATINGS
Symbol
Rating
Value
−0.5 to +5.5
−0.5 to +5.5
−0.5 to +5.5
−0.5 to +5.5
−20
Condition
Unit
V
V
CCA
, V
CCB
DC Supply Voltage
V
I
DC Input Voltage
A
B
B
V
V
O
DC Output Voltage
(Power Down)
(Active Mode)
V
= V = 0
CCB
V
CCA
V
I
DC Input Diode Current
DC Output Diode Current
V < GND
I
mA
mA
mA
mA
mA
°C
IK
I
−50
V < GND
O
OK
I
DC Output Source/Sink Current
DC Supply Current Per Supply Pin
DC Ground Current per Ground Pin
Storage Temperature
50
O
I
, I
100
CCA CCB
I
100
GND
T
−65 to +150
STG
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
RECOMMENDED OPERATING CONDITIONS
Symbol
, V
Parameter
Min
0.9
Max
4.5
4.5
4.5
Unit
V
V
CCA
Positive DC Supply Voltage
Bus Input Voltage
CCB
V
I
GND
GND
GND
−40
0
V
V
IO
Bus Output Voltage
(Power Down Mode)
(Active Mode)
B
B
V
V
CCB
V
T
A
Operating Temperature Range
Input Transition Rise or Rate
+85
°C
nS
Dt / DV
10
V , from 30% to 70% of V ; V = 3.3 V 0.3 V
I
CC
CC
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
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2
NLSV1T34
DC ELECTRICAL CHARACTERISTICS
−405C to +855C
Min
Max
Symbol
Parameter
Test Conditions
V
CCA
(V)
V
CCB
(V)
Unit
V
Input HIGH Voltage
0.9 – 4.5
V
3.6 – 4.5
2.7 – 3.6
2.3 – 2.7
1.4 − 2.3
0.9 – 1.4
3.6 – 4.5
2.7 – 3.6
2.3 – 2.7
1.4 − 2.3
0.9 – 1.4
0.9 – 4.5
0.9
2.2
−
IH
2.0
1.6
−
−
−
0.65 * V
CCA
CCA
0.9 * V
−
V
Input LOW Voltage
0.9 – 4.5
V
V
−
−
−
−
−
0.8
IL
0.8
0.7
0.35 * V
CCA
CCA
0.1 * V
V
OH
Output HIGH Voltage
I
I
I
I
= −100 mA; V = V
0.9 – 4.5
0.9
V – 0.2
CCB
−
−
OH
OH
OH
OH
I
IH
= −0.5 mA; V = V
0.75 * V
1.05
1.25
2.0
1.8
2.2
1.7
2.4
2.2
−
I
IH
CCB
= −2 mA; V = V
1.4
1.4
−
I
IH
IH
= −6 mA; V = V
1.65
1.65
2.3
−
I
2.3
−
I
I
= −12 mA; V = V
2.3
2.3
−
OH
I
IH
2.7
2.7
−
= −18 mA; V = V
2.3
2.3
−
OH
I
IH
IH
3.0
3.0
−
I
I
I
I
I
I
= −24 mA; V = V
3.0
3.0
−
OH
OL
OL
OL
OL
OL
I
V
OL
Output LOW Voltage
V
= 100 mA; V = V
0.9 – 4.5
1.1
0.9 – 4.5
1.1
0.2
0.3
I
IL
= 0.5 mA; V = V
−
I
IH
= 2 mA; V = V
1.4
1.4
−
0.35
0.3
0.4
0.4
0.6
0.4
0.55
1.0
2.0
I
IH
IL
= 6 mA; V = V
1.65
1.65
2.3
−
I
= 12 mA; V = V
2.3
−
I
IL
2.7
2.7
−
I
OL
= 18 mA; V = V
2.3
2.3
−
I
IL
3.0
3.0
−
I
OL
= 24 mA; V = V
3.0
3.0
−
I
IL
I
Input Leakage Current
V = V
or GND
or GND;
0.9 – 4.5
0.9 – 4.5
0.9 – 4.5
0.9 − 4.5
−1.0
−
mA
mA
I
I
CCA
I
I
Quiescent Supply Current
V = V
I
CCA
CCA
= 0, V
I
O
= V
CCA CCB
Quiescent Supply Current
Quiescent Supply Current
Power OFF Leakage Current
V = V
or GND;
0.9 – 4.5
0.9 – 4.5
0
0.9 − 4.5
0.9 – 4.5
0
−
−
−
2.0
4.0
5.0
mA
mA
mA
CCB
I
CCA
I
O
= 0, V
= V
CCA
CCB
I
+ I
V = V
or GND;
= V
CCB
CCA
CCB
I
CCA
CCA
I
O
= 0, V
I
V = 4.5 V
I
OFF
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
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3
NLSV1T34
TOTAL STATIC POWER CONSUMPTION (ICCA + ICCB
)
−405C to +855C
V
CCB
(V)
4.5
3.3
2.8
1.8
0.9
V
CCA
(V)
Min
Max
2
Min
Max
2
Min
Max
Min
Max
2
Min
Max
< 1.5
< 1.5
< 0.5
< 0.5
< 0.5
Unit
μA
μA
μA
μA
μA
4.5
2
3.3
2.8
1.8
0.9
2
2
2
2
< 2
< 1
< 0.5
< 1
< 1
< 0.5
< 1
< 0.5
< 0.5
< 0.5
< 0.5
< 0.5
NOTE: Connect ground before applying supply voltage V
or V
. This device is designed with the feature that the power−up
CCA
CCB
sequence of V
and V
will not damage the IC.
CCA
CCB
AC ELECTRICAL CHARACTERISTICS
−405C to +855C
V
CCB
(V)
4.5
3.3
2.8
1.8
1.2
Min
Max
Min
Max
1.8
1.9
2.1
2.4
2.7
Min
Max
2.0
2.1
2.3
2.5
2.8
Min
Max
2.1
2.3
2.5
2.7
3.0
Min
Max
2.3
2.6
2.8
3.0
3.3
Symbol
Parameter
V
CCA
(V)
Unit
t
t
,
Propagation
Delay,
4.5
1.6
1.7
1.9
2.1
2.4
nS
PLH
PHL
3.3
2.8
1.8
1.2
(Note 1)
A to B
1. Propagation delays defined per Figure 2.
CAPACITANCE
Symbol
Parameter
Test Conditions
= 3.3 V, V = 0 V or V
CCA/B
Typ (Note 2)
Unit
pF
C
I/O
C
PD
I/O Pin Input Capacitance
Power Dissipation Capacitance
V
V
= V
5.0
5.0
CCA
CCB
I
= V
= 3.3 V, V = 0 V or V
, f = 10 MHz
pF
CCA
CCB
I
CCA
2. Typical values are at T = +25°C.
A
3. C is defined as the value of the IC’s equivalent capacitance from which the operating current can be calculated from:
PD
I
^ C x V x f where I = I
+ I
CCB
.
CC(operating)
PD
CC
IN
CC
CCA
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4
NLSV1T34
V
CC
Pulse
Generator
DUT
C
R
L
L
Figure 2. AC (Propagation Delay) Test Circuit
Switch
Test
C = 15 pF or equivalent (includes probe and jig capacitance)
L
R = 2 kW or equivalent
L
Z
OUT
of pulse generator = 50 W
V
IH
Input (A )
n
Vm
Vm
0 V
t
t
PHL
PLH
V
OH
Output (B )
n
Vm
Vm
V
OL
Waveform 1 − Propagation Delays
= t = 2.0 ns, 10% to 90%; f = 1 MHz; t = 500 ns
t
R
F
W
Figure 3. AC (Propagation Delay) Test Circuit Waveforms
V
CC
0.9 V – 4.5 V
Symbol
V
V
CCA
V
CCB
/2
/2
mA
mB
V
ORDERING INFORMATION
Device
†
Package
Shipping
NLSV1T34MUTBG
UDFN6, 1.2 x 1.0, 0.4P
3000 / Tape & Reel
3000 / Tape & Reel
(Pb−Free)
NLSV1T34AMUTAG
NLSV1T34AMUTCG
NLSV1T34AMX1TCG
UDFN6, 1.45 x 1.0, 0.5P
(Pb−Free)
ULLGA6
(Pb−Free)
3000 / Tape & Reel
3000 / Tape & Reel
NLSV1T34DFT2G
SC−88A
(Pb−Free)
NLVSV1T34DFT2G*
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable
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5
NLSV1T34
PACKAGE DIMENSIONS
SC−88A (SC−70−5/SOT−353)
CASE 419A−02
ISSUE L
A
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
G
2. CONTROLLING DIMENSION: INCH.
3. 419A−01 OBSOLETE. NEW STANDARD
419A−02.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
5
4
3
−B−
S
INCHES
DIM MIN MAX
MILLIMETERS
MIN
1.80
1.15
0.80
0.10
MAX
2.20
1.35
1.10
0.30
1
2
A
B
C
D
G
H
J
0.071
0.045
0.031
0.004
0.087
0.053
0.043
0.012
0.026 BSC
0.65 BSC
M
M
B
D 5 PL
0.2 (0.008)
---
0.004
0.004
0.004
0.010
0.012
---
0.10
0.10
0.10
0.25
0.30
K
N
S
N
0.008 REF
0.20 REF
0.079
0.087
2.00
2.20
J
C
K
H
SOLDER FOOTPRINT
0.50
0.0197
0.65
0.025
0.65
0.025
0.40
0.0157
1.9
0.0748
mm
inches
ǒ
Ǔ
SCALE 20:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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6
NLSV1T34
PACKAGE DIMENSIONS
UDFN6, 1.2x1.0, 0.4P
CASE 517AA
ISSUE D
EDGE OF PACKAGE
NOTES:
A
B
D
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.25 AND
0.30 mm FROM TERMINAL.
L1
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
PIN ONE
E
DETAIL A
REFERENCE
Bottom View
MILLIMETERS
2X
DIM MIN
0.45
A1 0.00
MAX
0.55
0.05
(Optional)
A
0.10
C
MOLD CMPD
EXPOSED Cu
TOP VIEW
A3
b
D
E
0.127 REF
2X
0.15
0.25
0.10
C
C
1.20 BSC
1.00 BSC
0.40 BSC
A3
e
L
0.30
0.40
0.15
0.50
(A3)
L1 0.00
L2 0.40
0.10
0.08
A1
DETAIL B
Side View
(Optional)
A
SEATING
PLANE
10X
C
MOUNTING FOOTPRINT*
SIDE VIEW
6X
C
A1
6X
0.22
0.42
5X L
3
1
L2
6X b
6
4
0.10 C A B
0.05
0.40
PITCH
1.07
e
C
NOTE 3
DIMENSIONS: MILLIMETERS
BOTTOM VIEW
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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7
NLSV1T34
PACKAGE DIMENSIONS
UDFN6, 1.45x1.0, 0.5P
CASE 517AQ
ISSUE O
A
B
D
L
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
L1
DETAIL A
PIN ONE
REFERENCE
OPTIONAL
E
MILLIMETERS
CONSTRUCTIONS
DIM MIN
0.45
A1 0.00
MAX
0.55
0.05
A
0.10
C
EXPOSED Cu
MOLD CMPD
A2
b
0.07 REF
0.20
1.45 BSC
TOP VIEW
0.30
0.10
C
D
E
e
1.00 BSC
0.50 BSC
DETAIL B
L
L1
0.30
−−−
0.40
0.15
DETAIL B
OPTIONAL
0.05
0.05
C
C
CONSTRUCTIONS
A
6X
MOUNTING FOOTPRINT
A1
SEATING
PLANE
6X
A2
C
SIDE VIEW
e
0.30
PACKAGE
OUTLINE
6X L
1.24
3
1
DETAIL A
6X
0.53
1
0.50
PITCH
DIMENSIONS: MILLIMETERS
6
4
6X b
0.10 C A B
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
NOTE 3
C
0.05
BOTTOM VIEW
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8
NLSV1T34
PACKAGE DIMENSIONS
ULLGA6 1.45x1.0, 0.5P
CASE 613AF
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
A
B
D
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
4. A MAXIMUM OF 0.05 PULL BACK OF THE
PLATED TERMINAL FROM THE EDGE OF THE
PACKAGE IS ALLOWED.
PIN ONE
E
REFERENCE
MILLIMETERS
DIM MIN
−−−
A1 0.00
MAX
0.40
0.05
0.25
A
0.10
C
TOP VIEW
SIDE VIEW
b
D
E
e
0.15
1.45 BSC
1.00 BSC
0.50 BSC
0.25
0.10
C
L
0.35
0.40
0.05
0.05
C
C
L1 0.30
A
MOUNTING FOOTPRINT
SEATING
PLANE
6X
SOLDERMASK DEFINED*
05.4X9
A1
C
6X
0.30
e
NOTE 4
5X L
3
1
6
1.24
L1
1
0.53
PKG
OUTLINE
0.50
PITCH
4
6X b
DIMENSIONS: MILLIMETERS
0.10 C A B
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
NOTE 3
C
0.05
BOTTOM VIEW
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